Smt barcode sticking device

CN224916413UActive Publication Date: 2026-10-30CONX OPTOELECTRONICS TECHNOLOGY (SUZHOU) CO LTD
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Patent Information

Application Number
CN202522645882.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-14
Publication Date
2026-10-30
Estimated Expiration
2035-12-14

AI Technical Summary

Technical Problem

[0004]本实用新型旨在解决现有SMT条码贴合设备中存在的Z轴运动效率与贴合柔性难以兼顾、PCB定位成本高以及缺乏闭环质量验证等技术问题,提供一种结构优化、贴合精度高且具有缓冲保护功能的SMT条码视觉定位贴合设备

Benefits of technology

采用伺服电机(第一驱动)负责快速趋近,步进电机(第二驱动)负责慢速贴合,既保证了生产节拍,又通过二级驱动配合弹性缓冲机构,有效防止了刚性冲击对PCB板造成的损伤。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of SMT bar code visual positioning laminating equipment, it is related to the technical field of automation equipment.The equipment includes rack, PCB support device fixedly arranged on rack, for providing bar code label feeding device, visual detection device including image acquisition unit and light source, laminating execution mechanism and controller.The laminating execution mechanism includes XY axis drive assembly, Z axis lifting assembly and adsorption component.The utility model is characterized in that:Z axis lifting assembly adopts series connection type double drive structure, including first lifting drive unit and second lifting drive unit;The fixed end of the first lifting drive unit is connected to XY axis drive assembly, the second lifting drive unit is fixedly installed on the lifting output end of first lifting drive unit, and the adsorption component is installed on the lifting output end of second lifting drive unit.The utility model can take into account large-stroke fast movement and small-stroke precision flexible lamination by the series connection double drive design of Z axis, effectively improves production efficiency and lamination quality.
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Description

Technical Field

[0001] This utility model relates to the field of SMT surface mount technology in electronic manufacturing, and in particular to an SMT barcode visual positioning and bonding device. Background Technology

[0002] In the SMT (Surface Mount Technology) production process in the electronics manufacturing industry, in order to achieve full-process product traceability, it is usually necessary to affix barcode labels containing traceability information to designated locations on the PCB (Printed Circuit Board). Existing SMT barcode bonding equipment typically uses a feeder in conjunction with a robotic arm for this operation.

[0003] However, in actual large-scale production, existing equipment structures mainly suffer from the following technical problems: Large material feeding position deviations lead to insufficient bonding accuracy: Existing feeders primarily rely on mechanical transmission to convey material belts. Due to the inherent flexibility of the belt and gaps in the transmission structure, the belt is prone to lateral shaking or angular tilting during transport. This mechanical structure results in significant deviations in the picking position of barcode materials. If the equipment lacks an effective hardware correction mechanism, it will directly lead to misaligned or out-of-bounds labels. Redundant vision inspection devices result in high costs: To address the aforementioned bonding accuracy issues, traditional high-precision bonding equipment often employs a "dual-camera" vision architecture. One camera looks down at the PCB board to locate its position, while the other camera looks up at the label on the nozzle to locate its position. However, in many standardized production lines, the PCB board is already effectively fixed using high-precision tooling fixtures and pneumatic clamps, resulting in very small positional offsets. In this scenario, configuring a camera solely for PCB board positioning is functionally redundant, increasing hardware costs and debugging complexity. Rigid Z-axis bonding can easily damage products: Traditional bonding heads typically use a single Z-axis motor to drive the nozzle's lifting and lowering. In pursuit of production efficiency, the Z-axis downward pressure is relatively fast, and the contact is mostly rigid. Due to the lack of a mechanical buffer structure, a large impact force is easily generated at the moment of bonding, causing damage to the PCB board and affecting product yield. Lack of online quality verification loop: Most existing bonding equipment considers the process complete after labeling, lacking hardware devices for real-time detection of the bonded barcodes. If there is severe barcode misalignment, wrinkles, or illegible label printing, the equipment cannot detect and remove defective products in time, causing problematic products to flow into subsequent processes, resulting in production line traceability interruptions and increased rework costs. In summary, developing a simplified, cost-controllable SMT barcode visual positioning bonding equipment that can effectively correct feeding deviations to protect the PCB board and achieve post-bonding verification has become an urgent technical problem to be solved. Summary of the Invention

