Microneedle patch stamping patch mechanism

Abstract

The utility model discloses a kind of microneedle patch stamping patch mechanisms, it is characterized that, the patch mechanism has one or more stamping patch stations, each stamping patch station includes stamping patch assembly and carrier module of linkage work, material belt is conveyed to the stamping end of stamping patch station by the transmission plate of patching machine rack, the stamping head of stamping patch assembly separates microneedle patch from carrier module and is attached to the target microneedle patch groove of material belt, and the utility model is separated from carrier module by the mode of quick down pressure of pneumatic cylinder by stamping patch assembly microneedle patch, and is attached to target microneedle patch groove in coherence, adopt assembly line type transmission material belt to stamping patch station to stamping patch, microneedle substrate sheet layer operating efficiency is higher, microneedle patch and the action of being attached to target microneedle patch groove are coherent, and full-automatic stamping patch operation can be achieved, can satisfy microneedle patch assembly line efficient stamping patch operation demand, and production capacity is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting structure technology in chip mounters, and in particular to a micro-needle chip mounting stamping mechanism. Background Technology

[0002] Microneedle patches are skin adjuvant therapy patches widely used in the dermatology and beauty fields. Common microneedle patches include acne patches and scar patches. They work by injecting drug ingredients into microneedles and then applying the patch with microneedles to the skin to achieve the therapeutic purpose. Currently, the production process of microneedle patches still commonly uses a robotic arm mode. On the one hand, the feeding end is stacked, with several microneedle base sheets stacked to form the feeding end, and then the robotic arm grabs them. After each sheet is applied, the next sheet is moved to continue applying. Moreover, after separating the patch from the needle, the microneedle patch is not directly and continuously applied to the target microneedle patch groove. This working method is extremely inefficient and quite expensive. As part of modern industrial production, assembly line operation is a way to improve work efficiency. In assembly line operation, how to link and quickly apply microneedle patches is also an important part. Therefore, this patent provides a microneedle patch stamping and application mechanism for use in microneedle patch machines. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a microneedle patch stamping and patching mechanism to solve the technical problems mentioned in the background art.

[0004] To solve the technical problem, this utility model adopts the following technical solution: A microneedle patch stamping and patching mechanism is provided, the patching mechanism having one or more stamping stations, each stamping station including a stamping component and a carrier module that work together. The material strip is conveyed to the stamping end of the stamping station via the conveyor plate of the patching machine frame. The stamping head of the stamping component separates the microneedle patch from the carrier module and attaches it to the target microneedle patch groove of the material strip.

[0005] Specifically, the stamping assembly includes a stamping base, a stamping cylinder, a first drive assembly, and a second drive assembly. The stamping cylinder is mounted on the upper end of the stamping base, and a stamping head is provided at the output end of the stamping cylinder. The stamping base is mounted on the frame through the first drive assembly. A stamping notch is recessed on the stamping base for the mold assembly to enter and be aligned. A stamping through hole is provided at the lower end of the stamping notch. Specifically, the carrier module includes a carrier frame assembly and a mold assembly. The carrier frame assembly is mounted on the frame via a second drive component. The mold assembly is mounted on the frame and has several regularly arranged punches. A microneedle mother plate is also placed inside the mold assembly. The punching seat and the carrier module are linked to the microneedle groove of the target strip. The punching head passes downward from the top of the mold assembly through the punches in the mold assembly and punches out a microneedle patch of a specific shape from the microneedle mother plate and attaches it to the microneedle groove.

