Cathode device and vapor deposition apparatus

Abstract

The utility model relates to the technical field of photovoltaic cell especially relates to a cathode device and gas phase deposition equipment, including fixed plate, magnet, magnet rotation subassembly and target material, magnet is set in the below of fixed plate along horizontal direction, magnet rotation subassembly is fixed in fixed plate, and transmission connection is established with magnet to drive magnet rotation around self axial, target material hollowly sets up, and along magnet extension direction is set up in magnet, through setting up magnet rotation subassembly on fixed plate to drive magnet rotation, change magnet orientation, to make the ion flow to sputter in the direction of departing from the carrier plate when the carrier plate is empty transmission and is refined target, avoid ion flow sputtering to the carrier plate and produce high temperature and lead to the carrier plate deformation, solved the existing technology in the empty transmission carrier plate surface also will be subjected to ion flow bombardment and deposit film layer to lead to the carrier plate life waste, increase operation cost's technical problem, eliminate the increase of invalid life when the carrier plate is empty transmission, the carrier plate cleaning frequency reduces, has reduced the equipment operation cost.

Description

Technical Field

[0001] This utility model relates to the technical field of photovoltaic cells, and in particular to a cathode device and a vapor deposition apparatus. Background Technology

[0002] Physical Vapor Deposition (PVD) is a technique that uses physical methods, such as evaporation and sputtering, to vaporize the coating material and deposit it onto a substrate surface. The PVD process is a physical reaction. In the host process chamber, a high-vacuum environment is maintained, an external electric field is applied, and a high-purity process gas is introduced. Gas molecules form plasma under the influence of the electric field. Gas ions bombard the target surface under the influence of the electric field, ejecting target atoms and generating secondary electrons. These ejected target atoms are deposited onto the surface of the silicon wafer on the substrate, forming a transparent conductive film. The secondary electrons are confined within a plasma region near the target surface by the combined influence of the electric field and the magnetic field generated by the magnetic rod on the target cathode surface. In this region, a large number of gas ions are ionized and bombard the target, thus achieving a high deposition rate.

[0003] Currently, existing cathode devices all involve positioning a magnetic rod controlling the emission of ion beams towards the target material to continuously attack it. However, in actual production processes, there are often situations where carrier boards are not loaded with silicon wafers and are idling in the main process chamber. For example, when the target material is depleted and the machine is being replaced, the power is gradually increased during target refining. Since the carrier boards are stored in the atmospheric environment during maintenance, they need to be idling again after refining to remove moisture. Another example is when a new carrier board is cleaned and returned to the factory or when a brand-new carrier board is introduced into the chamber, surface preheating is required, followed by idling inside the machine before production can begin. Yet another example is when a small number of carrier boards are used for production verification in process experiments, while the remaining carrier boards are disabled, but these disabled carrier boards are idling inside the machine along with the experimental carrier boards.

[0004] However, during air transport, the surface of the carrier plate is also bombarded by ion flow, resulting in the deposition of film layers, which wastes the carrier plate's lifespan and increases operating costs. Utility Model Content

[0005] The purpose of this invention is to provide a cathode device and a weather deposition equipment to solve the technical problem in the prior art where the surface of the carrier plate is also bombarded by ion flow during air transport, resulting in the deposition of film layers, which leads to the waste of the carrier plate's lifespan and increases operating costs.

[0006] In a first aspect, the present invention provides a cathode device, comprising a fixed plate, a magnetic rod, a magnetic rod rotating assembly, and a target material; The magnetic rod is horizontally positioned below the fixed plate. The magnetic rod rotating assembly is fixed to the fixed plate and is connected to the magnetic rod via a transmission mechanism to drive the magnetic rod to rotate around its own axis. The target material is hollow and is sleeved on the magnetic rod along its extension direction.

[0007] Furthermore, the magnetic rod rotating assembly includes a mounting bracket, a first driving member, a first transmission belt, a first driving wheel, and a first driven wheel; The mounting bracket is fixed above the fixing plate, the first driving member is fixed to the mounting bracket, the first driving member is connected to the first driving wheel, the first driven wheel is sleeved on the magnetic rod and is connected to the magnetic rod, and the first transmission belt is sleeved on the first driving wheel and the first driven wheel respectively.

[0008] Furthermore, the cathode device also includes a target rotation assembly, which includes a second driving member, a second transmission belt, a second driving wheel, and a second driven wheel; The second driving member is fixed to the mounting bracket and is connected to the second driving wheel. The second driven wheel is sleeved on the magnetic rod and is connected to the magnetic rod. The second transmission belt is sleeved on the second driving wheel and the second driven wheel respectively.

