Circuit board processing apparatus

Abstract

The application provides a circuit board processing equipment, which comprises a rack, at least two vibration spindle assemblies and a first guide rail. The vibration spindle assemblies are configured to drive a high-speed rotating processing tool to vibrate in a first direction with a set amplitude and frequency during processing, so that the processing tool and the circuit board form periodic contact and separation. The first guide rail extends in a second direction and is arranged on the rack. The vibration spindle assemblies are slidingly arranged on the first guide rail. The first guide rail comprises at least two guide rail sections arranged in the second direction. The guide rail sections are arranged correspondingly with the vibration spindle assemblies, and adjacent two guide rail sections are arranged at intervals. The circuit board processing equipment provided by the application has the advantage of high processing quality.

Description

Technical Field

[0001] This application belongs to the field of circuit board processing technology, and more specifically, relates to a circuit board processing equipment. Background Technology

[0002] Mechanical drilling is a key process for processing micro-holes in printed circuit boards (PCBs). Through micro-holes on the circuit board, efficient connections between circuit board layers can be achieved, meeting the needs of complex circuit designs. In the current technology, multi-axis drilling machines are used to process circuit boards.

[0003] However, in the multi-spindle drilling machine of the related technology, the vibration generated by the spindle is easily transmitted to the other spindle during machining, causing the vibrations between the spindles to interfere with each other, resulting in the problem of low machining quality in the multi-spindle drilling machine of the related technology. Utility Model Content

[0004] The purpose of this application is to provide a circuit board processing equipment to solve the technical problem of low processing quality in existing multi-axis drilling machines.

[0005] The circuit board processing equipment provided in this application includes: a frame; at least two vibrating spindle assemblies configured to drive a high-speed rotating processing tool to vibrate in a first direction at a set amplitude and frequency during processing, so that the processing tool and the circuit board form periodic contact and separation; a first guide rail extending along a second direction, the second direction being orthogonal to the first direction, and the first guide rail being disposed on the frame, the vibrating spindle assemblies being slidably connected to the first guide rail; wherein, the first guide rail includes at least two guide rail segments arranged along the second direction, the guide rail segments being correspondingly disposed with the vibrating spindle assemblies, and adjacent two guide rail segments being spaced apart.

[0006] The beneficial effects of the circuit board processing equipment provided in this application embodiment are as follows: Compared with the prior art, when at least two vibrating spindle assemblies of the circuit board processing equipment provided in this application embodiment are processed simultaneously, the spacing between the guide rail sections can prevent the vibration generated by any one vibrating spindle assembly from being transmitted to the other vibrating spindle assembly through the first guide rail, thus affecting the processing accuracy of the other vibrating spindle assembly. Therefore, the circuit board processing equipment provided in this application embodiment has the advantage of high processing accuracy.

[0007] Optionally, there are at least two first guide rails, and the at least two first guide rails are arranged at intervals along the first direction.

[0008] Optionally, the circuit board processing equipment further includes a first driving member corresponding to the number of at least two guide rail segments, the first driving member being connected to the vibration spindle assembly to drive the vibration spindle assembly to move along the first guide rail.

[0009] Optionally, the frame includes a bed and a gantry frame, the gantry frame includes a support base and a crossbeam, the crossbeam extends along the second direction, the support base is connected between the bed and the crossbeam, and the first guide rail is disposed on the crossbeam.

[0010] Optionally, the circuit board processing equipment includes at least one second driving member and at least two second guide rails. The second guide rails are disposed on the bed and extend along a third direction. The third direction is orthogonal to the second direction. The at least two second guide rails are arranged parallel to each other and spaced apart along the second direction. The support base includes two side support bases, and a first slide is provided at the end of the side support base away from the crossbeam. The first slide is slidably connected to the second guide rail, and the second drive member is connected between the bed and at least one of the side support bases.

[0011] Optionally, the second guide rail includes two side guide rails and at least one intermediate guide rail, the intermediate guide rail being located between the two side guide rails; The gantry frame includes a central support base, which is located between the two side support bases; The middle support seat is provided with a second slide at one end away from the crossbeam. The second slide is slidably connected to the middle guide rail, and the two first slides are slidably connected to the two side guide rails respectively.

[0012] Optionally, the vibration spindle assembly includes a bearing assembly and a mandrel. The bearing assembly is provided with a receiving space, and the mandrel is disposed in the receiving space for driving a processing tool to process the circuit board along the first direction. The mandrel is capable of vibrating along the first direction.

[0013] Optionally, the mandrel includes a core and a turntable; The shaft is rotatably inserted through the bearing assembly, and the turntable is connected to the shaft and rotatably disposed within the receiving space; The vibrating spindle assembly also includes an air supply assembly connected to the bearing assembly. When the air supply assembly supplies gas to the accommodating space, the turntable is suspended within the accommodating space. A first gap and a second gap are formed between the turntable and the side wall of the accommodating space. The first gap can form a first air film, and the second gap can form a second air film. The pressure difference between the first air film and the second air film changes periodically, causing the turntable to drive the spindle to reciprocate along the first direction.

[0014] Optionally, the circuit board processing equipment further includes a worktable assembly, the worktable assembly including a worktable surface; The workbench is fixed to the frame and is used to support the circuit board.

