A copper foil plating device for easy peelable copper foil processing

Abstract

The utility model relates to copper foil electroplating device technical field, concretely relates to a copper foil electroplating device for easy peel type copper foil processing, including electroplating pool, setting in the electroplating pool top can longitudinal movement's pressing mechanism, setting in the pressing mechanism top be used for monitoring copper foil position's laser detection device and setting in electroplating pool one side be used for adjusting copper foil attitude's sliding table, the top symmetry of electroplating pool one side is equipped with the fixed frame, the sliding table includes two groups of fixed seat that are fixed in the fixed frame top respectively, the inboard of fixed seat is equipped with the sliding seat that can move horizontally, the top of sliding seat is fixed with the mounting shaft, and the top of mounting shaft is equipped with the rotatable rotary seat, the sliding table includes two groups of fixed seat that are fixed in the fixed frame top respectively. The application has realized to the feed position of banded copper foil raw material and adjusted. The problem that banded copper foil raw material is easy to deviate in the feeding process is solved.

Description

Technical Field

[0001] This utility model relates to the technical field of copper foil electroplating equipment, specifically to a copper foil electroplating equipment for processing easily peelable copper foil. Background Technology

[0002] Copper foil electroplating equipment is a key piece of equipment in copper foil processing. It uses an electrochemical reaction to turn pure copper into composite copper foil, improving the conductivity and corrosion resistance of the copper foil. This equipment typically includes components such as an electrolytic cell, a substrate, an electrolyte, and a power supply. During operation, the substrate is immersed in the electrolyte and energized, causing copper ions to gradually reduce on the substrate surface and form copper foil. Copper foil electroplating equipment features high production efficiency, stable production quality, and safety and reliability, making it an indispensable piece of equipment in copper foil processing.

[0003] Chinese patent CN221877203U discloses an electroplating apparatus for improving color difference in the electroplating of low-roughness reverse copper foil. The apparatus includes a roughening electroplating tank containing a cathode plate, an anode plate, a cathode roller, and a roughening electrolyte. The cathode roller is immersed in the roughening electrolyte. The anode and cathode plates are arranged alternately. An insulating baffle is installed on the surface of the cathode plate. By adding an insulating baffle to the cathode plate, the conductive area of ​​the cathode plate is reduced. Under the premise of the same current, the current density increases, and the deposition rate of copper nodules on the copper foil surface increases. The formed nodules have a more uniform morphology and color, thus preventing abnormal color difference and pores on the surface of the reverse copper foil. Furthermore, appropriately increasing the current density does not significantly affect the surface roughness of the copper foil, remaining within acceptable parameter ranges. This effectively improves the yield of low-roughness reverse copper foil production without affecting the surface roughness, demonstrating strong practicality.

[0004] In the electroplating apparatus described in the aforementioned patent document, the copper foil is fed by being pulled by traction force. During feeding, the copper foil moves tightly around the outer circumference of the inlet roller. However, due to unavoidable errors in the thickness of the copper foil, it is prone to misalignment when fed onto the surface of the inlet roller. When the copper foil misaligns, its edge may collide with the inner wall of the electroplating tank, thus affecting the electroplating quality. Therefore, a copper foil electroplating apparatus for processing easily peelable copper foil is proposed. Utility Model Content

[0005] To address the aforementioned problems, a copper foil electroplating apparatus for processing easily peelable copper foil is provided. A sliding table drives a mounting shaft to move horizontally, which in turn drives a rotating base to move synchronously. This movement of the rotating base causes a straightening roller to tilt horizontally, allowing the position of the strip copper foil material to be adjusted. This achieves adjustment of the feeding position of the strip copper foil material and solves the problem of easy deviation during the feeding process.

