A patch inductance wire board combination device with anti-lamination function

Abstract

The utility model relates to patch inductance manufacturing technical field, especially a kind of patch inductance wire plate combination equipment with anti-lamination function.Wire plate supply machine is used to support stacked wire plate, and provide to be picked up material for wire plate picking machine;Wire plate picking machine picks up single wire plate from stacked wire plate.Wire plate supply machine removes the support to remaining stacked wire plate immediately after single picking of wire plate picking machine is completed, so that it enters temporary weightlessness state, and breaks the stress balance of closely adhered between pieces;Airflow generating assembly is arranged in the side of wire plate supply machine, and the gas blowing direction corresponds with the falling trajectory of remaining wire plate.In the wire plate falling process, airflow generating assembly blows high-pressure gas to it, effectively separates possible micro-adhesion wire plate by means of airflow impact force, and finally realizes the design purpose of anti-lamination.

Description

Technical Field

[0001] This utility model relates to the field of surface mount inductor manufacturing technology, and in particular to a surface mount inductor leadboard assembly device with anti-overlapping function. Background Technology

[0002] In the manufacturing process of surface mount inductors, the lead sheet is a core component, and its supply efficiency and accuracy directly affect the quality of subsequent key processes such as inductor coil soldering. Currently, the mainstream method for feeding surface mount inductor lead sheets in the industry is mainly a traditional mechanical stacking feeding structure. The specific process is as follows: multiple lead sheets are stacked inside the hopper, and then picked up one by one by a pushing mechanism or adsorption mechanism and transferred to the next production stage, thereby achieving a continuous supply of lead sheets.

[0003] In actual production scenarios, the aforementioned feeding methods have significant limitations due to the dual constraints of the leadboard's material characteristics and the production environment. Specifically: Firstly, leadboards generally have thin profiles and high surface smoothness, and coupled with the effects of electrostatic adsorption in the production environment, stacked leadboards are prone to inter-chip adhesion. Secondly, traditional feeding systems lack targeted anti-overlapping designs; that is, after a single pick-up action, the support mechanism cannot change the tight adhesion of the remaining stacked leadboards, making it difficult to effectively break the inter-chip adhesion. Even if some feeding structures attempt to add simple separation components such as brushes and scrapers, these components easily scratch the leadboard surface and can only act on a localized area of ​​the top layer of the stack, with very limited effect on separating adhesion from deeper leadboards. Once adhered leadboards enter subsequent processes, they not only cause product quality defects such as loose solder joints but also significantly increase the defect rate and drive up production costs, making them unsuitable for the needs of large-scale production of surface mount inductors.

[0004] Therefore, it is urgent for technical personnel to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a surface mount inductor leadboard assembly device with anti-overlapping function, which aims to solve the problem that leadboards are prone to sticking together during traditional mechanical stacking and feeding, resulting in multiple boards being picked up at the same time, which in turn leads to quality defects in subsequent welding processes.

[0006] This utility model relates to a surface mount inductor leadboard assembly device with anti-overlapping function, including a leadboard supply mechanism, a leadboard picking mechanism, and an airflow generating component. The leadboard supply mechanism supports stacked leadboards and provides leadboards to be picked up by the leadboard picking mechanism. The leadboard picking mechanism picks up a single leadboard from the stack of leadboards supported by the leadboard supply mechanism. After the leadboard picking mechanism completes a single picking action, the supporting force of the leadboard supply mechanism on the remaining stacked leadboards is instantly removed, and the remaining leadboards are in a state of temporary weightlessness. The airflow generating component is arranged to the side of the leadboard supply mechanism, and its gas blowing direction corresponds to the falling trajectory of the remaining leadboards. During the process of the remaining leadboards falling due to the removal of the supporting force, the airflow generating component blows high-pressure gas onto them.