[0015] Optionally, the worktable assembly further includes a table vibration assembly, which is used to drive the worktable surface to vibrate along the first direction. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the circuit board processing equipment provided in the embodiments of this application; Figure 2 for Figure 1 A magnified view of a portion of point A in the middle; Figure 3 for Figure 2 Schematic diagram of the cross section at point BB; Figure 4 for Figure 1 A magnified view of a portion of point C in the middle; Figure 5 This is a schematic diagram of the structure of a circuit board processing equipment provided in another embodiment of this application.

[0018] The following are the labeling elements in the figure: 100. Circuit board processing equipment; 10. Vibration spindle assembly; 11. Mandrel; 111. Shaft core; 112. Turntable; 12. Bearing assembly; 12a. Accommodation space; 121. First gap; 122. Second gap; 131. First air film; 132. Second air film; 20. Workbench assembly; 21. Workbench surface; 22. Workbench vibration assembly; 30. Frame; 31. Bed; 32. Gantry frame; 321. Crossbeam; 322. Support base; 322a. Side support base; 322b. Intermediate support base; 41. Second driving component; 42. Second guide rail; 421. Side guide rail; 422. Middle guide rail; 51. First driving component; 52. First guide rail; 521. Guide rail section; 522. Clearance; 60. Identification components; 001. Machining cutting tools; z - First direction; y - Third direction; x - Second direction. Detailed Implementation

[0019] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0020] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0021] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0023] Mechanical drilling is a key process for machining micro-holes on circuit boards. When machining circuit boards using a multi-spindle drilling machine, the vibrations generated by different spindles couple with each other, affecting the accuracy of the drilling process.

[0024] To address the aforementioned technical problems, this application provides a circuit board processing device 100.

[0025] Please refer to the following: Figure 1 and Figure 2 The circuit board processing equipment provided in the embodiments of this application will now be described.

[0026] The circuit board processing equipment 100 provided in this application embodiment includes a frame 30, at least two vibrating spindle assemblies 10 and a first guide rail 52.

[0027] In some embodiments, the vibrating spindle assembly 10 and the first guide rail 52 are both disposed on the frame 30, and the vibrating spindle assembly 10 and the first guide rail 52 are connected through the frame 30.

[0028] In some embodiments, the vibratory spindle assembly 10 is used to mount a machining tool 001 to perform machining such as drilling on a circuit board disposed on the frame 30. The vibratory spindle assembly 10 is also configured to drive the machining tool 001 to vibrate, as will be described in the following embodiments.

[0029] In some embodiments provided in this application, the circuit board processing equipment 100 includes a first guide rail 52, which extends along a second direction x and is disposed on a crossbeam 321. The vibration spindle assembly 10 is slidably mounted on the first guide rail 52.

[0030] like Figure 2 As shown, the first guide rail 52 includes at least two guide rail segments 521 arranged along the second direction x. The vibration spindle assembly 10 is arranged correspondingly to the guide rail segments 521, and adjacent guide rail segments 521 are spaced apart to form a gap between adjacent guide rail segments 521. Figure 2 The gap shown is 522.

[0031] like Figure 2 and Figure 3 As shown, the first guide rail 52 extends along the second direction x. The first guide rail 52 includes at least two guide rail segments 521. The at least two guide rail segments 521 have the same cross-sectional shape in a plane orthogonal to the second direction x, so that the first drive member 51 can drive the corresponding vibration spindle assembly 10 to move between two adjacent guide rail segments 521. The two adjacent guide rail segments 521 are arranged at intervals.

[0032] In some embodiments, a vibration spindle assembly 10 is provided on each guide rail segment 521.

[0033] In other embodiments, each guide rail segment 521 is provided with a plurality of vibration spindle assemblies 10, and the number of vibration spindle assemblies 10 on each guide rail segment 521 is the same.

[0034] In other embodiments, each guide rail segment 521 is provided with a plurality of vibration spindle assemblies 10, and the number of vibration spindle assemblies 10 on each guide rail segment 521 is different.

[0035] The beneficial effects of the circuit board processing equipment 100 provided in this application embodiment are as follows: by setting the first guide rail 52 as a multi-segment structure, the mechanical vibration generated by the vibrating spindle assembly 10 can be prevented from being transmitted from one guide rail segment 521 to another guide rail segment 521, thereby preventing the vibration generated by one vibrating spindle assembly 10 from affecting another vibrating spindle assembly 10, thereby improving the stability of the processing equipment and improving the processing accuracy of the circuit board processing equipment 100 provided in this application embodiment during multi-axis processing.

[0036] In some embodiments provided in this application (not shown in the figures), limiting members are provided on both sides of each guide rail segment 521. The limiting members can be strip-shaped or sheet-shaped devices. Two sets of limiting members are spaced apart on both sides of the guide rail segment 521 along the second direction x. At the same time, abutting members facing the third direction y are also provided on both sides of the vibration spindle assembly 10. When the vibration spindle assembly 10 moves to the edge of the guide rail segment 521, the abutting members abut against the limiting members to prevent the vibration spindle assembly 10 from disengaging from the guide rail segment 521.

[0037] In some embodiments provided in this application (not shown in the figures), a buffer is provided between two adjacent guide rail segments 521. The buffer fills the gap between the two adjacent guide rail segments 521, and the cross-sectional shape of the buffer in the plane orthogonal to the second direction x is the same as the cross-sectional shape of the guide rail segment 521 in the plane orthogonal to the second direction x. The buffer is made of elastic material.