[0009] Furthermore, the cathode device also includes a protective cover; The protective cover is fastened to the top of the fixed plate, and a cavity is provided inside the protective cover. The mounting bracket, the first driving component, the first drive wheel, the second driving component, and the second drive wheel are all disposed in the cavity.

[0010] Furthermore, the magnetic rod, the magnetic rod rotating assembly, the target material, and the target material rotating assembly are arranged to form a cathode group, and two cathode groups are arranged side by side on the fixed plate.

[0011] Furthermore, the cathode device also includes a fixed end; The two fixed ends are respectively disposed at both ends of the fixed plate, one end of the magnetic rod is rotatably disposed at the fixed end, and the other end of the magnetic rod is rotatably disposed at the other fixed end.

[0012] Secondly, this utility model also provides a vapor deposition apparatus, including the aforementioned cathode device.

[0013] Compared with the prior art, the present invention provides a cathode device including a fixed plate, a magnetic rod, a magnetic rod rotating assembly, and a target material. The magnetic rod is horizontally disposed below the fixed plate. The magnetic rod rotating assembly is fixed to the fixed plate and connected to the magnetic rod for transmission, so as to drive the magnetic rod to rotate around its own axis. The target material is hollow and is sleeved on the magnetic rod along the extension direction of the magnetic rod. By setting the magnetic rod rotating assembly on the fixed plate, the magnetic rod is driven to rotate, changing the orientation of the magnetic rod. This allows the ion flow to sputter away from the carrier plate during target refining, avoiding the high temperature generated by the ion flow sputtering onto the carrier plate, which would cause the carrier plate to deform. This solves the technical problem in the prior art where the carrier plate surface is also bombarded by the ion flow during air refining, resulting in the deposition of a film layer and wasting the carrier plate's lifespan, increasing operating costs. This invention eliminates the increase in the ineffective lifespan of the carrier plate during air refining, reduces the number of carrier plate cleanings, and lowers the equipment operating costs. Attached Figure Description

[0014] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of the cathode device provided in the embodiment of this utility model; Figure 2 This is a schematic diagram of the structure of the magnetic rod rotating assembly and the target rotating assembly in the cathode device provided in this embodiment of the utility model.

[0016] Figure label: 100. Fixing plate; 200. Magnetic rod; 310. Mounting bracket; 320. First driving component; 330. First transmission belt; 340. First driving pulley; 350. First driven pulley; 400. Target material; 510. Second driving component; 520. Second transmission belt; 530. Second driving pulley; 540. Second driven pulley; 600; protective cover; 700. Fixed end. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0021] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0022] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0024] Example 1 like Figure 1 and Figure 2 As shown, this utility model embodiment provides a cathode device, including a fixed plate, a magnetic rod, a magnetic rod rotating assembly, and a target material; the magnetic rod is arranged horizontally below the fixed plate, the magnetic rod rotating assembly is fixed to the fixed plate and is connected to the magnetic rod for transmission, so as to drive the magnetic rod to rotate around its own axis, and the target material is hollow and sleeved on the magnetic rod along the extension direction of the magnetic rod.

[0025] That is, the cathode device provided in this embodiment of the present invention drives the magnetic rod to rotate by setting a magnetic rod rotating assembly on the fixed plate, thereby changing the orientation of the magnetic rod. This causes the ion flow to sputter away from the carrier plate when the carrier plate is air-transmitted for target refining, avoiding the high temperature generated by the ion flow sputtering onto the carrier plate and causing the carrier plate to deform. This solves the technical problem in the prior art that the surface of the carrier plate is also bombarded by the ion flow during air transmission, resulting in the deposition of a film layer and wasting the life of the carrier plate, which increases the operating cost. It eliminates the increase in the ineffective life of the carrier plate during air transmission, reduces the number of times the carrier plate needs to be cleaned, and reduces the operating cost of the equipment.

