A low-bend gallium arsenide dicing apparatus

Abstract

The utility model discloses a kind of low bending degree gallium arsenide cutting device, including cutting equipment, cutting wheel, gallium arsenide wafer, the inner wall of cutting equipment is movably connected with support, the four corners of support are slidably connected with slide bar, the end of slide bar away from support is fixedly connected with bottom plate, the outside of slide bar is equipped with elastic member, the top of support is fixedly connected with water baffle, the outside of slide bar is fixedly connected with pressing plate, the outside of cutting equipment is fixedly connected with bearing plate, the outside of cutting equipment is fixedly connected with observation guard plate, the bottom of bottom plate is equipped with multiple water guide grooves, the both ends of bottom plate are provided with arc-shaped notch, the inner wall of support is fixedly connected with nozzle.In the utility model, the whole gallium arsenide wafer is covered by the diffusion of water flow, to achieve the purpose of uniformly cooling gallium arsenide wafer, so that the higher bending degree of gallium arsenide wafer can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of gallium arsenide wafer processing technology, and more specifically, to a gallium arsenide cutting device with low curvature. Background Technology

[0002] Gallium arsenide is an important semiconductor material, and a wafer is a silicon chip used to manufacture silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. During the processing, wafers need to be ground, polished and cut.

[0003] Existing gallium arsenide wafer dicing equipment uses water sprayed during dicing to cool the wafer. However, the water cannot cover the entire wafer during the dicing process; it is generally only sprayed at the dicing point for cooling. Due to the heat conduction effect and the thinness of the material, the wafer exhibits significant bending after dicing, as the entire material cannot be cooled evenly to reduce the bending of the wafer. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a low-bend gallium arsenide cutting device to solve the problem of uniformly cooling gallium arsenide wafers during cutting in the prior art in order to reduce the bend of gallium arsenide wafers.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a low-bend gallium arsenide cutting device, comprising...

[0006] The equipment includes a cutting device, a cutting wheel, and a gallium arsenide wafer. The inner wall of the cutting device is movably connected to a support, and the four corners of the support are slidably connected to sliding rods. The end of the sliding rod away from the support is fixedly connected to a base plate, and an elastic element is sleeved on the outside of the sliding rod. A water shield is fixedly connected to the top of the support.

[0007] The slide bar is externally fixedly connected to a pressure plate, the cutting device is externally fixedly connected to a bearing plate, and the cutting device is externally fixedly connected to an observation guard plate.

[0008] The bottom of the base plate has multiple water guide grooves, and the two ends of the base plate have arc-shaped cuts. The inner wall of the bracket is fixedly connected to a nozzle, and the outer side of the pressure plate is slidably connected to the inner wall of the bracket.

[0009] The end of the base plate away from the slide bar is in contact with the outside of the gallium arsenide wafer, and the outer part of the cutting wheel is rotatably connected to the inner wall of the bracket.

[0010] One end of the elastic element is fixedly connected to the outside of the pressure plate, and the other end of the elastic element away from the pressure plate is fixedly connected to the inner wall of the bracket.

[0011] The end of the support plate away from the cutting device is in contact with the bottom of the gallium arsenide wafer, and the end of the gallium arsenide wafer away from the support plate is in contact with the outside of the cutting wheel.

[0012] The outer side of the arc-shaped cut contacts the outer side of the gallium arsenide wafer, and a placement box is fixedly connected to the outside of the cutting equipment;

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] In the above solution, the elastic elements in the base plate and the slide bar work together to maintain the stability of the gallium arsenide wafer during dicing, preventing shaking and thus affecting the dicing accuracy. In order to ensure overall cooling of the gallium arsenide wafer during dicing, the water flow is diffused to cover the entire gallium arsenide wafer, thereby achieving uniform cooling and reducing the high curvature of the gallium arsenide wafer. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the support plate structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the water-blocking cover structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the support structure of this utility model;

[0019] Figure 5 This is a schematic diagram of the base plate structure of this utility model;

[0020] Figure 6 This is a schematic diagram of the nozzle structure of this utility model.