[0006] Specifically, the first driving assembly includes a first motor, a first driving rod, a first nut block, a first slide block, a first slider, a first slide rail, a second motor, a second driving rod, a second nut block, a second slide block, a second slider, and a second slide rail. The lower end of the first slide block is slidably connected to the first slide rail via the first slider. The first nut block is installed at the lower end of the first slide block. The first motor drives the first driving rod to rotate and connect with the first nut block. The first motor controls the longitudinal movement of the first slide block. The second slide rail is fixedly disposed above the first slide block. The lower end of the second slide block is slidably connected to the second slide rail via the second slider. The second nut block is installed at the lower end of the second slide block. The second motor drives the second driving rod to rotate and connect with the second nut block. The second motor controls the lateral movement of the second slide block. The second slide block is located above the first slide block. The stamping seat is fixed above the second slide block. Specifically, the second drive assembly includes a third motor, a third drive rod, a third nut block, a third slide block, a third slide rail, a fourth motor, a fourth drive rod, a fourth nut block, a fourth slide block, a fourth slide block, and a fourth slide rail. The lower end of the third slide block is slidably connected to the third slide rail via the third slide block. The third nut block is installed at the lower end of the third slide block. The third motor drives the third drive rod to rotate and connect with the third nut block. The third motor controls the longitudinal movement of the third slide block. The fourth slide rail is fixedly installed above the third slide block. The lower end of the fourth slide block is slidably connected to the fourth slide rail via the fourth slide block. The fourth nut block is installed at the lower end of the fourth slide block. The fourth motor drives the fourth drive rod to rotate and connect with the fourth nut block. The fourth motor controls the lateral movement of the fourth slide block. The fourth slide block is located at the upper end of the third slide block. The vehicle module is fixed above the fourth slide block.

[0007] Specifically, the carrier assembly includes a carrier base and a carrier arm, wherein the carrier base is fixedly connected to the fourth slide, one end of the carrier arm is fixedly connected to the carrier base and the other end extends toward the punching seat, the mold assembly includes a mold base plate and a mold cover plate that are pressed together, the mold base plate is fixedly installed on the carrier arm, both the mold base plate and the mold cover plate are provided with coaxial corresponding punch holes, and a micro needle mother plate is placed between the mold base plate and the mold cover plate.

[0008] Specifically, the output end of the punching cylinder is provided with a punching rod, which passes through the punching notch and the punching through hole. The punching head is located at the bottom of the punching rod. The punching head includes a sharp blade and an inner groove. The bottom of the punching rod is recessed inward to form the inner groove. The outer edge of the inner groove forms the sharp blade. The upper end of the punching rod is provided with a rod plug. The inner side of the rod plug is provided with an external air hole. The inner side of the punching rod is provided with a vent. The bottom of the vent connects to a blow hole. The lower end of the blow hole extends to the end face of the inner groove. (When the punching rod passes downward through the punching hole and cuts a microneedle patch of a specific shape from the microneedle mother plate with the help of punching pressure, the microneedle patch is embedded into the inner groove due to the downward pressure of the inner groove. Finally, the microneedle patch is blown onto the microneedle patch groove by the air blown out from the blow hole.)

[0009] Specifically, a punching and stabilizing mechanism is provided below the material strip and inside the conveyor plate. The punching and stabilizing mechanism includes an adsorption chamber, an electric suction cup, and a lifting component. An adsorption chamber is provided on the conveyor plate, and an electric suction cup is provided inside the adsorption chamber. The lower end of the electric suction cup is connected to a lifting component that lifts the suction cup upward.

[0010] It also includes a visual detection mechanism, which is installed on one side of the punching hole below the punching seat and is used to identify the orientation of the substrate layer and whether the punching hole is coaxial with the target microneedle groove.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: This patent utilizes a coordinated punching process between the punching component and the carrier module. The punching component rapidly separates the microneedle patch from the carrier module using a cylinder press-down mechanism and continuously applies it to the target microneedle patch groove. A streamlined conveyor belt is used at the punching station for punching, resulting in higher operating efficiency for the microneedle substrate layer. The actions of separating the microneedle patch and applying it to the target microneedle patch groove are seamless and can achieve fully automated punching operations. This meets the high-efficiency punching requirements of microneedle patch production lines and significantly increases production capacity. Attached Figure Description