[0006] To address the problems of the prior art, this application provides a copper foil electroplating apparatus for processing easily peelable copper foil, including an electroplating tank, a pressing mechanism that can move longitudinally on the top of the electroplating tank, a laser detection device on the top of the pressing mechanism for monitoring the position of the copper foil, and a slide table on one side of the electroplating tank for adjusting the posture of the copper foil. A fixing frame is symmetrically installed on the top of one side of the electroplating tank.

[0007] The slide table includes two sets of fixed seats respectively fixed to the top of the fixed frame. A slide that can move horizontally is installed inside the fixed seat. A mounting shaft is fixed to the top of the slide. A rotatable rotating seat is installed at the top of the mounting shaft.

[0008] The slide also includes an adjustable correction roller, with both ends of the correction roller rotatably mounted on a rotating base;

[0009] The pressing mechanism includes a longitudinally movable frame, and a laser detection device is installed on the lower end face of the movable frame to monitor the movement position of the strip copper foil raw material.

[0010] As one technical solution of this application, several sliding grooves are longitudinally opened on two corresponding side walls inside the electroplating tank; several limiting rods are symmetrically arranged on both sides of the lower end face of the moving frame, the limiting rods can extend downward into the interior of the electroplating tank and slide in cooperation with the sliding grooves, and the bottom end of the limiting rods is provided with a pressing roller shaft that can press the strip copper foil material into the interior of the electroplating tank.

[0011] As one technical solution of this application, a limiting groove is formed near the bottom of the limiting rod; a first sliding rod for limiting is fixed longitudinally inside the limiting groove, and a slider capable of moving longitudinally along its central axis is installed outside the first sliding rod, with both ends of the pressure roller shaft rotatably mounted on the slider.

[0012] As one technical solution of this application, a reset spring for pushing the slider to reset is installed on the outside of the first slide bar.

[0013] As one technical solution of this application, the electroplating tank is provided with a number of top rollers for supporting the strip copper foil raw material, and the two ends of the top rollers are rotatably mounted on the inner wall of the electroplating tank.

[0014] As one technical solution of this application, hydraulic telescopic components for driving the longitudinal movement of the moving frame are symmetrically installed on both sides of the outside of the electroplating tank.

[0015] As one technical solution of this application, the slide table is provided with a second slide rod for mounting the mounting shaft, and the mounting shaft is slidably mounted on the second slide rod.

[0016] As one technical solution of this application, a rotatable lead screw is horizontally arranged at the center of the inner side of the slide table, and the lead screw can be threadedly connected to the mounting shaft; a servo motor capable of driving the mounting shaft to move along the central axis of the second slide bar is arranged on one of the sets of fixed seats.

[0017] The advantages of this utility model compared to the prior art are:

[0018] 1. This application utilizes a sliding table to drive the mounting shaft to move horizontally, which in turn drives the rotating seat to move synchronously. This movement of the rotating seat causes the alignment roller to tilt horizontally, thereby adjusting the position of the strip copper foil material. This achieves adjustment of the feeding position of the strip copper foil material and solves the problem of easy deviation during the feeding process.

[0019] 2. This application utilizes the longitudinal movement of the moving frame to drive a limiting rod to slide along the inside of the chute. When the limiting rod moves downward, it drives the pressure roller shaft to move synchronously, thereby pressing the strip copper foil material into the electroplating tank. This eliminates the need for manual transport of the strip copper foil material into the electroplating tank, solving the problem that electroplating equipment cannot automatically transport strip copper foil material into the electroplating tank for processing. Attached Figure Description

[0020] Figure 1 This is a perspective view of a copper foil electroplating apparatus used for processing easily peelable copper foil.

[0021] Figure 2 This is a top view of a copper foil electroplating apparatus used for processing easily peelable copper foil.

[0022] Figure 3 yes Figure 2 Sectional view at point AA.

[0023] Figure 4 This is a perspective view of the electroplating tank in a copper foil electroplating apparatus used for processing easily peelable copper foil.

[0024] Figure 5 This is a perspective view of a slide table in a copper foil electroplating apparatus used for processing easily peelable copper foil.

