Circuit board processing apparatus

Abstract

The application provides a circuit board processing equipment, which comprises a bed body, a gantry and at least one workbench assembly arranged on the bed body, the gantry comprises a cross beam extending along a first direction; at least two vibration spindle assemblies, the vibration spindle assembly is configured to drive a high-speed rotating processing tool to vibrate in a second direction with a set amplitude and frequency during processing, so that the processing tool and the circuit board form periodic contact and separation, and the at least two vibration spindle assemblies are movably arranged on the cross beam along the first direction; wherein at least one of the cross beam and the workbench assembly can move along a third direction relative to the bed body, and the first direction, the second direction and the third direction are orthogonal to each other. The circuit board processing equipment provided by the application has the advantage of high processing quality.

Description

Technical Field

[0001] This application belongs to the field of circuit board processing technology, and more specifically, relates to a circuit board processing equipment and a circuit board. Background Technology

[0002] Mechanical drilling is a key process for processing micro-holes in printed circuit boards (PCBs). Through micro-holes on the circuit board, efficient connections between circuit layers can be achieved, meeting the needs of complex circuit designs.

[0003] However, PCB drilling equipment in related technologies suffers from low processing quality. Utility Model Content

[0004] The purpose of this application is to provide a circuit board processing device to solve the technical problem of low processing quality in existing PCB drilling devices.

[0005] The circuit board processing equipment provided in this application includes a bed, a gantry frame disposed on the bed, and at least one worktable assembly. The gantry frame includes a crossbeam extending along a first direction; at least two vibrating spindle assemblies, which are configured to drive a high-speed rotating processing tool to vibrate in a second direction at a set amplitude and frequency during processing, so that the processing tool and the circuit board form periodic contact and separation. At least two of the vibrating spindle assemblies are movably disposed on the crossbeam along the first direction. At least one of the crossbeam and the worktable assembly is movable relative to the bed in a third direction, and the first direction, the second direction, and the third direction are orthogonal to each other.

[0006] The beneficial effects of the circuit board processing equipment provided in this application embodiment are as follows: At least one of the gantry and the worktable assembly of the circuit board processing equipment provided in this application embodiment can move relative to the machine body in a second direction, thereby enabling the processing tool mounted on the vibrating spindle assembly and the circuit board mounted on the worktable assembly to move relative to each other in the second direction, moving the processing tool to a position corresponding to the hole to be processed on the circuit board, so that the processing tool held by the vibrating spindle assembly makes precise and brief contact and separation with the hole to be processed on the circuit board, making the processing more accurate, reducing the length of the chips, reducing the probability of forming a cold solder layer, thereby optimizing the chip removal efficiency, and thus improving the forming quality of the holes drilled on the circuit board by the circuit board processing equipment provided in this application embodiment, giving the circuit board processing equipment provided in this application embodiment the advantage of high processing quality.

[0007] Optionally, the gantry frame further includes at least two support seats spaced apart along the first direction, the support seats being connected between the bed and the crossbeam; The support base and the bed are movably connected so that the crossbeam can move relative to the bed in the third direction.

[0008] Optionally, the circuit board processing equipment further includes a first drive assembly for driving the gantry to move relative to the bed along the third direction; the first drive assembly includes at least one first drive member and at least two first guide rails, the first guide rails are disposed on the bed, the first guide rails extend along the third direction, and at least two first guide rails are arranged parallel and spaced apart along the first direction. The gantry frame includes two side support seats, and a first slide seat is provided at the end of the side support seat away from the crossbeam. The first slide seat is slidably connected to the first guide rail, and the first drive member is connected between the bed and at least one of the side support seats.

[0009] Optionally, at least two of the first guide rails include two side guide rails and at least one intermediate guide rail, the intermediate guide rail being located between the two side guide rails; The gantry frame also includes a central support base, which is located between the two side support bases; The middle support seat is provided with a second slide at one end away from the crossbeam. The second slide is slidably connected to the middle guide rail, and the two first slides are slidably connected to the two side guide rails respectively. The circuit board processing equipment includes at least two worktable assemblies, which are spaced apart on both sides of the intermediate support along the first direction.

[0010] Optionally, the circuit board processing equipment includes a second drive assembly for driving the vibration spindle assembly to move relative to the crossbeam along the first direction; The circuit board processing equipment includes at least two of the aforementioned vibration spindle assemblies. The second drive assembly includes at least two second drive members and a second guide rail. The second guide rail extends along the first direction and is disposed on the crossbeam. The vibration spindle assembly is slidably connected to the second guide rail. The second drive members are connected to the vibration spindle assembly in a one-to-one correspondence to drive the vibration spindle assembly to move along the second guide rail. The second guide rail includes multiple guide rail segments arranged along the first direction, and the vibration spindle assembly is correspondingly arranged with the guide rail segments, with adjacent guide rail segments spaced apart.

[0011] Optionally, the vibration spindle assembly includes a bearing assembly and a spindle. The bearing assembly is provided with a receiving space, and the spindle is disposed in the receiving space for driving a machining tool to process the circuit board on the worktable assembly along the second direction. In this configuration, at least one of the worktable assembly and the mandrel is capable of vibrating along the second direction.

[0012] Optionally, the mandrel includes a core and a turntable; The shaft is rotatably mounted on the bearing assembly, and the turntable is connected to the shaft and rotatably disposed within the receiving space.

[0013] Optionally, when the mandrel is floating in the receiving space, the vibrating spindle assembly further includes an air supply assembly connected to the bearing assembly. When the air supply assembly supplies gas to the receiving space, the turntable is suspended in the receiving space. A first gap and a second gap are formed between the turntable and the side wall of the receiving space. The first gap can form a first air film, and the second gap can form a second air film. The pressure difference between the first air film and the second air film changes periodically, causing the turntable to drive the mandrel to reciprocate along the second direction.

