Cooling and positioning mold for vacuum forming of ic tubes

Abstract

The utility model discloses a cooling positioning mould of IC tube vacuum forming belongs to vacuum forming mould technical field, including lower mould, upper mould, mould groove, positioning mechanism, cooling plate, rubber plate and sealing groove, and positioning mechanism connects upper mould and lower mould outer wall, and guides the relative movement of both, and the built -in of cooling plate is in lower mould and upper mould, and the circulation pipe is equipped in cooling plate, and circulation pipe is linked with refrigerating pump, and rubber plate is used for sealing mould groove with sealing groove cooperation. The utility model discloses through integrated cooling system and positioning mechanism, has solved the problem of slow cooling, and the problem of inaccurate positioning, has the beneficial effect of high cooling efficiency, accurate positioning, product forming quality is good, and the short production cycle.

Description

Technical Field

[0001] This utility model relates to the field of vacuum forming mold technology, and in particular to a cooling and positioning mold for vacuum forming of IC tubes. Background Technology

[0002] IC tubes are commonly used components in the electronics industry. Their manufacturing often employs vacuum forming technology. Vacuum forming relies on molds, typically including an upper mold and a lower mold. After the material is heated and formed in the mold, it must be cooled and solidified before it can be demolded.

[0003] In existing technologies, there are several common technical problems with IC tube vacuum forming molds. First, in terms of cooling efficiency, many molds rely on natural cooling or only have simple external cooling water channels. The efficiency of heat conduction from the mold core is low, resulting in slow cooling speed. This slow cooling process directly prolongs the product forming cycle and significantly reduces the overall production efficiency.

[0004] Secondly, in terms of positioning accuracy, the upper and lower molds require extremely high alignment accuracy during the high-speed reciprocating closing process. If the positioning mechanism is not designed properly or its accuracy decreases due to long-term wear, the upper and lower molds will shift or shake when closing. This inaccurate positioning will directly lead to defects such as uneven wall thickness, dimensional deviation, or burrs in the formed IC tube, which seriously affects the product yield.

[0005] In addition, the vacuum forming process has strict requirements for the sealing of the mold. The sealing structure of some existing molds is not reliable enough, which will cause air leakage during vacuum extraction, resulting in forming failure.

[0006] Therefore, this utility model proposes a cooling and positioning mold for vacuum forming of IC tubes to overcome the shortcomings of the prior art. Utility Model Content

[0007] In view of the problems of slow cooling speed leading to low production efficiency, inaccurate alignment of upper and lower molds resulting in high product defect rate, and insufficient vacuum sealing in the existing IC tube vacuum forming cooling positioning mold, this utility model aims to provide a structurally improved IC tube vacuum forming cooling positioning mold that can effectively solve the above problems.

[0008] This utility model provides a cooling and positioning mold for vacuum forming of IC tubes, including: a lower mold, an upper mold, and a mold groove formed on the mating surfaces of the lower mold and the upper mold; as well as a positioning mechanism, a cooling plate, a rubber plate, and a sealing groove.

[0009] The positioning mechanism connects the outer walls of the upper mold and the lower mold to guide the upper mold to move smoothly up and down relative to the lower mold.

[0010] Furthermore, the cooling plate is built into the interior of the lower mold and the upper mold, and a circulation pipe for circulating cooling medium is laid inside the cooling plate. The circulation pipe is connected to an external refrigeration pump.

[0011] The rubber plate and the sealing groove are disposed on the mating surface, and the rubber plate is embedded in the sealing groove to form a seal when the upper mold and the lower mold are closed.

[0012] Preferably, the positioning mechanism includes: a baffle, which is vertically fixed to the outer wall of the lower mold; a slide groove, which is formed on the side wall of the baffle facing the upper mold; and a slide bar, which is fixedly connected to the outer wall of the upper mold and slides in cooperation with the slide groove.

[0013] Preferably, the positioning mechanism further includes: a first fixing block, which is fixed to the outer wall of the upper mold; a limiting post, which is fixed to the first fixing block; a second fixing block, which is fixed to the outer wall of the lower mold; and a limiting cylinder, which is fixed to the second fixing block and is used to slide and match with the limiting post.

