Electroplating chuck and electroplating apparatus

Abstract

The utility model discloses an electroplating chuck and electroplating equipment, wherein, electroplating chuck includes chuck base body, the first boss is arranged on the chuck base body and protrudes, a plurality of sunken areas are arranged on the first boss, every sunken area is evenly provided with adsorption hole, to extract the air in the sunken area, and then form the negative pressure in the sunken area to adsorb the electroplating piece of cover setting on the sunken area, every sunken area is evenly provided with the second boss, to butt the electroplating piece of adsorption on the sunken area. Form a plurality of negative pressure zones in a plurality of sunken areas, and then respectively adsorb a plurality of areas on the electroplating piece, can stabilize the adsorption electroplating piece, every sunken area is evenly provided with the second boss, to butt the electroplating piece of adsorption on the sunken area, and then facilitate the stable conduction of the specific area on the electroplating piece.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic equipment technology, specifically to an electroplating suction cup and electroplating equipment. Background Technology

[0002] During the production of photovoltaic cells (referred to as cells), a small number of defective cells are generated. These defective cells typically exhibit flaws such as broken grids, poor soldering, over-soldering, leakage, and blackening of edges and corners. Among these, broken grids refer to the breakage or interruption of the grid lines on the cell, which leads to poor current collection and affects the cell's photoelectric conversion efficiency. Therefore, it is necessary to repair broken grids to restore the photoelectric conversion efficiency of the repaired cells and reduce the defect rate during cell production.

[0003] In the existing technology, there is no equipment specifically for electroplating repair of broken grids in solar cells, nor is there a device for stabilizing the conductivity of the electroplating surface of solar cells. Therefore, it is necessary to develop an electroplating suction cup and electroplating equipment. Utility Model Content

[0004] The purpose of this invention is to provide an electroplating suction cup and electroplating equipment, which fixes and conducts electricity to a local area of ​​the battery cell.

[0005] To achieve the above objectives, the technical solutions provided in this utility model embodiment are as follows.

[0006] An embodiment of this utility model provides an electroplating suction cup, which includes a suction cup base. A first protrusion is provided on the suction cup base. A plurality of recessed areas are provided on the first protrusion. Each recessed area is provided with an adsorption hole to extract air from the recessed area, thereby forming a negative pressure in the recessed area to adsorb the workpiece to be electroplated covered on the recessed area.

[0007] Each of the sunken areas is provided with a second protrusion to abut against the workpiece to be electroplated that is adsorbed on the sunken area.

[0008] In some embodiments, each of the sunken regions is provided with a plurality of second protrusions, and the plurality of second protrusions in each sunken region are evenly distributed in the sunken region.

[0009] In some embodiments, the spacing between the plurality of second protrusions in each of the sunken regions constitutes a negative pressure gap.

[0010] In some embodiments, if the second protrusion is adjacent to the inner wall of the sunken region, the gap between the second protrusion and the inner wall of the sunken region constitutes a negative pressure gap.

[0011] In some embodiments, the width of the negative pressure gap is 1-2.5 mm.

[0012] In some embodiments, each of the sinking regions is provided with a plurality of adsorption holes, which are evenly distributed in the negative pressure gap.

[0013] In some embodiments, the height of the second boss is lower than or equal to the height of the first boss.

[0014] In some embodiments, the suction cup substrate has a first vent hole that connects to a plurality of the suction holes.

[0015] In some embodiments, the roughness of the first boss is 0.1-0.4 μm, and / or the roughness of the second boss is 0.1-0.4 μm.

[0016] An embodiment of this utility model also provides an electroplating device, including the aforementioned electroplating suction cup.

[0017] Due to the application of the above technical solution, the embodiments of this utility model have the following advantages compared with the prior art:

[0018] The electroplating suction cup in this embodiment forms multiple negative pressure zones in multiple recessed areas, thereby adsorbing multiple areas on the workpiece to be electroplated, thus achieving stable adsorption of the workpiece. Each recessed area is provided with a second protrusion to abut against the workpiece adsorbed on the recessed area. The negative pressure formed in the recessed area adsorbs a specific area on the workpiece adsorbed on the recessed area, and the second protrusion abuts against the specific area on the workpiece adsorbed on the recessed area, thereby facilitating stable electrical conductivity of the specific area on the workpiece. Attached Figure Description

[0019] Appendix Figure 1 This is a front view of the electroplating chuck in an embodiment of the present invention;

[0020] Appendix Figure 2 This is a rear view of the electroplating suction cup in an embodiment of the present utility model;

[0021] Appendix Figure 3 This is a side view of the electroplating chuck in an embodiment of the present invention;

[0022] Appendix Figure 4 This is a cross-sectional view of section AA in an embodiment of this utility model;

[0023] Appendix Figure 5 This is a three-dimensional schematic diagram of the electroplating suction cup in an embodiment of the present utility model;

[0024] Appendix Figure 6 for Figure 5 A magnified view of a section at point B in the middle;

[0025] The meanings of the reference numerals in the attached figures are as follows:

[0026] The suction cup base 11 has a first protrusion 12, a recessed area 13, a second protrusion 14, an adsorption hole 15, a first vent hole 16, a second vent hole 17, a first weight reduction groove 181, and a second weight reduction groove 182. Detailed Implementation

[0027] The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings, so that the advantages and features of this utility model can be more easily understood by those skilled in the art. It should be noted that the description of these embodiments is for the purpose of aiding understanding of this utility model, but does not constitute a limitation thereof. The embodiments of this application are not merely one embodiment, but a collection of embodiments with similar schemes or features.