[0014] Optionally, the worktable assembly is fixed to the bed and includes a worktable surface and a worktable vibration assembly; The workbench surface is used to support the circuit board; The table vibration assembly is connected to the worktable and is used to drive the worktable to vibrate along the second direction.

[0015] Optionally, the processing equipment further includes an identification component connected to the vibrating spindle assembly, the identification component being used to identify the actual position of the hole to be processed in the circuit board carried by the worktable assembly; And / or, the processing equipment further includes a detection component for detecting the motion state of at least one of the vibrating spindle assembly and the worktable assembly. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the circuit board processing equipment provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of a circuit board processing equipment provided in another embodiment of this application; Figure 3 for Figure 2A magnified view of a portion of point A in the middle; Figure 4 for Figure 3 Schematic diagram of the cross section at point BB; Figure 5 for Figure 2 A magnified view of a portion of point C.

[0018] The following are the labeling elements in the figure: 100. Circuit board processing equipment; 10. Vibration spindle assembly; 11. Mandrel; 111. Shaft core; 112. Turntable; 12. Bearing assembly; 12a. Accommodation space; 121. First gap; 122. Second gap; 131. First air film; 132. Second air film; 20. Workbench assembly; 21. Workbench surface; 22. Workbench vibration assembly; 31. Bed frame; 32. Gantry frame; 321. Crossbeam; 322. Support base; 322a. Side support base; 322b. Intermediate support base; 40. First drive assembly; 41. First drive component; 42. First guide rail; 421. Side guide rail; 422. Middle guide rail; 50. Second drive assembly; 51. Second drive component; 52. Second guide rail; 521. Guide rail segment; 60. Identification components; 001. Machining cutting tools; x - First direction; z - Second direction; y - Third direction. Detailed Implementation

[0019] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0020] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0021] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0023] Mechanical drilling is a key process for machining micro-holes on circuit boards. With the miniaturization of electronic devices, the depth-to-diameter ratio of micro-holes (diameter <0.2mm) on circuit boards is constantly increasing, resulting in narrow chip removal space and severe heat accumulation from cutting, which in turn leads to problems such as poor hole wall quality, large exit burrs, and easy breakage of drill bits.

[0024] To address the aforementioned technical problems, this application provides a circuit board processing device 100.

[0025] Please refer to the following as well. Figure 1 , Figure 2 and Figure 3 The circuit board processing equipment 100 provided in the embodiments of this application will now be described.

[0026] The circuit board processing equipment 100 provided in this application embodiment includes a bed 31, a gantry frame 32, at least two vibrating spindle assemblies 10 and a worktable assembly 20.

[0027] In some embodiments provided in this application, the gantry 32 includes a crossbeam 321 extending along a first direction x, a vibrating spindle assembly 10 disposed on the crossbeam 321, and a worktable assembly 20 disposed on the bed 31. In some embodiments, the vibrating spindle assembly 10 is used to mount a machining tool 001 to perform drilling and other machining on a circuit board disposed on the worktable assembly 20. The vibrating spindle assembly 10 is configured to drive the machining tool 001 to vibrate along a second direction z, so that the machining tool 001 and the circuit board form periodic contact and separation. At least two vibrating spindle assemblies 10 are movably disposed on the crossbeam along the first direction x.

[0028] In some embodiments, the second direction z is orthogonal to the first direction x.

[0029] At least one of the crossbeam 321 and the worktable assembly 20 is movable relative to the bed 31 along a third direction y, which is orthogonal to the second direction z and intersects with the first direction x.

[0030] In some embodiments, only the beam 321 or the worktable assembly 20 can move in a third direction.

[0031] In other embodiments, both the crossbeam 321 and the worktable assembly 20 are movable in a third direction, in which case they can move in opposite directions or in the same direction.

[0032] The worktable assembly 20 is used to support the circuit board. In some embodiments, the worktable assembly 20 includes a T-slot worktable or a vacuum adsorption worktable, and the worktable assembly 20 is used to fix and mount the plate-shaped circuit board.

[0033] In some embodiments, the third direction y is orthogonal to the first direction x.

[0034] The crossbeam 321 of the circuit board processing equipment 100 provided in this application can drive the vibrating spindle assembly 10 to move relative to the bed 31 along a third direction y, and / or, the worktable assembly 20 can move relative to the bed 31 in a third direction y; thereby, the processing tool 001 mounted on the vibrating spindle assembly 10 and the circuit board mounted on the worktable assembly 20 can move relative to each other along a third direction y, moving the processing tool 001 to a position corresponding to the hole to be processed on the circuit board. Compared with the prior art, at least one of the gantry and the worktable assembly of the circuit board processing equipment provided in this application can move relative to the machine body along a third direction y. The second direction of movement allows the machining tool mounted on the vibrating spindle assembly and the circuit board mounted on the worktable assembly to move relative to each other in the second direction. This moves the machining tool to a position corresponding to the hole to be machined on the circuit board, allowing the machining tool held by the vibrating spindle assembly to make precise and brief contact and separation with the hole to be machined on the circuit board. This results in more precise machining, reduces the length of the chips, lowers the probability of forming a cold solder layer, and optimizes chip removal efficiency. Consequently, it improves the forming quality of the holes drilled on the circuit board by the circuit board processing equipment provided in this application embodiment, giving the circuit board processing equipment provided in this application embodiment the advantage of high processing quality.

[0035] In some embodiments provided in this application, the gantry 32 further includes at least two support seats 322 spaced apart along a first direction x, the support seats 322 being connected between the bed 31 and the crossbeam 321; the support seats 322 and the bed 31 are movably connected so that the crossbeam 321 can move relative to the bed 31 along a third direction y.

