Water baffle and vertical plating apparatus

CN224917963UActive Publication Date: 2026-10-30JIANGXI UNIVERSE INTELLIGENT EQUIP CO LTD
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Patent Information

Application Number
CN202522501657.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-25
Publication Date
2026-10-30
Estimated Expiration
2035-11-25

AI Technical Summary

Technical Problem

[0002]在PCB板输送过程中,挡水轮结构是实现药水流动路径管控、保障PCB板顺畅过板的关键组件,挡水轮结构存在设计缺陷,将引发药水对PCB板的咬蚀、过板时的水流冲击及过水状态不稳定等问题,致使产品不良率上升

Benefits of technology

[0013]本实用新型的技术方案通过采用第二挡水组件的顶端高于第一挡水组件的顶端,以使第一挡水组件和第二挡水组件之间具有高度差,从而形成多级梯度式挡水结构,提升了挡水装置的挡水效果,有效减少电路板在输送过程中电镀缸内的药液经进料口流动至电镀缸外,进而阻隔电镀缸与外部设备之间的药液串流以及减少药液浪费。

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Abstract

The utility model discloses a water baffle and vertical electroplating equipment relates to electroplating equipment technical field, wherein, water baffle includes electroplating jar, including feed plate, the feed plate has feed port, water baffle structure is located in the electroplating jar, water baffle structure includes first water baffle subassembly, second water baffle subassembly and water baffle board subassembly, the top of second water baffle subassembly is higher than the top of first water baffle subassembly, second water baffle subassembly is used for cooperation first water baffle subassembly to block the liquid medicine from feed port delivery to external equipment, the utility model provides technical scheme for through using the top of second water baffle subassembly is higher than the top of first water baffle subassembly, to make first water baffle subassembly and second water baffle subassembly between height difference, thereby forms multistage gradient type water baffle structure, has promoted the water baffle effect of water baffle device, effectively reduces the liquid medicine in the electroplating jar in the conveying process of circuit board and flows to the electroplating jar outside through feed port.
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Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to a water-blocking device and a vertical electroplating device. Background Technology

[0002] In the PCB board conveying process, the water-blocking wheel structure is a key component for controlling the flow path of the plating solution and ensuring smooth PCB board passage. Design flaws in the water-blocking wheel structure can lead to problems such as plating solution corrosion of the PCB board, water flow impact during passage, and unstable water flow, resulting in increased product defect rates. However, existing water-blocking devices have poor water-blocking effects, failing to effectively prevent cross-flow of plating solutions between the electroplating tank and external equipment. This causes the plating solution inside the tank to flow through the inlet to the external equipment, resulting in not only waste of plating solutions but also imbalance in solution concentration, ultimately affecting the circuit board. Utility Model Content The main purpose of this invention is to provide a water-blocking device and a vertical electroplating equipment, which aims to improve the water-blocking effect of the water-blocking device to prevent the cross-flow of chemical solutions between the electroplating tank and external equipment.

[0003] To achieve the above objectives, the present invention proposes a water-blocking device, including an electroplating tank and a feed plate having a feed inlet; a water-blocking structure disposed in the electroplating tank, the water-blocking structure including a first water-blocking component, a second water-blocking component, and a water-blocking plate assembly, the feed plate and the water-blocking plate assembly forming a water-blocking cavity, the first water-blocking component and the second water-blocking component being disposed within the water-blocking cavity, the first water-blocking component being disposed on the side of the second water-blocking component near the feed inlet, the top end of the first water-blocking component being lower than at least a portion of the top end of the feed plate, the top end of the second water-blocking component being higher than at least a portion of the top end of the water-blocking plate assembly, and the top end of the second water-blocking component being higher than the top end of the first water-blocking component, the second water-blocking component cooperating with the first water-blocking component to prevent the chemical solution from being conveyed from the feed inlet to external equipment.