[0038] Thus, on the one hand, the buffer filter removes mechanical vibration between two adjacent guide rail segments 521, preventing mechanical vibration from being transmitted between the two adjacent guide rail segments 521. On the other hand, the buffer keeps the first guide rail 52 in its complete shape, improving the accuracy of the first drive member 51 in driving the vibration spindle assembly 10 to move in the second direction x.

[0039] In some embodiments provided in this application, there are at least two first guide rails 52, and multiple first guide rails 52 are arranged parallel to each other and spaced apart in the first direction z.

[0040] In some embodiments, the vibration spindle assembly is slidably mounted on a plurality of first guide rails.

[0041] like Figure 2 and Figure 3 As shown, there are two first guide rails 52, which are respectively disposed on both sides of the first drive member 51 in the first direction z. Thus, by setting two first guide rails 52, the number of support points of the second drive assembly 50 on the vibration spindle assembly 10 is increased, thereby improving the rigidity of the vibration spindle assembly 10 mounted on the second drive assembly 50 and ensuring the processing accuracy of the circuit board processing equipment 100 provided in this application embodiment.

[0042] In other embodiments, the number of first guide rails 52 is an integer greater than 2.

[0043] In some embodiments provided in this application, the circuit board processing equipment 100 further includes a first drive member 51 corresponding to the number of at least two guide rail segments 521. The first drive member 51 is connected to the vibrating spindle assembly 10 to drive the vibrating spindle assembly 10 to move along the first guide rail 52. In this embodiment, by configuring corresponding drive members and guide rails for each vibrating spindle assembly, each vibrating spindle assembly can be individually driven by the corresponding set of drive members and guide rails (synchronous configuration of individual position detection, such as the axis grating ruler corresponding to the vibrating spindle assembly, the axis grating ruler corresponding to the worktable assembly, etc.), further improving processing accuracy. This method can be applied to structures where the crossbeam moves or the crossbeam is fixed.

[0044] In some embodiments, the first driving member 51 can be any one of a linear motor, a lead screw and nut mechanism, a gear and rack mechanism, a hydraulic cylinder, or a pneumatic cylinder, and the first guide rail 52 can be any one of a linear rolling guide rail or a linear sliding guide rail.

[0045] In some embodiments, each vibrating spindle assembly 10 is connected to a first drive element 51.

[0046] In other embodiments, each vibration spindle assembly 10 is connected to a plurality of first drive elements 51.

[0047] In other embodiments, each first drive element 51 is connected to a plurality of vibrating spindle assemblies 10.

[0048] like Figure 2 and Figure 3 As shown, multiple vibrating spindle assemblies 10 are arranged at intervals along the second direction x. The spindle is driven to move in the second direction x by the first driving member 51, and the weight of the spindle is supported by the first guide rail 52. Each vibrating spindle assembly 10 includes the aforementioned bearing assembly 12 and spindle 11. The first driving member 51 is arranged corresponding to the vibrating spindle assembly 10 so that the corresponding vibrating spindle assembly 10 is driven to move along the second direction x by the first driving member 51, thereby driving the vibrating spindle assembly 10 together with the spindle 11 and the machining tool 001 at the end of the spindle 11 to move relative to each other in the second direction x, and moving the machining tool 001 at the end of the spindle 11 relative to the circuit board to the position where drilling is required.

[0049] In some embodiments provided in this application, the circuit board processing equipment 100 further includes a frame 30, which includes a bed 31 and a gantry 32. The gantry 32 includes a support 322 and a crossbeam 321. The crossbeam 321 extends along a second direction x orthogonal to the axis z of the spindle 11, and the crossbeam 321 and the bed 31 are spaced apart along a first direction z. The support 322 is connected between the bed 31 and the crossbeam 321, and a first guide rail 52 is provided on the crossbeam.

[0050] Thus, the vibrating spindle assembly 10 is movably mounted on the crossbeam 321 along the second direction x, and the worktable assembly 20 is mounted on the bed 31. The worktable assembly 20 and the vibrating spindle assembly 10 are arranged opposite each other along the first direction z.

[0051] In some embodiments provided in this application, such as Figure 1 and Figure 4 As shown, the circuit board processing equipment 100 includes at least one second drive member 41 and at least two second guide rails 42. The second guide rails 42 are disposed on the bed 31 and extend along a third direction y. The plurality of second guide rails 42 are arranged parallel and spaced apart along a second direction x.

[0052] There are multiple support seats 322, including two side support seats 322a. The side support seat 322a is provided with a first slide at the end away from the crossbeam 321. The first slide is slidably connected to the second guide rail 42. The second drive member 41 is connected between the bed 31 and at least one side support seat 322a.

[0053] In some embodiments, the second drive member 41 can be any one of a linear motor, a lead screw and nut mechanism, a gear and rack mechanism, a hydraulic cylinder, or a pneumatic cylinder, and the second guide rail 42 can be any one of a linear rolling guide rail or a linear sliding guide rail.

