PECVD automatic wafer loading and unloading machine

Abstract

The utility model provides a kind of PECVD automatic up-down wafer machine, including up-down wafer positioning machine table, material handling robot and two PECVD machine tables, two PECVD machine tables are side by side arranged in the left and right sides of material handling robot, the up-down wafer positioning machine table is set in the back side of material handling robot, and the material handling robot is used to complete wafer between up-down wafer positioning machine table and PECVD machine table The movement of carrying out;The up-down wafer positioning machine table is equipped with card storage area and transfer positioning area, the card storage area is equipped with first card, and the first card is used to store wafer needing up-down material;The transfer positioning area is equipped with second card and the positioning mechanism for positioning and aligning whole stack wafer, through the positioning mechanism, the transfer positioning area can be positioned while also being used as buffer zone, improve overall loading efficiency, and reduce the complexity and manufacturing cost of system.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor automation technology, and specifically relates to a PECVD automatic wafer loading and unloading machine. Background Technology

[0002] PECVD (Plasma Enhanced Chemical Vapor Deposition) is a key process in semiconductor manufacturing. It uses microwave or radio frequency energy to ionize process gases containing thin film components, forming highly chemically active plasmas, which then undergo chemical reactions on the wafer surface to deposit the desired thin film.

[0003] In traditional PECVD production processes, tasks such as wafer loading and unloading, barcode scanning, program selection, and machine operation all rely on manual labor. This process is not only cumbersome but also demands a high level of skill from the operators. Especially during wafer handling, improper human operation can easily lead to wafer breakage or product quality degradation, making the stability and yield of the entire production process significantly affected by human factors.

[0004] To improve automation and production efficiency, existing technologies typically equip PECVD machines with automated wafer loading / unloading systems to replace manual operations. However, these automated systems generally suffer from a common drawback: the lack of a mechanism for in-situ alignment and positioning of the entire stack of wafers within the wafer cassette. Because the wafers are often misaligned within the cassette, precise alignment is difficult when the robot picks up the wafers and transfers them to the wafer carrier on the PECVD machine. This can easily lead to wafer collisions, fragmentation, and other problems, directly impacting production yield.

[0005] To address the aforementioned alignment challenges, existing solutions often employ a separate wafer positioning mechanism located away from the chuck. For example, Chinese Patent Publication No. CN221071646U discloses an automated wafer loading and unloading system. This patent adds a centering mechanism to the top of the loading rack. In this configuration, the handling robot must first remove the wafer from the chuck in the storage area, transport it to the centering mechanism for positioning, then transfer it to the waiting buffer position, and finally, the handling robot transports it to the PECVD machine. While this design achieves wafer positioning, each wafer requires this additional step of centering during loading, which increases the handling robot's path and cycle time, leading to a decrease in overall loading efficiency. Furthermore, the separate centering mechanism occupies valuable equipment space, increasing system complexity and manufacturing costs. Utility Model Content

[0006] The purpose of this invention is to provide an automatic PECVD wafer loading and unloading machine. By setting a positioning mechanism in the transfer positioning area, the entire stack of wafers is positioned, and the transfer positioning area is also used as a buffer zone, which improves the overall loading efficiency and reduces the complexity and manufacturing cost of the system.

[0007] To achieve the above objectives, the solution of this utility model is as follows: a PECVD automatic wafer loading and unloading machine is provided, including a wafer loading and unloading positioning machine, a material handling robot, and two PECVD machines. The two PECVD machines are arranged side by side on the left and right sides of the material handling robot. The wafer loading and unloading positioning machine is located behind the material handling robot. The material handling robot is used to complete the wafer handling operation between the wafer loading and unloading positioning machine and the PECVD machines. The wafer loading and unloading positioning machine is equipped with a cassette storage area and a transfer positioning area. The cassette storage area is equipped with a first cassette, which is used to store wafers that need to be loaded and unloaded. The transfer positioning area is equipped with a second cassette and a positioning mechanism for positioning and aligning the entire stack of wafers. After the material handling robot moves the wafers from the first cassette to the second cassette, the positioning mechanism aligns the entire stack of wafers on the second cassette vertically. Then, the material handling robot moves the aligned wafers to the PECVD machine.