[0036] The support base 322 extends along the second direction z, and the crossbeam 321 extends along the first direction x. One end of the support base 322 is connected to the crossbeam 321, and the other end of the support base 322 is movably connected to the bed 31 along the third direction y, so that the gantry can drive the machining tool 001 located on the vibrating spindle assembly 10 to move along the third direction y, and move the machining tool 001 to the position where the circuit board needs to be drilled.

[0037] Therefore, the support 322 can drive the crossbeam 321 and the vibrating spindle assembly 10 on the crossbeam 321 to move together along the third direction, so that the machining tool 001 installed on the vibrating spindle assembly 10 can move relative to the circuit board installed on the worktable assembly 20 along the third direction y, and move the machining tool 001 to the position corresponding to the hole to be machined on the circuit board.

[0038] In some embodiments provided in this application, such as Figure 2 and Figure 5 As shown, the circuit board processing equipment 100 includes a first drive assembly 40, which is used to drive the gantry 32 to move relative to the bed 31 in a third direction y.

[0039] The first drive assembly 40 includes at least one first drive member 41 and at least two first guide rails 42. The first guide rails 42 are disposed on the bed 31 and extend along a third direction y. The at least two first guide rails 42 are arranged parallel to each other and spaced apart along a first direction x.

[0040] The gantry frame 32 includes two side support seats 322a. The end of the side support seat 322a away from the crossbeam 321 is provided with a first slide. The first slide is slidably provided with the first guide rail 42. The first drive member 41 is connected between the bed 31 and at least one side support seat 322a.

[0041] In some embodiments, the first driving member 41 can be any one of a linear motor, a lead screw and nut mechanism, a gear and rack mechanism, a hydraulic cylinder, or a pneumatic cylinder, and the first guide rail 42 can be any one of a linear rolling guide rail or a linear sliding guide rail.

[0042] In some embodiments provided in this application, the first slide block can be slidably connected to the first guide rail 42 by any one of the following sliding methods: rolling sliding, sliding friction, air-floating sliding, and magnetic levitation sliding.

[0043] In some embodiments, the first slide includes at least one roller with its axis of rotation orthogonal to a third direction y. The roller can roll along the surface of the first guide rail 42, thereby slidably connecting the first slide to the first guide rail 42.

[0044] In some embodiments, the first slide block abuts against the first guide rail 42, and there is a small coefficient of friction between the first slide block and the first guide rail 42, so that the first slide block can slide relative to the first guide rail 42 in a third direction y.

[0045] In some embodiments, the first slide is connected to the air supply component, and the first slide is fitted with the first guide rail 42 with a gap. The air supply component supplies gas into the gap between the first slide and the first guide rail 42 to form an air film. The air film supports the space between the first slide and the first guide rail 42 to reduce the coefficient of friction between the first slide and the first guide rail 42, so that the first slide can slide relative to the first guide rail 42 in the third direction y.

[0046] In some embodiments provided in this application, at least two first guide rails 42 include two side guide rails 421 and at least one intermediate guide rail 422, with the intermediate guide rail 422 located between the two side guide rails 421. The gantry frame 32 includes a middle support 322b, which is located between two side supports 322a. The middle support 322b is provided with a second slide at the end away from the crossbeam 321. The second slide is slidably connected to the middle guide rail 422, and the two first slides are slidably connected to the two side guide rails 421 respectively.

[0047] like Figure 1 and Figure 2 As shown, the two side support seats 322a are respectively connected to the two ends of the crossbeam 321 in the first direction x. The middle support seat 322b is parallel to the side support seats 322a and is arranged at intervals along the first direction x. The middle support seat 322b is connected to the crossbeam 321. The first slide is slidably connected to the side guide rail 421, and the second slide is slidably connected to the middle guide rail 422. Thus, the middle section of the crossbeam 321 is supported by the middle support seat 322b, which improves the rigidity of the crossbeam 321 and reduces the deformation of the cantilever part of the crossbeam 321.

[0048] Furthermore, it should be noted that the above-mentioned configuration of the intermediate support seat is not limited to the technical solution of moving the crossbeam and the bed, but can also be applied to the technical solution of keeping the crossbeam and the bed fixed. By configuring the intermediate support seat 322b between the two side support seats 322a, this structure allows multiple vibrating spindle assemblies 10 to be configured, which can support the middle section of the crossbeam 321 through the intermediate support seat 322b, thereby improving the rigidity of the crossbeam 321, reducing the deformation of the cantilever part of the crossbeam 321, and thus improving the processing efficiency and processing accuracy.

[0049] In some embodiments, the first drive member 41 is connected to the side support 322a.

[0050] In other embodiments, the first drive member 41 is connected to the intermediate support 322b.

[0051] In other embodiments, there are multiple first drive members 41, with a portion of the multiple first drive members 41 connected to the side support 322a and another portion of the multiple first drive members 41 connected to the middle support 322b.

[0052] In some embodiments, there is one intermediate support 322b, and the intermediate support 322b is equidistant from the two side supports 322a in the third direction y.

[0053] In other embodiments, there are multiple intermediate support seats 322b, which are arranged at parallel intervals along the first direction x.

[0054] In some embodiments, the distance between any two adjacent intermediate supports 322b in the first direction x is the same as the distance between the nearest side support 322a and the side support 322a in the first direction x.

[0055] In some embodiments, the circuit board processing equipment 100 includes at least two worktable assemblies 20, which are spaced apart along a first direction x on both sides of the intermediate support 322b in the first direction x.