[0025] Figure 6This is an exploded view of a slide table in a copper foil electroplating apparatus used for processing easily peelable copper foil.

[0026] Figure 7 This is a perspective view of the pressing mechanism in a copper foil electroplating device used for processing easily peelable copper foil.

[0027] Figure 8 yes Figure 7 Enlarged view of point B in the image.

[0028] The following are the labels in the diagram: 1. Electroplating tank; 11. Fixed frame; 12. Slide groove; 2. Pressing mechanism; 21. Moving frame; 22. Limiting rod; 23. Limiting groove; 24. First slide rod; 25. Return spring; 26. Slider; 3. Slide table; 31. Fixed seat; 32. Lead screw; 33. Second slide rod; 34. Slide seat; 35. Mounting shaft; 36. Rotary seat; 37. Correcting roller; 5. Top roller; 6. Laser detection device; 7. Hydraulic telescopic component; 8. Servo motor; 9. Pressing roller shaft. Detailed Implementation

[0029] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments.

[0030] See Figures 1-8 As shown, a copper foil electroplating apparatus for processing easily peelable copper foil includes an electroplating tank 1, a pressing mechanism 2 that can move longitudinally on the top of the electroplating tank 1, a laser detection device 6 that monitors the position of the copper foil on the top of the pressing mechanism 2, and a slide table 3 that is set on one side of the electroplating tank 1 for adjusting the posture of the copper foil. Fixing frames 11 are symmetrically installed on the top of one side of the electroplating tank 1.

[0031] The slide table 3 includes two sets of fixed seats 31 that are respectively fixed to the top of the fixed frame 11. A slide 34 that can move horizontally is installed inside the fixed seat 31. A mounting shaft 35 is fixed to the top of the slide 34. A rotatable rotating seat 36 is installed at the top of the mounting shaft 35.

[0032] The slide table 3 also includes an adjustable-angle correction roller 37, the two ends of which are rotatably mounted on the rotary seat 36.

[0033] The pressing mechanism 2 includes a longitudinally movable frame 21, and a laser detection device 6 is installed on the lower end face of the movable frame 21 to monitor the movement position of the strip copper foil raw material.

[0034] When the laser detection device 6 detects a deviation in the feeding of the strip copper foil material, the slide table 3 drives the slide block 34 mounted on it to move horizontally. Simultaneously, the slide block 34 moves the mounting shaft 35, which in turn pushes one end of the alignment roller 37 to move horizontally via the rotating seat 36. During this process, both ends of the alignment roller 37 move in opposite directions, causing the alignment roller 37 to change from a horizontal state to a horizontal tilt. When the alignment roller 37 tilts, the position of the strip copper foil material can be adjusted.

[0035] See Figure 1 and Figure 7 As shown, several sliding grooves 12 are longitudinally opened on two corresponding side walls inside the electroplating tank 1; several limiting rods 22 are symmetrically arranged on both sides of the lower end face of the moving frame 21. The limiting rods 22 can extend downward into the interior of the electroplating tank 1 and slide in cooperation with the sliding grooves 12. The bottom end of the limiting rods 22 is provided with a pressing roller shaft 9 that can press the strip copper foil material into the interior of the electroplating tank 1.

[0036] As the moving frame 21 moves longitudinally, it drives the limiting rod 22 to slide along the groove 12, effectively ensuring the stability of the moving frame 21 during movement. Simultaneously, the limiting rod 22 drives the pressure roller shaft 9 at the bottom to move downwards. When the limiting rod 22 drives the pressure roller shaft 9 downwards, the bottom of the pressure roller shaft 9 contacts the upper surface of the strip copper foil material, and the pressure roller shaft 9 continues to move downwards until the strip copper foil material is pressed into the electroplating tank 1 and immersed in the electroplating solution. This allows the electroplating device to automatically add the strip copper foil material into the electroplating tank 1 for electroplating.