[0054] The first slide is slidably connected to the second guide rail 42 so that the second drive member 41 can drive the gantry 32 to move relative to the bed 31 in the third direction y, thereby driving the vibrating spindle assembly 10 together with the spindle 11 and the machining tool 001 at the end of the spindle 11 to move relative to the bed 31 in the third direction y.

[0055] In some embodiments provided in this application, the plurality of second guide rails 42 include two side guide rails 421 and at least one intermediate guide rail 422, wherein the intermediate guide rail 422 is located between the two side guide rails 421; The gantry frame 32 includes a middle support 322b, which is located between two side support 322a. The middle support 322b is provided with a second slide at the end away from the crossbeam 321. The second slide is slidably mounted on the middle guide rail 422, and the two first slides are slidably mounted on the two side guide rails 421 respectively.

[0056] like Figure 1 , Figure 4 and Figure 5 As shown, the two side support seats 322a are respectively connected to the two ends of the crossbeam 321 in the second direction x. The middle support seat 322b is parallel to the side support seats 322a and is arranged at intervals along the second direction x. The middle support seat 322b is connected to the crossbeam 321. The first slide is slidably assembled on the side guide rail 421, and the second slide is slidably assembled on the middle guide rail 422. Thus, the middle section of the crossbeam 321 is supported by the middle support seat 322b, which improves the rigidity of the crossbeam 321 and reduces the deformation of the cantilever part of the crossbeam 321.

[0057] Furthermore, it should be noted that the above-mentioned configuration of the intermediate support seat is not limited to the technical solution of moving the crossbeam and the bed, but can also be applied to the technical solution of keeping the crossbeam and the bed fixed. By configuring the intermediate support seat 322b between the two side support seats 322a, this structure allows multiple vibrating spindle assemblies 10 to be configured, which can support the middle section of the crossbeam 321 through the intermediate support seat 322b, thereby improving the rigidity of the crossbeam 321, reducing the deformation of the cantilever part of the crossbeam 321, and thus improving the processing efficiency and processing accuracy.

[0058] In some embodiments, the second drive member 41 is connected to the side support 322a.

[0059] In other embodiments, the second drive member 41 is connected to the intermediate support 322b.

[0060] In other embodiments, there are multiple second drive members 41, some of which are connected to the side support 322a and some of which are connected to the middle support 322b.

[0061] In some embodiments, there is one intermediate support 322b, and the intermediate support 322b is equidistant from the two side supports 322a in the third direction y.

[0062] In other embodiments, there are multiple intermediate support seats 322b, which are arranged parallel to each other along the second direction x.

[0063] In some embodiments, the distance between any two adjacent intermediate supports 322b in the second direction x is the same as the distance between the nearest side support 322a and the side support 322a in the second direction x.

[0064] In some embodiments provided in this application, such as Figure 3As shown, the vibrating spindle assembly 10 includes a bearing assembly 12 and a spindle 11. The bearing assembly 12 is provided with a receiving space 12a, and the spindle 11 is disposed in the receiving space 12a. It is used to drive the processing tool 001 to process the circuit board on the worktable assembly 20 along the first direction z. The spindle 11 can vibrate along the first direction z.

[0065] In some embodiments, the bearing assembly 12 has a receiving space 12a, and at least a portion of the spindle 11 is fitted within the receiving space 12a. The spindle 11 extends along a first direction z, i.e., the first direction z is the axial direction of the spindle 11. One end of the spindle 11 in the axial direction z protrudes from the bearing assembly 12 so that the end in the first direction z can be used to install a machining tool 001.

[0066] In some embodiments, the machining tool 001 may be a drill bit.

[0067] In other embodiments, the machining tool 001 can be a milling cutter, grinding disc, or other machining tool.

[0068] The spindle 11 can vibrate along the first direction z. When the machining tool mounted on the spindle 11 processes the circuit board, the machining tool mounted on the spindle 11 and the circuit board generate a relatively high-frequency reciprocating motion.

[0069] On the one hand, the pulsed cutting force causes the chip thickness to change periodically, causing the chips to break at weak points and form short fragments, thus avoiding long fragments from entangled in the machining tool and clogging the chip removal groove. On the other hand, vibratory drilling causes the drill bit to periodically detach from the circuit board during the cutting process, releasing the cutting force instantaneously and reducing the adhesion between the chips and the rake face. Through the periodic contact and separation between the drill bit and the circuit board, the formation of a cold solder layer on the surface of the machining tool is avoided, thereby reducing the friction between the chips and the machining tool. This improves the forming quality of the holes drilled on the circuit board by the circuit board processing equipment 100 provided in this application embodiment, giving the circuit board processing equipment 100 provided in this application embodiment the advantage of high processing quality.

[0070] Furthermore, in practical applications, the inventors have found that the rotational speed of existing vibratory drilling spindles is relatively low. This low speed results in poor hole wall processing quality, which cannot meet the requirements for micro-hole processing in circuit boards. To solve the above problems, in some embodiments provided in this application, the mandrel 11 is floatingly disposed in the receiving space 12a.

[0071] like Figure 3 As shown, at least a portion of the mandrel 11 is gap-fitted with the bearing assembly 12 so that the mandrel 11 is floatingly disposed within the receiving space 12a, so that the mandrel 11 can be displaced relative to the bearing assembly 12 in a first direction z, so that the mandrel 11 vibrates relative to the bearing assembly 12 along its axial direction z.