[0008] Furthermore, the positioning mechanism includes a horizontal drive mechanism, a lifting drive mechanism, and two first positioning rods. The lifting drive mechanism is located in front of the second chuck, the horizontal drive mechanism is mounted on the lifting drive mechanism, and the two first positioning rods are mounted side by side on the horizontal drive mechanism. After the lifting drive mechanism drives the two first positioning rods to rise and align with the stack of wafers on the second chuck, the horizontal drive mechanism drives the two first positioning rods to push the stack of wafers on the second chuck backward, aligning the stack of wafers vertically. After the lifting drive mechanism drives the two first positioning rods to descend, it makes way for the wafer handling robot to transport the wafers.

[0009] Furthermore, the loading and unloading positioning machine is also equipped with a cooling buffer zone, which has a third chuck for storing wafers that need to be cooled during unloading; the transfer positioning area is equipped with a base, on which multiple second chucks are placed, each second chuck being configured with a positioning mechanism; the lifting drive mechanism is located on the front side of the base, and the third chuck and the first positioning rod are both located on the horizontal drive mechanism, with the third chuck located in front of the first positioning rod.

[0010] Furthermore, the second cassette consists of a left support plate, a right support plate, and a rear support plate. Each of the three support plates is provided with a wafer carrier slot for placing wafers. A fixed second positioning rod is provided on each side of the rear support plate. The two second positioning rods cooperate with the two first positioning rods to align and position the stacked wafers.

[0011] Furthermore, the tops of the two first positioning rods are connected by a crossbar to form a U-shaped rod structure.

[0012] Furthermore, a wafer detection assembly is provided on the front side of the cassette storage area. The wafer detection assembly includes a first sensor and a second sensor. The first sensor is signal-connected to an alarm mechanism. The first sensor is used to check whether the stack of wafers on the first cassette is aligned vertically. If they are not aligned, a signal is sent to the alarm mechanism to alert the operator that the wafers need to be realigned. The second sensor is used to detect the number of wafers on the first cassette.

[0013] Furthermore, the cartridge storage area is provided with a multi-layered material rack, each layer of which holds multiple first cartridges. The rear side of the material rack is provided with an indicator light for displaying the status of the first cartridges being picked up or placed. The transfer positioning area is located in front of the material rack, and the second cartridge is located below the first cartridge. The wafer inspection component is located between the transfer positioning area and the material rack. The wafer inspection component also includes a dual-axis drive arm, and both the first sensor and the second sensor are mounted on the dual-axis drive arm.

[0014] Furthermore, the material rack is provided with a fourth clip for storing the accompanying pieces, and a horizontal cylinder is provided below the fourth clip, which drives the fourth clip to move back and forth.

[0015] Furthermore, the material handling robot includes a mounting base, a robotic arm, and a handling assembly. The bottom end of the robotic arm is mounted on the mounting base, and the top end of the robotic arm is provided with the handling assembly. The handling assembly includes a support frame, the top of which is connected to the top end of the robotic arm. Two first Bernoulli chucks for adsorbing wafers are respectively provided on opposite sides of the support frame, and a wafer fork for gripping wafers and a second Bernoulli chuck for adsorbing co-wafers are respectively provided on the other two sides of the support frame.

[0016] Furthermore, the material handling robot is set on a transport platform, which is equipped with a vision inspection component to visually inspect the wafers being unloaded from the PECVD machine to confirm whether there are any broken wafers.