[0007] As a further improvement to the technical solution disclosed in this utility model, the wire board supply mechanism includes a sliding table, a left-side wire board temporary storage fixture, a right-side wire board temporary storage fixture, and a wire board lifting mechanism. Both the left-side and right-side wire board temporary storage fixtures are used to accommodate multiple wire boards arranged in a stacked manner. The sliding table serves as the mounting base for both, and they are spaced a predetermined distance apart in the left-right direction. The sliding table drives one of the left-side or right-side wire board temporary storage fixtures to move to a preset loading station. The wire board lifting mechanism is configured corresponding to the loading station and is used to support the stacked wire boards within either the left-side or right-side wire board temporary storage fixture at the loading station. Through a lifting action, the overall height of the stacked wire boards is adjusted sequentially, allowing the stacked wire boards to be pushed from the top layer to a preset picking height for the wire board picking mechanism. After the wire board picking mechanism completes a single picking action, the wire board lifting mechanism instantly releases its support for the remaining stacked wire boards.

[0008] As a further improvement to the technical solution disclosed in this utility model, the guide plate lifting mechanism includes a linear motor module, a lifting rod assembly, and a lifting plate; the stroke of the linear motor module is adapted to the thickness of a single guide plate; one end of the lifting rod assembly is fixedly connected to the mover of the linear motor module, and the other end is fixedly connected to the lifting plate; the lifting plate is arranged horizontally and is used to lift the stacked guide plates in the left or right guide plate temporary storage fixture at the loading station; after the guide plate picking machine completes a single picking action, the linear motor module drives the lifting rod assembly to instantly retract the lifting plate downwards to release the support for the remaining stacked guide plates.

[0009] As a further improvement to the technical solution disclosed in this utility model, the speed of the lifting plate is controlled at 50-150 mm / s when it retracts downwards, and the displacement of the downward retraction is not less than the thickness of a single guide plate.

[0010] As a further improvement to the technical solution disclosed in this utility model, the airflow generating assembly includes a support frame, a first air supply pipe, a second air supply pipe, a third air supply pipe, and a fourth air supply pipe; the support frame is used to support and fix the first air supply pipe, the second air supply pipe, the third air supply pipe, and the fourth air supply pipe; a series of blowing holes are arrayed along the length direction of each of the first air supply pipe, the second air supply pipe, the third air supply pipe, and the fourth air supply pipe; the first air supply pipe and the second air supply pipe are symmetrically arranged on both sides of the left-side guide plate temporary storage fixture, while the third air supply pipe and the fourth air supply pipe are symmetrically arranged on both sides of the right-side guide plate temporary storage fixture.

[0011] As a further improvement to the technical solution disclosed in this utility model, the pressure range of the high-pressure gas blown out by the first gas pipe, the second gas pipe, the third gas pipe, and the fourth gas pipe is 0.3 to 0.8 MPa.

[0012] As a further improvement to the technical solution disclosed in this utility model, the surface mount inductor leadboard assembly equipment with anti-overlapping function also includes a leadboard stripping assembly; the leadboard stripping assembly is located downstream of the leadboard supply machine and on the material transfer path of the leadboard picking machine; the leadboard stripping assembly is used to process two or more sticky leadboards that may be mistakenly picked up during the transfer process of the leadboard picking machine, and forces them to disperse by applying mechanical force to the sticky leadboards, allowing only a single leadboard to pass normally along the transfer path.

[0013] As a further improvement to the technical solution disclosed in this utility model, the lead plate stripping assembly includes a mounting base and a stripping function component; the stripping function component is detachably fixed to the mounting base, and has a through-slit on it for the lead plate to pass through, the width of which is adapted to the thickness of a single lead plate; when the lead plate pick-up mechanical transfers two or more bonded lead plates to the through-slit, the sidewall of the through-slit applies a mechanical blocking force to the bonded lead plates, forcibly dispersing the bonded parts, allowing only a single lead plate to pass through the slit.

[0014] As a further improvement to the technical solution disclosed in this utility model, the peeling function is fixedly connected to the mounting base by means of screws; along its own length direction, the peeling function has a waist-shaped hole for the screw to pass through freely; along the direction consistent with the extension direction of the waist-shaped hole, the mounting base has a plurality of threaded holes for the screw to be screwed into.