[0004] In one embodiment, the first water-blocking assembly includes at least two first water-blocking wheels, which are disposed on opposite sides of the electroplating tank corresponding to the feed inlet. A first through-plate channel is formed between the at least two first water-blocking wheels. The at least two first water-blocking wheels are used to clamp the circuit board and prevent the liquid from being conveyed from the feed inlet to external equipment. The second water-blocking assembly includes at least two second water-blocking wheels, which are respectively located on opposite sides of the first water-blocking assembly corresponding to the first through-plate channel. A second through-plate channel is formed between the at least two second water-blocking wheels. The at least two second water-blocking wheels are used to clamp the circuit board and prevent the liquid from being conveyed from the feed inlet to external equipment.

[0005] In one embodiment, the first water-blocking wheel includes a first rotating shaft and a first rubber wheel sleeved outside the first rotating shaft, and the second water-blocking wheel includes a second rotating shaft and a second rubber wheel sleeved outside the second rotating shaft, wherein the top end of the second rubber wheel is higher than the top end of the first rubber wheel.

[0006] In one embodiment, the first water-blocking assembly further includes at least two water-blocking plates, which are disposed on opposite sides of the electroplating cylinder corresponding to the feed inlet, and the water-blocking plates are located between the first water-blocking wheel and the electroplating cylinder.

[0007] In one embodiment, the baffle assembly includes a baffle frame disposed on the electroplating tank, and two baffles disposed between the baffle frame and the electroplating tank, such that the baffle frame, the feed plate, and the two baffles enclose and form the baffle cavity.

[0008] In one embodiment, the first water-blocking assembly further includes a water-blocking element for sealing the gap between the first water-blocking wheel and the electroplating cylinder. The electroplating cylinder has a first mounting groove located below the feed inlet. The water-blocking element is disposed in the first mounting groove, and the side of the water-blocking element away from the first mounting groove abuts against the first water-blocking wheel.

[0009] In one embodiment, the water-blocking device further includes a driving assembly disposed on the electroplating tank. The driving assembly includes a driving member, a first transmission member, a plurality of second transmission members, and a plurality of third transmission members. The plurality of third transmission members are respectively disposed one-to-one on the first rotating shaft or the second rotating shaft. The driving member is drivenly connected to the first transmission member. The first transmission member is drivenly connected to the plurality of second transmission members. Each second transmission member is drivenly connected to one of the third transmission members.

[0010] In one embodiment, the water-blocking device further includes a third water-blocking component. The electroplating tank has an outlet on the side away from the inlet. The third water-blocking component is rotatably disposed on the side of the electroplating tank near the outlet. The third water-blocking component has a third board passage for conveying circuit boards. The third water-blocking component is used to block the chemical solution in the electroplating tank from being conveyed from the outlet to external equipment.

[0011] In one embodiment, the first rubber wheel is configured as a sponge-like rubber wheel, and / or the second rubber wheel is configured as a sponge-like rubber wheel.

[0012] This utility model also proposes a vertical electroplating device, including a water-blocking device as described in any of the above embodiments.

[0013] The technical solution of this utility model adopts a method where the top of the second water-blocking component is higher than the top of the first water-blocking component, so that there is a height difference between the first water-blocking component and the second water-blocking component, thereby forming a multi-level gradient water-blocking structure, which improves the water-blocking effect of the water-blocking device, effectively reduces the flow of the chemical solution in the electroplating tank to the outside of the electroplating tank through the feed port during the conveying of the circuit board, thereby blocking the cross-flow of chemical solution between the electroplating tank and external equipment and reducing chemical solution waste. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0015] Figure 1 A schematic diagram of the structure of an embodiment of the water-blocking device provided by this utility model; Figure 2 A schematic diagram of another embodiment of the water-blocking device provided by this utility model; Figure 3 A front view of an embodiment of the water-blocking device provided by this utility model; Figure 4 A structural cross-sectional view of an embodiment of the water-blocking device provided by this utility model; Figure 5 An exploded structural diagram of an embodiment of the water-blocking device provided by this utility model; Figure 6 A schematic diagram of an embodiment of the vertical electroplating equipment provided by this utility model.