[0056] Therefore, by increasing the rigidity of the crossbeam 321 through the intermediate support 322b, the deformation of the middle section of the crossbeam 321 is reduced, thereby improving the accuracy of the vibration spindle assembly 10 when processing the circuit board on the worktable assembly 20 on both sides of the intermediate support 322b in the first direction x.

[0057] In some embodiments provided in this application, the circuit board processing equipment 100 includes a second drive assembly 50, at least a portion of which is connected between the vibrating spindle assembly 10 and the crossbeam 321 to drive the vibrating spindle assembly 10 to move relative to the crossbeam 321 along a first direction x.

[0058] The vibrating spindle assembly 10 comprises at least two components. The second drive assembly 50 includes at least two second drive members 51 and a second guide rail 52. The second guide rail 52 extends along a first direction x and is disposed on the crossbeam 321. The vibrating spindle assembly 10 is slidably mounted on the second guide rail 52. The second drive members 51 are connected to the vibrating spindle assembly 10 in a one-to-one correspondence to drive the vibrating spindle assembly 10 to move along the second guide rail 52. In this embodiment, by configuring corresponding drive members and guide rails for each vibrating spindle assembly, each vibrating spindle assembly can be individually driven by the corresponding set of drive members and guide rails (synchronous configuration of individual position detection, such as the axis grating ruler of the corresponding spindle assembly, the axis grating ruler of the corresponding worktable assembly, etc.), further improving machining accuracy. This method can be applied to structures where the crossbeam moves or is fixed.

[0059] In some embodiments, the second drive member 51 can be any one of a linear motor, a lead screw and nut mechanism, a gear and rack mechanism, a hydraulic cylinder, or a pneumatic cylinder, and the second guide rail 52 can be any one of a linear rolling guide rail or a linear sliding guide rail.

[0060] like Figure 2 and Figure 3 As shown, multiple vibrating spindle assemblies 10 are arranged at intervals along the first direction x. The spindle is driven to move in the first direction x by the second drive member 51, and the weight of the spindle is supported by the second guide rail 52. The second drive member 51 is arranged corresponding to the vibrating spindle assembly 10, so that the corresponding vibrating spindle assembly 10 is driven to move along the first direction x by the second drive member 51, thereby driving the vibrating spindle assembly 10 together with the processing tool 001 to move relative to each other in the first direction x, and moving the processing tool 001 relative to the circuit board to the position where drilling is required.

[0061] In some embodiments provided in this application, the second guide rail 52 includes a plurality of guide rail segments 521 arranged along the first direction x, and the vibration spindle assembly 10 is correspondingly disposed on any one of the guide rail segments 521, with adjacent guide rail segments 521 arranged at intervals.

[0062] like Figure 2 and Figure 3 As shown, the second guide rail 52 extends along the first direction x. The second guide rail 52 includes multiple guide rail segments 521. The multiple guide rail segments 521 have the same cross-sectional shape in a plane orthogonal to the first direction x, so that the second drive member 51 can drive the corresponding vibration spindle assembly 10 to move between two adjacent guide rail segments 521. The two adjacent guide rail segments 521 are arranged at intervals.

[0063] Therefore, by setting the second guide rail 52 as a multi-segment structure, the mechanical vibration generated by the vibration of the spindle 11 relative to the gantry 32 can be prevented from being transmitted from one guide rail segment 521 to another guide rail segment 521, thereby preventing the vibration generated by one vibrating spindle assembly 10 from affecting another vibrating spindle assembly 10, thereby improving the stability of the processing equipment and improving the processing accuracy of the circuit board processing equipment 100 provided in this application embodiment during multi-axis processing.

[0064] In some embodiments provided in this application (not shown in the figures), limiting members are provided on both sides of each guide rail segment 521. The limiting members can be strip-shaped or sheet-shaped devices. Two sets of limiting members are spaced apart on both sides of the guide rail segment 521 along the first direction x. At the same time, abutting members facing the third direction y are also provided on both sides of the vibration spindle assembly 10. When the vibration spindle assembly 10 moves to the edge of the guide rail segment 521, the abutting members abut against the limiting members to prevent the vibration spindle assembly 10 from disengaging from the guide rail segment 521.

[0065] In some other embodiments (not shown in the figures), a buffer is provided between two adjacent guide rail segments 521. The buffer fills the gap between the two adjacent guide rail segments 521, and the cross-sectional shape of the buffer in the plane orthogonal to the first direction x is the same as the cross-sectional shape of the guide rail segment 521 in the plane orthogonal to the first direction x. The buffer is made of elastic material.

[0066] Thus, on the one hand, the buffer filter removes mechanical vibration between two adjacent guide rail segments 521, preventing mechanical vibration from being transmitted between the two adjacent guide rail segments 521; on the other hand, the buffer keeps the second guide rail 52 in its complete shape, improving the accuracy of the second drive member 51 in driving the vibration spindle assembly 10 to move in the first direction x.

[0067] In some embodiments provided in this application, there are multiple second guide rails 52, which are parallel to each other and spaced apart along a second direction z. The vibration spindle assembly 10 is slidably connected to the multiple second guide rails 52.

[0068] like Figure 2 and Figure 3 As shown, there are two second guide rails 52, which are respectively disposed on both sides of the second drive member 51 in the second direction z. Thus, by setting two second guide rails 52, the number of support points of the second drive assembly 50 on the vibration spindle assembly 10 is increased, thereby improving the rigidity of the vibration spindle assembly 10 mounted on the second drive assembly 50 and ensuring the processing accuracy of the circuit board processing equipment 100 provided in this application embodiment.

