A more efficient coating process chamber

Abstract

The utility model discloses a kind of coating process cabin, it includes coating cavity and the each pair of magnetron sputtering target located in membrane cavity two sides, the upper end of magnetron sputtering target on one side is inclined to workpiece, the upper end of magnetron sputtering target on the other side is inclined to workpiece, the inclination angle of two sides magnetron sputtering target is same parallel shape;Workpiece is horizontally rotated when coating, magnetron sputtering target of inclined to workpiece is located in the oblique upper side of workpiece in horizontal state, magnetron sputtering target of inclined to workpiece is located in the oblique lower side of workpiece in horizontal state.The utility model can more easily realize the uniform deposition of each direction coating of special-shaped mobile phone middle frame, without complex adjustment to workpiece during coating process, it can be easily realized uniform coating, improve coating efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of vacuum coating technology, specifically relating to a coating process chamber suitable for more efficient and uniform coating of irregularly shaped workpieces with multi-directional coating surfaces. Background Technology

[0002] The mid-frame of a well-known brand of mobile phones is made of stainless steel and requires ion plating with various colored decorative films that are wear-resistant and scratch-resistant. This mid-frame is an irregularly shaped part, rectangular in shape, with long and short sides. Its outer surface is a vertical plane, while its top and bottom edges are narrow curved edges, and the four corners of the rectangle are rounded. In addition to the traditional imitation rose gold (TiCN) and black (amorphous carbon film), the colors to be plated also include sky blue, emerald green, purplish red, and bluish black. These rich and unique colors can be achieved through two methods: First, a hard, light-colored support layer is first plated, and then two relatively hard transparent or translucent films with high and low refractive indices are selected on top of it. According to the principle of optical interference, multiple overlapping film systems are plated to make it present the desired interference colors (such as sky blue, emerald green, purplish red, etc.). Second, a hard support layer of approximately the desired color (such as black) is first plated, and then two relatively hard transparent or translucent films with high and low refractive indices are selected on top of it. According to the principle of optical interference, multiple overlapping film systems are plated to make it present the desired adjustment interference colors (such as blue). Finally, interference colors (blue) are added to the base color (black) to achieve the desired richer film colors (such as bluish black). Undoubtedly, the two methods mentioned above are a combination of the traditional ion plating decorative film method and the optical interference film plating method. The latter requires strict control of the film thickness of each transparent film layer in order to present accurate colors, but it becomes a problem for irregularly shaped workpieces, such as the mobile phone frame mentioned above.

[0003] Traditional ion plating machines typically use vertical sputtering targets, while the phone's mid-frame is horizontally stacked on a vertically rotating workpiece holder. The sputtering target surface is directly facing the side plane of the phone's mid-frame during deposition. Because the target-substrate distance varies between different points on the mid-frame, the incident angle of the emitted particles relative to the target also varies. Furthermore, the time each point faces the target during the mid-frame's rotation is also different, resulting in varying degrees of mutual obstruction at different points on the mid-frame. This leads to inconsistent film thicknesses in different locations, causing the mid-frame to exhibit different interference colors. Ultimately, the mid-frame will be scrapped due to inconsistent colors.

[0004] To better achieve coating on the aforementioned irregularly shaped mobile phone frames, a horizontal rotational coating method for a single mobile phone frame has been adopted, which can completely solve the problem of workpieces occluding each other. However, in existing coating methods, the columnar targets are arranged parallel or perpendicular to the horizontal mobile phone frame. This results in a relatively concentrated incident angle of the plasma beam emitted by the target, and a narrower incident direction range compared to a horizontally placed workpiece. This is not conducive to uniform coating of irregularly shaped mobile phone frames. When the target is emitting at a certain position, excessive deposition occurs on certain surfaces. To overcome this problem, existing technology requires moving the target position after a period of deposition to reduce deposition on surfaces with higher deposition and increase deposition on surfaces with lower deposition to compensate. This change in operation increases the complexity and difficulty of the entire process. Utility Model Content

