Spinning device for chip regenerated SiO2 master batch

Abstract

The utility model discloses a chip regeneration SiO2 master batch's silk drawing device relates to silk drawing technical field, including the feeding system, the melting system, the silk drawing system and the winding machine that connect gradually, the melting system includes special screw extruder, and special screw extruder is connected with the discharge port of feeding system, and the coarse filter is connected with the discharge port of special screw extruder, and the medium filter is connected with the discharge port of coarse filter, and the fine filter is located between the medium filter and silk drawing system, this kind of chip regeneration SiO2 master batch's silk drawing device can filter the impurity that exists to silk drawing device, avoid the precision spinneret of impurity block, cause the production interruption, improve the fluidity of melt of SiO2 particle in the process of melting spinning simultaneously, stabilize fiber diameter, ensure the product quality after SiO2 master batch silk drawing.

Description

Technical Field

[0001] This utility model relates to the field of wire drawing technology, specifically a wire drawing device for chip regeneration SiO2 masterbatch. Background Technology

[0002] Chips are the core components of modern electronic devices. Effective recycling of the waste generated during their manufacturing and use can not only alleviate resource shortages but also reduce environmental pollution. In particular, the SiO2 masterbatch obtained from chip recycling can be further processed into filamentous materials, which can be widely used in textiles, electronics, construction, and many other fields.

[0003] However, during chip manufacturing, metals such as copper and aluminum are introduced to achieve specific circuit functions. These metals become impurities in the SiO2 masterbatch after the chip is discarded. When using traditional spinning equipment, these impurities easily clog the precision spinneret orifices, causing production interruptions. Furthermore, SiO2 (silicon dioxide) particles can cause uneven melt flow during melt spinning, resulting in large fluctuations in fiber diameter. This affects the quality of the product after the SiO2 masterbatch is spun. Utility Model Content

[0004] The purpose of this invention is to provide a drawing device for chip regenerated SiO2 masterbatch. This drawing device can filter impurities present in the drawing device, preventing impurities from clogging the precision spinneret and causing production interruption. At the same time, it improves the fluidity of the melt during the melt spinning process of SiO2 particles, stabilizes the fiber diameter, and ensures the product quality after drawing SiO2 masterbatch.

[0005] The above-mentioned optimized structure of this utility model is achieved through the following technical solution: a drawing device for chip regeneration SiO2 masterbatch, comprising a feeding system, a melting system, a drawing system and a winding machine connected in sequence; The melting system includes a special screw extruder, which is connected to the discharge port of the feeding system; A coarse filter, which is connected to the discharge port of the special screw extruder; A medium filter, which is connected to the discharge port of the coarse filter; A fine filter is disposed between the intermediate filter and the fiber drawing system.

[0006] Preferably, the coarse filter has a filtration diameter of 60 μm, the medium filter has a filtration diameter of 25 μm, and the fine filter has a filtration diameter of 15 μm.

[0007] Preferably, the coarse filter, the medium filter, and the fine filter all use sintered metal fiber felt as the filter medium.

[0008] Preferably, the feeding system includes a drying hopper; A metering feeder is located between the drying hopper and the special screw extruder.

[0009] Preferably, the fiber drawing system includes a fiber drawing machine, which is connected to the discharge port of the fine filter. A wear-resistant spinneret structure, wherein the wear-resistant spinneret structure is detachable and sealed at the discharge port of the drawing machine; A gradient slow cooling structure is provided between the drawing machine and the winding machine.

[0010] Preferably, the wear-resistant spinneret structure includes a spinneret plate, which is detachable and sealed at the discharge port of the drawing machine; A spinneret, which is coaxially disposed on the top of the spinneret plate; Multiple guide holes are arranged in a ring on the bottom wall of the spinneret; Multiple spinnerets are coaxially located at the bottom of the guide hole and penetrate the spinneret plate; A wear-resistant layer is disposed on the inner wall of the spinneret groove, the guide hole, and the spinneret hole.

[0011] Preferably, the wear-resistant spinneret structure further includes a flow guide cone, which is coaxially disposed on the bottom wall of the inner wall of the spinneret groove.

