Chip package module colloid pouring mold

Abstract

The utility model discloses a chip package module colloid pouring mold, and its technical scheme main points are: including the table body, the bottom surface fixed mounting of table body has the fixed box, the inside bushing of fixed box has the electric push rod, the top surface of table body has set up the through -hole, the inside bushing of through -hole has set up the telescopic link, the telescopic link is by cylinder part and disc part and is composed, the telescopic end of electric push rod with disc part bottom surface fixed mounting of telescopic link is together, the cylinder part top surface fixed mounting of telescopic link has the contact disc, through setting up electric push rod, electric push rod is the structure that has on the market already, and its telescopic end is in the ceaseless movement of vertical direction, can constantly drive the structure of contact disc and telescopic link and carry out knocking vibration, through the design of contact disc and telescopic link, its periodic knock the bottom surface of pouring device, can make the bubble that colloid produces in the process of pouring and be shaken and float up.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to a chip packaging module colloidal casting mold. Background Technology

[0002] Chip packaging uses a casing, which is used to mount semiconductor integrated circuit chips. The casing serves to house, fix, seal, and protect the chip, enhance its electrical and thermal performance, and also acts as a bridge between the chip's internal world and external circuits—the contacts on the chip are connected to the pins of the package casing via wires, and these pins, in turn, establish connections with other devices through wires on the printed circuit board. Therefore, packaging plays a crucial role in CPUs and other LSI integrated circuits.

[0003] Existing colloidal casting molds on the market generally involve placing the material to be processed into the mold, pressing the upper and lower molds together, and injecting the colloidal material into the mold through a pipe connected to the inside of the mold to complete the colloidal casting process. However, in actual use, due to various external factors such as casting speed and temperature difference, a large number of air bubbles are generated in the colloidal material during the casting process. If these air bubbles are not treated, they may affect the quality of the finished product, resulting in lower strength and easy detachment. Therefore, we propose a colloidal casting mold for chip packaging modules. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a chip packaging module colloid casting mold, which solves the problem that during actual use, due to various external factors such as casting speed and temperature difference, a large number of air bubbles will be generated in the colloid. If these air bubbles are not treated, they may affect the quality of the finished product, resulting in low strength and easy detachment.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] A chip packaging module colloidal casting mold includes a table body. A fixed box is fixedly installed on the bottom surface of the table body. An electric push rod is sleeved inside the fixed box. A through hole is opened on the top surface of the table body. A telescopic rod is sleeved inside the through hole. The telescopic rod consists of a cylindrical part and a disc part. The telescopic end of the electric push rod is fixedly installed together with the bottom surface of the disc part of the telescopic rod. A contact plate is fixedly installed on the top surface of the cylindrical part of the telescopic rod.

[0007] Preferably, a protective pad is fixedly installed on the top surface of the contact plate. The protective pad is made of rubber. A fixed frame is fixedly installed on the top surface of the table body. The telescopic rod is located inside the fixed frame.

[0008] Preferably, a limiting frame is fixedly installed on the top surface of the fixed frame, and two first fixing plates are fixedly installed on the outer wall surface of the limiting frame. A sliding rod is fixedly installed on the top surface of the first fixing plate. The sliding rod consists of a cylindrical part and a disc part. An upper mold is provided on the top surface of the limiting frame, and two second fixing plates are fixedly installed on the outer wall surface of the upper mold. Two through holes are opened on the top surface of the second fixing plates. The limiting frame and the upper mold are engaged together through the sliding rod and the through holes opened on the top surface of the second fixing plates.

[0009] Preferably, a positioning frame is engaged inside the limiting frame, and a lower mold is fitted inside the positioning frame.

[0010] Preferably, a fixing ring is fixedly installed inside the limiting frame, and a heat-conducting plate is snapped into the inside of the fixing ring.

[0011] Preferably, the limiting frame is fitted with heat-absorbing sand, and the top surface of the upper mold is fixedly fitted with a connecting sleeve.