[0005] The purpose of this invention is to provide a coating process chamber that provides a more efficient and uniform coating for irregularly shaped workpieces with multi-directional coating surfaces.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] A coating process chamber for more efficient coating is characterized by comprising a coating chamber and a pair of magnetron sputtering targets on each side of the coating chamber. The upper end of the magnetron sputtering target on one side is tilted downward relative to the workpiece, and the upper end of the magnetron sputtering target on the other side is tilted upward relative to the workpiece. The magnetron sputtering targets on both sides are tilted at the same angle and are parallel. During coating, the workpiece is rotated horizontally, and the tilted magnetron sputtering target is located obliquely above one side of the horizontal workpiece, while the tilted magnetron sputtering target is located obliquely below the other side of the horizontal workpiece.

[0008] A further technical solution of this utility model is that the tilt angle of both the downward-tilting magnetron sputtering target and the upward-tilting magnetron sputtering target is 45°.

[0009] A further technical solution of this utility model is that both the downward-tilting magnetron sputtering target and the upward-tilting magnetron sputtering target are a pair of twin mid-frequency magnetron sputtering targets.

[0010] A further technical solution of this utility model is as follows: a first mounting slope and a second mounting slope are provided on the coating chamber, and a magnetron sputtering target tilted upwards and a magnetron sputtering target tilted downwards are respectively mounted on the first mounting slope and the second mounting slope.

[0011] A further technical solution of this utility model is as follows: a first mounting inclined surface is provided on one side of the upper end of the coating chamber, and an upwardly protruding target mounting chamber is provided on the upper part of the coating chamber. A second mounting inclined surface is provided on one side of the target mounting chamber, and the first mounting inclined surface and the second mounting inclined surface are located on the same side.

[0012] A further technical solution of this utility model is: a molecular pump is provided on one side of the coating chamber.

[0013] A further technical solution of this utility model is: an observation window is provided on one side of the coating chamber.

[0014] A further technical solution of this utility model is: a vacuum gauge is provided in the coating chamber.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] This invention features a downward-tilted magnetron sputtering target and an upward-tilted magnetron sputtering target within the coating chamber. During coating, the downward-tilted target is positioned slightly above one side of the workpiece, while the upward-tilted target is positioned slightly below the other side of the horizontal workpiece. By tilting the magnetron sputtering targets at a certain angle, this invention ensures that particles are emitted towards the workpiece along all directions of the target length during coating, providing omnidirectional incident angles. This is particularly advantageous for irregularly shaped mobile phone frames. As long as the target's tilt angle is appropriate, it is easier to achieve uniform deposition on the irregularly shaped mobile phone frame in all directions. Uniform coating can be easily achieved without complex adjustments to the workpiece during the coating process, thus improving coating efficiency. Attached Figure Description

[0017] Figure 1 This is a side view of the coating chamber of the coating process compartment according to an embodiment of the present invention.

[0018] Figure 2 This is a cross-sectional schematic diagram of the coating chamber of the coating process compartment according to an embodiment of the present utility model;

[0019] Figure 3 This is a schematic diagram of the structure when the fixture and workpiece are lifted into the coating chamber of the coating process compartment in this embodiment of the utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the coating chamber of the coating process compartment in an embodiment of the present invention when the side door is opened.

[0021] Meaning of the labels in the attached diagram:

[0022] 1-Coating chamber; 2-Inclined magnetron sputtering target; 3-Inclined magnetron sputtering target; 4-First mounting ramp; 5-Second mounting ramp; 6-Target mounting chamber; 7-Vacuum gauge; 8-Molecular pump; 9-Shaft protective cover; 10-Connecting port; 11-Observation window; 12-Damping rod; 13-Workpiece fixture; 14-Shaft assembly; 15-Side door. Detailed Implementation

[0023] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0025] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0026] The present invention will be further described below with reference to embodiments.