[0069] In some embodiments provided in this application, such as Figure 4 As shown, the vibratory spindle assembly 10 includes a bearing assembly 12 and a spindle 11. The bearing assembly 12 is provided with a receiving space 12a, and the spindle 11 is disposed in the receiving space 12a for driving the machining tool 001 to process the circuit board on the worktable assembly 20 along the second direction z. In some embodiments, the second direction z is a vertical up-down direction, and the axial direction of the spindle 11 is the second direction z.

[0070] In some embodiments, the bearing assembly 12 has a receiving space 12a, at least a portion of the spindle 11 is fitted into the receiving space 12a, and one end in the second direction z protrudes from the bearing assembly 12 so that the end in the second direction z can be used to install the machining tool 001.

[0071] In some embodiments, the machining tool 001 may be a drill bit.

[0072] In other embodiments, the machining tool 001 can be a milling cutter, a grinding disc, or other machining tool.

[0073] In some embodiments, the mandrel 11 is movable relative to the worktable assembly 20 along a second direction z, thereby enabling the machining tool 001 to contact the circuit board and move with the mandrel 11 to drill holes in the circuit board. Thus, the machining tool 001 mounted at the end in the second direction z can perform machining on the circuit board mounted on the worktable.

[0074] At least one of the worktable assembly 20 and the spindle 11 is capable of vibrating along the second direction z.

[0075] It should be noted that the motion along the second direction z mentioned in this article refers to the high-frequency, low-amplitude reciprocating motion of the object along the second direction z.

[0076] In some embodiments, at least one of the worktable assembly 20 and the mandrel 11 has a vibration frequency range of 500-2000Hz or 10-30KHz, and the vibration amplitude of at least one of the worktable assembly 20 and the mandrel 11 is less than or equal to 2% of the drilling diameter, so that the machining tool 001 vibrates at a high frequency relative to the circuit board with a small amplitude.

[0077] In some embodiments, at least a portion of the table assembly 20 and the spindle 11 are both capable of vibrating along the second direction z.

[0078] In other embodiments, the spindle 11 is capable of vibrating along the second direction z, and the position of the table assembly 20 in the second direction z is fixed.

[0079] In other embodiments, at least a portion of the worktable assembly 20 is capable of vibrating along a second direction z, and the position of the spindle 11 in the second direction z is fixed.

[0080] In other embodiments, the spindle 11 is capable of vibrating along a second direction z, and at least a portion of the vibration of the table assembly 20 is in a direction intersecting the second direction z.

[0081] In other embodiments, the table assembly 20 is capable of vibrating along a second direction z, and the direction of vibration of the spindle 11 intersects the second direction z.

[0082] In some embodiments, when at least one of the spindle 11 and the table assembly 20 vibrates along the first direction z, the spindle 11 and the table assembly 20 always maintain relative motion, that is, there is no situation where the two are relatively stationary.

[0083] Therefore, during the drilling of the circuit board, the vibration of either the worktable assembly 20 or the mandrel 11 along the second direction z causes the circuit board mounted on the worktable assembly 20 and the machining tool 001 mounted on the mandrel 11 to generate relatively high-frequency reciprocating motion. On the one hand, the pulsed cutting force causes the chip thickness to change periodically, and the chips break at weak points, forming short chips, thus avoiding long chips from entangled in the machining tool 001 and clogging the chip removal groove. On the other hand, the vibratory drilling causes the drill bit to periodically detach from the circuit board during the cutting process, releasing the cutting force instantaneously and reducing the adhesion between the chips and the rake face. This periodic contact and detachment prevents the formation of a cold solder layer on the surface of the machining tool 001, thereby reducing the friction between the chips and the machining tool 001.

[0084] In some embodiments provided in this application, the spindle 11 includes a core 111 and a turntable 112; the core 111 is rotatably disposed on the bearing assembly 12, and the turntable 112 is connected to the core 111 and located within the receiving space 12a.

[0085] like Figure 4 As shown, the shaft core 111 extends along the second direction z, the turntable 112 protrudes from the outer periphery of the shaft core 111, and the turntable 112 extends in a closed manner along the circumference of the shaft core 111. The inner wall of the bearing assembly 12 is provided with an annular groove, and a receiving space 12a is formed in the annular groove. The turntable 112 is rotatably assembled in the annular groove. The shaft core 111 passes through the bearing assembly 12 along the second direction z, and one end of the shaft core 111 is used to install the machining tool 001.

[0086] Therefore, when the spindle 11 is floating on the bearing assembly 12 and rotates around its axis, it is rotatably fitted within the receiving space 12a by the turntable 112, thereby improving the rotational accuracy of the spindle 11.

[0087] In other embodiments, the spindle 11 includes a plurality of turntables 112 arranged in parallel at intervals along a second direction z, and the bearing assembly 12 includes a plurality of receiving spaces 12a, in which the turntables 112 are rotatably mounted.

[0088] In some embodiments provided in this application, the vibration spindle assembly 10 further includes a stator and a rotor. The rotor is rotatably mounted inside the stator and is connected to the spindle 11. The bearing assembly 12 is disposed on the stator. The rotor drives the spindle 11 to rotate around the axis of the spindle 11 through the periodically changing magnetic field generated by the stator.

[0089] The inventors discovered that the rotational speed of existing vibratory drilling spindles is relatively low, resulting in poor hole wall processing quality and failing to meet the requirements for micro-hole processing in circuit boards. To address this issue, in some embodiments provided in this application, the mandrel 11 is floatingly disposed within the receiving space 12a.

[0090] like Figure 4 As shown, at least a portion of the mandrel 11 is gap-fitted with the bearing assembly 12 so that the mandrel 11 is floatingly disposed within the receiving space 12a, so that the mandrel 11 can be displaced relative to the bearing assembly 12 in the second direction z, so that the mandrel 11 can vibrate relative to the bearing assembly 12 in the second direction z.