[0012] Preferably, the wear-resistant spinneret structure further includes a sealing ring groove, which is coaxially arranged around the outside of the spinneret groove.

[0013] Preferably, the diameter of the guide hole is 1.0 mm, the diameter of the spinneret hole is 0.15-0.25 mm, and a transition tapered hole is provided between the guide hole and the spinneret hole.

[0014] Preferably, the gradient slow cooling structure includes a primary cooling zone, which is connected to the drawing machine; A secondary cooling zone is provided between the primary cooling zone and the winding machine; A third-level cooling zone is located between the second-level cooling zone and the winding machine.

[0015] In summary, this utility model has the following beneficial effects: (1) This utility model uses a multi-stage filtration system consisting of a coarse filter, a medium filter, and a fine filter to effectively remove impurities from the chip regeneration SiO2 masterbatch, reduce the probability of spinneret blockage, ensure production continuity, and at the same time improve the fluidity of the melt during the SiO2 particle melt spinning process, making the internal structure of the filament more uniform, and improving its strength and toughness, thereby stabilizing the filament diameter and ensuring the product quality after the SiO2 masterbatch is drawn.

[0016] (2) This utility model can reduce the wear of high hardness SiO2 on the spinneret holes through the wear-resistant spinneret structure, ensure the stability and uniformity of the spinneret, make the diameter of the filament more consistent and the fiber uniformity better, and at the same time extend the service life of the wear-resistant spinneret structure, reduce the downtime and replacement time caused by the wear of the spinneret plate, and improve production efficiency.

[0017] (3) The present invention can achieve uniform cooling of the yarn through the gradient slow cooling structure, avoid stress concentration inside the yarn, improve the fiber mechanical properties of the yarn, and make the yarn less prone to deformation, cracking and other defects during stretching, bending and other processing, thereby improving the product qualification rate. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a cross-sectional view of the wear-resistant spinneret structure of this utility model.

[0019] In the diagram: 1. Feeding system; 11. Drying hopper; 12. Metering feeder; 2. Melting system; 21. Special screw extruder; 22. Coarse filter; 23. Medium filter; 24. Fine filter; 3. Fiber drawing system; 31. Fiber drawing machine; 32. Wear-resistant spinneret structure; 321. Spinneret; 322. Spinneret groove; 323. Guide hole; 324. Spinneret orifice; 325. Wear-resistant layer; 326. Guide cone; 327. Sealing ring groove; 33. Gradient cooling structure; 331. Primary cooling zone; 332. Secondary cooling zone; 333. Tertiary cooling zone; 4. Winding machine. Detailed Implementation

[0020] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] refer to Figure 1-2The chip regenerated SiO2 masterbatch drawing device includes a feeding system 1, a melting system 2, a drawing system 3, and a winding machine 4 connected in sequence. The feeding system 1 can transport the chip regenerated SiO2 masterbatch raw material to the melting system 2. The melting system 2 can melt and perform multi-stage filtration on the masterbatch to remove impurities and provide a pure melt for subsequent drawing. The drawing system 3 can draw the processed melt and cool the wire. The winding machine 4 can include a winding roller, a tension control system, and a drive device. The winding roller can adjust its speed according to the wire specifications, receive the wire shaped by the drawing system 3, and maintain a constant tension of the wire through the tension control system to avoid stretching or loosening of the wire. The drive device drives the winding roller to rotate, evenly winding the wire on the roller to form a regular wire roll, which is convenient for subsequent storage, transportation, or further processing. At the same time, the speed matching ensures that the winding speed and the drawing speed are synchronized, ensuring stable wire quality.

