A conveying device with pretreatment function after cleaning of semiconductor parts

Abstract

The utility model discloses the technical field of semiconductor parts processing, specifically discloses a kind of conveying device with pretreatment function after semiconductor parts cleaning, including box, further include: drying mechanism, it is set to the inside of box, through the drying mechanism to semiconductor parts is dried, the drying mechanism includes two baffle fixedly connected in the inside of box and left and right distribution, two the baffle between rotationally connected with drying cone cylinder, located left side wall rotationally connected with the feeding cylinder of drying cone cylinder left end fixed connection of left side baffle, located right side wall rotationally connected with the discharge cylinder of drying cone cylinder right end fixed connection of right side baffle, through the synergic mechanism of " rotation flips + spiral conveying + penetrating hot air", fundamentally solve the problems of part stacking, uneven heating, long drying time in traditional static or simple conveying type drying, realize the efficient, high quality and protective drying pretreatment to semiconductor parts.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor component processing technology, and specifically discloses a conveying device with pretreatment function after cleaning semiconductor components. Background Technology

[0002] Semiconductors are materials with electrical conductivity between that of insulators and conductors. Their conductivity is easily controlled, making them suitable as components for information processing. From a technological and economic development perspective, semiconductors are extremely important. Many electronic products, such as computers, mobile phones, and digital recorders, utilize changes in the conductivity of semiconductors to process information. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being the most influential in commercial applications among all semiconductor materials.

[0003] Semiconductor components need to be cleaned during processing. After cleaning, water droplets remain on the surface. To avoid affecting subsequent work, pre-treatment is usually performed on the cleaned semiconductor components. However, the existing treatment method is to directly blow hot air to dry the surface of the semiconductor components. This causes the semiconductor components to stack, which makes it difficult for the water at the stacked parts to dry. This results in poor drying quality and long drying time, affecting the overall work efficiency. Therefore, we propose a conveying device with a pre-treatment function for semiconductor components after cleaning. Utility Model Content

[0004] This invention proposes a conveying device with pre-treatment function after cleaning semiconductor components. Through a horizontal drum structure, it can tumble and convey semiconductor components, and continuously convey hot air to dry the semiconductor components from all directions, reducing drying time and avoiding affecting overall work efficiency.

[0005] This utility model is implemented as follows: a conveying device with pre-treatment function after cleaning of semiconductor components, including a housing, and further comprising:

[0006] A drying mechanism, located inside the housing, dries semiconductor components. The drying mechanism includes two partitions fixedly connected to the inside of the housing and distributed on the left and right sides. A drying cone is rotatably connected between the two partitions. A feed cylinder, fixedly connected to the left end of the drying cone, is rotatably connected to the left side wall of the left partition. A discharge cylinder, fixedly connected to the right end of the drying cone, is rotatably connected to the right side wall of the right partition. A spiral conveyor blade is fixedly connected to the inner walls of the drying cone and the discharge cylinder. High-temperature resistant silicone is fixedly connected to the inner walls of the drying cone and the discharge cylinder, as well as the outer wall of the spiral conveyor blade.

[0007] As a preferred embodiment of the semiconductor component cleaning and pretreatment conveying device of this utility model, a first conveyor and a second conveyor are respectively installed on the left and right side walls of the box. One end of the first conveyor extends into the inside of the feed cylinder, and one end of the second conveyor extends to the bottom of the discharge cylinder.

[0008] As a preferred embodiment of the present invention, a conveying device with a pretreatment function after cleaning semiconductor components is provided, wherein a first gear is fixedly connected to the outer wall of the feed cylinder, and a second gear that meshes with the first gear is rotatably connected to the inner wall of the housing.

[0009] As a preferred embodiment of the semiconductor component cleaning and pretreatment conveying device of this utility model, a hot air blower with an air outlet connected to the box is installed on the lower end face of the box.

[0010] As a preferred embodiment of the semiconductor component cleaning and pretreatment conveying device of this utility model, a drive motor is installed on the left side wall of the box, and the output end of the drive motor is fixedly connected to the second gear.

[0011] As a preferred embodiment of the present invention, a conveying device with pretreatment function after cleaning semiconductor components is provided, wherein the drying cone is configured as a mesh structure.

[0012] In a preferred embodiment of this utility model, a conveying device with pretreatment function after cleaning semiconductor components is provided, wherein both the hot air blower and the drive motor are electrically connected to an external control computer.

[0013] The beneficial effects of this utility model are:

[0014] By employing a synergistic mechanism of "rotation and tumbling + spiral conveying + penetrating hot air", the problems of component stacking, uneven heating, and long drying time in traditional static or simple conveying drying are fundamentally solved, achieving efficient, high-quality, and protective drying pretreatment for semiconductor components. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a front cross-sectional view of the present invention.