[0037] See Figure 7 and Figure 8 As shown, a limiting groove 23 is provided near the bottom of the limiting rod 22; a first sliding rod 24 for limiting is fixed longitudinally inside the limiting groove 23, and a slider 26 that can move longitudinally along its central axis is installed outside the first sliding rod 24. Both ends of the pressure roller shaft 9 are rotatably mounted on the slider 26.

[0038] To prevent friction between the pressure roller shaft 9 and the surface of the strip copper foil material, both ends of the pressure roller shaft 9 are rotatably mounted on the slider 26. When the strip copper foil material moves, the surface of the strip copper foil material can drive the pressure roller shaft 9 to rotate, effectively preventing friction between the pressure roller shaft 9 and the strip copper foil material.

[0039] See Figure 8 As shown, a reset spring 25 for pushing the slider 26 to reset is installed on the outside of the first slider 24.

[0040] During the pressing process of the pressure roller shaft 9 against the strip copper foil material, when the pressure roller shaft 9 presses the strip copper foil material into the electroplating tank 1, the strip copper foil material generates an upward counterforce, causing the pressure roller shaft 9 to drive the slider 26 to move upward along the central axis of the first slide rod 24. Simultaneously, the slider 26 compresses the return spring 25, which accumulates potential energy under compression. When the strip copper foil relaxes, the potential energy accumulated in the return spring 25 is released, causing the pressure roller shaft 9 to move downward under the push of the slider 26. The slider 26 can drive the pressure roller shaft 9.

[0041] See Figure 4 As shown, several top rollers 5 are horizontally arranged inside the electroplating tank 1 to support the strip copper foil raw material. The two ends of the top rollers 5 are rotatably arranged on the inner wall of the electroplating tank 1.

[0042] To improve the electroplating quality of strip copper foil raw materials, a rotating top roller 5 is installed inside the electroplating bath 1 near its top. When the pressure roller shaft 9 presses the strip copper foil raw material into the electroplating bath 1, the strip copper foil raw material is blocked by the top roller 5, causing the strip copper foil raw material to change from a horizontal state to an M-shaped state, thereby allowing the strip copper foil raw material to be immersed in the electroplating solution for a longer time. This avoids the problem of uneven thickness caused by insufficient immersion time during the electroplating process, thus improving the electroplating quality of the strip copper foil raw material.

[0043] See Figure 1 and Figure 7 As shown, hydraulic telescopic components 7 for driving the longitudinal movement of the moving frame 21 are symmetrically installed on both sides of the outside of the electroplating tank 1.

[0044] By longitudinally installing the hydraulic telescopic component 7 on the corresponding side of the outside of the electroplating tank 1, and fixing the output end of the hydraulic telescopic component 7 to both sides of the movable frame 21, the output end of the hydraulic telescopic component 7 can drive the movable frame 21 to move longitudinally for adjustment when it extends or retracts.

[0045] See Figure 5 and Figure 6 As shown, the slide table 3 is provided with a second slide rod 33 for mounting the mounting shaft 35, and the mounting shaft 35 is slidably mounted on the second slide rod 33.

[0046] To ensure the stability of the mounting shaft 35, a second slide rod 33 is installed parallel to the inner side of the fixed base 31, allowing the mounting shaft 35 to move along the central axis of the second slide rod 33 during movement. This effectively ensures the stability of the mounting shaft 35 and prevents it from shifting during movement.

[0047] See Figure 5 and Figure 6As shown, a rotatable lead screw 32 is horizontally arranged at the center of the inner side of the slide table 3, and the lead screw 32 can be threadedly connected to the mounting shaft 35; a servo motor 8 is arranged on one of the sets of fixed seats 31, which can drive the mounting shaft 35 to move along the central axis of the second slide bar 33.