[0016] Explanation of icon numbers: 1. Electroplating tank; 11. Feed plate; 111. Feed inlet; 112. Water-blocking cavity; 113. First mounting groove; 12. Discharge outlet; 2. Water-blocking structure; 21. First water-blocking assembly; 211. First water-blocking wheel; 2111. First rotating shaft; 2112. First rubber wheel; 212. First through-plate channel; 22. Second water-blocking assembly; 221. Second water-blocking wheel; 2211. Second rotating shaft; 2212. Second rubber wheel; 222. Second through-plate channel; 23. Water-blocking plate assembly; 231. Water-blocking plate; 232. Water-blocking frame; 233. Water-blocking component; 3. Drive assembly; 31. First transmission component; 32. Second transmission component; 33. Third transmission component; 4. Third water-blocking assembly; 41. Third through-plate channel; 10. Chemical tank; 20. Circuit board.

[0017] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0019] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0020] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0021] This utility model proposes a water-blocking device.

[0022] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6In one embodiment of this utility model, the water-blocking device includes an electroplating tank 1 and a water-blocking structure 2. The electroplating tank 1 includes a feed plate 11, which has a feed inlet 111. The water-blocking structure 2 is disposed on the electroplating tank 1. The water-blocking structure 2 includes a first water-blocking component 21, a second water-blocking component 22, and a water-blocking plate component 23. The feed plate 11 and the water-blocking plate component 23 enclose a water-blocking cavity 112. The first water-blocking component 21 and the second water-blocking component 22 are disposed in the water-blocking cavity 112. The first water-blocking component 21 is disposed on the side of the second water-blocking component 22 near the feed inlet 111. The top of the first water-blocking component 21 is lower than at least part of the top of the feed plate 11. The top of the second water-blocking component 22 is higher than at least part of the top of the water-blocking plate component 23. The top of the second water-blocking component 22 is higher than the top of the first water-blocking component 21. The second water-blocking component 22 is used to cooperate with the first water-blocking component 21 to prevent the liquid from being transported from the feed inlet 111 to external equipment.

[0023] The technical solution of this utility model adopts a method where the top of the second water-blocking component 22 is higher than the top of the first water-blocking component 21, so that there is a height difference between the first water-blocking component 21 and the second water-blocking component 22, thereby forming a multi-level gradient water-blocking structure 2, which improves the water-blocking effect of the water-blocking device, effectively reduces the flow of the chemical solution in the electroplating tank 1 to the outside of the electroplating tank 1 through the feed inlet 111 during the conveying process of the circuit board, thereby blocking the cross-flow of chemical solution between the electroplating tank 1 and external equipment and reducing chemical solution waste.

[0024] In this embodiment, the electroplating tank 1, serving as a reaction vessel containing electroplating solution, can be made of stainless steel. The vertical electroplating equipment also includes external equipment, which can be understood as a chemical solution tank located between two adjacent electroplating tanks 1. The liquid level of the chemical solution in the chemical solution tank can be level with the top of the first water-blocking component 21. A feed plate 11 is installed inside the electroplating tank 1. The electroplating tank 1 has a conveying channel and an inlet 111 and an outlet 12 connecting the conveying channel. The inlet 111 is located on the feed plate 11 and is used to input the circuit board from the previous process. A water-blocking structure 2 is rotatably mounted on the electroplating tank 1. The water-blocking structure 2 is used to prevent the chemical solution in the electroplating tank 1 from flowing from the inlet 111 into the chemical solution tank, thereby preventing mixing of the chemical solutions in the chemical solution tank and the electroplating tank 1. The water-blocking structure 2 is also used to clamp the circuit board on both sides along the thickness direction, so that the circuit board is conveyed along the extension direction of the conveying channel under the rotation of the water-blocking structure 2, thereby improving the stability of the circuit board conveyed in the electroplating tank 1. This application uses a two-stage water-blocking assembly to block the chemical solution. Specifically, the water-blocking structure 2 includes a first water-blocking assembly 21 and a second water-blocking assembly 22. The first water-blocking assembly 21 is rotatably disposed in the electroplating tank 1, and the second water-blocking assembly 22 is rotatably disposed in the electroplating tank 1. The first water-blocking assembly 21 is disposed on the side of the second water-blocking assembly 22 near the feed inlet 111. The top of the second water-blocking assembly 22 is higher than the top of the first water-blocking assembly 21, so that a stepped height difference is formed between the second water-blocking assembly 22 and the first water-blocking assembly 21. The first water-blocking component 21 is used to prevent the chemical solution in the electroplating tank 1 from flowing into the chemical solution tank from the inlet 111. The second water-blocking component 22 is used to construct a barrier that is higher than the first water-blocking component 21, further cooperating with the first water-blocking component 21 to prevent the chemical solution in the electroplating tank 1 from being transported into the chemical solution tank. The technical solution provided in this application aims to effectively block the chemical solution and prevent cross-contamination between the electroplating tank 1 and the chemical solution tank. Through the coordinated work of multiple water-blocking components, this application significantly improves the reliability of blocking the chemical solution and can maintain a stable blocking effect during the dynamic transport of the circuit board. The height difference design between the first water-blocking component 21 and the second water-blocking component 22 can form a pressure gradient and help consume the penetration kinetic energy of the chemical solution, thereby preventing the chemical solution from splashing onto the surface of the circuit board. The closed structure of the water-blocking cavity 112 ensures that the leaked chemical solution is in a controllable circulation state, preventing the chemical solution in the electroplating tank 1 from flowing to the outside.