[0018] Figure 3 This is a top view sectional structural diagram of the present invention;

[0019] Figure 4 This is a schematic diagram of the three-dimensional structure of the drying cone of this utility model.

[0020] The markings in the diagram are: 1. Box body; 2. Baffle plate; 3. Drying cone; 4. Feed cylinder; 5. Discharge cylinder; 6. Spiral conveyor blade; 7. First conveyor; 8. Second conveyor; 9. First gear; 10. Second gear; 11. Hot air blower; 12. Drive motor. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments to aid in understanding its content. Unless otherwise specified, the methods used in this invention are conventional methods; the raw materials and apparatus used, unless otherwise specified, are conventional commercially available products.

[0022] Please see Figure 1-4 A conveying device with pretreatment function after cleaning semiconductor components includes a housing 1, and further includes:

[0023] The drying mechanism is located inside the housing 1 and dries the semiconductor components. The drying mechanism includes two partitions 2 fixedly connected to the inside of the housing 1 and distributed on the left and right. A drying cone 3 is rotatably connected between the two partitions 2. A feed cylinder 4, which is fixedly connected to the left end of the drying cone 3, is rotatably connected to the left side wall of the left partition 2. A discharge cylinder 5, which is fixedly connected to the right end of the drying cone 3, is rotatably connected to the right side wall of the right partition 2. A spiral conveyor blade 6 is fixedly connected to the inner walls of the drying cone 3 and the discharge cylinder 5. High-temperature resistant silicone is fixedly connected to the inner walls of the drying cone 3 and the discharge cylinder 5, as well as the outer wall of the spiral conveyor blade 6.

[0024] In this embodiment: the cleaned semiconductor components are fed into the feed cylinder 4 by the first conveyor 7 and enter the drying cone 3. Then, the second gear 10 rotates, driving the first gear 9, which meshes with it, to rotate. This causes the feed cylinder 4, the drying cone 3, and the discharge cylinder 5 to rotate uniformly around their axis as a whole. Since the drying cone 3 is conical or cylindrical and has a spiral conveying blade 6 fixed on its inner wall, the semiconductor components are axially conveyed by the spiral conveying blade 6, causing them to move slowly and steadily from the feed end (left side) to the discharge end (right side). At the same time, the semiconductor components are tumbled inside the cylinder. This process prevents the components from stacking together, instead placing them in a state of being constantly thrown up and scattered, fully exposing their surfaces. Since the inner walls of the drying cone 3 and the discharge cylinder 5, as well as the outer wall of the spiral conveying blade 6, are all fixedly connected with high-temperature resistant silicone, the high-temperature resistant silicone can be used to clean the semiconductor components. The protection effectively prevents scratches or collision damage to precision semiconductor components caused by metal surfaces. At the same time, the hot air blown into the sealed chamber of the box 1 by the hot air blower 11 is dry. Since the drying cone 3 is designed with a mesh structure, the hot air can penetrate the cylinder wall without obstruction and directly surround and penetrate each component that is dynamically turning. All surfaces of the components (including grooves and contact surfaces that are difficult to access when statically stacked) are exposed to the hot air flow during movement, achieving 360-degree heat exchange without dead angles. Moisture is quickly evaporated and carried away. The dried components are finally discharged through the discharge cylinder 5 under the push of the spiral conveyor blades 6 and fall onto the second conveyor 8 below, and are sent to the next process. In the whole process, the conveying, turning and drying of semiconductor components are carried out simultaneously, forming a continuous automated pre-processing production line, which significantly shortens the time required for individual drying and improves the overall work efficiency.

[0025] As a technical optimization of this utility model, a first conveyor 7 and a second conveyor 8 are respectively installed on the left and right side walls of the box body 1. One end of the first conveyor 7 extends into the interior of the feed cylinder 4, and one end of the second conveyor 8 extends to the bottom of the discharge cylinder 5.

[0026] In this embodiment, semiconductor components can be transported via the first conveyor 7 and the second conveyor 8.

[0027] As a technical optimization of this utility model, a first gear 9 is fixedly connected to the outer wall of the feed cylinder 4, and a second gear 10 that meshes with the first gear 9 is rotatably connected to the inner wall of the housing 1.

[0028] In this embodiment: the second gear 10 rotates, the second gear 10 drives the first gear 9 to rotate, and the first gear 9 drives the feed cylinder 4 to rotate.

[0029] As a technical optimization of this utility model, a hot air blower 11 with an air outlet connected to the lower end of the housing 1 is installed.

[0030] In this embodiment, dry hot air is continuously blown into the sealed cavity of the housing 1 by the hot air blower 11.