[0091] In other embodiments, the mandrel 11 is gap-fitted within the receiving space 12a so that the mandrel 11 can be displaced radially relative to the bearing assembly 12.

[0092] In some other embodiments provided in this application (not shown in the figures), the mandrel 11 is fixedly disposed in the receiving space 12a. At least a portion of the mandrel 11 is fixedly assembled in the receiving space 12a so that the mandrel 11 can vibrate together with the bearing assembly 12 in its axial direction z.

[0093] In some embodiments provided in this application, the circuit board processing equipment 100 further includes an air supply assembly (not shown in the figure). The air supply assembly is connected to the bearing assembly 12. When the air supply assembly supplies gas to the accommodating space 12a, the turntable 112 is suspended in the accommodating space 12a and divides the accommodating space 12a into a first gap 121 and a second gap 122 along the second direction z. The first gap 121 can form a first air film 131, and the second gap 122 can form a second air film 132. The pressure difference between the first air film 131 and the second air film 132 changes periodically, causing the turntable 112 to drive the spindle 11 to reciprocate along the second direction z.

[0094] The air supply assembly includes an air pump and an air delivery pipe. The air delivery pipe is connected to the bearing assembly 12, and the air pump is connected to the receiving space 12a through the air delivery pipe, so that the air supply assembly inputs gas into the receiving space 12a to form an airflow. A first gap 121 is formed between the turntable 112 on one side of the spindle 11 in the axial direction z and the inner wall of the receiving space 12a. A second gap 122 is formed between the turntable 112 on the other side of the spindle 11 in the axial direction z and the inner wall of the receiving space 12a. Part of the airflow is located in the first gap 121 to form a first air film 131, and part of the airflow is located in the second gap 122 to form a second air film 132.

[0095] It should be noted that the pressure of the first air film 131 is negatively correlated with the thickness of the first gap 121, and the pressure of the second air film 132 is negatively correlated with the thickness of the second gap 122. When the pressure of the first air film 131 is greater than the pressure of the second air film 132, the turntable 112 moves toward the second gap 122, increasing the thickness of the first gap 121 and decreasing the thickness of the second gap 122, thereby increasing the pressure of the second air film 132 and decreasing the pressure of the first air film 131. This drives the turntable 112 to move toward the first gap 121, which in turn decreases the thickness of the first gap 121 and increases the thickness of the second gap 122, thus making the pressure of the first air film 131 greater than the pressure of the second air film 132. This process repeats itself, causing the pressure difference between the first air film 131 and the second air film 132 to change periodically.

[0096] In some embodiments, when the thickness of the first gap 121 is minimum and the thickness of the second gap 122 is maximum, the pressure of the first air film 131 is greater than the pressure of the second air film 132; when the thickness of the first gap 121 is maximum and the thickness of the second gap 122 is minimum, the pressure of the first air film 131 is less than the pressure of the second air film 132.

[0097] In other embodiments, when the thickness of the first gap 121 is minimum and the thickness of the second gap 122 is maximum, the pressure of the first air film 131 is less than the pressure of the second air film 132, and the pressure difference between the first air film 131 and the second air film 132 is the minimum value of the range of pressure difference between the first air film 131 and the second air film 132; when the thickness of the first gap 121 is maximum and the thickness of the second gap 122 is minimum, the pressure of the first air film 131 is less than the pressure of the second air film 132, and the pressure difference between the first air film 131 and the second air film 132 is the maximum value of the range of pressure difference between the first air film 131 and the second air film 132.

[0098] The pressure difference between the first air film 131 and the second air film 132 changes periodically, causing the difference between the supporting force of the airflow in the accommodating space 12a on the second direction z and the gravity of the spindle 11 to change periodically, thereby causing the spindle 11 to reciprocate in its axial direction z and generate high-frequency vibration.

[0099] Therefore, the vibration spindle assembly 10 of the circuit board processing equipment 100 provided in this application embodiment is an air-floating vibration spindle. The viscous resistance of the air film is only 1 / 1000 of that of the oil film, and the rotational resistance of the spindle 11 is small, so that the rotational speed of the spindle 11 can reach 200,000 RPM-500,000 RPM. While the spindle 11 can vibrate along the second direction z, it can also have a high rotational speed, thereby improving the processing accuracy of the circuit board processing equipment 100 provided in this application embodiment.

[0100] In some other embodiments provided in this application, the spindle 11 is floating on the bearing assembly 12 by magnetic levitation.

[0101] In some embodiments provided in this application, the workbench assembly 20 includes a workbench surface 21 and a workbench vibration assembly 22; the workbench surface 21 is used to fix the circuit board; the workbench vibration assembly 22 is connected to the workbench surface 21 and is used to drive the workbench surface 21 to vibrate along the second direction z.

[0102] like Figure 2 As shown, the worktable 21 can be either a T-slot worktable or a vacuum adsorption worktable. The circuit board can be directly fixed on the side of the worktable 21 facing the vibrating spindle assembly 10, or the circuit board can be fixed on the side of the worktable 21 facing the vibrating spindle assembly 10 by a fixing clamp.

[0103] The table vibration assembly 22 is connected to the worktable 21. The table vibration assembly 22 is used to generate high-frequency mechanical vibration and transmit the vibration to the worktable 21, so that the worktable 21 can generate high-frequency low-amplitude vibration relative to the vibrating spindle assembly 10 in the second direction z. Thus, when the circuit board processing equipment 100 provided in this application drills holes in the circuit board, the processing tool 001 mounted on the vibrating spindle assembly 10 generates high-frequency vibration along the second direction z relative to the circuit board mounted on the worktable 21.