[0026] Specifically, the mounting plate 100, serving as the foundation for the entire device, is typically made of a rigid metal material (such as stainless steel or aluminum alloy) and is horizontally installed within the process chamber of the PVD equipment. A magnetic rod 200 is positioned horizontally below the mounting plate 100. The magnetic rod 200 contains a specific arrangement of permanent magnets (such as neodymium iron boron magnets) to generate a magnetic field that confines the plasma during sputtering. A magnetic rod rotating assembly is fixed to the upper surface of the mounting plate 100 and is drively connected to the magnetic rod 200. This assembly can drive the magnetic rod 200 to rotate about its own axis (i.e., its length direction). The target 400 is made of the material to be sputtered (such as copper, aluminum, ITO, etc.), and is a hollow tubular structure, fitted around the outside of the magnetic rod 200 along its extension direction. A certain gap typically exists between the target 400 and the magnetic rod 200. During normal production, the N and S poles of the magnetic rod 200 face the target 400, and the magnetic field direction is perpendicular to the surface of the target 400. At this time, the plasma is confined to the region near the target 400. The ion stream bombards the target 400 and sputters towards the silicon wafer on the carrier, completing thin film deposition. However, when carrier rotation is required (e.g., for target refining, preheating, or process experiments), the magnetic rod 200 is driven to rotate around its own axis by a certain angle (e.g., 90° or 180°) via the magnetic rod rotation assembly, causing its N and S poles to face away from the carrier below. At this time, the magnetic field distribution changes, and the plasma region moves accordingly, with the ion stream primarily sputtering away from the carrier. Thus, even when the carrier rotates in the chamber, its surface is not bombarded by the ion stream or experiences minimal film deposition, thereby avoiding high temperatures and wasted carrier life due to ineffective deposition and significantly reducing equipment operating costs.

[0027] Furthermore, the magnetic rod rotating assembly includes a mounting frame, a first driving member, a first transmission belt, a first driving wheel, and a first driven wheel; the mounting frame is fixed above the fixed plate, the first driving member is fixed to the mounting frame, the first driving member is connected to the first driving wheel, the first driven wheel is sleeved on the magnetic rod and connected to the magnetic rod, and the first transmission belt is sleeved on the first driving wheel and the first driven wheel respectively.

[0028] Specifically, the mounting bracket 310 is fixed to the top of the fixing plate 100 by bolts or welding. The first drive component 320, preferably a servo motor or stepper motor, is fixed to the mounting bracket 310 and provides precise rotation control. The output shaft of the first drive component 320 is connected to the first driving wheel 340. The first driven wheel 350 is fixedly sleeved on the end of the magnetic rod 200 and is connected to the magnetic rod 200 by a key or other means, so that the rotation of the first driven wheel 350 directly drives the magnetic rod 200 to rotate. A first transmission belt 330, such as a synchronous belt, is respectively sleeved on the first driving wheel 340 and the first driven wheel 350. During operation, the first drive component 320 starts, driving the first driving wheel 340 to rotate, and the power is transmitted to the first driven wheel 350 through the first transmission belt 330, ultimately driving the magnetic rod 200 to rotate precisely around its axis to a predetermined angle.

[0029] Furthermore, the cathode device also includes a target rotation assembly, which includes a second driving member, a second transmission belt, a second driving wheel, and a second driven wheel; the second driving member is fixed to the mounting frame and is connected to the second driving wheel in a transmission manner; the second driven wheel is sleeved on the magnetic rod and is connected to the magnetic rod in a transmission manner; and the second transmission belt is sleeved on the second driving wheel and the second driven wheel respectively.

[0030] Specifically, the target rotation assembly includes a second drive member 510, a second transmission belt 520, a second drive wheel 530, and a second driven wheel 540.

[0031] The second drive component 510 is also fixed to the mounting bracket 310 in Embodiment 2, preferably another servo motor or stepper motor. The second drive component 510 is connected to the second drive wheel 530 via a transmission. The second driven wheel 540 is sleeved on the magnetic rod 200, but is connected to the magnetic rod 200 via a bearing, allowing the second driven wheel 540 to rotate freely relative to the magnetic rod 200. The second driven wheel 540 is fixedly connected to the end of the target material 400, thereby enabling the target material 400 to rotate. The second transmission belt 520 is respectively sleeved on the second drive wheel 530 and the second driven wheel 540. In this configuration, the magnetic rod rotation assembly and the target material rotation assembly are independent of each other. The rotation of the magnetic rod 200 is controlled by the first drive component 320 to switch the magnetic field direction between production and air-transfer modes; while the rotation of the target material 400 is controlled by the second drive component 510 to uniformly consume the target material during sputtering, extending its overall service life. The two systems work together without interfering with each other.

[0032] Furthermore, the cathode device also includes a protective cover; the protective cover is fastened to the top of the fixed plate, and a receiving cavity is provided inside the protective cover. The mounting bracket, the first driving member, the first driving wheel, the second driving member, and the second driving wheel are all located in the receiving cavity.