[0017] After adopting the above solution, the beneficial effects of this utility model are as follows: This application sets up a positioning mechanism in the transfer positioning area. After the material handling robot moves the wafers from the cassette storage area to the second cassette in the transfer positioning area, the positioning mechanism can position and adjust the entire stack of wafers on the second cassette so that the entire stack of wafers is aligned vertically. After alignment, the material handling robot can move the wafers to the PECVD machine for deposition and growth.

[0018] Therefore, the transfer positioning area of ​​this application is equivalent to the waiting buffer position of the prior art. By setting a positioning mechanism in the transfer positioning area, this application realizes the in-situ precise alignment of wafers in the wafer loading and unloading process. This effectively avoids the problem of wafer fragmentation caused by wafer misalignment, significantly improves the yield rate, eliminates the extra handling path to and from the independent positioning mechanism, optimizes the equipment space layout, greatly improves the wafer loading and unloading efficiency and equipment integration, and reduces the complexity of the system and manufacturing cost. Attached Figure Description

[0019] Figure 1 This is a top view of the complete machine of this utility model; Figure 2 This is a perspective view of the complete machine of this utility model; Figure 3 This is a perspective view of the upper and lower piece positioning machine of this utility model; Figure 4 This is a perspective view of the material rack of this utility model; Figure 5 This is a perspective view of the wafer inspection component of this utility model; Figure 6 This is a perspective view of part of the transfer positioning area and cooling buffer zone of this utility model; Figure 7 This is a perspective view of the fourth cartridge of this utility model; Figure 8 This is a perspective view of the material handling robot of this utility model; Figure 9 This is a perspective view of the handling component of this utility model.

[0020] Label Explanation: 1. Wafer loading and unloading positioning machine; 2. Material handling robot; 21. Mounting base; 22. Robotic arm; 23. Handling components; 24. Support frame; 25. First Bernoulli chuck; 26. Second Bernoulli chuck; 27. Wafer fork; 28. Handling machine; 3. PECVD machine; 31. Wafer carrier; 4. Casing storage area; 41. Material rack; 411. First layer support; 412. Second layer support; 413. Indicator light; 42. Fourth casing; 43. Horizontal cylinder; 5. Middle 51. Positioning area; 51. Second stopper; 511. Left support plate; 512. Right support plate; 513. Rear support plate; 52. Positioning mechanism; 521. Horizontal drive mechanism; 522. Lifting drive mechanism; 523. First positioning rod; 524. Second positioning rod; 525. Crossbar; 53. Base; 6. Cooling buffer zone; 61. Third stopper; 7. Wafer inspection assembly; 71. First sensor; 72. Second sensor; 73. Dual-axis drive arm; 8. Vision inspection assembly. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. The "upper and lower sheets" mentioned in this application refer to "loading and unloading".

[0022] like Figures 1-9 As shown, this application provides an automated PECVD wafer loading and unloading machine, including a wafer loading and unloading positioning machine 1, a material handling robot 2, and two PECVD machines 3. The PECVD machines 3 are existing structures and will not be described in detail here. The two PECVD machines 3 are arranged side by side on the left and right sides of the material handling robot 2. The wafer loading and unloading positioning machine 1 is located behind the material handling robot 2. The material handling robot 2 is used to complete the wafer handling operation between the wafer loading and unloading positioning machine 1 and the PECVD machines 3.

[0023] The wafer loading / unloading positioning machine 1 is equipped with a chuck storage area 4, a transfer positioning area 5, and a cooling buffer area 6. The chuck storage area 4 has a first chuck (not shown in the figure) for storing wafers to be loaded / unloaded. The transfer positioning area 5 has a second chuck 51 and a positioning mechanism 52 for aligning the stack of wafers. The cooling buffer area 6 has a third chuck 61 for storing wafers that need to be cooled during unloading. The entire workflow is as follows: The operator or handling equipment (not shown in the figure) places the first cassette containing the wafer into the cassette storage area 4. Then, the material handling robot 2 transports the wafer from the first cassette to the second cassette 51 in the transfer positioning area 5. Next, the positioning mechanism 52 aligns the stack of wafers on the second cassette 51 vertically. Finally, the material handling robot 2 transports the aligned wafers to the PECVD machine 3. After the wafer has deposited the required thin film, the material handling robot 2 transports the wafer from the PECVD machine 3 to the third cassette 61 in the cooling buffer 6 for cooling. After cooling, the material handling robot 2 transports the wafer back to the first cassette. Finally, the operator or handling equipment removes the first cassette from the cassette storage area 4, completing the entire wafer loading and unloading operation.