[0004] This invention aims to solve the technical problems existing in SMT barcode bonding equipment, such as the difficulty in balancing Z-axis motion efficiency and bonding flexibility, high PCB positioning costs, and lack of closed-loop quality verification. It provides an SMT barcode visual positioning and bonding equipment with optimized structure, high bonding accuracy, and buffer protection function.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: An SMT barcode visual positioning and bonding device includes: a frame; a PCB support device fixedly mounted on the frame for supporting PCB boards; a feeding device disposed on one side of the frame for providing barcode labels; a visual inspection device including an image acquisition unit and a light source; a bonding execution mechanism including an XY axis drive assembly, a Z-axis lifting assembly, and an adsorption assembly disposed at the end of the Z-axis lifting assembly; and a controller electrically connected to the visual inspection device and the bonding execution mechanism.

[0006] The innovation of this utility model is that the Z-axis lifting assembly adopts a series dual-drive structure, including a first lifting drive unit and a second lifting drive unit; the fixed end of the first lifting drive unit is connected to the movable slide of the XY-axis drive assembly, and the second lifting drive unit is fixedly installed on the lifting output end of the first lifting drive unit; the adsorption assembly is installed on the lifting output end of the second lifting drive unit.

[0007] As a further improvement of this utility model, the first lifting drive unit is a servo motor module, and the second lifting drive unit is a stepper motor module; the second lifting drive unit is fixed to the slider of the first lifting drive unit through an adapter flange, and the stroke of the first lifting drive unit is greater than the stroke of the second lifting drive unit.

[0008] As a further improvement of this utility model, the image acquisition unit is fixedly mounted below the bonding actuator by a camera bracket, and the optical axis of the lens of the image acquisition unit is vertically upward, facing the moving path of the adsorption component; the light source is a ring light source, which is sleeved on the outer periphery of the lens of the image acquisition unit.

[0009] As a further improvement of this utility model, the feeding device includes a material belt guide groove and a tension regulator disposed at the discharge port; the material belt guide groove is a U-shaped groove structure with limiting sidewalls; the tension regulator includes a swing arm and a tension roller, the tension roller being disposed on the material belt conveying path and in contact with the surface of the material belt.

[0010] As a further improvement of this utility model, the adsorption assembly includes a vacuum generator and a silicone suction nozzle; the silicone suction nozzle is detachably installed at the end of the Z-axis lifting assembly and connected to the vacuum generator through an air pipe.

[0011] As a further improvement of this utility model, the PCB support device includes a lifting platform located below the PCB transport track and a lifting drive assembly; the upper surface of the lifting platform is provided with a plurality of upwardly extending support pins; the output end of the lifting drive assembly is connected to the lifting platform and is used to drive the lifting platform and the support pins to rise synchronously, so that the support pins abut against the lower surface of the PCB board.

[0012] The beneficial effects of this utility model are: A servo motor (first drive) is used for rapid approach, and a stepper motor (second drive) is used for slow bonding. This ensures production cycle time and, through the two-stage drive and the elastic buffer mechanism, effectively prevents damage to the PCB board caused by rigid impact.

[0013] By using high-precision positioning grooves in conjunction with pneumatic clamping components to fix the PCB, the downward-facing camera used for positioning the PCB is eliminated, and only the upward-facing camera for photographing barcodes is retained, which significantly reduces equipment costs while ensuring the reliability of positioning.

[0014] By combining pressure monitoring from a pressure sensor with online scanning from a downstream barcode reader, a closed-loop quality control system is achieved, from "bonding force control" to "post-bonding inspection," effectively preventing defective products from leaving the site. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the SMT barcode visual positioning and bonding equipment of this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of the fitting actuator in this utility model.

[0017] Figure 3 This is a schematic diagram of the visual positioning detection device in this utility model.

[0018] Figure 4 This is a structural schematic diagram of the PCB support device and lifting drive assembly in this utility model.

[0019] Figure 5 This is a schematic diagram of the Z-axis lifting assembly in this utility model.

[0020] Figure 6 This is a partially enlarged structural diagram of the adsorption component and silicone nozzle in this utility model.

[0021] Figure 7 This is a three-dimensional structural diagram of the feeding device in this utility model.