[0012] In summary, the present invention has the following main advantages:

[0013] 1. By setting up an electric push rod, which is a commercially available structure, the continuous vertical movement of its telescopic end can continuously drive the structure composed of the contact plate and the telescopic rod to perform knocking vibration. Through the design of the contact plate and the telescopic rod, the periodic knocking on the bottom surface of the pouring device can cause the air bubbles generated by the colloid to be shaken and floated to the surface. After floating to the surface, they will burst, thereby removing the colloid air bubbles. This can effectively increase the strength of the finished product and reduce the occurrence of separation.

[0014] 2. By setting up a heat-conducting plate, the heat generated by the high-temperature colloid during pouring can be quickly conducted, maximizing the cooling rate of the colloid and ensuring the efficient use of the device. The heat-absorbing sand design can quickly absorb the heat conducted by the heat-conducting plate, minimizing the double damage caused by heat and impact to the limiting frame, thus increasing the service life of the limiting frame to a certain extent. The connecting sleeve design can be engaged with the telescopic end of the external electric push rod when needed, allowing the upper mold to automatically perform pressing and lifting operations, further increasing the automation level of the device. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the table structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the limiting frame structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the upper mold structure of this utility model.

[0019] Reference numerals in the attached drawings: 1. Table body; 2. Contact plate; 3. Fixing box; 4. Electric push rod; 5. Through hole; 6. Telescopic rod; 7. Protective pad; 8. Fixing frame; 9. Limiting frame; 10. First fixing plate; 11. Sliding rod; 12. Upper mold; 13. Second fixing plate; 14. Positioning frame; 15. Lower mold; 16. Fixing ring; 17. Heat-conducting plate; 18. Heat-absorbing sand; 19. Connecting sleeve. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] refer to Figures 1-4 A chip packaging module colloid casting mold includes a table body 1. A fixed box 3 is fixedly installed on the bottom surface of the table body 1. An electric push rod 4 is installed inside the fixed box 3. The electric push rod 4 is a commercially available structure. Its telescopic end moves continuously in the vertical direction, which can continuously drive the structure composed of contact plate 2 and telescopic rod 6 to perform knocking vibration. A through hole 5 is opened on the top surface of the table body 1. The telescopic rod 6 is installed inside the through hole 5. The telescopic rod 6 is composed of a cylindrical part and a disc part. The telescopic end of the electric push rod 4 is fixedly installed together with the bottom surface of the disc part of the telescopic rod 6. The contact plate 2 is fixedly installed on the top surface of the cylindrical part of the telescopic rod 6. Through the design of the contact plate 2 and the telescopic rod 6, the periodic knocking of the bottom surface of the casting device can cause the air bubbles generated in the colloid to be vibrated and floated to the surface during the casting process. After floating to the surface, they will burst, thereby achieving the effect of removing the air bubbles in the colloid. This can effectively increase the strength of the finished product and reduce the occurrence of separation.

[0022] A protective pad 7 is fixedly installed on the top surface of the contact plate 2. The protective pad 7 is made of rubber. The design of the protective pad 7 can protect the bottom surface of the mold while ensuring that the oscillating element can complete the cycle of tapping normally. The deformable property of rubber can prevent the mold from being damaged by long-term tapping. A fixed frame 8 is fixedly installed on the top surface of the table body 1. The telescopic rod 6 is located inside the fixed frame 8. The design of the fixed frame 8 can reserve enough space between the mold and the oscillating element while limiting the mold, so as to ensure the normal completion of tapping.

[0023] A limiting frame 9 is fixedly installed on the top surface of the fixed frame 8. Two first fixing plates 10 are fixedly installed on the outer wall of the limiting frame 9. A sliding rod 11 is fixedly installed on the top surface of the first fixing plate 10. The sliding rod 11 consists of a cylindrical part and a disc part. Through the design of the sliding rod 11, it is engaged with the through hole opened on the top surface of the second fixing plate 13, which can limit the sliding trajectory of the upper mold 12, ensuring that it can slide along the specified trajectory and preventing the position of the upper mold 12 from shifting during the sliding process, which would affect the quality of the finished product. The top surface of the limiting frame 9 is provided with an upper mold 12. Two second fixing plates 13 are fixedly installed on the outer wall of the upper mold 12. Two through holes are opened on the top surface of the second fixing plates 13. The limiting frame 9 and the upper mold 12 are connected together by the sliding rod 11 and the through holes on the top surface of the second fixing plates 13. Through the design of the limiting frame 9 and the upper mold 12, and through their interlocking design, the position of the upper mold 12 can be moved at any time, and the distance between the limiting frame 9 and the upper mold 12 can be adjusted, thereby ensuring that the casting and pressing work can be carried out normally.