[0015] As a further improvement to the technical solution disclosed in this utility model, the surface mount inductor leadboard assembly equipment with anti-overlapping function also includes a dropping box; the dropping box is located directly below the leadboard peeling assembly; after the leadboard peeling assembly peels off the bonded leadboard and separates the excess leadboard, the excess leadboard falls into the dropping box by its own weight.

[0016] In practical applications, the surface mount inductor leadboard assembly with anti-overlapping function disclosed in this utility model can achieve at least the following beneficial technical effects, specifically: 1) After the leadboard picking mechanism completes a single picking action, the leadboard supply mechanism immediately releases its support for the remaining stacked leadboards. The unsupported leadboards enter a state of temporary weightlessness, directly breaking the force balance between the tight adhesion between the boards, which was originally maintained by stacking pressure and surface adhesion. This creates the necessary conditions for subsequent adhesion separation. During this process, the airflow generating component blows high-pressure gas in real time along the leadboard's falling trajectory. The airflow impact force can be precisely applied to the gaps between the stacked leadboards. This effectively separates existing micro-adhesions and prevents the formation of new adhesions during the leadboard's descent, ensuring that each leadboard remains independent. 2) The guide plate supply mechanism continuously feeds the material to be picked up by the guide plate picking mechanism, forming a rapid response process with the unsupporting and airflow separation stages. The entire process requires no machine downtime, thus ensuring the continuity of the feeding process. Furthermore, the airflow generation component adopts an on-demand start mode, blowing high-pressure gas only during the guide plate's descent. This not only ensures the adhesion and separation effect of the guide plate but also avoids significant energy consumption under unnecessary operating conditions. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional schematic diagram of a patch inductor leadboard assembly device with anti-overlapping function disclosed in this utility model.

[0019] Figure 2 This is a three-dimensional schematic diagram from another perspective of the patch inductor leadboard assembly device with anti-overlapping function disclosed in this utility model.

[0020] Figure 3 This is a schematic diagram showing the state of the surface mount inductor leadboard assembly device with anti-overlapping function disclosed in this utility model after the leadboard supply mechanism and airflow generation component are assembled.

[0021] Figure 4 This is a three-dimensional schematic diagram of the lead plate support mechanism in the patch inductor lead plate assembly device with anti-overlapping function disclosed in this utility model.

[0022] Figure 5 This is a three-dimensional schematic diagram of the leadboard stripping assembly in the patch inductor leadboard assembly device with anti-overlapping function disclosed in this utility model.

[0023] Figure 6 This is a three-dimensional schematic diagram from another perspective of the lead plate stripping assembly in the surface mount inductor lead plate assembly device with anti-overlapping function disclosed in this utility model.

[0024] 1-Wire board supply mechanism; 11-Sliding table; 12-Left wire board temporary storage fixture; 13-Right wire board temporary storage fixture; 14-Wire board lifting mechanism; 141-Linear motor module; 142-Lifting rod assembly; 143-Lifting plate; 2-Wire board picking mechanism; 3-Airflow generating assembly; 31-Support frame; 32-First air supply pipe; 33-Second air supply pipe; 34-Third air supply pipe; 35-Fourth air supply pipe; 4-Wire board peeling assembly; 41-Mounting base; 42-Peeling functional component; 421-Through seam; 43-Screw; 5-Drop box. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to specific embodiments. Figure 1 , Figure 2 The diagrams show two different perspectives of the surface mount inductor leadboard assembly equipment with anti-overlapping function disclosed in this utility model. It can be seen that it is mainly composed of several parts, including leadboard supply mechanism 1, leadboard picking mechanism 2, airflow generating component 3, leadboard peeling component 4, and dropping box 5. Through close functional linkage, the components not only effectively solve the overlapping problem in the process of surface mount inductor leadboard feeding, but also ensure the continuity of the feeding process.

[0026] The guide plate supply mechanism plays a core role in supporting and conveying materials. For example... Figure 3 As shown, the guide plate supply machine 1 mainly consists of a sliding table 11, a left guide plate temporary storage fixture 12, a right guide plate temporary storage fixture 13, and a guide plate lifting mechanism 14. The left and right guide plate temporary storage fixtures 12 and 13 are used to accommodate multiple guide plates arranged in a stacked manner. Both are mounted on the sliding table 11 and are spaced a predetermined distance apart in the left-right direction. The sliding table 11 drives one of the left and right guide plate temporary storage fixtures 12 to move to a preset loading station. This alternating loading mechanism ensures that subsequent loading operations do not require machine downtime, thus providing a foundation for the continuity of the loading process.