[0022] Figure 8This is a block diagram illustrating the connection principle of the electrical control system of this utility model. Detailed Implementation

[0023] Implementation, for example Figure 1 (Equipment appearance diagram) and Figure 7 (Oblique view of the motion mechanism) As shown, this utility model provides an SMT barcode visual positioning and bonding equipment, mainly including a frame 100, a PCB support device 200, a feeding device 300, a visual inspection device 400, a bonding execution mechanism, and a controller 600. The PCB support device 200 is fixedly mounted on the work platform 101 of the frame 100, used to support and mechanically fix the PCB board to be bonded; the feeding device 300 is located on one side of the frame 100, used to provide roll-shaped barcode labels; the bonding execution mechanism 500 spans above the frame 100, responsible for transporting the barcode 301 from the feeding device 300 to the PCB board; the controller 600 is electrically connected to each driving component and sensor, controlling the operation of the entire machine.

[0024] like Figure 2 As shown, the fitting actuator 500 includes an XY-axis drive assembly 510 and a Z-axis lifting assembly 520. The XY-axis drive assembly 510 is fixed to the gantry beam 102 of the frame 100 and is used to drive the Z-axis lifting assembly 520 to move in the horizontal plane. Figure 5 As shown, the core of this embodiment lies in the Z-axis lifting assembly 520, which adopts a series dual-drive structure. Specifically, this assembly includes a first lifting drive unit 521 and a second lifting drive unit 522.

[0025] The first lifting drive unit 521 uses a servo motor module (such as a Panasonic A6 series servo motor with a lead screw guide rail), and its fixed end is connected to the moving slide 511 of the XY axis drive assembly 510. It is responsible for rapid lifting with a long stroke, used to quickly move the suction nozzle to a height close to the working surface. The second lifting drive unit 522 uses a stepper motor module 5221 (such as a Shinano 42HS series stepper motor).

[0026] In terms of travel, the travel of the first lifting drive unit 521 is significantly greater than that of the second lifting drive unit 522. The first lifting drive unit 521 is responsible for "coarse positioning," handling most of the displacement from the safety height to the working surface (e.g., travel covering 0-150mm), and its moving speed is set relatively fast (e.g., 300mm / s). The second lifting drive unit 522, on the other hand, is only responsible for "fine bonding," with a shorter travel design (e.g., effective travel only 10-20mm, with a buffer travel of 0-5mm using spring 542), focusing on low-speed (e.g., 10-20mm / s) and high-precision fine-tuning at the moment of contact with the PCB board. This design utilizes the speed advantage of the servo motor to shorten the production cycle time (CT) and the stable low-speed torque of the stepper motor, combined with the buffer mechanism, to achieve flexible bonding.

[0027] The servo motor module is fixedly mounted on the lifting output slider 5213 of the first lifting drive unit 521 via an adapter flange 5222. That is, when the first lifting drive unit 521 operates, it will lift the entire second lifting drive unit 522 together. The second lifting drive unit 522 is responsible for the precise contact action with a small stroke, and its stroke is less than that of the first lifting drive unit 521.

[0028] An adsorption assembly 530 is installed on the lifting output end of the second lifting drive unit 522. For example... Figure 6 and Figure 7 As shown, the adsorption assembly 530 includes a silicone suction nozzle 533 connected to a vacuum generator 532 via an air tube. The silicone suction nozzle 533 is detachably mounted at the end for easy replacement. To facilitate the flexible bonding process, the adsorption assembly is also connected to a pressure sensor 543 (not shown) for real-time monitoring of the contact pressure at the nozzle end.

[0029] When the device performs the suction action, the controller 600 controls the vacuum generator 532 to operate, generating negative pressure inside the air tube and nozzle. For example, in this embodiment, the suction force is set to 0.3-0.5 MPa. This negative pressure causes the barcode label to be firmly adsorbed onto the end face of the silicone nozzle 533 until the adhesion action is completed. Then, the vacuum generator 532 stops working or breaks the vacuum, releasing the label onto the PCB board.

[0030] like Figure 3 As shown, the visual inspection device 400 includes an image acquisition unit 410 and a light source 420. The image acquisition unit 410 is fixedly mounted below the moving path of the fitting actuator 500 via an L-shaped camera bracket 411. The optical axis of the lens 412 of the image acquisition unit 410 is vertically upward. After the suction assembly 530 picks up the barcode, it moves to hover directly above the camera, and the camera takes a picture of the barcode on the suction nozzle from below. To eliminate reflections and clearly present the barcode outline, a ring light source 421 is fitted around the lens 412 to provide uniform backlight illumination.