[0025] like Figure 2 and Figure 4As shown, in one embodiment, the first water-blocking component 21 includes at least two first water-blocking wheels 211, which are located on opposite sides of the electroplating tank 1 corresponding to the feed inlet 111. A first plate-passing channel 212 is formed between the at least two first water-blocking wheels 211. The at least two first water-blocking wheels 211 are used to clamp the circuit board and prevent the liquid from being conveyed from the feed inlet 111 to the external device. The second water-blocking component 22 includes at least two second water-blocking wheels 221, which are located on opposite sides of the first water-blocking component 21 corresponding to the first plate-passing channel 212. A second plate-passing channel 222 is formed between the at least two second water-blocking wheels 221. The at least two second water-blocking wheels 221 are used to clamp the circuit board and prevent the liquid from being conveyed from the feed inlet 111 to the external device.

[0026] In this embodiment, the synergistic action of the two first water-blocking rollers 211 and the two second water-blocking rollers 221 forms a multi-stage seal within the water-blocking cavity 112, ensuring that the plating solution in the electroplating tank 1 only overflows into the water-blocking cavity 112. The first water-blocking rollers 211 and the second water-blocking rollers 221 cooperate to prevent the plating solution in the electroplating tank 1 from flowing into external equipment. The two first water-blocking rollers 211 and the two second water-blocking rollers 221 ensure that the circuit board conveying trajectory remains stable, reducing jamming or misalignment. like Figure 2 and Figure 4 As shown, in one embodiment, the first water-blocking wheel 211 includes a first rotating shaft 2111 and a first rubber wheel 2112 sleeved on the first rotating shaft 2111, and the second water-blocking wheel 221 includes a second rotating shaft 2211 and a second rubber wheel 2212 sleeved on the second rotating shaft 2211, with the top end of the second rubber wheel 2212 being higher than the top end of the first rubber wheel 2112.

[0027] In this embodiment, when the circuit board enters from the inlet 111, it is first clamped by two first baffle rollers 211. The elastic rubber of the first baffle rollers 211 deforms under pressure, forming a preliminary seal. Subsequently, the circuit board enters the second through-channel 222 formed by the second baffle roller 221. Because the top of the second baffle roller 221 is higher than the top of the first baffle roller 211, a liquid level difference is created, restricting the flow of the plating solution in the electroplating tank 1 towards the side closer to the inlet 111. This, in turn, allows the synergistic effect of the two baffle roller assemblies to form a multi-stage seal within the baffle cavity 112. The double clamping structure ensures the dispersion of water flow impact during the through-channel process, maintaining a stable circuit board transport trajectory and reducing jamming or offset phenomena. When the circuit board enters from the inlet 111, it is first clamped by the first baffle roller 211, at which point the elastic rubber is deformed under pressure, forming a preliminary seal. The circuit board then enters the second through-plate channel 222 formed by the second baffle wheel 221. Since the top of the second baffle wheel 221 is higher than the first baffle wheel 211, a liquid level difference is formed, which restricts the flow of the chemical solution in the electroplating tank 1 to the side closer to the feed port 111.