[0014] Preferably, the first fixing block and the limiting post, as well as the second fixing block and the limiting cylinder, are respectively disposed on the outer side of the baffle.

[0015] Preferably, the circulation pipe is in large-area contact with the inner wall of the cooling plate to efficiently transfer the cooling capacity of the cooling medium in the circulation pipe to the cooling plate.

[0016] Preferably, the cooling plate is a metal plate with excellent thermal conductivity.

[0017] Preferably, there are multiple refrigeration pumps, which are connected in series or in parallel on the circulation pipe.

[0018] Preferably, the rubber plate is disposed around the outer wall of the mold groove.

[0019] This utility model has the following beneficial effects:

[0020] 1. This utility model solves the problems of slow mold cooling speed and low production efficiency caused by reliance on external cooling in the prior art by setting cooling plates inside the upper and lower molds and laying circulation pipes connected to the refrigeration pump inside the cooling plates. It achieves the technical effect of active, rapid and uninterrupted cooling of the mold, which significantly shortens the product molding cycle and improves production efficiency.

[0021] 2. This utility model, by setting a positioning mechanism, utilizes the sliding groove on the baffle and the sliding strip of the upper mold for smooth guidance, and uses the insertion cooperation of the limiting post and the limiting cylinder for final precise alignment. This solves the problem of high product defect rate caused by the offset and inaccurate alignment of the upper and lower molds during the closing process in the prior art. It achieves the technical effect of dual positioning, ensures the accuracy of mold closing, and effectively improves the molding quality and consistency of IC tubes. Attached Figure Description

[0022] Figure 1 This is a front perspective view of the cooling and positioning mold for vacuum forming of IC tubes proposed in this utility model.

[0023] Figure 2 This is a partial structural exploded view of the upper mold of the cooling and positioning mold for vacuum forming of IC tubes proposed in this utility model;

[0024] Figure 3 This is a partial structural exploded view of the lower mold of the cooling and positioning mold for vacuum forming of IC tubes proposed in this utility model;

[0025] Figure 4 This is a partial structural exploded view of the cooling plate of the cooling positioning mold for vacuum forming of IC tubes proposed in this utility model.

[0026] Legend:

[0027] 1. Lower mold; 2. Positioning mechanism; 201. Baffle; 202. Slide groove; 203. Slide bar; 204. Fixing block one; 205. Limiting post; 206. Limiting cylinder; 207. Fixing block two; 3. Upper mold; 4. Mold groove; 5. Rubber plate; 6. Sealing groove; 7. Cooling plate; 8. Circulation pipe; 9. Refrigeration pump. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0029] Example:

[0030] Please refer to Figure 1 , Figure 2 and Figure 3The cooling and positioning mold for IC tube vacuum forming includes a lower mold 1 and an upper mold 3. The upper mold 3 is movable and fits onto the lower mold 1. A mold groove 4 for IC tube forming is formed on the mating surface of the lower mold 1 and the upper mold 3. The cooling and positioning mold for IC tube vacuum forming also includes a positioning mechanism 2, a cooling plate 7, a circulation pipe 8, a refrigeration pump 9, a rubber plate 5, and a sealing groove 6. The positioning mechanism 2 connects the upper mold 3 to the outer wall of the lower mold 1 and guides the upper mold 3 to move smoothly up and down relative to the lower mold 1. Please refer to [reference needed]. Figure 4 The cooling plate 7 is built into the interior of the lower mold 1 and the upper mold 3. The interior of the cooling plate 7 is laid with a circulation pipe 8 for the flow of cooling medium. The circulation pipe 8 is connected to an external refrigeration pump 9. There are multiple refrigeration pumps 9, which are connected in series or in parallel on the circulation pipe 8. The cooling plate 7 is a metal plate with excellent thermal conductivity. The circulation pipe 8 is in large-area contact with the inner wall of the cooling plate 7 to efficiently conduct the cooling capacity of the cooling medium in the circulation pipe 8 to the cooling plate 7. The rubber plate 5 and the sealing groove 6 are set on the mating surface of the lower mold 1 and the upper mold 3. When the upper mold 3 and the lower mold 1 are closed, the rubber plate 5 is embedded in the sealing groove 6 to form a seal. The rubber plate 5 is set around the outer wall of the mold groove 4.