[0027] As Figure 3 As shown, the guide plate lifting mechanism 14 is precisely aligned with the feeding station. Figure 4As described above, the wire guide plate lifting mechanism 14 mainly consists of a linear motor module 141, a lifting rod assembly 142, and a lifting plate 143. The stroke of the linear motor module 141 is adapted to the thickness of a single wire guide plate to achieve precise adjustment of the stacking height of the wire guide plates. One end of the lifting rod assembly 142 is fixedly connected to the mover of the linear motor module 141, and the other end is fixedly connected to the lifting plate 143. The lifting plate 143 is arranged horizontally and is specifically used to lift the stacked wire guide plates in the left-side wire guide plate temporary storage fixture 12 or the right-side wire guide plate temporary storage fixture 13 at the loading station.

[0028] In practical operation, the lead plate lifting mechanism 14 adjusts the overall height of the lead plate stack sequentially through lifting actions, allowing the stacked lead plates to be pushed from the top layer to the preset picking height of the lead plate picking machine 2, thus meeting the stable picking requirements. After the lead plate picking machine 2 completes a single picking action, the lead plate lifting mechanism 14 enters a transient unloading state, instantly releasing support for the remaining stacked lead plates. Specifically, the linear motor module 141 drives the lifting rod assembly 142 to instantly retract the lifting plate 143 downwards. The retraction speed is controlled at 50–150 mm / s, and the downward displacement is not less than the thickness of a single lead plate. This results in the remaining lead plates being temporarily weightless, directly breaking the force balance between the stacking pressure and surface adhesion that was previously maintained by the combined forces of stacking pressure and surface adhesion, thus creating the necessary conditions for subsequent adhesion separation.

[0029] The core component used to achieve adhesion separation is the airflow generation component 3. For example... Figure 1 , Figure 2 As shown, the airflow generating assembly 3 is arranged to the side of the guide plate supply mechanism 1, and its gas blowing direction strictly corresponds to the falling trajectory of the remaining guide plate. Figure 3 As shown, the airflow generating assembly 3 mainly consists of a support frame 31, a first air supply pipe 32, a second air supply pipe 33, a third air supply pipe 34, and a fourth air supply pipe 35. The support frame 31 supports and fixes the first air supply pipe 32, the second air supply pipe 33, the third air supply pipe 34, and the fourth air supply pipe 35. A series of blowing holes are arrayed along the length of each of the first air supply pipe 32, the second air supply pipe 33, the third air supply pipe 34, and the fourth air supply pipe 35, allowing for uniform airflow. In terms of layout, the first air supply pipe 32 and the second air supply pipe 33 are symmetrically arranged on both sides of the left-side guide plate temporary storage fixture 12, while the third air supply pipe 34 and the fourth air supply pipe 35 are symmetrically arranged on both sides of the right-side guide plate temporary storage fixture 13, ensuring that the airflow fully covers the guide plate's falling area.

[0030] During the process of the remaining conductor plates falling due to the removal of the supporting force, the first air supply pipe 32, the second air supply pipe 33, the third air supply pipe 34, and the fourth air supply pipe 35 work together to blow high-pressure gas onto them, and the pressure range of the high-pressure gas is controlled within the range of 0.3 to 0.8 MPa. After multiple tests, it has been verified that the airflow impact force can be accurately applied to the gaps between the stacked conductor plates, effectively separating the existing micro-adhesions on the one hand, and preventing the formation of new adhesions during the falling of the conductor plates on the other hand, ensuring that each conductor plate remains independent at all times, and avoiding displacement or damage to the conductor plates due to excessive pressure.

[0031] It should also be noted that the airflow generating component 3 adopts an on-demand start mode, blowing high-pressure gas only during the process of the guide plate falling. In this way, energy consumption under a large number of unnecessary operating conditions can be effectively avoided.