[0033] Specifically, the protective cover 600 is fastened to the top of the fixed plate 100, forming a closed or semi-closed cavity together with the fixed plate 100. Precision transmission components such as the mounting bracket 310, the first drive component 320, the first drive wheel 340, the second drive component 510, and the second drive wheel 530 are all housed and protected within this cavity. The protective cover 600 effectively prevents contaminants such as metal dust and sputtering particles from adhering to the transmission components within the process chamber, ensuring their long-term reliability and stability, while also improving equipment safety.

[0034] Furthermore, the magnetic rod, the magnetic rod rotating assembly, the target material, and the target rotating assembly are arranged to form a cathode group, and the two cathode groups are arranged side by side on the fixed plate.

[0035] Specifically, the magnetic rod 200, the magnetic rod rotation assembly, the target material 400, and the target material rotation assembly together form a complete cathode group. In this embodiment, two such cathode groups are arranged side by side on the same fixed plate 100. This dual cathode group design can be used to process more substrates simultaneously in the same process chamber, or to deposit different material layers, greatly improving the production efficiency and process flexibility of PVD equipment.

[0036] Furthermore, the cathode device also includes fixed ends; two fixed ends are respectively disposed at both ends of the fixed plate, one end of the magnetic rod is rotatably disposed at the fixed end, and the other end of the magnetic rod is rotatably disposed at the other fixed end.

[0037] Specifically, two fixed ends 700 are respectively fixedly installed at both ends of the fixed plate 100 along its length. One end of the magnetic rod 200 is rotatably mounted on one fixed end 700 via a bearing, and the other end is rotatably mounted on the other fixed end 700 via a bearing. This double-end support structure greatly enhances the rigidity and stability of the magnetic rod 200 (especially long magnetic rods) during rotation and operation, preventing bending and vibration due to its own weight or external forces, and ensuring the uniformity and consistency of the magnetic field distribution.

[0038] Example 2 This utility model also provides a vapor deposition apparatus, which includes all the structures of the cathode device described above, and naturally includes all the technical effects of the cathode device described above, which will not be repeated in this embodiment.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A cathode device, characterized in that, Includes a fixed plate, a magnetic rod, a magnetic rod rotating assembly, and a target material; The magnetic rod is horizontally positioned below the fixed plate. The magnetic rod rotating assembly is fixed to the fixed plate and is connected to the magnetic rod via a transmission mechanism to drive the magnetic rod to rotate around its own axis. The target material is hollow and is sleeved on the magnetic rod along its extension direction.

2. The cathode device according to claim 1, characterized in that, The magnetic rod rotating assembly includes a mounting frame, a first driving component, a first transmission belt, a first driving wheel, and a first driven wheel; The mounting bracket is fixed above the fixing plate, the first driving member is fixed to the mounting bracket, the first driving member is connected to the first driving wheel, the first driven wheel is sleeved on the magnetic rod and is connected to the magnetic rod, and the first transmission belt is sleeved on the first driving wheel and the first driven wheel respectively.

3. The cathode device according to claim 2, characterized in that, The cathode device further includes a target rotation assembly, which includes a second driving member, a second transmission belt, a second driving wheel, and a second driven wheel; The second driving member is fixed to the mounting bracket and is connected to the second driving wheel. The second driven wheel is sleeved on the magnetic rod and is connected to the magnetic rod. The second transmission belt is sleeved on the second driving wheel and the second driven wheel respectively.

4. The cathode device according to claim 3, characterized in that, The cathode device also includes a protective cover; The protective cover is fastened to the top of the fixed plate, and a cavity is provided inside the protective cover. The mounting bracket, the first driving component, the first drive wheel, the second driving component, and the second drive wheel are all disposed in the cavity.

5. The cathode device according to claim 3, characterized in that, The magnetic rod, the magnetic rod rotating assembly, the target material, and the target material rotating assembly are arranged to form a cathode group, and two cathode groups are arranged side by side on the fixed plate.

6. The cathode device according to any one of claims 1-4, characterized in that, The cathode device also includes a fixed end; The two fixed ends are respectively disposed at both ends of the fixed plate, one end of the magnetic rod is rotatably disposed at the fixed end, and the other end of the magnetic rod is rotatably disposed at the other fixed end.

7. A vapor deposition apparatus, characterized in that, Includes the cathode device as described in any one of claims 1-5.

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