[0072] In other embodiments, the mandrel 11 is gap-fitted within the receiving space 12a so that the mandrel 11 can be displaced radially relative to the bearing assembly 12.

[0073] In some other embodiments provided in this application (not shown in the figures), the mandrel 11 is fixedly disposed in the receiving space 12a. At least a portion of the mandrel 11 is fixedly assembled in the receiving space 12a so that the mandrel 11 can vibrate together with the bearing assembly 12 along its first direction z.

[0074] In some embodiments provided in this application, the spindle 11 includes a core 111 and a turntable 112; the core 111 is rotatably disposed on the bearing assembly 12, and the turntable 112 is connected to the core 111 and located within the receiving space 12a.

[0075] like Figure 3 As shown, the shaft core 111 extends along the axial direction z of the spindle 11, the turntable 112 protrudes from the outer periphery of the shaft core 111, and the turntable 112 extends in a closed manner along the circumference of the shaft core 111. The inner wall of the bearing assembly 12 is provided with an annular groove, and a receiving space 12a is formed in the annular groove. The turntable 112 is rotatably assembled in the annular groove. The shaft core 111 passes through the bearing assembly 12 along the axial direction z of the spindle 11, and one end of the shaft core 111 is used to install the machining tool 001.

[0076] Therefore, when the spindle 11 is floating on the bearing assembly 12 and rotates around its axis, it is rotatably fitted within the receiving space 12a by the turntable 112, thereby improving the rotational accuracy of the spindle 11.

[0077] In other embodiments, the spindle 11 includes a plurality of turntables 112, which are arranged parallel to each other along the axial direction z of the spindle 11. The bearing assembly 12 includes a plurality of receiving spaces 12a, and the turntables 112 are rotatably assembled in the receiving spaces 12a in a one-to-one correspondence.

[0078] In some embodiments provided in this application, the vibration spindle assembly 10 further includes a stator and a rotor. The rotor is rotatably mounted inside the stator and is connected to the spindle 11. The bearing assembly 12 is disposed on the stator. The rotor drives the spindle 11 to rotate around the axis of the spindle 11 through the periodically changing magnetic field generated by the stator.

[0079] In some embodiments provided in this application, the circuit board processing equipment 100 further includes an air supply assembly (not shown in the figure). The air supply assembly is connected to the bearing assembly 12. When the air supply assembly supplies gas to the receiving space 12a, the turntable 112 is suspended in the receiving space 12a and divides the receiving space 12a into a first gap 121 and a second gap 122 along the axial direction z of the spindle 11. The first gap 121 can form a first air film 131, and the second gap 122 can form a second air film 132. The pressure difference between the first air film 131 and the second air film 132 changes periodically, causing the turntable 112 to drive the spindle 11 to reciprocate along its axial direction z.

[0080] The air supply assembly includes an air pump and an air delivery pipe. The air delivery pipe is connected to the bearing assembly 12, and the air pump is connected to the receiving space 12a through the air delivery pipe, so that the air supply assembly inputs gas into the receiving space 12a to form an airflow. The turntable 112 forms a first gap 121 between one side of the spindle 11 in the first direction z and the inner wall of the receiving space 12a. The turntable 112 forms a second gap 122 between the other side of the spindle 11 in the first direction z and the inner wall of the receiving space 12a. Part of the airflow is located in the first gap 121 to form a first air film 131, and part of the airflow is located in the second gap 122 to form a second air film 132.

[0081] It should be noted that the pressure of the first air film 131 is negatively correlated with the thickness of the first gap 121, and the pressure of the second air film 132 is negatively correlated with the thickness of the second gap 122. When the pressure of the first air film 131 is greater than the pressure of the second air film 132, the turntable 112 moves toward the second gap 122, increasing the thickness of the first gap 121 and decreasing the thickness of the second gap 122, thereby increasing the pressure of the second air film 132 and decreasing the pressure of the first air film 131. This drives the turntable 112 to move toward the first gap 121, which in turn decreases the thickness of the first gap 121 and increases the thickness of the second gap 122, thus making the pressure of the first air film 131 greater than the pressure of the second air film 132. This process repeats itself, causing the pressure difference between the first air film 131 and the second air film 132 to change periodically.

[0082] In some embodiments, when the thickness of the first gap 121 is minimum and the thickness of the second gap 122 is maximum, the pressure of the first air film 131 is greater than the pressure of the second air film 132; when the thickness of the first gap 121 is maximum and the thickness of the second gap 122 is minimum, the pressure of the first air film 131 is less than the pressure of the second air film 132.

[0083] In other embodiments, when the thickness of the first gap 121 is minimum and the thickness of the second gap 122 is maximum, the pressure of the first air film 131 is less than the pressure of the second air film 132, and the pressure difference between the first air film 131 and the second air film 132 is the minimum value of the range of pressure difference between the first air film 131 and the second air film 132; when the thickness of the first gap 121 is maximum and the thickness of the second gap 122 is minimum, the pressure of the first air film 131 is less than the pressure of the second air film 132, and the pressure difference between the first air film 131 and the second air film 132 is the maximum value of the range of pressure difference between the first air film 131 and the second air film 132.