[0031] The visual inspection device 400 is used for 'presence detection' and 'content verification' before the label is applied. After the adsorption component 530 picks up the label from the feeding device 300, it moves and hovers directly above the image acquisition unit 410. At this time, the image acquisition unit 410 takes a picture of the nozzle end face and sends it back to the controller 600.

[0032] The controller 600 performs the following detection method, using an image recognition algorithm to determine whether a label is present on the nozzle. If the nozzle is detected to be empty or the label's adsorption posture is severely abnormal (e.g., upright), the device will report an error or retry the pick-up to prevent subsequent 'empty labeling' and protect the PCB board from being damaged by the exposed nozzle.

[0033] Simultaneously, the image acquisition unit 410 directly reads the barcode or QR code content on the label and decodes it, transmitting it to the controller 600. The controller compares the read content with the preset data in the production work order. If an error is found in the label content, such as the feeder loading the wrong roll of material, or the label being printed blurry and unreadable, the equipment will automatically perform a material discarding action to ensure that only labels with correct and clear content are affixed to the PCB board.

[0034] like Figure 4 As shown, this equipment uses a mechanical lifting support method to ensure the flatness of the PCB board during operation. The PCB support device 200 mainly includes a lifting platform 210 and a lifting drive assembly 220. The lifting platform 210 is located below the PCB transport track, and its upper surface is provided with several upward-extending support pins 211. The positions of the support pins 211 can be arranged according to the component layout at the bottom of the PCB board, and are used to abut against the open space on the lower surface of the PCB board during lifting.

[0035] A lifting drive assembly 220 is installed below the lifting platform 210, which includes a lifting cylinder (or motor) and a lifting bracket 222 connected to the cylinder output end. The lifting bracket 222 is connected to the lifting platform 210. During operation, when the PCB is transported to the designated workstation, the lifting drive assembly 220 is activated, driving the lifting bracket 222 to simultaneously raise the lifting platform 210 and the support pin 211 until the top of the support pin 211 abuts against the lower surface of the PCB, thereby providing multi-point support for the PCB and preventing it from denting or vibrating during subsequent processing.

[0036] like Figure 7As shown, the feeding device 300 includes a material tray shaft 310, a take-up shaft 320, a material belt guide groove 330, and a tension regulator 340 disposed at the discharge port. The material belt guide groove 330 is a U-shaped groove structure with limiting sidewalls 331, used to constrain the left and right swing of the barcode material belt. The tension regulator 340 includes a swing arm 341 and a tension roller 342. The tension roller 342 is disposed on the material belt conveying path and always presses against or abuts the surface of the material belt. The swing of the swing arm 341 absorbs the vibration during the material belt conveying process and maintains constant tension, thereby helping to improve the repeatability accuracy of the picking position.

[0037] In this embodiment, the width of the guide groove is customized according to the width of the barcode tape (for example, for a 10mm wide tape, the guide groove width is designed to be 12mm), and its two vertical sidewalls form physical limiting surfaces. When the tape passes through the guide groove, its lateral sway is strictly constrained within the range defined by the sidewalls, thereby preventing the tape from deviating.

[0038] During the feeding process, the material belt often exhibits inconsistent tension. When the belt tension is too high, the tension roller 342 forces the swing arm 341 to lift or swing to release the tension; when the belt is slack, the swing arm 341 falls back under its own weight or the action of a torsion spring, pressing the belt down through the tension roller 342 to maintain tension. In this embodiment, the adjustment range is set to 0.3-1.5N. This dynamic adjustment mechanism can compensate for tension fluctuations during transmission in real time, ensuring that the barcode label remains flat and under constant tension when it reaches the suction position, providing a stable initial state for subsequent vacuum suction.

[0039] To achieve online closed-loop verification of bonding quality and prevent defective products from flowing into the next process, this embodiment adds a barcode reader to the equipment. Specifically, the barcode reader is fixedly mounted on the equipment frame using a dedicated bracket. Spatially, the barcode reader is located downstream of the PCB support device 200 along the discharge direction. According to the specific settings of this embodiment, the barcode reader is installed approximately 100mm downstream of the positioning fixture table to ensure that the PCB board can pass through the detection area when it flows out after bonding. The scanning head 711 of the barcode reader 710 is adjusted to face the conveyor track 103 of the PCB board, accurately aligning with the barcode bonding area on the PCB board's outflow path. In this embodiment, the barcode reader 710 is a Honeywell 1900GHD model or a similar industrial-grade laser / image scanner.