[0027] Example:

[0028] The coating process chamber of this embodiment includes a coating chamber 1 and magnetron sputtering targets located on both sides of the coating chamber. During coating, the upper end of one magnetron sputtering target is tilted downwards relative to the workpiece, which is a tilted magnetron sputtering target 2, and the upper end of the other magnetron sputtering target is tilted upwards relative to the workpiece, which is a tilted magnetron sputtering target 3. Both the tilted magnetron sputtering target 2 and the tilted magnetron sputtering target 3 are a pair of twin mid-frequency magnetron sputtering targets, and the magnetron sputtering targets are cylindrical targets.

[0029] like Figure 1 and Figure 2 The coating chamber 1 shown in this embodiment is shaped like a flattened cuboid with one corner cut off. A first mounting ramp 4 is located at one corner, on which a tilted magnetron sputtering target 3 is mounted. A smaller, upward-protruding target mounting chamber 6 is provided on the coating chamber 1. A second mounting ramp 5 is located on one side of the target mounting chamber 6, on which a tilted magnetron sputtering target 2 is mounted. The tilted magnetron sputtering target 2 and the tilted magnetron sputtering target 3 have the same tilt direction and tilt angle; a preferred angle is 45° (i.e., the angle between the magnetron sputtering target and the horizontal plane is 45°).

[0030] like Figure 3As shown, during coating, the workpiece (in this embodiment, the workpiece is the aforementioned irregularly shaped mobile phone frame) is clamped on the workpiece fixture 13 in a horizontal position and lifted by the shaft assembly 14. The workpiece fixture 13 and the workpiece enter the coating chamber 1 through the connecting port 10, and the shaft assembly 14 drives the fixture 13 and the workpiece to rotate horizontally together for coating. At this time, the downward-tilting magnetron sputtering target 2 will be located diagonally above one side of the workpiece, and the upward-tilting magnetron sputtering target 3 will be located diagonally below the other side of the workpiece. The line connecting the midpoints of the downward-tilting magnetron sputtering target 2 and the upward-tilting magnetron sputtering target 3 will pass near the geometric center of the workpiece. Of course, the connecting port 10 of the coating chamber 1 will be closed during the coating process. Since the closing method of the connecting port 10 is not protected by this utility model, it will not be described in detail in this embodiment. In addition, the shaft assembly 14 is also not protected by this utility model, so it will not be described in detail in this embodiment.

[0031] The advantages of using two pairs of tilted magnetron sputtering targets are explained below: The target layout relative to the workpiece should ensure uniform deposition on the workpiece's surfaces in multiple directions. This means that the target-substrate distance should be as equal as possible across all points on each surface of the workpiece, and that plasma of equal intensity should be injected and deposited in all directions. If a layout parallel to a horizontal workpiece is used, the incident angle of the plasma beam emitted by the target will be relatively concentrated, resulting in a narrower incident direction range compared to a horizontally placed workpiece. This is not advantageous for uniform coating of irregularly shaped workpieces. When the target is firing at a certain position, excessive deposition occurs on certain surfaces. To overcome this problem, existing technologies require moving the target position after a period of deposition to reduce deposition on surfaces with higher deposition and increase deposition on surfaces with lower deposition to compensate. This alteration increases the complexity and difficulty of the entire process. By tilting the magnetron sputtering target at a certain angle, particles are emitted towards the workpiece along all directions of the target length, resulting in omnidirectional incident angles. This is most advantageous for irregularly shaped workpieces. As long as the target tilt angle is appropriate, it is easier to achieve uniform deposition on all surfaces of the workpiece. Considering the relatively long side dimension of the workpiece, we employed two parallel, tilted magnetron sputtering targets to expand the uniform deposition range across the width. Because the mobile phone frame has a symmetrical shape, the upper half and upper curved edges of the frame are primarily deposited by particles emitted from the tilting magnetron sputtering target, while the lower half and lower curved edges are deposited by particles emitted from the tilting magnetron sputtering target. This innovative target layout allows for omnidirectional particle deposition onto the irregularly shaped mobile phone frame, facilitating uniform deposition from multiple directions. This reduces the complexity of process adjustments during coating and achieves superior uniformity. Using a target layout perpendicular to the workpiece would result in significant differences in the directionality and distance of particles emitted from the target onto the workpiece's side and curved surfaces, which would also negatively impact coating uniformity.