[0084] The pressure difference between the first air film 131 and the second air film 132 changes periodically, causing the difference between the supporting force of the airflow in the accommodating space 12a on the spindle 11 along the axial direction z and the gravity of the spindle 11 to change periodically, thereby causing the spindle 11 to reciprocate in the first direction z and generate high-frequency vibration.

[0085] Therefore, the vibration spindle assembly 10 of the circuit board processing equipment 100 provided in this application embodiment is an air-floating vibration spindle. The viscous resistance of the air film is only 1 / 1000 of that of the oil film, and the rotational resistance of the spindle 11 is small, so that the rotational speed of the spindle 11 can reach 200,000 RPM-500,000 RPM. While the spindle 11 can vibrate along its axial direction z, it can also have a high rotational speed, thereby improving the processing accuracy of the circuit board processing equipment 100 provided in this application embodiment.

[0086] In some other embodiments provided in this application, the spindle 11 may also be floated on the bearing assembly 12 by magnetic levitation.

[0087] In some embodiments provided in this application, the circuit board processing equipment 100 further includes a worktable assembly 20, which includes a worktable surface 21; the worktable surface 21 is fixed to the frame 30 and is used to support the circuit board.

[0088] In some embodiments, the worktable assembly 20 is fixed to the bed 31, and the gantry 32 is movable relative to the bed 31 in the third direction y. The movement of the gantry 32 relative to the bed 31 drives the machining tool 001 to move relative to the circuit board in the third direction y. Compared with the scheme where the gantry 32 is fixed relative to the bed 31 and the worktable assembly 20 moves relative to the bed in the third direction y, the above embodiment can reduce the size of the bed 31 in the third direction y, thus reducing costs. On the other hand, since the worktable surface 21 is fixed, the movement offset is concentrated in the vibrating spindle assembly 10, making it easier to control the accuracy by adjusting the position of the vibrating spindle assembly 10 in the third direction y, thereby improving machining accuracy.

[0089] In some embodiments, the mandrel 11 is movable along a first direction z, thereby enabling the machining tool 001 to contact the circuit board and move along with the mandrel 11 to drill holes in the circuit board. Thus, the machining tool 001 mounted at the end in the first direction z can perform machining on the circuit board.

[0090] In some embodiments provided in this application, the workbench assembly 20 includes a workbench surface 21 and a workbench vibration assembly 22; the workbench surface 21 is used to fix the circuit board; the workbench vibration assembly 22 is used to drive the workbench surface 21 to vibrate along a first direction z.

[0091] like Figure 1 As shown, the worktable 21 can be either a T-slot worktable or a vacuum adsorption worktable. The circuit board can be directly fixed on the side of the worktable 21 facing the vibrating spindle assembly 10, or the circuit board can be fixed on the side of the worktable 21 facing the vibrating spindle assembly 10 by a fixing clamp.

[0092] The table vibration assembly 22 is connected to the worktable 21. The table vibration assembly 22 is used to generate high-frequency mechanical vibration and transmit the vibration to the worktable 21 so that the worktable 21 can generate high-frequency low-amplitude vibration relative to the vibrating spindle assembly 10 in the first direction z. Thus, when the circuit board processing equipment 100 provided in this application drills holes in the circuit board, the processing tool 001 mounted on the vibrating spindle assembly 10 generates high-frequency vibration along the axis z of the spindle 11 relative to the circuit board mounted on the worktable 21.

[0093] In some embodiments, the table vibration assembly 22 includes a fixed member and a movable member, the movable member generating high-frequency vibrations relative to the fixed member along the axial direction z of the spindle 11, and the movable member being connected to the worktable 21 to transmit the vibrations of the movable member to the worktable 21.

[0094] In some embodiments, the movable part is connected to the worktable 21 by a motion mechanism such as a lever, gear, or cam, so as to amplify the stroke of the small-amplitude vibration generated by the movable part and transmit it to the worktable 21.

[0095] In some embodiments provided in this application, the table vibration assembly 22 includes one of a motor drive assembly, a piezoelectric ceramic vibration assembly, and a pneumatic hydrostatic vibration assembly.

[0096] In some embodiments, the output shaft of the motor drive assembly is connected to the table vibration assembly 22 via any one of a cam mechanism, a crank-slider mechanism, a gear and rack mechanism, and a screw mechanism, so as to convert the rotational motion of the output shaft of the motor drive assembly into linear reciprocating motion along the first direction z, driving the worktable 21 to vibrate along the axial direction z of the spindle 11.

[0097] In some embodiments, the piezoelectric ceramic vibration assembly includes a thin circular piezoelectric ceramic and an AC component. The AC component is electrically connected to the piezoelectric ceramic. The electrode surface of the piezoelectric ceramic is perpendicular to the polarization direction and its diameter is much larger than its thickness. When the AC component applies an alternating voltage to the piezoelectric ceramic, a small deformation occurs inside the piezoelectric ceramic, which triggers vibration. The piezoelectric ceramic is connected by motion mechanisms such as levers, gears, and cams to amplify the stroke of the small amplitude vibration generated by the piezoelectric ceramic and transmit it to the worktable 21 to drive the worktable 21 to vibrate along the first direction z.

[0098] In some embodiments, the pneumatic vibration assembly includes a movable member and a fixed member. The movable member is floatingly assembled within the fixed member, and air films are formed on both sides of the movable member in the first direction z. The pressure difference between the air films on both sides of the movable member in the first direction z changes periodically to drive the movable member to reciprocate along the first direction z. The movable member is connected to the worktable 21 to drive the worktable 21 to vibrate along the first direction z.