[0022] The melting system 2 includes a special screw extruder 21, a coarse filter 22, a medium filter 23, and a fine filter 24. The special screw extruder 21 is connected to the discharge port of the feeding system 1 and can heat and melt the chip-regenerated SiO2 masterbatch to make it a melt with good fluidity. The screw structure and heating method of the special screw extruder 21 are specially designed to adapt to the characteristics of the chip-regenerated SiO2 masterbatch and achieve a highly efficient melting process. This is existing technology and will not be described in detail here. The special screw extruder 21 can be equipped with a seven-zone temperature control system, with the temperature distribution from the feed port to the die head as 180℃→200℃→220℃→235℃→230℃→225℃→220℃, with a temperature control accuracy of ±0.5℃. The die head can adopt a double-layer heating structure and has a built-in Pt100 temperature sensor. The melt pipeline is equipped with a dynamic temperature adjustment device with a response time of <3 seconds, which can efficiently melt and plasticize the masterbatch. The coarse filter 22 is connected to the outlet of the special screw extruder 21. Its filtration diameter is 60 μm, primarily used to intercept larger particulate impurities in the melt, such as larger metal particles and agglomerated masterbatch. The intermediate filter 23 is connected to the outlet of the coarse filter 22. Its filtration diameter is 25 μm, further filtering medium-sized impurities in the melt to improve its purity. The fine filter 24 is located between the intermediate filter 23 and the fiber drawing system 3. Its filtration diameter is 15 μm, performing fine filtration of the melt to ensure that the melt entering the fiber drawing system 3 is virtually free of impurities, guaranteeing high-quality fiber drawing.

[0023] The chip regenerated SiO2 masterbatch is fed to the special screw extruder 21 through the feeding system 1. The masterbatch is melted and plasticized in the special screw extruder 21 to form a melt. The melt then enters the coarse filter 22 for preliminary filtration to remove larger particles of impurities. The melt after coarse filtration flows into the medium filter 23 to further filter out medium particles of impurities. Then, it enters the fine filter 24 from the medium filter 23 to filter out fine particles of impurities. The purity of the melt after three-stage filtration is greatly improved, reducing the clogging of the spinneret orifice and ensuring the quality of subsequent wire drawing. Finally, the melt enters the wire drawing system 3 for wire drawing operation, and the formed wire is wound by the winding machine 4.

[0024] Preferably, the coarse filter 22 has a filtration diameter of 60 μm, the medium filter 23 has a filtration diameter of 25 μm, and the fine filter 24 has a filtration diameter of 15 μm. This stepped filtration diameter design, from large to small, ensures that impurities in the melt are filtered progressively, avoiding clogging of the filter media due to excessively high filtration precision in a single step. This guarantees the continuity and stability of the filtration process and improves filtration efficiency. The structure and filtration principle of the coarse filter 22, medium filter 23, and fine filter 24 are existing technologies, and those skilled in the art can implement this technical solution based on the above description; further details are omitted here.

[0025] Preferably, the coarse filter 22, the medium filter 23, and the fine filter 24 all use sintered metal fiber felt as the filter medium, with a porosity ≥85%, and are also equipped with a pressure monitoring system that automatically alarms when the pressure difference exceeds 3MPa. Sintered metal fiber felt possesses characteristics of high temperature resistance, corrosion resistance, and high mechanical strength, enabling it to adapt to the high-temperature environment of the melt. Its porous structure provides excellent filtration performance, effectively trapping impurities of different particle sizes. Furthermore, it is easy to clean and reuse, extending the service life of the filter.

[0026] Preferably, the feeding system 1 includes a drying hopper 11 and a metering feeder 12. Chip regeneration SiO2 masterbatch can be fed into the drying hopper 11 by an external mechanism such as an elevator. The drying hopper 11 can be a vacuum drying hopper, which can pre-dry the masterbatch to remove moisture and prevent bubbles from forming during the melting process, thus affecting the melt quality. The metering feeder 12 is located between the drying hopper 11 and the special screw extruder 21. The metering feeder 12 can deliver the masterbatch to the special screw extruder 21 according to the production needs and at a set speed and quantity, thereby accurately controlling the amount of masterbatch delivered, keeping the amount of masterbatch entering the special screw extruder 21 stable, ensuring uniformity in the melting and plasticizing process, and improving the stability of melt quality.