[0104] In some embodiments, the table vibration assembly 22 is disposed on the side of the worktable 21 facing away from the vibration spindle assembly 10 in the second direction z, and the table vibration assembly 22 is connected between the worktable 21 and the bed 31.

[0105] In other embodiments, the table vibration assembly 22 is disposed on at least one side of the worktable 21 in the first direction x and / or at least one side of the worktable 21 in the third direction y, and the table vibration assembly 22 is connected between the worktable 21 and the bed 31.

[0106] In other embodiments, the table vibration assembly 22 is only connected to the worktable 21, and the table vibration assembly is disposed on the side of the worktable 21 in the second direction z facing the vibration spindle assembly 10, or the table vibration assembly 22 is disposed on at least one side of the worktable 21 in the first direction x, or the table vibration assembly 22 is disposed on at least one side of the worktable 21 in the third direction y.

[0107] In some embodiments, the table vibration assembly 22 includes a fixed member and a movable member, the movable member generating high-frequency vibrations relative to the fixed member along a second direction z, and the movable member being connected to the worktable 21 to transmit the vibrations of the movable member to the worktable 21.

[0108] In some embodiments, the movable part is connected to the worktable 21 by a motion mechanism such as a lever, gear, or cam, so as to amplify the stroke of the small-amplitude vibration generated by the movable part and transmit it to the worktable 21.

[0109] In some embodiments provided in this application, the table vibration assembly 22 includes one of a motor drive assembly, a piezoelectric ceramic vibration assembly, and a pneumatic hydrostatic vibration assembly.

[0110] In some embodiments, the output shaft of the motor drive assembly is connected to the table vibration assembly 22 via any one of a cam mechanism, a crank-slider mechanism, a gear and rack mechanism, and a screw mechanism, so as to convert the rotational motion of the output shaft of the motor drive assembly into linear reciprocating motion along the second direction z, driving the worktable 21 to vibrate along the second direction z.

[0111] In some embodiments, the piezoelectric ceramic vibration assembly includes a thin circular piezoelectric ceramic and an AC component. The AC component is electrically connected to the piezoelectric ceramic. The electrode surface of the piezoelectric ceramic is perpendicular to the polarization direction and its diameter is much larger than its thickness. When the AC component applies an alternating voltage to the piezoelectric ceramic, a small deformation occurs inside the piezoelectric ceramic, which triggers vibration. The piezoelectric ceramic is connected by motion mechanisms such as levers, gears, and cams to amplify the stroke of the small amplitude vibration generated by the piezoelectric ceramic and transmit it to the worktable 21 to drive the worktable 21 to vibrate along the second direction z.

[0112] In some embodiments, the pneumatic vibration assembly includes a movable member and a fixed member. The movable member is floatingly assembled within the fixed member, and air films are formed on both sides of the movable member in the second direction z. The pressure difference between the air films on both sides of the movable member in the second direction z changes periodically to drive the movable member to reciprocate along the second direction z. The movable member is connected to the worktable 21 to drive the worktable 21 to vibrate along the second direction z.

[0113] In some embodiments provided in this application, the circuit board processing equipment 100 further includes an identification component 60, which is connected to the vibrating spindle assembly 10. The identification component 60 is used to identify the actual position of the hole to be processed in the circuit board carried by the worktable assembly 20.

[0114] like Figure 2 and Figure 3As shown, there are multiple identification components 60, each fixedly connected to the vibration spindle assembly 10 in a one-to-one correspondence. In some embodiments, the identification component 60 is a camera. The identification component 60 is used to photograph the surface of the circuit board to obtain image information of the circuit board surface. The surface of the circuit board is provided with identification points with a set pattern. The identification component 60 can identify the identification points on the surface of the circuit board and obtain the coordinates of the identification points on the circuit board relative to the identification component 60 based on the image information of the circuit board surface. Based on the coordinates of the identification points relative to the identification component 60, the actual position of the hole to be processed in the circuit board is obtained.

[0115] The circuit board processing equipment 100 provided in this application embodiment can calculate the target motion path of the mandrel 11 relative to the worktable based on the coordinates of the identification points on the circuit board relative to the identification component 60. The mandrel 11 can arrange the identification points on the circuit board surface and the identification component 60 relative to each other along the second direction z according to the above motion path. When the identification points on the circuit board surface and the identification component 60 are arranged relative to each other along the second direction z, the processing tool 001 at the end of the mandrel 11 is arranged relative to the position of the circuit board to be drilled along the second direction z, so that the circuit board processing equipment 100 provided in this application embodiment can drill holes at a preset position on the circuit board.

[0116] In some embodiments provided in this application, the circuit board processing equipment 100 further includes a detection component (not shown in the figure) for detecting the motion state of at least one of the mandrel 11 and the worktable assembly 20.

[0117] In some embodiments, the detection component includes a high-precision position sensor such as a laser interferometer, a capacitive sensor, or a grating sensor, and detects the vibration motion state of the spindle 11 relative to the bearing assembly 12 (i.e., the vibration motion state of the spindle 11 relative to the gantry 32 or the bed 31).

[0118] In other embodiments, the detection component is used to detect the relative position of the machining tool 001 at the end of the mandrel 11 and the circuit board mounted on the worktable 21.

[0119] The detection component is electrically connected to the table vibration component 22 to transmit the vibration motion state of the spindle 11 relative to the gantry 32 or the bed 31 to the table vibration component 22, so that the table vibration component 22 adjusts the vibration motion state of the worktable 21 according to the vibration motion state of the spindle 11 relative to the gantry 32 or the bed 31.

[0120] In some embodiments provided in this application, the circuit board processing equipment 100 further includes a shock-absorbing assembly (not shown in the figure), which is disposed on the bottom side of the bed 31, and the gantry 32 and the bed 31 are configured to swing as a whole relative to the shock-absorbing assembly.