[0099] In some embodiments provided in this application, when both the worktable assembly 20 and the spindle 11 are vibrating, at any given time, the vibration direction of the spindle 11 along the axial direction z of the spindle 11 is the same as the vibration direction of the worktable assembly 20 along the axial direction z of the spindle 11.

[0100] The direction of movement of the spindle 11 and the direction of vibration of the worktable 21 are always the same. That is, when the spindle 11 vibrates toward one side of its axial direction z, the worktable 21 also vibrates in the same direction; when the spindle 11 moves toward the other side of its axial direction z, the worktable 21 also moves in the same direction.

[0101] Optionally, when the spindle 11 vibrates to the end of its vibration stroke, the spindle 11 moves at a speed of 0 and has no direction of movement. At the same time, the worktable 21 also vibrates to the end of its vibration stroke, and the worktable moves at a speed of 0 and has no direction of movement.

[0102] In some embodiments, the vibration frequency of the spindle 11 is the same as the vibration frequency of the worktable 21, and the vibration direction of the spindle 11 is always the same as the vibration direction of the worktable 21. When the circuit board processing equipment 100 provided in this application drills holes in the circuit board, the processing tool 001 installed on the vibrating spindle assembly 10 and the circuit board installed on the worktable 21 always move in the same direction.

[0103] In some embodiments, the vibration amplitude of the mandrel 11 is greater than the vibration amplitude of the worktable 21.

[0104] Therefore, the vibration amplitude of the machining tool 001 at the end of the mandrel 11 in the axial direction z of the mandrel 11 is also greater than the vibration amplitude of the circuit board in the axial direction z of the mandrel 11. When the machining tool 001 at the end of the mandrel 11 drills a hole in the circuit board mounted on the worktable, both the machining tool 001 and the circuit board vibrate along the axial direction z of the mandrel 11, and the vibration amplitude of the machining tool 001 is greater than the vibration amplitude of the circuit board. This allows the machining tool 001 to generate a high-frequency impact on the circuit board, thereby improving drilling efficiency and giving the circuit board processing equipment 100 in the above embodiment a high processing efficiency.

[0105] In some other embodiments, the vibration amplitude of the mandrel 11 is smaller than that of the worktable 21.

[0106] In some embodiments provided in this application, at any given time, the vibration direction of the mandrel 11 along the axial direction z of the mandrel 11 is opposite to the vibration direction of the worktable surface 21 along the axial direction z of the mandrel 11.

[0107] The vibration frequency of the spindle 11 is the same as that of the worktable 21, and the vibration direction of the spindle 11 is always opposite to that of the worktable 21. That is, when the spindle 11 moves along one side of its axial direction z, the worktable 21 moves toward the other side of the axial direction z of the spindle 11.

[0108] Optionally, when the spindle 11 vibrates to the end of its vibration stroke, the spindle 11 moves at a speed of 0 and has no direction of movement. At the same time, the worktable 21 also vibrates to the end of its vibration stroke, and the worktable moves at a speed of 0 and has no direction of movement.

[0109] As a result, the spindle 11 and the worktable 21 vibrate in opposite directions. On the one hand, this amplifies the relative speed of the machining tool 001 and the circuit board, which can effectively reduce the cutting force between the machining tool 001 and the circuit board. This can improve the feed rate of the machining tool 001 and increase the drilling efficiency. Furthermore, the relative vibration between the machining tool 001 and the circuit board can optimize the drill bit deflection phenomenon during drilling, thereby improving the drilling quality.

[0110] On the other hand, the vibration direction of the spindle 11 is opposite to that of the worktable 21, so that the vibration generated by the spindle 11 can cancel out the vibration generated by the worktable 21 in relation to the circuit board processing equipment 100 provided in this application embodiment, thereby suppressing the overall vibration of the circuit board processing equipment 100.

[0111] In some embodiments provided in this application, the circuit board processing equipment 100 further includes an identification component 60, which is connected to the vibrating spindle assembly 10. The identification component 60 is used to identify the actual coordinates of the holes to be processed in the circuit board carried by the worktable assembly 20.

[0112] like Figure 1 and Figure 2 As shown, there are multiple recognition components 60, and each recognition component 60 is fixedly connected to the vibration spindle assembly 10 in a one-to-one correspondence. In some embodiments, the recognition component 60 is a camera. The recognition component 60 is used to photograph the surface of the circuit board to obtain image information of the circuit board surface. The surface of the circuit board is provided with recognition points with a set pattern. The recognition component 60 can identify the recognition points on the surface of the circuit board and obtain the coordinates of the recognition points on the circuit board relative to the recognition component 60 based on the image information of the circuit board surface.

[0113] The circuit board processing equipment 100 provided in this application embodiment can calculate the target motion path of the mandrel 11 relative to the worktable based on the coordinates of the identification points on the circuit board relative to the identification component 60. The mandrel 11 can arrange the identification points on the surface of the circuit board and the identification component 60 relative to each other along the axial direction z of the mandrel 11 according to the above motion path. When the identification points on the surface of the circuit board and the identification component 60 are arranged relative to each other along the axial direction z of the mandrel 11, the processing tool 001 at the end of the mandrel 11 is arranged relative to the position of the circuit board where drilling is required along the axial direction z of the mandrel 11, so that the circuit board processing equipment 100 provided in this application embodiment can drill holes at a preset position on the circuit board.