[0032] In this embodiment, a shaft protection cover 9 is provided on the bottom surface of the coating chamber 1 at the position corresponding to the communication port 10. The shaft protection cover 9 has openings on both the top and bottom and is interconnected. The outer perimeter of the upper part of the shaft protection cover 9 is smaller. During coating, the shaft protection cover 9 can partially block the portion of the shaft assembly 14 that extends into the coating chamber 1, thereby reducing the contamination of the shaft assembly 14 by the sputtered material during coating. In this embodiment, the opening shape of the shaft protection cover 9 and the shape of the communication port 10 are both rectangular, which are larger than the outer dimensions of the clamp 13 and the mobile phone frame, allowing the clamp 13 and the mobile phone frame to pass through smoothly.

[0033] In this embodiment, a vacuum gauge 7 is provided on the side wall of the coating chamber 1, which is used to measure the vacuum level inside the chamber. An observation window 11 is provided on one side of the coating chamber 1, which is used to observe the coating condition inside. A side door 15 that can be rotated to open and close is provided on the other side of the coating chamber 1. Damping rods 12 are provided on both sides of the side door 15, and the extension of the damping rods 12 provides support when the side door 15 is open. The molecular pump 8 of the coating chamber 1 is mounted on the side door 15. Figure 4 The image shows the side door 15 when it is open. Of course, the side door 15 is sealed when closed, and its sealing structure uses an existing structure, so it will not be described in detail.

[0034] The above embodiments of this utility model are not intended to limit the scope of protection of this utility model. The implementation of this utility model is not limited thereto. All other modifications, substitutions or alterations made to the above structure of this utility model based on the above content of this utility model and in accordance with the common technical knowledge and conventional means in the field, without departing from the basic technical idea of ​​this utility model, shall fall within the scope of protection of this utility model.

Claims

1. A coating process chamber for more efficient coating, characterized in that: It includes a coating chamber and a pair of magnetron sputtering targets on each side of the coating chamber. The upper end of the magnetron sputtering target on one side is tilted downward relative to the workpiece, and the upper end of the magnetron sputtering target on the other side is tilted upward relative to the workpiece. The magnetron sputtering targets on both sides are tilted at the same angle and are parallel. During coating, the workpiece is rotated horizontally. The tilted magnetron sputtering target is located above one side of the horizontal workpiece, and the tilted magnetron sputtering target is located below the other side of the horizontal workpiece.

2. The coating process chamber for more efficient coating according to claim 1, characterized in that: The tilt angles of both the downward-tilting magnetron sputtering target and the upward-tilting magnetron sputtering target are 45°.

3. The coating process chamber for more efficient coating according to claim 1, characterized in that: Both the tilting magnetron sputtering target and the tilting magnetron sputtering target are a pair of twin mid-frequency magnetron sputtering targets.

4. The coating process chamber for more efficient coating according to claim 1, characterized in that: The coating chamber is provided with a first mounting slope and a second mounting slope, and the upward-tilted magnetron sputtering target and the downward-tilted magnetron sputtering target are respectively mounted on the first mounting slope and the second mounting slope.

5. The coating process chamber for more efficient coating according to claim 4, characterized in that: The first mounting slope is located on one side of the upper end of the coating chamber, and an upwardly protruding target mounting chamber is provided on the upper part of the coating chamber. The second mounting slope is located on one side of the target mounting chamber, and the first mounting slope and the second mounting slope are located on the same side.

6. The coating process chamber for more efficient coating according to claim 1, characterized in that: A molecular pump is provided on one side of the coating chamber.

7. The coating process chamber for more efficient coating according to claim 1, characterized in that: An observation window is provided on one side of the coating chamber.

8. The coating process chamber for more efficient coating according to claim 1, characterized in that: The coating chamber is equipped with a vacuum gauge.

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