[0027] Preferably, the drawing system 3 includes a drawing machine 31, an abrasion-resistant spinneret structure 32, and a gradient slow cooling structure 33. The drawing machine 31 is connected to the outlet of the fine filter 24 and can draw the finely filtered melt into fine filaments. The abrasion-resistant spinneret structure 32 is detachable and sealed at the outlet of the drawing machine 31, which can improve the abrasion resistance of the outlet of the drawing machine 31. The detachable design of the abrasion-resistant spinneret structure 32 facilitates later maintenance and replacement, while the sealing setting prevents melt leakage. The gradient slow cooling structure 33 is located between the drawing machine 31 and the winding machine 4, which can cool the filaments generated by the drawing machine 31 in a gradient, effectively reducing the internal stress of the fibers and improving the mechanical properties of the filaments. The gradient slow cooling structure 33 can adopt a segmented heating and slow cooling box with an adjustable temperature range of 200-160℃. The slow cooling zone is 600mm long and has three independent temperature control zones. It is equipped with an inert gas protection system with an oxygen content of <50ppm to achieve gradient slow cooling of the filament and reduce internal stress.

[0028] The finely filtered melt enters the drawing machine 31 and is conveyed to the wear-resistant spinneret 32 ​​under the action of the drawing machine 31. The wear-resistant spinneret 32 ​​forms a filament, which then enters the gradient slow cooling structure 33 for cooling and shaping, and is finally wound up by the winding machine 4.

[0029] Preferably, the drawing system 3 also includes a side-blowing cooling system, which can further cool and shape the filaments.

[0030] Preferably, the wear-resistant spinneret structure 32 includes a spinneret plate 321, a spinneret groove 322, multiple guide holes 323, multiple spinneret holes 324, and a wear-resistant layer 325. The spinneret plate 321 is detachably and sealed at the discharge port of the wire drawing machine 31. An external thread can be provided on the spinneret plate 321 to be screwed into the internal thread of the distribution plate of the wire drawing machine 31, so as to realize the detachable connection between the spinneret plate 321 and the wire drawing machine 31, which facilitates replacement after the wear-resistant spinneret structure 32 wears. The spinneret plate 321 can be made of cemented carbide YG15 material to improve its wear resistance. The spinneret groove 322 is coaxially arranged on the top of the spinneret plate 321 and can collect the melt extruded from the wire drawing machine 31. Multiple guide holes 323 are arranged in a ring on the bottom wall of the spinneret 322 to guide the melt to the spinneret hole 324. The spinneret hole 324 is coaxially arranged at the bottom of the guide hole 323 and penetrates the spinneret plate 321, so that the melt flows out in the shape of a wire. The wear-resistant layer 325 is provided on the inner wall of the spinneret 322, the guide hole 323 and the spinneret hole 324. The wear-resistant layer 325 can be a diamond coating with a thickness of 50-100μm and a Vickers hardness ≥3000HV2 to further improve its wear resistance, resist the high hardness of SiO2, reduce the severe wear caused by processing masterbatch with high SiO2 content, and extend the service life of the wear-resistant spinneret structure 32.

[0031] The molten material first enters the spinneret 322, which temporarily stores and diverts the molten material, ensuring its even distribution to each guide hole 323. The guide holes 323 provide initial flow guidance and pressure stabilization for the molten material. Subsequently, the molten material enters the spinneret orifice 324 and is extruded through the orifice to form a filament. Since the melt of the chip regenerated SiO2 masterbatch contains SiO2 particles, it causes significant wear to the spinneret structure. The wear-resistant layer 325 can significantly improve the wear resistance of the spinneret 322, guide holes 323, and spinneret orifice 324, extending the service life of the wear-resistant spinneret structure 32.

[0032] Preferably, the wear-resistant spinneret structure 32 further includes a flow-guiding cone 326, which is coaxially disposed on the inner bottom wall of the spinneret 322. When the melt enters the spinneret 322, the flow-guiding cone 326 guides the melt, causing it to flow more evenly towards the edge of the spinneret 322, preventing the melt from accumulating in the central area of ​​the spinneret 322, ensuring uniform feeding of each guide hole 323, thereby ensuring consistent filament thickness and improving product quality stability.