[0012] Figure 1 : This is a reference diagram of the frame structure of the chip mounter in this utility model patent; Figure 2 This is one of the schematic diagrams of the overall structure of this utility model patent; Figure 3 This is the second schematic diagram of the overall structure of this utility model patent; Figure 4 This is the third schematic diagram of the overall structure of this utility model patent; Figure 5 This is an exploded view of the overall structure of this utility model patent. Figure 6 This is an exploded view of the vehicle module structure in this utility model patent. Figure 7 : This is a cross-sectional view of the stamping stabilization mechanism in this utility model patent; Figure 8 This is an exploded view of the material strip structure in this utility model patent. Figure 9 : This is a cross-sectional view of the material strip structure in this utility model patent; Figure 10 This is a perspective view of the punching rod structure in this utility model patent. In the diagram: 1. Material strip; 11. Upper release film layer; 12. Substrate layer; 13. Lower release film layer; 121. Microneedle mounting groove; 100. Mounting machine frame; 101. Conveyor plate; 2. Microneedle mother plate; 201. Microneedle mounting block; 201. Punching station A1; 3. Punching assembly; 31. Punching seat; 32. Punching cylinder; 33. Punching head; 34. Punching notch; 35. Punching through hole; 301. Punching end; 4. First drive assembly; 401. First motor; 402. First drive rod; 403. First nut block; 404. First slide block; 405. First slide rail; 406. Second motor; 407. Second drive rod; 408. Second nut block; 409. Second slide block; 410. Second slide block; 411. Second slide rail; 412. Second drive assembly; 5. Third motor; 501. Third drive... Moving rod 502, third nut block 503, third slide block 504, third slider 505, third slide rail 506, fourth motor 507, fourth drive rod 508, fourth nut block 509, fourth slide block 510, fourth slider 511, fourth slide rail 512, carrier module 6, carrier frame assembly 61, mold assembly 62, carrier frame base 611, carrier frame arm 612, mold base plate 621, mold cover plate 622, punch 623, magnetic suction part 624, positioning pin 625, positioning hole 626, punching rod 7, sharp blade part 72, inner groove part 73, rod plug part 74, external air hole 75, air passage 76, air blowing hole 77, punching stabilizing mechanism 8, adsorption chamber 81, electric suction cup 82, lifting part 83, buffer spring 84, visual detection mechanism 9. Detailed Implementation

[0013] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0014] refer to Figures 1 to 10 : This utility model discloses a microneedle patch stamping and patching mechanism, applied in the middle of the frame 100 of a microneedle patching machine. The microneedle patching machine adopts an assembly line patching method. A conveyor plate 101 is provided on the frame 100. A feed roller at the front or rear end of the conveyor plate 101 pulls the material strip 1 forward from its head. As the material strip 1 passes through the stamping station A1 of this patching mechanism, the stamping component 3 in the stamping station A1 sequentially performs patching operations on the target microneedle patching slot 121 of the target material strip 1, thereby improving the patching efficiency of the microneedle patch. It should be understood that in this patent, the microneedle motherboard 2 and the material strip 1 have already been prepared in the preceding process. The material strip 1 includes a three-layer structure, namely a lower... The three-layer structure consists of a release film layer 13, a substrate layer 12, and an upper release film layer 11. The upper release film layer 11 and the lower release film layer 13 are continuous in length, while the substrate layer 12 is arranged in an equidistant array between the upper release film layer 11 and the lower release film layer 13. When the pick-and-place machine is turned on, the feeding end first tears off the upper release film layer 11, leaving only the lower release film layer 13 to drag the substrate layer 12 to continue moving towards the pick-and-place mechanism. The substrate layer 12 has the target placement position. The pick-and-place mechanism in this patent needs to separate the micro-needle patch 201 from the micro-needle mother plate 2 and attach it to the micro-needle patch groove 121 on the substrate layer 12 to complete the pick-and-place operation. The micro-needle mother plate 2 is also a cardboard with micro-needles made in the previous process. Specifically, this patching mechanism has one or more punching stations A1. Each punching station A1 includes a punching component 3 and a carrier module 6 that work together. The strip 1 is pulled forward by a continuously rotating pull roller at the rear unloading end position via the conveyor plate 101 of the patching machine frame 100, thereby conveying the substrate layer 12 to the punching end 301 of the punching station A1. The punching head 33 of the punching component 3 separates the micro-needle patch 201 from the carrier module 6 and attaches it to the target micro-needle patch groove 121 of the strip 1. Here, punching refers to the process of removing the micro-needle patch 201 by pressing downward and then attaching it to the micro-needle patch groove 121. In an optional embodiment, the punching end 301 is the area located below the punching through hole 35 at the lower end of the punching seat 31. It can punch one micro-needle patch groove 121 at a time, or multiple punching rods 7 and multiple punching heads 33 can be set to punch downward at the same time, which can punch multiple micro-needle patch grooves 121 at the same time.

[0015] Specifically, the preferred method for linkage here is for the stamping component 3 and the carrier module 6 to be linked through a linkage mechanism. Common linkage mechanisms include gear-type linkage mechanisms, linear motor-type linkage mechanisms, and lead screw and slider-type linkage mechanisms.