[0024] Therefore, the transfer positioning area 5 of this application is equivalent to the waiting buffer position of patent CN221071646U. By setting a positioning mechanism 52 in the transfer positioning area 5, this application achieves precise in-situ alignment of wafers in the wafer loading and unloading process. This effectively avoids the problem of wafer fragmentation caused by wafer misalignment and significantly improves the yield. At the same time, it eliminates the extra handling path to and from the independent positioning mechanism, optimizes the equipment space layout, greatly improves the wafer loading and unloading efficiency and equipment integration, and reduces the complexity of the system and manufacturing cost.

[0025] Key references Figure 3 and Figure 6 The positioning mechanism 52 includes a horizontal drive mechanism 521, a lifting drive mechanism 522, and two first positioning rods 523. The lifting drive mechanism 522 is located in front of the second stopper 51, and the horizontal drive mechanism 521 is mounted on the lifting drive mechanism 522. The two first positioning rods 523 are arranged side by side on the horizontal drive mechanism 521. The lifting drive mechanism 522 and the horizontal drive mechanism 521 can be cylinders, linear screw modules, or other drive mechanisms; this application uses cylinders. During positioning, the lifting drive mechanism 522 first drives the two first positioning rods 523 to rise until they are aligned with the stack of wafers on the second stopper 51. Then, the horizontal drive mechanism 521 drives the two first positioning rods 523 to move backward until they push the stack of stoppers on the second stopper 51, aligning the stack of wafers vertically. After alignment, the horizontal drive mechanism 521 drives the first positioning rods 523 to retract, and then the lifting drive mechanism 522 drives the first positioning rods 523 to descend back to their original positions. Since the material handling robot 2 moves the wafers from the first cassette to the second cassette 51, it uses a fork 27 to grip the wafers. During the handling, the fork 27 needs to be inserted between two wafers from the front to grip the wafers. Therefore, the first positioning rod 523 needs to be lowered to its original position to make way for the material handling robot 2 to move the next batch of wafers.

[0026] Specifically, the transfer positioning area 5 is provided with a base 53, on which multiple second latches 51 are placed. The multiple second latches 51 are arranged in a row. The base 53 can be a single base or several bases arranged in a row. For example, this application provides multiple bases 53, and each base 53 is provided with two second latches 51. Each second latch 51 needs to be equipped with a positioning mechanism 52. Preferably, the lifting drive mechanism 522 is located on the front side of the base 53. The third latch 61 and the first positioning rod 523 are both located on the horizontal drive mechanism 521, and the third latch 61 is located in front of the first positioning rod 523. Thus, the cooling buffer 6 is located in front of the transfer positioning area 5. During positioning, the first positioning rod 523 and the third latch 61 move together. This arrangement can save space and make the structure of the upper and lower plate positioning machine 1 more compact.

[0027] Key references Figure 6The second cassette 51 consists of a left support plate 511, a right support plate 512, and a rear support plate 513. Each of the three support plates has a wafer tray for placing the wafer, thus the second cassette 51 has no top wall. When the material handling robot 2 moves the wafer from the second cassette 51 to the PECVD machine 3, a Bernoulli chuck is used for handling. The absence of a top wall in the second cassette 51 facilitates the Bernoulli chuck's sequential handling of the wafer from top to bottom. Similarly, the structures of the third cassette 61 and the subsequent fourth cassette 42 are the same as those of the second cassette 51.