[0021] [Figure Labels]

[0022] 1. Cutting equipment; 2. Support; 3. Slide bar; 4. Elastic element; 5. Pressure plate; 6. Base plate; 7. Water shield; 8. Cutting wheel; 9. Water guide groove; 10. Arc-shaped cut; 11. Bearing plate; 12. Gallium arsenide wafer; 13. Observation guard plate; 14. Placement box; 15. Nozzle. Detailed Implementation

[0023] To make the technical problems, technical solutions and advantages of this utility model clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0024] Example 1: Please refer to Figures 1 to 6 This utility model provides a technical solution: a low-bending gallium arsenide cutting device, including a cutting device 1, a cutting wheel 8, and a gallium arsenide wafer 12. A support 2 is movably connected to the inner wall of the cutting device 1. Sliding rods 3 are slidably connected to the four corners of the support 2. A base plate 6 is fixedly connected to the end of the sliding rod 3 away from the support 2. An elastic element 4 is sleeved on the outside of the sliding rod 3. A water baffle 7 is fixedly connected to the top of the support 2. The end of the base plate 6 away from the sliding rod 3 is in contact with the outside of the gallium arsenide wafer 12. The outside of the cutting wheel 8 is rotatably connected to the inner wall of the support 2. Multiple water guide grooves 9 are opened at the bottom of the base plate 6.

[0025] When cutting gallium arsenide wafer 12, the base plate 6 can maintain the stability of gallium arsenide wafer 12 under the action of elastic element 4, and the water channel 9 in the base plate 6 can diffuse the water flow, so that the water flow can diffuse and cover the entire gallium arsenide wafer 12 during the cutting process, thereby reducing its stability and achieving the purpose of stable and uniform reduction.

[0026] Example 2: Based on Example 1, in order to conveniently maintain the stability during the cutting of gallium arsenide wafer 12, a pressure plate 5 is fixedly connected to the outside of the slide bar 3, a support plate 11 is fixedly connected to the outside of the cutting device 1, an observation guard plate 13 is fixedly connected to the outside of the cutting device 1, one end of the elastic element 4 is fixedly connected to the outside of the pressure plate 5, the end of the elastic element 4 away from the pressure plate 5 is fixedly connected to the inner wall of the bracket 2, the end of the support plate 11 away from the cutting device 1 is in contact with the bottom of the gallium arsenide wafer 12, and the end of the gallium arsenide wafer 12 away from the support plate 11 is in contact with the outside of the cutting wheel 8.

[0027] The gallium arsenide wafer 12 is placed on the support plate 11 in the cutting equipment 1. Then, the cutting mechanism is started and the cutting wheel 8 cuts the gallium arsenide wafer 12. At this time, the operator can observe the cutting status through the observation guard plate 13. When the cutting wheel 8 cuts the gallium arsenide wafer 12, in order to ensure the stability of the cutting, the base plate 6 and the pressure plate 5 in the slide rod 3 squeeze the elastic element 4 to make the base plate 6 fit against the outside of the gallium arsenide wafer 12. This makes the gallium arsenide wafer 12 stable when being cut, avoids shaking during the cutting process, and improves the stability and accuracy of the gallium arsenide wafer 12 cutting.

[0028] Example 3: Based on Example 2, in order to facilitate the uniform reduction of the temperature of the gallium arsenide wafer 12, arc-shaped cuts 10 are provided at both ends of the base plate 6, nozzles 15 are fixedly connected to the inner wall of the support 2, the outer side of the pressure plate 5 is slidably connected to the inner wall of the support 2, the outer side of the arc-shaped cuts 10 is in contact with the outer side of the gallium arsenide wafer 12, and a placement box 14 is fixedly connected to the outer side of the cutting device 1.

[0029] During the dicing of the gallium arsenide wafer 12, the nozzle 15 works synchronously with the dicing wheel 8. The nozzle 15 sprays water to cool the temperature generated by the dicing wheel 8 during the dicing of the gallium arsenide wafer 12. When dicing a large gallium arsenide wafer 12, the water sprayed by the nozzle 15 may not be sufficient to cover the entire gallium arsenide wafer 12 for cooling, resulting in uneven local temperature distribution. This causes the gallium arsenide wafer 12 to have a large curvature after dicing. Therefore, when the nozzle 15 sprays water, it diffuses along the surface of the gallium arsenide wafer 12. Under the action of the water flow from the nozzle 15, it impacts the base plate 6, causing the water to diffuse further from the water guide groove 9 in the base plate 6, providing guidance for the water flow and ensuring that the water covers the entire surface of the gallium arsenide wafer 12 to achieve uniform cooling. This reduces the curvature of the gallium arsenide wafer 12.