[0028] like Figure 2 and Figure 5 As shown, in one embodiment, the first water-blocking assembly 21 further includes at least two water-blocking plates 231, which are disposed on opposite sides of the electroplating cylinder 1 corresponding to the feed inlet 111, and the water-blocking plates 231 are located between the first water-blocking wheel 211 and the electroplating cylinder 1.

[0029] In this embodiment, the baffle plate 231 is disposed on the edges of the electroplating tank 1 on both sides of the inlet 111, and its installation position is located between the first baffle wheel 211 and the side wall of the electroplating tank 1. The bottom of the baffle plate 231 can extend below the liquid surface inside the electroplating tank 1, while the top of the baffle plate 231 maintains a gap with the rotation trajectory of the first baffle wheel 211, thus avoiding interference with the rotation of the first baffle wheel 211 and effectively blocking the liquid in the electroplating tank 1 from flowing out along the tank wall of the electroplating tank 1 and through the inlet 111. This application effectively solves the problem of the liquid in the electroplating tank 1 seeping into the chemical tank through the gap between the inlet 111 and the electroplating tank 1. The synergistic effect of the baffle plate 231 and the first baffle wheel 211 confines the liquid in the electroplating tank 1 inside the baffle cavity 112, while maintaining the unobstructed flow of the plate passage.

[0030] like Figure 2 and Figure 5 As shown, in one embodiment, the water baffle assembly 23 includes a water baffle frame 232, which is disposed on the electroplating tank 1, and two water baffles 231 are disposed between the water baffle frame 232 and the electroplating tank 1, so that the water baffle frame 232, the feed plate 11 and the two water baffles 231 surround and form the water baffle cavity 112.

[0031] In this embodiment, the water-blocking frame 232 is vertically installed at the feed inlet 111 of the electroplating tank 1, and two water-blocking plates 231 are respectively embedded in the second mounting groove formed by the water-blocking frame 232 and the side wall of the electroplating tank 1. After the water-blocking frame 232 and the electroplating tank 1 are assembled, the top of the water-blocking frame 232 is aligned with the feed plate 11, and the side of the water-blocking frame 232 is tightly fitted with the water-blocking plate 231, forming an annular closed structure around the feed inlet 111. The water-blocking plate 231 and the water-blocking frame 232 are fitted with an interference fit. This application effectively improves the problem of leakage of the electroplating solution caused by the poor sealing of the water-blocking cavity 112. The combined structure of the water-blocking frame 232 and the water-blocking plate 231 not only ensures the assembly accuracy but also reduces the processing difficulty. The replaceable design of the water-blocking plate 231 extends the service life of the device, and the water-blocking frame 232 can provide support for the constructed water-blocking cavity 112 and avoid structural deformation after long-term use.

[0032] like Figure 2 and Figure 5 As shown, in one embodiment, the first water-blocking assembly 21 further includes a water-blocking member 233, which is used to seal the gap between the first water-blocking wheel 211 and the electroplating cylinder 1. The electroplating cylinder 1 has a first mounting groove 113, which is located below the feed inlet 111. The water-blocking member 233 is disposed in the first mounting groove 113, and the side of the water-blocking member 233 away from the first mounting groove 113 abuts against the first water-blocking wheel 211.

[0033] In this embodiment, the water-blocking member 233 has an arc-shaped mounting surface on the side near the first water-blocking wheel 211. After the water-blocking member 233 is embedded in the first mounting groove 113, the mounting surface fits against the first water-blocking wheel 211 to achieve a seal between the first water-blocking wheel 211 and the side wall of the electroplating tank 1. When the first water-blocking wheel 211 rotates, the water-blocking member 233 continuously fits against the surface of the first water-blocking wheel 211 through elastic deformation, thereby forming a sealed interface between the first water-blocking wheel 211 and the side wall of the electroplating tank 1. This application effectively solves the problem of the chemical solution flowing out from the gap between the first water-blocking wheel 211 and the electroplating tank 1 into the chemical solution tank, preventing the chemical solution in the electroplating tank 1 from flowing into the chemical solution tank.