[0028] Furthermore, a fixed second positioning rod 524 is provided on each side of the rear support plate 513. The two second positioning rods 524 are aligned with the two first positioning rods 523. During positioning, the two first positioning rods 523 push the stack of wafers from the front. When the rear side of the wafers abuts against the two second positioning rods 524, the alignment and positioning of the stack of wafers are completed. The cooperation between the two first positioning rods 523 and the two second positioning rods 524 makes the wafer positioning more accurate. Subsequently, the material handling robot 2 can more accurately load the wafers onto the PECVD machine 3, thereby improving the yield.

[0029] As a preferred embodiment, a crossbar 525 can be set between the two first positioning rods 523 to connect the tops of the two first positioning rods 523 to form a U-shaped rod structure. This arrangement can strengthen the first positioning rods 523 and prevent the first positioning rods 523 from bending and deforming.

[0030] Key references Figures 3-5 A wafer detection component 7 is provided on the front side of the cartridge storage area 4. The wafer detection component 7 includes a first sensor 71 and a second sensor 72. The first sensor 71 is signal-connected to an alarm mechanism. The first sensor 71 is used to check whether the stack of wafers on the first cartridge is vertically aligned, i.e., whether the wafers are misaligned. If they are not aligned, a signal is sent to the alarm mechanism to warn the operator. The operator or handling equipment needs to remove the first cartridge, realign the wafers, and then put the first cartridge back into the cartridge storage area 4. The first sensor 72 plays a preliminary positioning role, with a detection accuracy of ≥3mm wafer misalignment, i.e., it can detect a wafer misalignment of more than 3mm. The subsequent positioning in the transfer positioning area 5 is a more precise positioning. The preliminary positioning can prevent wafer breakage due to excessive wafer misalignment in the transfer positioning area. The second sensor 72 is used to detect the number of wafers on the first cassette. Before the operator or handling equipment loads the first cassette into the cassette storage area 4, it will scan the first cassette to obtain the wafer information on the first cassette. The wafer information includes the number of wafers. After the second sensor 72 detects the number of wafers in the first cassette, it will check it against the number obtained by scanning to determine whether there is an error.

[0031] Specifically, the cartridge storage area 4 is equipped with a multi-layered storage rack 41. Each layer of the storage rack 41 holds multiple first cartridges, arranged in a row along the left-right direction. The number of layers of the storage rack 41 can be set as needed. Figure 4 As shown, the rear side of the material rack 41 is provided with a signal light 413 for displaying the status of the first clip being placed or removed. After the first clip is placed on the material rack 41, the corresponding signal light 413 lights up, and after the first clip is removed, the signal light 413 goes out.

[0032] The transfer positioning area 5 is located on the front side of the material rack 41, and the second chuck 51 is located below the first chuck, thus the first chuck, the second chuck 51, and the third chuck 61 are arranged in parallel. The wafer inspection assembly 7 is located between the transfer positioning area 5 and the material rack 41. The wafer inspection assembly 7 also includes a dual-axis drive arm 73. The first sensor 71 and the second sensor 72 are both mounted on the dual-axis drive arm 73. The dual-axis drive arm 73 can drive the first sensor 71 and the second sensor 72 to move up and down and left and right to detect the first chuck at different positions on the material rack 41. The dual-axis drive arm 73 can be a lead screw linear module or a cylinder, preferably driven by a lead screw linear module for easy integration.

[0033] Furthermore, since the wafer carrier 31 of the PECVD machine 3 is equipped with multiple circular slots for placing wafers, if the number of wafers is insufficient to fill all the circular slots, it is necessary to supplement with additional wafers to fill them. Therefore, a fourth cassette 42 for storing wafers can be set on the material rack 41. The wafers are made of the same material as the wafers and can be smaller in size. Since they are smaller in size, they are easier to be transported into the circular slots of the wafer carrier 31 without positioning. The material handling robot 2 directly transports the wafers on the fourth cassette 42 to the PECVD machine 3. When unloading, the wafers are also directly transported from the PECVD machine 3 to the fourth cassette 42.