[0040] When the bonding process is completed, as the PCB board moves downstream along the conveyor track 103 through this area, the barcode reader 710 automatically triggers a scanning task. If the barcode can be successfully read, the controller 600 determines that the product is qualified and releases it; if the barcode reading fails (meaning that the barcode may be misaligned, missing, or illegible), the controller 600 will trigger an alarm signal or reject the product, thereby ensuring the integrity and reliability of data in the SMT production process.

[0041] During operation, the PCB is manually or by a loading machine placed into the conveyor track 103 and positioned, then fixed by the lifting drive assembly 220. The XY axis drive assembly 510 drives the nozzle to the feeding device 300 to pick up the barcode. The nozzle then moves to hover directly above the camera of the vision inspection device 400, where the camera takes a picture of the barcode on the nozzle from below. The controller 600 compensates for any deviations by driving the XY axes. During the bonding process, the Z1 axis first rapidly descends to a preset height above the PCB surface for coarse positioning; then, the Z2 axis steps at a lower speed to drive the nozzle to contact the PCB, optionally with spring buffering, until the pressure sensor 543 returns a preset value (e.g., 10N), achieving flexible bonding. After bonding, the nozzle resets, the PCB flows out, and is verified online by the vision inspection device.

[0042] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model. It will be apparent to those skilled in the art that the present utility model is not limited to the details of the above exemplary embodiments, and that the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of the present utility model is defined by the claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within the present utility model.

Claims

1. An SMT barcode bonding device, characterized in that, include: frame; A PCB support device is fixedly mounted on the frame to support the PCB board; A feeding device, located on one side of the frame, is used to provide barcode labels; A visual inspection device, comprising an image acquisition unit and a light source; The fitting actuator includes an XY axis drive assembly, a Z axis lifting assembly, and an adsorption assembly located at the end of the Z axis lifting assembly; The controller is electrically connected to both the vision detection device and the bonding actuator. Its characteristic is that the Z-axis lifting assembly adopts a series dual-drive structure, including a first lifting drive unit and a second lifting drive unit; The fixed end of the first lifting drive unit is connected to the movable slide of the XY axis drive assembly, and the second lifting drive unit is fixedly installed on the lifting output end of the first lifting drive unit; the adsorption assembly is installed on the lifting output end of the second lifting drive unit.

2. The SMT barcode bonding equipment according to claim 1, characterized in that: The first lifting drive unit is a servo motor module, and the second lifting drive unit is a stepper motor module; the second lifting drive unit is fixed to the slider of the first lifting drive unit through an adapter flange, and the stroke of the first lifting drive unit is greater than the stroke of the second lifting drive unit.

3. The SMT barcode bonding equipment according to claim 2, characterized in that: The image acquisition unit is fixedly mounted below the bonding actuator via a camera bracket, and the optical axis of the lens of the image acquisition unit is vertically upward, facing the moving path of the adsorption component; the light source is a ring light source, which is fitted around the lens of the image acquisition unit.

4. The SMT barcode bonding equipment according to claim 3, characterized in that: The feeding device includes a belt guide groove and a tension regulator disposed at the outlet; the belt guide groove is a U-shaped groove structure with limiting sidewalls; the tension regulator includes a swing arm and a tension roller, the tension roller being disposed on the belt conveying path and in contact with the belt surface.

5. An SMT barcode bonding device according to claim 3, characterized in that: The adsorption assembly includes a vacuum generator and a silicone suction nozzle; the silicone suction nozzle is detachably mounted at the end of the Z-axis lifting assembly and connected to the vacuum generator via an air tube.

6. An SMT barcode bonding device according to claim 3, characterized in that: The PCB support device includes a lifting platform located below the PCB transport track and a lifting drive assembly; the upper surface of the lifting platform is provided with a plurality of upwardly extending support pins; the output end of the lifting drive assembly is connected to the lifting platform and is used to drive the lifting platform and the support pins to rise synchronously, so that the support pins abut against the lower surface of the PCB board.

7. An SMT barcode bonding device according to claim 1, characterized in that: It also includes a barcode reader, which is fixedly mounted on the frame and located downstream of the PCB support device along the discharge direction; the scanning head of the barcode reader is positioned facing the outflow path of the PCB board and is used to scan and verify the barcode after bonding.