[0034] like Figure 2 and Figure 3As shown, in one embodiment, the water-blocking device further includes a driving assembly 3, which is disposed on the electroplating tank 1. The driving assembly 3 includes a driving member, a first transmission member 31, a plurality of second transmission members 32, and a plurality of third transmission members 33. The plurality of third transmission members 33 are respectively disposed one-to-one on the first rotating shaft 2111 or the second rotating shaft 2211. The driving member is drivenly connected to the first transmission member 31, the first transmission member 31 is drivenly connected to the plurality of second transmission members 32, and each second transmission member 32 is drivenly connected to one of the third transmission members 33.

[0035] In this embodiment, the driving component can be configured as either a motor or an electric motor, and the first transmission component 31, the second transmission component 32, and the third transmission component 33 can be configured as transmission gears. The power output by the driving component is initially transmitted through the first transmission component 31. Multiple second transmission components 32 rotate under the drive of the first transmission component 31, thereby diverting the power to different paths through the multiple second transmission components 32. Each second transmission component 32 is connected to a corresponding third transmission component 33, and the third transmission component 33 is fixed on the first rotating shaft 2111 or the second rotating shaft 2211, thereby driving the first water-blocking wheel 211 or the second water-blocking wheel 221 to rotate synchronously. The driving assembly 3 enables multiple first water-blocking wheels 211 and / or second water-blocking wheels 221 to rotate synchronously, thereby ensuring uniform pressure distribution when clamping the circuit board. This application achieves synchronous operation of the first water-blocking assembly 21 and the second water-blocking assembly 22, ensuring that the circuit board is stably clamped during transportation.

[0036] like Figure 4 As shown, in one embodiment, the water-blocking device further includes a third water-blocking component 4. The electroplating cylinder 1 has an outlet 12 on the side away from the inlet 111. The third water-blocking component 4 is rotatably disposed on the side of the electroplating cylinder 1 near the outlet 12. The third water-blocking component 4 has a third board passage 41 for conveying circuit boards. The third water-blocking component 4 is used to block the chemical solution in the electroplating cylinder 1 from being conveyed from the outlet 12 to external equipment.

[0037] In this embodiment, the third water-blocking component 4 is rotatably disposed on the side of the electroplating tank 1 near the outlet 12. The third water-blocking component 4 is used to clamp the circuit board on both sides along the thickness direction, so that the circuit board is conveyed towards the outlet 12 under the rotation of the water-blocking structure 2. The third water-blocking component 4 is also used to prevent the chemical solution in the electroplating tank 1 from being discharged from the outlet 12. The third water-blocking component 4 may include two third water-blocking wheels, which are respectively located on opposite sides of the outlet 12 of the electroplating tank 1, and a third plate passage 41 is formed between the two third water-blocking wheels. The third water-blocking wheels can be implemented as rubber wheel assemblies with rotating shafts. The surface of the rubber wheel can be made of elastic material to adapt to the clamping of circuit boards of different thicknesses. This application effectively solves the problem of electroplating solution spreading outward through the outlet 12 and contaminating external equipment. The third water-blocking component 4 forms a reliable liquid seal while ensuring continuous conveying of the circuit board, reducing chemical solution loss and preventing contamination diffusion, thereby improving the stability of the electroplating process and the product yield.

[0038] In one embodiment, the first rubber wheel 2112 is configured as a sponge-like rubber wheel, and / or, the second rubber wheel 2212 is configured as a sponge-like rubber wheel. In this embodiment, the present application improves the interception efficiency of the water-blocking component for the chemical solution, reduces the probability of the chemical solution in the electroplating tank 1 flowing into the chemical solution tank through the feed inlet 111, and avoids the indentation damage caused by the hard rubber wheel to the surface of the circuit board, thus ensuring the integrity of the circuit board during the transportation process and the stability of the electroplating process.