[0034] Key references Figure 8-9The material handling robot 2 is a six-axis robot, which includes a mounting base 21, a robotic arm 22, and a handling component 23. The bottom end of the robotic arm 22 is mounted on the mounting base 21, and the top end of the robotic arm 22 is provided with the handling component 23. The handling component 23 includes a support frame 24, the top of which is connected to the top end of the robotic arm 22. On opposite sides of the support frame 24, there are two first Bernoulli chucks 25 for adsorbing wafers. The first Bernoulli chucks 25 are used to transfer wafers between the second cassette 51 and the PECVD machine 3. On the other two sides of the support frame 24, there is a wafer fork 27 for gripping wafers and a second Bernoulli chuck 26 for adsorbing wafers. The wafer fork 27 is used to transfer wafers between the first cassette and the second cassette 51 and between the third cassette 61 and the first cassette. The second Bernoulli chuck 26 is used to transfer wafers between the fourth cassette 42 and the PECVD machine 3. The support frame 24 is also equipped with a light sensor to determine whether each handling component 23 is picking up a wafer or a die.

[0035] Key references Figure 4 and Figure 7 The material rack 41 is specifically configured with two layers, including a first layer support 411 and a second layer support 412. The first layer support 411 is located below the second layer support 412, and the length of the first layer support 411 is greater than the length of the second layer support 412. The second layer support 412 is centrally located on the first layer support 411. Multiple fourth chucks 42 can be set at both ends of the first layer support 411 and on both sides of the second layer support 412. Due to the large number and volume of structures on the support frame 24 and the relatively small size of the second Bernoulli chuck 26, when adsorbing wafers on the fourth chucks 42, other handling components besides the second Bernoulli chuck 26 are prone to interference with the second layer support 412. Therefore, a horizontal cylinder 43 can be set below the fourth chucks 42. Before the fourth chucks 42 pick up or place wafers, the horizontal cylinder 43 drives the fourth chucks 42 to move forward to avoid interference between the handling components and the second layer support 412. The fourth stopper 42 is relatively small in size, and two fourth stoppers 42 can be installed on a horizontal cylinder 43.

[0036] Furthermore, the material handling robot 2 is mounted on a handling platform 28, that is, the mounting base 21 is mounted on the handling platform 28. The handling platform 28 is equipped with a vision inspection component 8. During unloading, the first Bernoulli chuck 25 transports the wafer of the PECVD machine 3 to the top of the vision inspection component 8, and the vision inspection component 8 detects whether the wafer is broken. After the detection is completed, the wafer is placed on the third stopper 61 of the cooling buffer 6 for cooling.

[0037] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0038] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automatic PECVD wafer loading and unloading machine, characterized in that: The system includes a wafer mounting and unmounting positioning machine, a material handling robot, and two PECVD machines. The two PECVD machines are arranged side by side on the left and right sides of the material handling robot. The wafer mounting and unmounting positioning machine is located behind the material handling robot. The material handling robot is used to complete the wafer handling operation between the wafer mounting and unmounting positioning machine and the PECVD machines. The wafer loading and unloading positioning machine is equipped with a cassette storage area and a transfer positioning area. The cassette storage area is equipped with a first cassette, which is used to store wafers that need to be loaded and unloaded. The transfer positioning area is equipped with a second cassette and a positioning mechanism for positioning and aligning the entire stack of wafers. After the material handling robot moves the wafers from the first cassette to the second cassette, the positioning mechanism aligns the entire stack of wafers on the second cassette vertically. Then, the material handling robot moves the aligned wafers to the PECVD machine.