[0016] It should be understood that the stamping components 3 and carrier modules 6 in each stamping station A1 work together in a linked manner. When there are multiple stamping stations A1, different stamping stations A1 can also be designed to work together. The system comprehensively controls the quantity and order of the material belt 1. A production line with multiple stamping stations A1 can significantly improve stamping efficiency.

[0017] Specifically, the punching assembly 3 includes a punching base 31, a punching cylinder 32, a first drive assembly 4, and a second drive assembly 5. The punching cylinder 32 is mounted on the upper end of the punching base 31, and a punching head 33 is provided at the output end of the punching cylinder 32. The punching base 31 is mounted on the frame through the first drive assembly 4. A punching notch 34 is recessed on the punching base 31 for the mold assembly 62 to enter and be aligned. A punching through hole 35 is provided at the lower end of the punching notch 34. The carrier module 6 includes a carrier frame group 61 and a mold group 62. The carrier frame group 61 is mounted on the frame via a second drive assembly 5. The mold group 62 is mounted on the frame and has a number of regularly arranged punches 623. A microneedle mother plate 2 is also placed inside the mold group 62. The punching seat 31 and the carrier module 6 are linked to the microneedle patching groove 121 of the target material strip 1. The punching head 33 passes downward from the upper end of the mold group 62 through the punches 623 of the mold group 62 and punches out a microneedle patch 201 of a specific shape from the microneedle mother plate 2 and attaches it to the microneedle patching groove 121.

[0018] Under the support of the carrier assembly 61, the mold assembly 62 moves in conjunction with the punching recess 34 of the punching seat 31 (at the same time, the punching recess 34 also moves with the punching seat 31), and continuously translates according to the coordinates, so that the punching through hole 35 is aligned with the position of the target punching hole 623. Here, the punching hole 623 on each mold assembly 62 is encoded by the system. The system achieves precise punching operation through the linkage of the punching seat 31 and the mold assembly 62 according to the position of the target micro-needle groove 121 to be punched.

[0019] In an optional embodiment, the punching head 33 is a flat head located at the bottom of the output rod of the punching cylinder 32. In the previous process, the microneedle mother plate 2 extrudes stamping lines (mark lines or dotted lines of a specific shape) by aligning with the punch holes 623 of the mold assembly 62. Each microneedle patch 201 is contained within the stamping line. When the microneedle mother plate 2 is placed inside the mold assembly 62, the individual microneedle patches 201 to be punched can be manually aligned with the punch holes 623. When the punching head 33 punches downwards from above, the inertia of the punching head 33 will carry the next microneedle patch 201. The system adjusts the punching head by setting specific punching parameters. During the pressing stroke, the microneedle patch 201 is quickly attached to the target microneedle groove 121. In another optional embodiment, the microneedle mother plate 2 does not have a stamping line, and the punching head 33 is a recessed annular tubular component with a cutting edge. The punching head 33 can use inertia and the characteristic that the microneedle mother plate 2 is fastened in the mold assembly 62 to cut off the microneedle patch 201 when punching downward from the punch hole 623. Then, under the control of the stroke, it reaches 1 mm above the microneedle groove 121. Air is blown into the punching head 33 through an additional channel in the cylinder to blow the microneedle patch 201 onto the microneedle groove 121. The implementation method is not limited here.