[0033] Preferably, the wear-resistant spinneret structure 32 further includes a sealing ring groove 327, which is coaxially arranged around the outside of the spinneret groove 322. A sealing ring may be provided inside the sealing ring groove 327 to ensure the sealing performance between the spinneret structure and the drawing machine 31 and prevent melt leakage. The cross-section of the sealing ring groove 327 may be triangular, which can increase the deformation degree of the sealing ring when the sealing ring is under force inside the sealing ring groove 327, further enhancing the sealing performance between the spinneret plate 321 and the discharge port of the drawing machine 31, preventing high-temperature melt from leaking from the connection, thus avoiding raw material waste and ensuring the safety of the production environment.

[0034] Preferably, the diameter of the guide hole 323 is 1.0 mm, the diameter of the spinneret hole 324 is 0.15-0.25 mm, the length-to-diameter ratio can be 6:1, and a transition tapered hole is provided between the guide hole 323 and the spinneret hole 324. The larger diameter of the guide hole 323 facilitates the smooth flow of the melt and stabilizes the pressure, while the smaller diameter of the spinneret hole 324 can extrude the melt to form fine wires; the transition tapered hole between the two can reduce the resistance and turbulence of the melt flow, allowing the melt to smoothly transition from the guide hole 323 to the spinneret hole 324, avoiding problems such as uneven wire thickness and breakage caused by poor flow.

[0035] Preferably, the gradient slow cooling structure 33 includes a primary cooling zone 331, a secondary cooling zone 332, and a tertiary cooling zone 333. The primary cooling zone 331 is connected to the drawing machine 31, and its temperature is generally controlled at 180-220℃ to initially solidify the yarn. The secondary cooling zone 332 is located between the primary cooling zone 331 and the winding machine 4, and its temperature is controlled at 100-140℃ to further reduce the yarn temperature. The tertiary cooling zone 333 is located between the secondary cooling zone 332 and the winding machine 4, and its temperature is controlled at 40-60℃ to bring the yarn to near room temperature and complete its shaping. The yarn ejected from the wear-resistant spinneret structure 32 is at a relatively high temperature. It first enters the primary cooling zone 331 for initial cooling, then enters the lower-temperature secondary cooling zone 332 for further cooling, and finally enters the tertiary cooling zone 333 to complete cooling and shaping. This gradient cooling method allows the internal temperature of the thread to drop evenly, reducing internal stress and cracks caused by rapid cooling, improving the toughness and strength of the thread, and ensuring the quality of the thread.

[0036] The specific working principle is as follows: The chip regenerated SiO2 masterbatch enters the drying hopper 11 via an external feeding mechanism such as an elevator, where it undergoes vacuum drying to remove moisture and volatile impurities. The dried masterbatch is then conveyed by a metering feeder 12 to a special screw extruder 21 at a set speed and quantity.

[0037] Under the precise temperature control of the seven zones in the special screw extruder 21, the chip regenerated SiO2 masterbatch gradually melts and plasticizes to form a uniform melt with good fluidity. The molten melt is then propelled by the screw into the coarse filter 22, which intercepts larger particulate impurities with a 60μm filtration diameter. Next, the melt enters the intermediate filter 23, which further filters out medium-sized impurities with a 25μm filtration diameter. Finally, the melt enters the fine filter 24, which performs fine filtration with a 15μm filtration diameter, removing minute impurities and ensuring the melt entering the spinning system reaches a high purity state, preventing clogging of the subsequent spinneret 324.

[0038] The finely filtered melt enters the drawing machine 31, which sprays the melt through the wear-resistant spinneret structure 32 to form fine filaments. In the wear-resistant spinneret structure 32, the melt first enters the spinneret groove 322, where the guide cone 326 guides the melt to flow evenly through the guide hole 323, and then it is sprayed out through the spinneret hole 324. The wear-resistant layer 325 effectively reduces the wear of the melt on the spinneret structure, extending its service life. The freshly sprayed high-temperature fine filament enters the gradient slow cooling structure 33, where it undergoes preliminary cooling in the first-stage cooling zone 331 to lower the temperature and allow it to initially solidify. It then enters the second-stage cooling zone 332 for further cooling, and finally undergoes final cooling and shaping in the third-stage cooling zone 333. During the slow cooling process, the filament is protected by an inert gas to reduce oxidation and effectively reduce internal stress. After slow cooling, the filament is further cooled and shaped by the side-blowing cooling system to ensure that the filament reaches a stable state before winding.