[0114] In some embodiments provided in this application, the circuit board processing equipment 100 further includes a detection component (not shown in the figure) for detecting the motion state of at least one of the mandrel 11 and the worktable assembly 20.

[0115] In some embodiments, the detection component includes a high-precision position sensor such as a laser interferometer, a capacitive sensor, or a grating sensor, and detects the vibration motion state of the spindle 11 relative to the bearing assembly 12 (i.e., the vibration motion state of the spindle 11 relative to the frame 30).

[0116] In other embodiments, the detection component is used to detect the relative position of the machining tool 001 at the end of the mandrel 11 and the circuit board mounted on the worktable 21.

[0117] The detection component is electrically connected to the table vibration component 22 to transmit the vibration motion state of the spindle 11 relative to the frame 30 to the table vibration component 22, so that the table vibration component 22 adjusts the vibration motion state of the worktable 21 according to the vibration motion state of the spindle 11 relative to the frame 30.

[0118] In some embodiments provided in this application, the circuit board processing equipment 100 includes a first drive assembly connected between the worktable assembly 20 and the bed 31 to drive the worktable assembly 20 to move along a third direction y.

[0119] In some embodiments provided in this application, the circuit board processing equipment 100 includes a second drive assembly connected between the crossbeam 321 and the vibrating spindle assembly 10, so as to drive the vibrating spindle assembly 10 to move along the axial direction z of the spindle 11.

[0120] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board processing equipment, characterized in that, include: frame; At least two vibrating spindle assemblies are configured to drive a high-speed rotating machining tool to vibrate in a first direction at a set amplitude and frequency during machining, so that the machining tool and the circuit board form periodic contact and separation. A first guide rail extends along a second direction, which is orthogonal to the first direction, and the first guide rail is disposed on the frame. The vibration spindle assembly is slidably connected to the first guide rail. The first guide rail includes at least two guide rail segments arranged along the second direction, and the guide rail segments are correspondingly arranged with respect to the vibration spindle assembly, with adjacent guide rail segments spaced apart.

2. The circuit board processing equipment as described in claim 1, characterized in that: There are at least two first guide rails, and the at least two first guide rails are arranged at intervals along the first direction.

3. The circuit board processing equipment as described in claim 1, characterized in that: The circuit board processing equipment further includes a first driving member corresponding to the number of at least two guide rail segments. The first driving member is connected to the vibration spindle assembly to drive the vibration spindle assembly to move along the first guide rail.

4. The circuit board processing equipment as described in claim 1, characterized in that: The frame includes a bed and a gantry frame. The gantry frame includes a support base and a crossbeam. The crossbeam extends along the second direction. The support base is connected between the bed and the crossbeam. The first guide rail is disposed on the crossbeam.

5. The circuit board processing equipment as described in claim 4, characterized in that: The circuit board processing equipment includes at least one second driving member and at least two second guide rails. The second guide rails are disposed on the bed and extend along a third direction. The third direction is orthogonal to the second direction. The at least two second guide rails are arranged parallel to and spaced apart along the second direction. The support base includes two side support bases, and a first slide is provided at the end of the side support base away from the crossbeam. The first slide is slidably connected to the second guide rail, and the second drive member is connected between the bed and at least one of the side support bases.

6. The circuit board processing equipment as described in claim 5, characterized in that: The second guide rail includes two side guide rails and at least one intermediate guide rail, the intermediate guide rail being located between the two side guide rails; The gantry frame includes a central support base, which is located between the two side support bases; The middle support seat is provided with a second slide at one end away from the crossbeam. The second slide is slidably connected to the middle guide rail, and the two first slides are respectively slidably connected to the two side guide rails.

7. The circuit board processing equipment as described in any one of claims 1-6, characterized in that: The vibration spindle assembly includes a bearing assembly and a mandrel. The bearing assembly is provided with a receiving space, and the mandrel is disposed in the receiving space for driving a processing tool to process the circuit board along the first direction. The mandrel is capable of vibrating along the first direction.

8. The circuit board processing equipment as described in claim 7, characterized in that: The mandrel includes a core and a turntable; The shaft is rotatably inserted through the bearing assembly, and the turntable is connected to the shaft and rotatably disposed within the receiving space; The vibrating spindle assembly also includes an air supply assembly connected to the bearing assembly. When the air supply assembly supplies gas to the accommodating space, the turntable is suspended within the accommodating space. A first gap and a second gap are formed between the turntable and the side wall of the accommodating space. The first gap can form a first air film, and the second gap can form a second air film. The pressure difference between the first air film and the second air film changes periodically, causing the turntable to drive the spindle to reciprocate along the first direction.

9. The circuit board processing equipment as described in any one of claims 1-6, characterized in that: It also includes a worktable assembly, the worktable assembly including a worktable surface; The workbench is fixed to the frame and is used to support the circuit board.

10. The circuit board processing equipment as described in claim 9, characterized in that: The worktable assembly further includes a table vibration assembly for driving the worktable surface to vibrate along the first direction.

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