[0031] Please refer to Figure 1 , Figure 2 and Figure 3 The positioning mechanism 2 includes a first positioning component for smooth guidance and a second positioning component for precise alignment. The first positioning component includes a baffle 201, a groove 202, and a slide bar 203. The baffle 201 is vertically fixed to the outer wall of the lower mold 1, and there are two baffles 201 symmetrically arranged on both sides of the lower mold 1. The groove 202 is formed on the side wall of the baffle 201 facing the upper mold 3. The slide bar 203 is fixedly connected to the outer wall of the upper mold 3 and can be slidably accommodated in the groove 202 in the assembled state. The sliding fit structure formed by the baffle 201, the groove 202, and the slide bar 203 provides guidance when the upper mold 3 moves up and down. The second positioning component includes a first fixing block 204, a limiting post 205, and a second fixing block 207. The upper mold 3 is fixed to the outer wall of the limiting cylinder 206, the fixing block 204 is fixed to the outer wall of the lower mold 1, the limiting post 205 is fixed to the fixing block 204, the fixing block 207 is fixed to the outer wall of the lower mold 1, and the limiting cylinder 206 is fixed to the fixing block 207. The shape and size of the limiting post 205 match the internal cavity of the limiting cylinder 206. The limiting cylinder 206 is used to slide and match with the limiting post 205. During the process of the upper mold 3 approaching the lower mold 1 to close, the limiting post 205 is inserted into the limiting cylinder 206. Through the guiding cooperation of the limiting post 205 and the limiting cylinder 206, the upper mold 3 and the lower mold 1 are finally closed and aligned. The fixing block 204 and the limiting post 205, as well as the fixing block 207 and the limiting cylinder 206, are respectively set on the outside of the baffle 201.

[0032] Please refer to Figure 4 In a preferred embodiment, the cooling plate 7 specifically comprises a lower cooling plate 7 built into the lower mold 1 and an upper cooling plate 7 built into the upper mold 3. The cooling plate 7 is made of a metal plate with excellent thermal conductivity, such as a copper alloy or aluminum alloy with high thermal conductivity. The circulation pipe 8 is laid in a serpentine or S-shape inside the cooling plate 7, forming a large-area contact with the inner wall of the cooling plate 7. This large-area contact structure ensures that the cooling capacity of the cooling medium flowing in the circulation pipe 8 can be quickly and evenly transferred to the entire cooling plate 7, thereby achieving efficient cooling of the mold groove 4. The circulation pipe 8 is connected to a refrigeration pump 9. Preferably, there are multiple refrigeration pumps 9, which can be connected in series or in parallel on the circulation pipe 8. The refrigeration pump 9 not only drives the circulation of the cooling medium but also actively cools the cooling medium, ensuring that the cooling medium always remains at a low temperature. Please refer to Figure 1 and Figure 3 In another preferred embodiment, the sealing structure includes a rubber plate 5 and a sealing groove 6. The rubber plate 5 is fixedly disposed on the outer wall of the mold groove 4 and surrounds the entire contour of the mold groove 4. The sealing groove 6 is formed on the mating surface of the other half of the mold opposite to the rubber plate 5. The cross-sectional shape of the sealing groove 6 matches that of the rubber plate 5. When the upper mold 3 and the lower mold 1 are closed and compressed, the rubber plate 5 is squeezed and completely fills the sealing groove 6, thereby achieving a reliable seal around the mold groove 4.

[0033] Working principle:

[0034] The material is shaped by the cooperation of the lower mold 1 and the upper mold 3. The mold groove 4 is provided with the mold groove 4 of the forming shape. At the same time, the outer wall of the mold groove 4 is provided with a rubber plate 5, which cooperates with the sealing groove 6 on the outer wall of the sealing groove 6 to seal the lower mold 1 and the upper mold 3, preventing the forming failure due to insufficient sealing during vacuum forming. Cooling plates 7 are provided inside the lower mold 1 and the upper mold 3. The cooling plates 7 have excellent temperature conduction effect. At the same time, a circulation pipe 8 is laid inside the cooling plate 7. The circulation pipe 8 contacts the cooling plate 7. After the cooling medium is introduced into the circulation pipe 8, the cooling plate 7 is cooled, thereby achieving rapid cooling of the lower mold 1 and the upper mold 3. At the same time, multiple refrigeration pumps 9 are connected to the first and last ends of the circulation pipe 8. When the cooling medium in the circulation pipe 8 passes through the refrigeration pumps 9, the medium is cooled down, keeping the medium at a cooling temperature, achieving uninterrupted cooling and accelerating the cooling speed.