[0039] This utility model also proposes a vertical electroplating device, which includes a water-blocking device. The specific structure of the water-blocking device is as described in the above embodiments. Since this vertical electroplating device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A water-blocking device, characterized in that, include: An electroplating tank, including a feed plate having a feed inlet; A water-blocking structure is provided in the electroplating tank. The water-blocking structure includes a first water-blocking component, a second water-blocking component, and a water-blocking plate assembly. The feed plate and the water-blocking plate assembly enclose a water-blocking cavity. The first water-blocking component and the second water-blocking component are disposed within the water-blocking cavity. The first water-blocking component is disposed on the side of the second water-blocking component near the feed inlet. The top of the first water-blocking component is lower than at least a portion of the top of the feed plate, and the top of the second water-blocking component is higher than at least a portion of the top of the water-blocking plate assembly. The top of the second water-blocking component is higher than the top of the first water-blocking component. The second water-blocking component is used to cooperate with the first water-blocking component to prevent the liquid from being transported from the feed inlet to external equipment.

2. The water-blocking device as described in claim 1, characterized in that, The first water-blocking assembly includes at least two first water-blocking wheels, which are disposed on opposite sides of the electroplating tank corresponding to the feed inlet. A first through-plate channel is formed between the at least two first water-blocking wheels. The at least two first water-blocking wheels are used to clamp the circuit board and prevent the liquid from being transported from the feed inlet to external equipment. The second water-blocking assembly includes at least two second water-blocking wheels, which are respectively located on opposite sides of the first water-blocking assembly corresponding to the first through-plate channel. A second through-plate channel is formed between the at least two second water-blocking wheels. The at least two second water-blocking wheels are used to clamp the circuit board and prevent the liquid medicine from being conveyed from the feed port to the external equipment.

3. The water-blocking device as described in claim 2, characterized in that, The first water-blocking wheel includes a first rotating shaft and a first rubber wheel sleeved outside the first rotating shaft. The second water-blocking wheel includes a second rotating shaft and a second rubber wheel sleeved outside the second rotating shaft. The top of the second rubber wheel is higher than the top of the first rubber wheel.

4. The water-blocking device as described in claim 2, characterized in that, The baffle assembly further includes at least two baffles, which are disposed on opposite sides of the electroplating cylinder corresponding to the feed inlet, and the baffles are located between the first baffle wheel and the electroplating cylinder.

5. The water-blocking device as described in claim 4, characterized in that, The water baffle assembly includes a water baffle frame disposed on the electroplating tank, and two water baffles disposed between the water baffle frame and the electroplating tank, so that the water baffle frame, the feed plate and the two water baffles together form the water baffle cavity.

6. The water-blocking device as described in claim 2, characterized in that, The baffle assembly further includes a baffle element for sealing the gap between the first baffle wheel and the electroplating cylinder. The electroplating cylinder has a first mounting groove located below the feed inlet. The baffle element is disposed in the first mounting groove, and the side of the baffle element away from the first mounting groove abuts against the first baffle wheel.

7. The water-blocking device as described in claim 3, characterized in that, The water-blocking device further includes a driving assembly, which is disposed on the electroplating tank. The driving assembly includes a driving component, a first transmission component, a plurality of second transmission components, and a plurality of third transmission components. The plurality of third transmission components are respectively disposed one-to-one on the first rotating shaft or the second rotating shaft. The driving component is drivenly connected to the first transmission component. The first transmission component is drivenly connected to the plurality of second transmission components. Each second transmission component is drivenly connected to one of the third transmission components.

8. The water-blocking device as described in claim 1, characterized in that, The water-blocking device further includes a third water-blocking component. The electroplating tank has an outlet on the side away from the inlet. The third water-blocking component is rotatably disposed on the side of the electroplating tank near the outlet. The third water-blocking component has a third board passage for conveying circuit boards. The third water-blocking component is used to block the chemical solution in the electroplating tank from being conveyed from the outlet to external equipment.

9. The water-blocking device as described in claim 3, characterized in that, The first rubber wheel is configured as a sponge-like rubber wheel, and / or the second rubber wheel is configured as a sponge-like rubber wheel.

10. A vertical electroplating device, characterized in that, Includes the water-blocking device as described in any one of claims 1 to 9.