[0031] As a technical optimization of this utility model, a drive motor 12 is installed on the left side wall of the housing 1, and the output end of the drive motor 12 is fixedly connected to the second gear 10.

[0032] In this embodiment, the second gear 10 can be driven to rotate by the drive motor 12.

[0033] As a technical optimization of this utility model, the drying cone 3 is configured as a mesh structure.

[0034] In this embodiment, the drying cone 3 is configured with a mesh structure, which allows hot air to penetrate the cylinder wall without obstruction, directly surrounding and penetrating each component that is dynamically tumbling.

[0035] As a technical optimization of this utility model, both the hot air blower 11 and the drive motor 12 are electrically connected to an external control computer.

[0036] In this embodiment, the hot air blower 11 and the drive motor 12 can be controlled by an external control computer.

[0037] The working principle and usage process of this utility model: After cleaning, the semiconductor components are fed into the feeding cylinder 4 by the first conveyor 7 and enter the drying cone 3. Then, the second gear 10 is driven to rotate by the drive motor 12. The second gear 10 drives the first gear 9, which meshes with it, to rotate. This causes the feeding cylinder 4, the drying cone 3, and the discharge cylinder 5 to rotate uniformly around their axis as a whole. The semiconductor components are axially transported by the spiral conveyor blades 6, so that the semiconductor components move slowly and steadily from the feeding end to the discharge end. At the same time, the semiconductor components are tumbled inside the cylinder. This process makes the semiconductor components rotate. The components are no longer stacked, but are constantly being tossed up and scattered, fully exposing their surfaces. At the same time, hot air is continuously blown into the sealed chamber of the housing 1 by the hot air blower 11, penetrating the cylinder wall without obstruction and directly surrounding and penetrating each component that is dynamically tumbling. All surfaces of the components are exposed to the hot airflow during the movement, achieving 360-degree heat exchange without dead angles. Moisture is quickly evaporated and carried away. The dried components are finally discharged through the discharge cylinder 5 under the push of the spiral conveyor blades 6 and fall onto the second conveyor 8 below, where they are sent to the next process.

[0038] In the description of this utility model, it should be understood that the terms "left", "right", "up", "down", "top", "bottom", "front", "back", "inner", "outer", "back", "middle", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] However, the above description is only a specific embodiment of this utility model and should not be construed as limiting the scope of implementation of this utility model. Therefore, any substitution of equivalent components or equivalent changes and modifications made in accordance with the scope of protection of this utility model should still fall within the scope of the claims of this utility model.

Claims

1. A conveying device with pretreatment function after cleaning semiconductor components, comprising a housing (1), characterized in that: Also includes: A drying mechanism is installed inside the housing (1) to dry semiconductor components. The drying mechanism includes two partitions (2) fixedly connected inside the housing (1) and distributed on the left and right. A drying cone (3) is rotatably connected between the two partitions (2). A feed cylinder (4) fixedly connected to the left end of the drying cone (3) is rotatably connected to the left side wall of the left partition (2). A discharge cylinder (5) fixedly connected to the right end of the drying cone (3) is rotatably connected to the right side wall of the right partition (2). A spiral conveyor blade (6) is fixedly connected to the inner walls of the drying cone (3) and the discharge cylinder (5). High-temperature resistant silicone is fixedly connected to the inner walls of the drying cone (3) and the discharge cylinder (5) and the outer wall of the spiral conveyor blade (6).

2. The conveying device with pretreatment function after cleaning of semiconductor components according to claim 1, characterized in that: The left and right side walls of the box (1) are respectively equipped with a first conveyor (7) and a second conveyor (8). One end of the first conveyor (7) extends into the inside of the feed cylinder (4), and one end of the second conveyor (8) extends to the bottom of the discharge cylinder (5).

3. The conveying device with pretreatment function after cleaning of semiconductor components according to claim 1, characterized in that: The outer wall of the feed cylinder (4) is fixedly connected to a first gear (9), and the inner wall of the housing (1) is rotatably connected to a second gear (10) that meshes with the first gear (9).

4. A conveying device with pretreatment function after cleaning of semiconductor components according to claim 3, characterized in that: A hot air blower (11) with its air outlet connected to the lower end of the housing (1) is installed.

5. A conveying device with pretreatment function after cleaning of semiconductor components according to claim 4, characterized in that: A drive motor (12) is installed on the left side wall of the housing (1), and the output end of the drive motor (12) is fixedly connected to the second gear (10).

6. A conveying device with pretreatment function after cleaning of semiconductor components according to claim 1, characterized in that: The drying cone (3) is configured with a mesh structure.

7. A conveying device with pretreatment function after cleaning of semiconductor components according to claim 5, characterized in that: Both the hot air blower (11) and the drive motor (12) are electrically connected to an external control computer.

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