[0020] The first driving assembly 4 includes a first motor 401, a first driving rod 402, a first nut block 403, a first slide block 404, a first slider 405, a first slide rail 406, a second motor 407, a second driving rod 408, a second nut block 409, a second slide block 410, a second slider 411, and a second slide rail 412. The lower end of the first slide block 404 is slidably connected to the first slide rail 406 via the first slider 405. The first nut block 403 is installed at the lower end of the first slide block 404. The first motor 401 drives the first driving rod 402 to rotate, connecting it to the first nut block 403. The first motor 401 controls the vertical movement of the first slide block 404. The second slide rail 412 is fixedly mounted above the first slide block 404. The lower end of the second slide block 410 is slidably connected to the second slide rail 412 via the second slider 411. The second nut block 409 is installed at the lower end of the second slide block 410. The second motor 407 drives the second drive rod 408 to rotate and connect with the second nut block 409. The second motor 407 controls the second slide block 410 to move laterally. The second slide block 410 is located at the upper end of the first slide block 404. The punching seat 31 is fixed above the second slide block 410. In this way, the punching seat 31 can change its lateral and longitudinal position in the horizontal direction. This position change can be linked. The second drive assembly 5 includes a third motor 501, a third drive rod 502, a third nut block 503, a third slide block 504, a third slider 505, a third slide rail 506, a fourth motor 507, a fourth drive rod 508, a fourth nut block 509, a fourth slide block 510, a fourth slider 511, and a fourth slide rail 512. The lower end of the third slide block 504 is slidably connected to the third slide rail 506 via the third slider 505. The third nut block 503 is installed at the lower end of the third slide block 504. The third motor 501 drives the third drive rod 502 to rotate and connect with the third nut block 503. The third motor 501 controls the third slide block. 504 moves longitudinally. The fourth slide rail 512 is fixedly set above the third slide block 504. The lower end of the fourth slide block 510 is slidably connected to the fourth slide rail 512 through the fourth slider 511. The fourth nut block 509 is installed at the lower end of the fourth slide block 510. The fourth motor 507 drives the fourth drive rod 508 to rotate and connect with the fourth nut block 509. The fourth motor 507 controls the fourth slide block 510 to move laterally. The fourth slide block 510 is located at the upper end of the third slide block 504. The vehicle module 6 is fixed above the fourth slide block 510. In this way, the vehicle module 6 can realize the linkage change of the lateral and longitudinal positions in the horizontal direction.

[0021] The carrier assembly 61 includes a carrier base 611 and a carrier arm 612. The carrier base 611 is fixedly connected to the fourth slide 510. One end of the carrier arm 612 is fixedly connected to the carrier base 611, and the other end extends towards the punching seat 31. The mold assembly 62 includes a mold base plate 621 and a mold cover plate 622 that are pressed together. The mold base plate 621 is fixedly mounted on the carrier arm 612. Both the mold base plate 621 and the mold cover plate 622 are provided with coaxially corresponding punch holes 623. A microneedle mother plate 2 is placed between the mold base plate 621 and the mold cover plate 622. The microneedle mother plate 2 is a cardboard produced in the previous process with a surface covered with microneedles. The thickness of this cardboard is customized according to requirements. Here, the clamping between the mold base plate 621 and the mold cover plate 622 can be tightened by bolts. Of course, in order to quickly replace the microneedle mother plate 2, it can also be positioned and clamped by magnetic attraction using magnetic attraction component 624. For example, if the number of punches 623 on a set of mold group 62 is 20 x 50, that is, a total of 1000, then a microneedle with sufficient area can be used. The master plate 2 can punch and apply 250 substrate layers of type 2 (12). This means a single mold assembly 62 can produce 250 finished microneedle patches. Multiple interconnected punching stations A1 can multiply this number. The microneedle master plate 2 only needs to be replaced after each punching cycle. Specifically, the mold base plate 621 is mounted on the carrier arm 612. When replacing the microneedle master plate 2, simply remove the microneedle cover plate, remove the punched microneedle master plate 2, and then lay it flat to replace it with a new microneedle master plate 2. After aligning the microneedle cover plate with the correct position, place it on the microneedle mother plate 2. Preferably, the magnetic suction element 624 is located on the lower end face of the microneedle cover plate. In order to further improve the axial positioning when the microneedle cover plate and the microneedle mother plate 2 are longitudinally connected, positioning pins 625 and positioning holes 626 can also be used to position the microneedle cover plate and the microneedle base plate. For example, four positioning pins 625 are set at the four corners of the microneedle base plate, and four positioning holes 626 are set at the four corners of the microneedle cover plate. In this way, the gravity of the microneedle cover plate can be used to press the microneedle mother plate 2 tightly.