[0121] The stiffness at the connection between the gantry 32 and the bed 31 is greater than either the stiffness of the gantry 32 or the stiffness of the bed 31. When the circuit board processing equipment 100 provided in this application performs drilling on the circuit board, the gantry 32 and the bed 31 are able to avoid relative swaying. Under the combined influence of the vibration of the spindle 11 and the vibration of the worktable 21, the gantry 32 and the bed 31 sway together relative to the shock absorption assembly, thereby reducing the positional error between the spindle 11 and the worktable 21 caused by vibration and improving the processing accuracy of the circuit board processing equipment 100 provided in this application.

[0122] In some embodiments provided in this application, the circuit board processing equipment 100 includes a third drive assembly connected between the worktable assembly 20 and the bed 31 to drive the worktable assembly 20 to move along a third direction y.

[0123] In some embodiments provided in this application, the circuit board processing equipment 100 includes a fourth drive assembly connected between the crossbeam 321 and the vibrating spindle assembly 10, so as to drive the vibrating spindle assembly 10 to move along the second direction z.

[0124] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board processing equipment, characterized in that, include: A bed, a gantry mounted on the bed, and at least one worktable assembly, the gantry including a crossbeam extending in a first direction; At least two vibrating spindle assemblies are configured to drive a high-speed rotating machining tool to vibrate in a second direction at a set amplitude and frequency during machining, so that the machining tool and the circuit board form periodic contact and separation, and at least two of the vibrating spindle assemblies are movably disposed on the crossbeam along the first direction; At least one of the crossbeam and the worktable assembly is movable relative to the bed along a third direction, wherein the first direction, the second direction, and the third direction are orthogonal to each other.

2. The circuit board processing equipment as described in claim 1, characterized in that: The gantry frame further includes at least two support seats spaced apart along the first direction, the support seats being connected between the bed and the crossbeam; The support base and the bed are movably connected so that the crossbeam can move relative to the bed in the third direction.

3. The circuit board processing equipment as described in claim 2, characterized in that: The circuit board processing equipment further includes a first drive assembly, which is used to drive the gantry to move relative to the bed along the third direction. The first drive assembly includes at least one first drive element and at least two first guide rails. The first guide rails are disposed on the bed and extend along the third direction. The at least two first guide rails are arranged parallel and spaced apart along the first direction. The support base includes two side support bases, and a first slide is provided at the end of the side support base away from the crossbeam. The first slide is slidably connected to the first guide rail, and the first drive member is connected between the bed and at least one of the side support bases.

4. The circuit board processing equipment as described in claim 3, characterized in that: At least two of the first guide rails include two side guide rails and at least one intermediate guide rail, the intermediate guide rail being located between the two side guide rails; The gantry frame also includes a central support base, which is located between the two side support bases; The middle support seat is provided with a second slide at one end away from the crossbeam. The second slide is slidably connected to the middle guide rail, and the two first slides are slidably connected to the two side guide rails respectively. The circuit board processing equipment includes at least two worktable assemblies, which are spaced apart on both sides of the intermediate support along the first direction.

5. The circuit board processing equipment as described in claim 3, characterized in that: The circuit board processing equipment includes a second drive assembly for driving the vibration spindle assembly to move relative to the crossbeam along the first direction. The circuit board processing equipment includes at least two of the aforementioned vibration spindle assemblies. The second drive assembly includes at least two second drive members and a second guide rail. The second guide rail extends along the first direction and is disposed on the crossbeam. The vibration spindle assembly is slidably connected to the second guide rail. The second drive members are connected to the vibration spindle assembly in a one-to-one correspondence to drive the vibration spindle assembly to move along the second guide rail. The second guide rail includes multiple guide rail segments arranged along the first direction, and the vibration spindle assembly is correspondingly arranged with the guide rail segments, with adjacent guide rail segments spaced apart.

6. The circuit board processing equipment as described in any one of claims 1-5, characterized in that: The vibration spindle assembly includes a bearing assembly and a spindle. The bearing assembly is provided with a receiving space, and the spindle is disposed in the receiving space for driving the processing tool to process the circuit board on the worktable assembly along the second direction. In this configuration, at least one of the worktable assembly and the mandrel is capable of vibrating along the second direction.

7. The circuit board processing equipment as described in claim 6, characterized in that: The mandrel includes a core and a turntable; The shaft is rotatably mounted on the bearing assembly, and the turntable is connected to the shaft and rotatably disposed within the receiving space.

8. The circuit board processing equipment as described in claim 7, characterized in that: When the mandrel is floating in the receiving space, the vibrating spindle assembly also includes an air supply assembly. The air supply assembly is connected to the bearing assembly. When the air supply assembly supplies gas to the receiving space, the turntable is suspended in the receiving space. A first gap and a second gap are formed between the turntable and the side wall of the receiving space. The first gap can form a first air film, and the second gap can form a second air film. The pressure difference between the first air film and the second air film changes periodically, causing the turntable to drive the mandrel to reciprocate along the second direction.

9. The circuit board processing equipment as described in claim 6, characterized in that: The worktable assembly is fixed to the bed and includes a worktable surface and a worktable vibration assembly; The workbench surface is used to support the circuit board; The table vibration assembly is connected to the worktable and is used to drive the worktable to vibrate along the second direction.

10. The circuit board processing equipment as described in any one of claims 1-5, characterized in that: The processing equipment also includes an identification component, which is connected to the vibrating spindle assembly. The identification component is used to identify the actual position of the hole to be processed in the circuit board carried by the worktable assembly. And / or, the processing equipment further includes a detection component for detecting the motion state of at least one of the vibrating spindle assembly and the worktable assembly.

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