2. The PECVD automatic wafer loading and unloading machine as described in claim 1, characterized in that: The positioning mechanism includes a horizontal drive mechanism, a lifting drive mechanism, and two first positioning rods. The lifting drive mechanism is located in front of the second chuck, the horizontal drive mechanism is mounted on the lifting drive mechanism, and the two first positioning rods are mounted side by side on the horizontal drive mechanism. After the lifting drive mechanism drives the two first positioning rods to rise and align with the stack of wafers on the second chuck, the horizontal drive mechanism drives the two first positioning rods to push the stack of wafers on the second chuck backward, aligning the stack of wafers vertically. After the lifting drive mechanism drives the two first positioning rods to descend, it makes way for the wafer handling robot to move the wafers.

3. The PECVD automatic wafer loading and unloading machine as described in claim 2, characterized in that: The loading and unloading positioning machine is also equipped with a cooling buffer zone, which has a third chuck for storing wafers that need to be cooled during unloading. The transfer positioning area has a base, on which multiple second chucks are placed, each second chuck being equipped with a positioning mechanism. The lifting drive mechanism is located on the front side of the base, and the third chuck and the first positioning rod are both located on the horizontal drive mechanism, with the third chuck located in front of the first positioning rod.

4. The PECVD automatic wafer loading and unloading machine as described in claim 2, characterized in that: The second cassette consists of a left support plate, a right support plate, and a rear support plate. Each of the three support plates is provided with a wafer slot for placing wafers. A fixed second positioning rod is provided on each side of the rear support plate. The two second positioning rods cooperate with the two first positioning rods to align and position the stacked wafers.

5. The PECVD automatic wafer loading and unloading machine as described in claim 2, characterized in that: The tops of the two first positioning rods are connected by a crossbar to form a U-shaped rod structure.

6. The PECVD automatic wafer loading and unloading machine as described in claim 1, characterized in that: A wafer detection assembly is provided on the front side of the cassette storage area. The wafer detection assembly includes a first sensor and a second sensor. The first sensor is signal-connected to an alarm mechanism. The first sensor is used to check whether the stack of wafers on the first cassette is aligned vertically. If they are not aligned, a signal is sent to the alarm mechanism to alert the operator that the wafers need to be realigned. The second sensor is used to detect the number of wafers on the first cassette.

7. The PECVD automatic wafer loading and unloading machine as described in claim 6, characterized in that: The cartridge storage area is equipped with a multi-layered material rack, with each layer holding multiple first cartridges. The rear side of the material rack is equipped with an indicator light to show the status of the first cartridges being picked up or placed. The transfer and positioning area is located in front of the material rack, and the second cartridge is located below the first cartridge. The wafer inspection component is located between the transfer and positioning area and the material rack. The wafer inspection component also includes a dual-axis drive arm, and both the first sensor and the second sensor are mounted on the dual-axis drive arm.

8. The PECVD automatic wafer loading and unloading machine as described in claim 7, characterized in that: The material rack is equipped with a fourth clip for storing the accompanying film. Below the fourth clip is a horizontal cylinder that drives the fourth clip to move back and forth.

9. The PECVD automatic wafer loading and unloading machine as described in claim 1, characterized in that: The material handling robot includes a mounting base, a robotic arm, and a handling assembly. The bottom end of the robotic arm is mounted on the mounting base, and the top end of the robotic arm is equipped with the handling assembly. The handling assembly includes a support frame, the top of which is connected to the top end of the robotic arm. On opposite sides of the support frame, there are two first Bernoulli chucks for adsorbing wafers, and on the other two sides of the support frame, there is a wafer fork for gripping wafers and a second Bernoulli chuck for adsorbing co-wafers.

10. The PECVD automatic wafer loading and unloading machine as described in claim 1, characterized in that: The material handling robot is set on a transport platform, which is equipped with a vision inspection component to visually inspect the wafers being unloaded from the PECVD machine to confirm whether there are any broken wafers.

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