[0048] To ensure the movement of the mounting shaft 35, a rotatable lead screw 32 is horizontally installed inside the fixed base 31, and the mounting shaft 35 is movably mounted on the lead screw 32. A servo motor 8 is fixed to one of the two sets of fixed bases 31, and its output end is fixedly connected to one end of the lead screw 32. When the servo motor 8 drives its output end to rotate, the output end of the servo motor 8 synchronously drives the lead screw 32 to rotate, so that the rotation of the lead screw 32 simultaneously drives the movement of the mounting shaft 35.

[0049] The above embodiments only illustrate one or more implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. A copper foil electroplating apparatus for processing easily peelable copper foil, comprising an electroplating tank (1), a pressing mechanism (2) disposed on the top of the electroplating tank (1) and capable of longitudinal movement, a laser detection device (6) disposed on the top of the pressing mechanism (2) for monitoring the position of the copper foil, and a slide table (3) disposed on one side of the electroplating tank (1) for adjusting the posture of the copper foil, characterized in that, A fixing frame (11) is symmetrically installed on the top of one side of the electroplating tank (1); The slide (3) includes two sets of fixed seats (31) respectively fixed to the top of the fixed frame (11). A slide (34) capable of horizontal movement is installed inside the fixed seat (31). A mounting shaft (35) is fixed to the top of the slide (34). A rotatable rotating seat (36) is installed at the top of the mounting shaft (35). The slide (3) also includes an adjustable angle correction roller (37), the two ends of which are rotatably mounted on the rotary seat (36); The pressing mechanism (2) includes a moving frame (21) that can move longitudinally, and a laser detection device (6) that can monitor the movement position of the strip copper foil raw material is installed on the lower end face of the moving frame (21).

2. The copper foil electroplating apparatus for processing easily peelable copper foil according to claim 1, characterized in that, The electroplating tank (1) has several longitudinally opened grooves (12) on two corresponding side walls inside; the lower end face of the moving frame (21) has several limiting rods (22) symmetrically arranged on both sides. The limiting rods (22) can extend downward into the electroplating tank (1) and slide in cooperation with the grooves (12). The bottom end of the limiting rods (22) is provided with a pressing roller shaft (9) that can press the strip copper foil material into the electroplating tank (1).

3. The copper foil electroplating apparatus for processing easily peelable copper foil according to claim 2, characterized in that, The limiting rod (22) has a limiting groove (23) near its bottom end; a first sliding rod (24) for limiting is fixed longitudinally inside the limiting groove (23), and a slider (26) that can move longitudinally along its central axis is installed outside the first sliding rod (24). The two ends of the pressure roller shaft (9) are rotatably installed on the slider (26).

4. A copper foil electroplating apparatus for processing easily peelable copper foil according to claim 3, characterized in that, The first slide bar (24) is externally equipped with a return spring (25) for pushing the slider (26) to reset.

5. A copper foil electroplating apparatus for processing easily peelable copper foil according to claim 1, characterized in that, The electroplating tank (1) is equipped with several top rollers (5) for lifting the strip copper foil raw material. The two ends of the top rollers (5) are rotatably mounted on the inner wall of the electroplating tank (1).

6. A copper foil electroplating apparatus for processing easily peelable copper foil according to claim 1, characterized in that, Hydraulic telescopic components (7) for driving the longitudinal movement of the moving frame (21) are symmetrically installed on both sides of the outside of the electroplating tank (1).

7. A copper foil electroplating apparatus for processing easily peelable copper foil according to claim 1, characterized in that, The slide (3) is provided with a second slide rod (33) for mounting the mounting shaft (35), and the mounting shaft (35) is slidably mounted on the second slide rod (33).

8. A copper foil electroplating apparatus for processing easily peelable copper foil according to claim 1, characterized in that, A rotatable lead screw (32) is horizontally arranged at the center of the inner side of the slide (3), and the lead screw (32) can be threadedly connected to the mounting shaft (35); a servo motor (8) is provided on one of the sets of fixed seats (31) to drive the mounting shaft (35) to move along the central axis of the second slide (33).

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