[0032] To further improve the anti-overlapping effect, such as Figure 1 , Figure 2 As shown, the surface mount inductor leadboard assembly equipment with anti-overlapping function is also equipped with a leadboard stripping assembly 4. The leadboard stripping assembly 4 is located downstream of the leadboard supply machine 1 and on the material transfer path of the leadboard picking machine 2. It is mainly used to perform secondary processing on two or more sticky leadboards that may be mistakenly picked up by the leadboard picking machine 2 during the transfer process. By applying mechanical force to the sticky leadboards, it forces them to disperse, allowing only a single leadboard to pass normally along the transfer path, forming a "double insurance against overlapping".

[0033] like Figure 5 , Figure 6 As shown, the lead plate stripping assembly 4 mainly consists of a mounting base 41 and a stripping functional component 42. The stripping functional component 42 is detachably fixed to the mounting base 41, and has a through-slit 421 for the lead plate to pass through. The width of the through-slit 421 is adapted to the thickness of a single lead plate; when the lead plate picking mechanism 2 transports two or more bonded lead plates to the through-slit 421, the sidewall of the through-slit 421 applies a mechanical blocking force to the bonded lead plates, forcibly dispersing the bonded parts, ultimately allowing only a single lead plate to pass through the through-slit 421.

[0034] It is worth noting that, as Figure 6 As shown, the stripping function 42 is fixedly connected to the mounting base 41 by screws 43. Along its length, the stripping function 42 has an oblong hole through which the screw 43 can pass freely. Along the same direction as the oblong hole, the mounting base 41 has multiple threaded holes linearly arranged for the screws 43 to be screwed into. In practical applications, the combination of the oblong hole and the multiple threaded holes allows for flexible adjustment of the installation position of the stripping function 42 according to different specifications of lead sheets, thereby significantly improving the adaptability and practicality of the lead sheet stripping assembly 4.

[0035] Finally, it should be noted that, in addition to the core components mentioned above, the surface mount inductor leadboard assembly equipment with anti-overlapping function is also equipped with a discharge box 5, which is located directly below the leadboard peeling assembly 4. After the leadboard peeling assembly 4 peels off the adhered leadboards and separates the excess leadboards, the excess leadboards fall into the discharge box 5 under their own weight. This design enables the centralized recycling of excess materials, thereby effectively avoiding the problems of difficult cleaning or equipment jamming caused by materials scattering freely.

[0036] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A surface mount inductor leadboard assembly device with anti-overlapping function, characterized in that, The system includes a lead sheet supply mechanism, a lead sheet pickup mechanism, and an airflow generating assembly. The lead sheet supply mechanism supports stacked lead sheets and provides lead sheets to be picked up by the lead sheet pickup mechanism. The lead sheet pickup mechanism picks up a single lead sheet from the stack of lead sheets supported by the lead sheet supply mechanism. After the lead sheet pickup mechanism completes a single pickup action, the supporting force of the lead sheet supply mechanism on the remaining stacked lead sheets is instantly removed, and the remaining lead sheets are in a state of temporary weightlessness. The airflow generating assembly is arranged to the side of the lead sheet supply mechanism, and its gas blowing direction corresponds to the falling trajectory of the remaining lead sheets. During the process of the remaining lead sheets falling due to the removal of the supporting force, the airflow generating assembly blows high-pressure gas onto them.

2. The surface mount inductor leadboard assembly with anti-overlapping function according to claim 1, characterized in that, The lead plate supply mechanism includes a sliding table, a left lead plate temporary storage fixture, a right lead plate temporary storage fixture, and a lead plate lifting mechanism. Both the left and right lead plate temporary storage fixtures are used to accommodate multiple lead plates arranged in a stacked configuration. They are mounted on the sliding table and spaced a predetermined distance apart in the left-right direction. The sliding table drives either the left or right lead plate temporary storage fixture to a preset loading station. The lead plate lifting mechanism is positioned corresponding to the loading station and supports the stacked lead plates within either the left or right lead plate temporary storage fixture at the loading station. Through a lifting motion, it sequentially adjusts the overall height of the lead plate stack, allowing the stacked lead plates to be pushed sequentially from the top layer to a preset picking height for the lead plate picking mechanism. After the lead plate picking mechanism completes a single picking action, the lead plate lifting mechanism instantly releases its support from the remaining stacked lead plates.