[0039] The cooled and shaped yarn is wound up by winding machine 4 to form a finished coil, completing the entire yarn drawing process. The winding speed of winding machine 4 is matched with the yarn drawing speed to ensure the winding quality and production efficiency of the yarn.

[0040] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A drawing device for regenerating SiO2 masterbatch for chips, characterized in that: It includes a feeding system (1), a melting system (2), a wire drawing system (3), and a winding machine (4) connected in sequence. The melting system (2) includes a special screw extruder (21), which is connected to the discharge port of the feeding system (1); A coarse filter (22) is connected to the discharge port of the special screw extruder (21); Intermediate filter (23), which is connected to the discharge port of the coarse filter (22); Fine filter (24) is located between the intermediate filter (23) and the fiber drawing system (3).

2. The drawing device for chip regeneration SiO2 masterbatch according to claim 1, characterized in that: The coarse filter (22) has a filtration diameter of 60 μm, the medium filter (23) has a filtration diameter of 25 μm, and the fine filter (24) has a filtration diameter of 15 μm.

3. The drawing device for chip regeneration SiO2 masterbatch according to claim 1, characterized in that: The coarse filter (22), the medium filter (23), and the fine filter (24) all use sintered metal fiber felt as the filter medium.

4. The drawing device for chip regeneration SiO2 masterbatch according to claim 1, characterized in that: The feeding system (1) includes a drying hopper (11); Metering feeder (12) is located between the drying hopper (11) and the special screw extruder (21).

5. The drawing device for chip regeneration SiO2 masterbatch according to claim 1, characterized in that: The fiber drawing system (3) includes a fiber drawing machine (31), which is connected to the discharge port of the fine filter (24); A wear-resistant spinneret structure (32) is provided in a detachable and sealed manner at the discharge port of the drawing machine (31). A gradient slow cooling structure (33) is provided between the drawing machine (31) and the winding machine (4).

6. The drawing device for chip regeneration SiO2 masterbatch according to claim 5, characterized in that: The wear-resistant spinneret structure (32) includes a spinneret plate (321), which is detachable and sealed at the discharge port of the drawing machine (31); A spinneret (322) is coaxially disposed on the top of the spinneret plate (321); Multiple guide holes (323) are arranged in a ring on the bottom wall of the spinneret (322); Multiple spinneret holes (324) are coaxially disposed at the bottom of the guide hole (323) and penetrate the spinneret plate (321). Wear-resistant layer (325) is provided on the inner wall of the spinneret groove (322), the guide hole (323), and the spinneret hole (324).

7. The drawing device for chip regeneration SiO2 masterbatch according to claim 6, characterized in that: The wear-resistant spinneret structure (32) also includes a flow guide cone (326), which is coaxially disposed on the bottom wall of the inner side of the spinneret groove (322).

8. The drawing device for chip regeneration SiO2 masterbatch according to claim 6, characterized in that: The wear-resistant spinneret structure (32) also includes a sealing ring groove (327), which is coaxially arranged around the outside of the spinneret groove (322).

9. The drawing device for chip regeneration SiO2 masterbatch according to claim 6, characterized in that: The diameter of the guide hole (323) is 1.0 mm, the diameter of the spinneret hole (324) is 0.15-0.25 mm, and a transition cone hole is provided between the guide hole (323) and the spinneret hole (324).

10. The drawing device for chip regeneration SiO2 masterbatch according to claim 5, characterized in that: The gradient slow cooling structure (33) includes a primary cooling zone (331), which is connected to the drawing machine (31); A secondary cooling zone (332) is provided between the primary cooling zone (331) and the winding machine (4); The third-level cooling zone (333) is located between the second-level cooling zone (332) and the winding machine (4).

Images