[0030] The working process of this utility model is as follows:

[0031] First, the gallium arsenide wafer 12 is placed on the support plate 11 in the cutting equipment 1. Then, the cutting mechanism is started, and the cutting wheel 8 cuts the gallium arsenide wafer 12. At this time, the operator can observe the cutting status through the observation guard plate 13. When the cutting wheel 8 cuts the gallium arsenide wafer 12, in order to ensure the stability of the cutting, the base plate 6, together with the pressure plate 5 in the slide bar 3, squeezes the elastic element 4 to make the base plate 6 fit against the outside of the gallium arsenide wafer 12. This makes the gallium arsenide wafer 12 stable during cutting and avoids shaking during cutting, thus improving the stability and accuracy of the gallium arsenide wafer 12 cutting. During the cutting of the gallium arsenide wafer 12, the nozzle 15 works synchronously with the cutting wheel 8. The nozzle 15 sprays water to provide cutting fluid. The wheel 8 cools the gallium arsenide wafer 12 generated during dicing. When dicing a large gallium arsenide wafer 12, the water sprayed from the nozzle 15 may not be sufficient to cover the entire gallium arsenide wafer 12 for cooling, resulting in uneven local temperature distribution. This causes the gallium arsenide wafer 12 to have a large curvature after dicing. Therefore, when the nozzle 15 sprays water, it spreads along the surface of the gallium arsenide wafer 12. Under the action of the water flow from the nozzle 15, it impacts the base plate 6, causing the water to spread more widely from the water guide groove 9 in the base plate 6, providing guidance for the water flow and covering the entire surface of the gallium arsenide wafer 12 to achieve uniform cooling. This reduces the curvature of the gallium arsenide wafer 12.

[0032] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0033] Secondly: The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0034] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A low-bending gallium arsenide cutting device, characterized in that, The device includes a cutting device (1), a cutting wheel (8), and a gallium arsenide wafer (12). The inner wall of the cutting device (1) is movably connected to a support (2). The four corners of the support (2) are slidably connected to sliding rods (3). The end of the sliding rod (3) away from the support (2) is fixedly connected to a base plate (6). An elastic element (4) is sleeved on the outside of the sliding rod (3). A water shield (7) is fixedly connected to the top of the support (2).

2. The low-bend gallium arsenide cutting device according to claim 1, characterized in that, The slide bar (3) is externally fixedly connected to a pressure plate (5), the cutting device (1) is externally fixedly connected to a bearing plate (11), and the cutting device (1) is externally fixedly connected to an observation guard plate (13).

3. The low-bending gallium arsenide cutting device according to claim 2, characterized in that, The bottom of the base plate (6) is provided with multiple water guide grooves (9), and the two ends of the base plate (6) are provided with arc-shaped cuts (10). The inner wall of the bracket (2) is fixedly connected with a nozzle (15), and the outer side of the pressure plate (5) is slidably connected to the inner wall of the bracket (2).

4. The low-bending gallium arsenide cutting device according to claim 1, characterized in that, The end of the base plate (6) away from the slide bar (3) is in contact with the outside of the gallium arsenide wafer (12), and the outside of the cutting wheel (8) is rotatably connected to the inner wall of the bracket (2).

5. The low-bending gallium arsenide cutting device according to claim 2, characterized in that, One end of the elastic element (4) is fixedly connected to the outside of the pressure plate (5), and the other end of the elastic element (4) away from the pressure plate (5) is fixedly connected to the inner wall of the bracket (2).

6. The low-bending gallium arsenide cutting device according to claim 2, characterized in that, The end of the support plate (11) away from the cutting device (1) is in contact with the bottom of the gallium arsenide wafer (12), and the end of the gallium arsenide wafer (12) away from the support plate (11) is in contact with the outside of the cutting wheel (8).

7. The low-bending gallium arsenide cutting device according to claim 3, characterized in that, The outside of the arc-shaped cut (10) is in contact with the outside of the gallium arsenide wafer (12), and a placement box (14) is fixedly connected to the outside of the cutting device (1).

Images