3. The surface mount inductor leadboard assembly device with anti-overlapping function according to claim 2, characterized in that, The lead plate lifting mechanism includes a linear motor module, a lifting rod assembly, and a lifting plate; the stroke of the linear motor module is adapted to the thickness of a single lead plate; one end of the lifting rod assembly is fixedly connected to the mover of the linear motor module, and the other end is fixedly connected to the lifting plate; the lifting plate is arranged horizontally and is used to lift the stacked lead plates in the left or right lead plate temporary storage fixture at the loading station; after the lead plate picking mechanism completes a single picking action, the linear motor module drives the lifting rod assembly to instantly retract the lifting plate downwards to release the support for the remaining stacked lead plates.

4. The surface mount inductor leadboard assembly with anti-overlapping function according to claim 3, characterized in that, At the moment the lifting plate retracts downwards, its movement speed is controlled to be 50-150 mm / s, and the downward displacement is not less than the thickness of a single guide plate.

5. The surface mount inductor leadboard assembly with anti-overlapping function according to claim 2, characterized in that, The airflow generating assembly includes a support frame, a first air supply pipe, a second air supply pipe, a third air supply pipe, and a fourth air supply pipe; the support frame is used to support and fix the first air supply pipe, the second air supply pipe, the third air supply pipe, and the fourth air supply pipe; a series of blowing holes are arrayed along the length direction of each of the first air supply pipe, the second air supply pipe, the third air supply pipe, and the fourth air supply pipe; the first air supply pipe and the second air supply pipe are symmetrically arranged on both sides of the left-side guide plate temporary storage fixture, while the third air supply pipe and the fourth air supply pipe are symmetrically arranged on both sides of the right-side guide plate temporary storage fixture.

6. The surface mount inductor leadboard assembly with anti-overlapping function according to claim 5, characterized in that, The pressure range of the high-pressure gas blown out by the first gas supply pipe, the second gas supply pipe, the third gas supply pipe, and the fourth gas supply pipe is 0.3 to 0.8 MPa.

7. The surface mount inductor leadboard assembly with anti-overlapping function according to any one of claims 1-6, characterized in that, It also includes a lead plate stripping assembly; the lead plate stripping assembly is located downstream of the lead plate supply machine and on the material transfer path of the lead plate picking machine; the lead plate stripping assembly is used to process two or more sticky lead plates that may be mistakenly picked up during the transfer process of the lead plate picking machine, and forces them to disperse by applying mechanical force to the sticky lead plates, allowing only a single lead plate to pass normally along the transfer path.

8. The surface mount inductor leadboard assembly with anti-overlapping function according to claim 7, characterized in that, The lead plate stripping assembly includes a mounting base and a stripping function component. The stripping function component is detachably fixed to the mounting base and has a through-slit with a width adapted to the thickness of a single lead plate for the lead plate to pass through. When the lead plate pick-up mechanical transfer mechanism transports two or more bonded lead plates to the through-slit, the sidewall of the through-slit applies a mechanical blocking force to the bonded lead plates, forcibly dispersing the bonded parts and allowing only a single lead plate to pass through the slit.

9. The surface mount inductor leadboard assembly with anti-overlapping function according to claim 8, characterized in that, The peeling function is fixedly connected to the mounting base by means of screws; along its own length, the peeling function has a waist-shaped hole for the screw to pass through freely; along the direction consistent with the extension direction of the waist-shaped hole, the mounting base has a plurality of threaded holes for the screw to be screwed in.

10. The surface mount inductor leadboard assembly with anti-overlapping function according to claim 7, characterized in that, It also includes a drop box; the drop box is located directly below the lead plate stripping assembly; after the lead plate stripping assembly peels off the adhered lead plates and separates the excess lead plates, the excess lead plates fall into the drop box by their own weight.

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