[0022] The output end of the punching cylinder 32 is provided with a punching rod 7, which passes through the punching notch 34 and the punching through hole 35. The punching head 33 is located at the bottom of the punching rod 7. The punching head 33 includes a sharp blade portion 72 and an inner groove portion 73. The bottom of the punching rod 7 is recessed inward to form the inner groove portion 73. The outer edge of the inner groove portion 73 forms the sharp blade portion 72. The upper end of the punching rod 7 is provided with a rod plug portion 74, and the inner side of the rod plug portion 74 is provided with an external air hole 75. The inner side of the punching rod 7 is provided with a ventilation channel 76, and the bottom of the ventilation channel 76 is connected to the air blowing hole 77. The lower opening of the air blowing hole 77 extends to the end face of the inner groove 73. When the punching rod 7 passes downward through the punching hole 623 and cuts a micro-needle patch 201 of a specific shape from the micro-needle mother plate 2 with the help of punching pressure, the micro-needle patch 201 is embedded into the inner groove 73 due to the downward pressure of the inner groove 73. Finally, the air blown out from the air blowing hole 77 blows the micro-needle patch 201 onto the micro-needle patch groove 121.

[0023] Specifically, although the conveyor belt 1 is taut by multiple pull rollers on the conveyor plate 101, it may still loosen when passing through the stamping station A1 for stamping because the material of the conveyor belt 1 is lightweight. To solve this problem, a stamping stabilizing mechanism 8 is provided below the conveyor belt 1 and inside the conveyor plate 101. The stamping stabilizing mechanism 8 includes an adsorption chamber 81, an electric suction cup, and a lifting component. The conveyor plate 101 has an adsorption chamber 81 with its opening facing upwards and the conveyor belt 1 passing through the opening of the adsorption chamber 81. An electric suction cup is provided inside the adsorption chamber 81, and the lower end of the electric suction cup is connected to a lifting component that lifts the electric suction cup upwards. When the system determines that the position is centered through a visual detection mechanism, it gives the stamping head 33 in the stamping station A1 the instruction to stamp downwards. Simultaneously, the lifting component raises the electric suction cup upwards to the lower surface of the release film layer 13 of the material strip 1, adsorbing the material strip 1. When the current several substrate layers 12 are applied and the material strip 1 needs to continue moving forward, the electric suction cup releases its adsorption, and the lifting mechanism moves the electric suction cup downwards. This process is repeated. The lifting mechanism here can be a cylinder, electric cylinder, etc. Normally, an electric cylinder or a cylinder can control the electric suction cup to reach the opening of the adsorption cavity 81 by controlling the stroke. However, in some cases, errors may occur, causing the electric suction cup to exceed the conveyor plate 101 (adsorption cavity 81). In order to prevent the electric suction cup from being raised too high, a buffer mechanism, such as a buffer spring, can be set at the connection between the electric suction cup and the lifting mechanism. This provides a buffer force when the suction cup is adsorbed upwards, giving the lifting mechanism a correction mechanism for the control process.

[0024] Here, in order to improve the alignment accuracy between the punching through hole 35 and the micro-needle groove 121 below, a visual detection mechanism is also included. The visual detection mechanism is installed on one side of the punching through hole 35 below the punching base 31 and is used to identify the orientation of the substrate layer 12 and whether the punching hole 623 and the target micro-needle groove 121 are coaxial. The visual detection mechanism consists of several cameras, which are associated with the main control board and are responsible for matching the returned data with the system data to identify the specific orientation. For example, when the micro-needle groove 121 is located directly above the punching through hole 35, if the matching degree between the captured target micro-needle groove 121 and the circle in the system is higher than 99%, it is considered a valid alignment. If it is lower than a certain threshold, it is necessary to adjust the coordinates of the linkage between the punching component 3 and the carrier module 6 in the system (based on this visual detection mechanism and coordinate adjustment mechanism, which are existing technologies, they will not be described in detail here).

[0025] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A microneedle patch stamping and patching mechanism, characterized in that, This placement mechanism has one or more punching stations. Each punching station includes a punching component and a carrier module that work together. The material tape is conveyed to the punching end of the punching station via the conveyor plate of the placement machine frame. The punching head of the punching component separates the micro-needle patch from the carrier module and attaches it to the target micro-needle patch groove of the material tape.

2. The microneedle patch stamping and patching mechanism as described in claim 1, characterized in that, The stamping assembly includes a stamping base, a stamping cylinder, a first drive assembly, and a second drive assembly. The stamping cylinder is mounted on the upper end of the stamping base, and a stamping head is provided at the output end of the stamping cylinder. The stamping base is mounted on the frame through the first drive assembly. A stamping notch is formed in the stamping base for the mold assembly to enter and be aligned. A stamping through hole is provided at the lower end of the stamping notch. The carrier module includes a carrier frame assembly and a mold assembly. The carrier frame assembly is mounted on the frame via a second drive component. The mold assembly is mounted on the frame and has several regularly arranged punches. A micro-needle mother plate is also placed inside the mold assembly. The punching seat and the carrier module are linked to the micro-needle groove of the target strip. The punching head passes downward from the top of the mold assembly through the punches in the mold assembly and punches out a micro-needle patch of a specific shape from the micro-needle mother plate and attaches it to the micro-needle groove.