[0035] The lower mold 1 is provided with a positioning mechanism 2 on its outer wall. The positioning mechanism 2 mainly includes a baffle 201. The outer wall of the baffle 201 is provided with a sliding groove 202. The sliding groove 202 slides with a sliding strip 203. The sliding strip 203 is connected to the upper mold 3, so that the upper mold 3 slides smoothly inside the baffle 201. The baffles 201 on both sides of the upper mold 3 and the lower mold 1 also serve as limiters. At the same time, fixing block 1 204 and fixing block 207 are fixedly connected to the outer walls of the upper mold 3 and the lower mold 1, respectively. The outer wall of fixing block 1 204 is fixedly connected to a limit post 205, and the outer wall of fixing block 207 is fixedly connected to a limit cylinder 206. The fixing block 1 204 and the limit cylinder 206 match. Even if the upper mold 3 moves, the fixing block 1 204 always slides inside the limit cylinder 206, which serves to position the upper mold 3.

Claims

1. A cooling and positioning mold for vacuum forming of IC tubes, comprising: Lower mold (1); Upper mold (3); Mold groove (4), the mold groove (4) is formed on the mating surface of the lower mold (1) and the upper mold (3); The cooling and positioning mold for vacuum forming of the IC tube is characterized in that it further includes: Positioning mechanism (2), which connects the outer wall of the upper mold (3) and the lower mold (1) to guide the upper mold (3) to move smoothly up and down relative to the lower mold (1); Cooling plate (7), the cooling plate (7) is built inside the lower mold (1) and the upper mold (3), the cooling plate (7) is provided with a circulation pipe (8) for circulating cooling medium, and the circulation pipe (8) is connected to an external refrigeration pump (9); The rubber plate (5) and sealing groove (6) are provided on the mating surface. The rubber plate (5) is embedded in the sealing groove (6) to form a seal when the upper mold (3) and the lower mold (1) are closed.

2. The cooling and positioning mold for vacuum forming of IC tubes according to claim 1, characterized in that, The positioning mechanism (2) includes: A baffle (201) is vertically fixed to the outer wall of the lower mold (1); The slide (202) is formed on the side wall of the baffle (201) facing the upper mold (3); The slide bar (203) is fixedly connected to the outer wall of the upper mold (3) and slides in cooperation with the slide groove (202).

3. The cooling and positioning mold for vacuum forming of IC tubes according to claim 2, characterized in that, The positioning mechanism (2) further includes: Fixing block one (204) is fixed to the outer wall of the upper mold (3); Limiting post (205), the limiting post (205) is fixed to the fixing block one (204); Fixing block two (207) is fixed to the outer wall of the lower mold (1); And a limiting cylinder (206), which is fixed to the second fixing block (207) and is used to slide and match with the limiting post (205).

4. The cooling and positioning mold for vacuum forming of IC tubes according to claim 1, characterized in that, The circulation pipe (8) is in large-area contact with the inner wall of the cooling plate (7) so as to efficiently transfer the cooling capacity of the cooling medium in the circulation pipe (8) to the cooling plate (7).

5. The cooling and positioning mold for vacuum forming of IC tubes according to claim 1, characterized in that, The rubber plate (5) is disposed around the outer wall of the mold groove (4).

6. The cooling and positioning mold for vacuum forming of IC tubes according to claim 1, characterized in that, The cooling plate (7) is a metal plate with excellent thermal conductivity.

7. The cooling and positioning mold for vacuum forming of IC tubes according to claim 1, characterized in that, There are multiple refrigeration pumps (9), which are connected in series or in parallel on the circulation pipe (8).

8. The cooling and positioning mold for vacuum forming of IC tubes according to claim 3, characterized in that, The first fixing block (204) and the limiting post (205), as well as the second fixing block (207) and the limiting cylinder (206), are respectively disposed on the outside of the baffle (201).

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