[0024] The limiting frame 9 has a positioning frame 14 inside, and the positioning frame 14 has a lower mold 15 inside. The design of the positioning frame 14 and the lower mold 15 makes it convenient for workers to replace the lower mold 15 according to the different specifications of the workpiece.

[0025] A fixing ring 16 is fixedly installed inside the limiting frame 9. A heat-conducting plate 17 is snapped into the inside of the fixing ring 16. Through the design of the heat-conducting plate 17, the heat generated by the high-temperature colloid during pouring can be quickly conducted to increase the cooling speed of the colloid as much as possible and ensure the efficient use of the device.

[0026] The limiting frame 9 is fitted with heat-absorbing sand 18. The heat-absorbing sand 18 is designed to quickly absorb the heat conducted by the heat-conducting plate 17, thus avoiding the dual damage caused by heat and impact to the limiting frame 9. This can increase the service life of the limiting frame 9 to a certain extent. The top surface of the upper mold 12 is fixedly installed with a connecting sleeve 19. The connecting sleeve 19 is designed to engage with the telescopic end of the external electric push rod when needed, so that the upper mold 12 can automatically perform pressing and lifting operations, further increasing the automation level of the device.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip packaging module colloidal casting mold, comprising a table (1), characterized in that, A fixed box (3) is fixedly installed on the bottom surface of the table body (1). An electric push rod (4) is installed inside the fixed box (3). A through hole (5) is opened on the top surface of the table body (1). A telescopic rod (6) is installed inside the through hole (5). The telescopic rod (6) consists of a cylindrical part and a disc part. The telescopic end of the electric push rod (4) is fixedly installed together with the bottom surface of the disc part of the telescopic rod (6). A contact plate (2) is fixedly installed on the top surface of the cylindrical part of the telescopic rod (6).

2. The chip packaging module colloidal casting mold according to claim 1, characterized in that, A protective pad (7) is fixedly installed on the top surface of the contact plate (2). The protective pad (7) is made of rubber. A fixed frame (8) is fixedly installed on the top surface of the table body (1). The telescopic rod (6) is located inside the fixed frame (8).

3. The chip packaging module colloidal casting mold according to claim 2, characterized in that, A limiting frame (9) is fixedly installed on the top surface of the fixed frame (8). Two first fixing plates (10) are fixedly installed on the outer wall surface of the limiting frame (9). A sliding rod (11) is fixedly installed on the top surface of the first fixing plate (10). The sliding rod (11) is composed of a cylindrical part and a disc part. An upper mold (12) is provided on the top surface of the limiting frame (9). Two second fixing plates (13) are fixedly installed on the outer wall surface of the upper mold (12). Two through holes are opened on the top surface of the second fixing plate (13). The limiting frame (9) and the upper mold (12) are connected together through the through holes opened on the top surface of the sliding rod (11) and the second fixing plate (13).

4. The chip packaging module colloidal casting mold according to claim 3, characterized in that, The limiting frame (9) is internally engaged with a positioning frame (14), and the positioning frame (14) is internally fitted with a lower mold (15).

5. The chip packaging module colloidal casting mold according to claim 3, characterized in that, A fixing ring (16) is fixedly installed inside the limiting frame (9), and a heat-conducting plate (17) is snapped into the inside of the fixing ring (16).

6. The chip packaging module colloidal casting mold according to claim 3, characterized in that, The limiting frame (9) is fitted with heat-absorbing sand (18), and the top surface of the upper mold (12) is fixedly installed with a connecting sleeve (19).

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