3. The microneedle patch stamping and patching mechanism as described in claim 2, characterized in that, The first driving assembly includes a first motor, a first driving rod, a first nut block, a first slide block, a first slider, a first slide rail, a second motor, a second driving rod, a second nut block, a second slide block, a second slider, and a second slide rail. The lower end of the first slide block is slidably connected to the first slide rail via the first slider. The first nut block is installed at the lower end of the first slide block. The first motor drives the first driving rod to rotate and connect with the first nut block. The first motor controls the longitudinal movement of the first slide block. The second slide rail is fixedly disposed above the first slide block. The lower end of the second slide block is slidably connected to the second slide rail via the second slider. The second nut block is installed at the lower end of the second slide block. The second motor drives the second driving rod to rotate and connect with the second nut block. The second motor controls the lateral movement of the second slide block. The second slide block is located above the first slide block. The stamping seat is fixed above the second slide block.

4. The microneedle patch stamping and patching mechanism as described in claim 2, characterized in that, The second drive assembly includes a third motor, a third drive rod, a third nut block, a third slide block, a third slide rail, a fourth motor, a fourth drive rod, a fourth nut block, a fourth slide block, a fourth slide block, and a fourth slide rail. The lower end of the third slide block is slidably connected to the third slide rail via the third slide block. The third nut block is installed at the lower end of the third slide block. The third motor drives the third drive rod to rotate and connect with the third nut block. The third motor controls the longitudinal movement of the third slide block. The fourth slide rail is fixedly installed above the third slide block. The lower end of the fourth slide block is slidably connected to the fourth slide rail via the fourth slide block. The fourth nut block is installed at the lower end of the fourth slide block. The fourth motor drives the fourth drive rod to rotate and connect with the fourth nut block. The fourth motor controls the lateral movement of the fourth slide block. The fourth slide block is located at the upper end of the third slide block. The vehicle module is fixed above the fourth slide block.

5. The microneedle patch stamping and patching mechanism as described in claim 2, characterized in that, The carrier assembly includes a carrier base and a carrier arm, wherein the carrier base is fixedly connected to the fourth slide, one end of the carrier arm is fixedly connected to the carrier base, and the other end extends toward the punching seat. The mold assembly includes a mold base plate and a mold cover plate that are pressed together. The mold base plate is fixedly installed on the carrier arm. Both the mold base plate and the mold cover plate are provided with coaxial corresponding punch holes. A micro needle mother plate is placed between the mold base plate and the mold cover plate.

6. The microneedle patch stamping and patching mechanism as described in claim 2, characterized in that, The output end of the punching cylinder is provided with a punching rod, which passes through the punching notch and the punching through hole. The punching head is located at the bottom of the punching rod. The punching head includes a sharp blade and an inner groove. The bottom of the punching rod is recessed inward to form the inner groove. The outer edge of the inner groove forms the sharp blade. The upper end of the punching rod is provided with a rod plug. The inner side of the rod plug is provided with an external air hole. The inner side of the punching rod is provided with a vent. The bottom of the vent connects to an air blowing hole. The lower opening of the air blowing hole extends to the end face of the inner groove.

7. A microneedle patch stamping and patching mechanism as described in any one of claims 1-6, characterized in that, Below the material strip and inside the conveyor plate, there is also a punching and bonding stabilizing mechanism. The punching and bonding stabilizing mechanism includes an adsorption chamber, an electric suction cup, and a lifting component. The conveyor plate has an adsorption chamber, and an electric suction cup is installed inside the adsorption chamber. The lower end of the electric suction cup is connected to a lifting component that lifts the suction cup upward.

8. A microneedle patch stamping and patching mechanism as described in claim 2, characterized in that, It also includes a visual detection mechanism, which is installed on one side of the punching hole below the punching seat and is used to identify the orientation of the substrate layer and whether the punching hole and the target microneedle groove are coaxial.

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