[0028] In order to fix the battery cells and stabilize the conductivity of the surface of the battery cells to be electroplated during the electroplating process, embodiments of this application provide an electroplating suction cup, which includes a suction cup base 11. A first boss 12 is provided on the suction cup base 11. A plurality of recessed areas 13 are provided on the first boss 12. Each recessed area 13 is provided with an adsorption hole 15 to extract air from the recessed area 13, thereby forming a negative pressure in the recessed area 13 to adsorb the part to be electroplated covering the recessed area 13. Each recessed area 13 is provided with a second boss 14 to abut against the part to be electroplated adsorbed on the recessed area 13.

[0029] In this embodiment, the electroplating suction cup forms multiple negative pressure zones in multiple recessed areas 13, thereby adsorbing multiple areas on the workpiece to be electroplated, thus achieving stable adsorption of the workpiece. Each recessed area 13 is provided with a second protrusion 14 to abut against the workpiece adsorbed on the recessed area 13. The negative pressure formed in the recessed area 13 adsorbs specific areas on the workpiece adsorbed on the recessed area 13, and the second protrusion 14 abuts against the specific areas on the workpiece adsorbed on the recessed area 13, thereby facilitating stable electrical conductivity to the specific areas on the workpiece. Multiple second protrusions 14 can abut against corresponding specific areas on the workpiece to be electroplated, thereby ensuring stable electrical conductivity to the entire workpiece.

[0030] It should be noted that the electroplating suction cup as a whole is made of conductive material, or at least the second protrusion 14 is made of conductive material, so that the second protrusion 14 can conduct electricity to the part to be electroplated. The conductive material can be iron or copper.

[0031] In one specific embodiment, the part to be electroplated is preferably a semi-finished photovoltaic cell, and grid lines are formed on the semi-finished photovoltaic cell by electroplating. In another specific embodiment, the part to be electroplated is preferably a defective photovoltaic cell with broken grids, and grid lines are formed at the broken grids of the photovoltaic cell to repair the broken grids. When electroplating the broken grids of the photovoltaic cell, the electroplating chuck generally needs to stably conduct electricity to the back side of the entire grid line area of ​​the photovoltaic cell, and stable conductivity is achieved by the second boss 14 stably contacting the back side.

[0032] In some embodiments, each recessed region 13 is provided with a plurality of second protrusions 14, and the plurality of second protrusions 14 in each recessed region 13 are evenly distributed in the recessed region 13 to conduct electricity evenly to the entire workpiece to be electroplated.

[0033] In some embodiments, the intervals between the plurality of second protrusions 14 in each recessed region 13 constitute a negative pressure gap. The negative pressure gap allows for stable adsorption of the workpiece to be electroplated. The negative pressure gaps between the plurality of second protrusions 14 are interconnected, ensuring that the pressure within the negative pressure gap is uniform, facilitating the uniform adsorption of multiple areas on the workpiece to be electroplated.

[0034] In some embodiments, if the second protrusion 14 is adjacent to the inner wall of the sunken region 13, the gap between the second protrusion 14 and the inner wall of the sunken region 13 constitutes a negative pressure gap.

[0035] In some embodiments, the width of the negative pressure gap is 1-2.5 mm, preferably 1 mm, 1.2 mm, 1.3 mm, 1.5 mm, 2.0 mm, 2.2 mm, 2.4 mm, or 2.5 mm. A negative pressure gap of suitable area forms a negative pressure zone of suitable area, which facilitates stable and uniform adsorption of the workpiece to be electroplated.

[0036] In some embodiments, each sinking region 13 is provided with a plurality of adsorption holes 15, which are evenly distributed in the negative pressure gap to facilitate the uniform adsorption of the workpiece to be electroplated.

[0037] Specifically, the second protrusion 14 has a polygonal structure, and each outer corner of the polygonal structure is provided with an adsorption hole 15. More specifically, the second protrusion 14 has a quadrilateral structure, and each outer corner of the quadrilateral structure is provided with an adsorption hole 15.

[0038] In some embodiments, the height of the second boss 14 is lower than or equal to the height of the first boss 12.

[0039] When the height of the second boss 14 is lower than the height of the first boss 12, the electroplated part is slightly deformed by the adsorption and then abuts against the second boss 14. When the height of the second boss 14 is equal to the height of the first boss 12, the electroplated part is directly abutted against the second boss 14 after being adsorbed.

[0040] In some embodiments, the suction cup substrate 11 has a first vent 16 that connects to a plurality of suction holes 15.

[0041] When processing the first vent 16, the first vent 16 is made to extend laterally through the suction cup base 11 to facilitate processing. The bottom of the suction cup base 11 is provided with a second vent 17 that connects to the first vent 16. When using the electroplating suction cup, both ends of the first vent 16 are blocked, and air is allowed to pass through the second vent 17.

[0042] Specifically, the first boss 12 is disposed on the first surface of the suction cup base 11, and a weight-reducing groove is disposed on the second surface of the first boss 12. More specifically, the weight-reducing groove includes a first weight-reducing groove 181 and a second weight-reducing groove 182, wherein the size of the first weight-reducing groove 181 is larger than the size of the second weight-reducing groove 182.

[0043] In some embodiments, the roughness of the first boss 12 is 0.1-0.4 μm, and / or the roughness of the second boss 14 is 0.1-0.4 μm; to avoid scratching the workpiece to be electroplated, which could cause damage to the workpiece.

[0044] Embodiments of this application also provide an electroplating apparatus, including the aforementioned electroplating suction cup. This electroplating suction cup forms multiple negative pressure zones in multiple recessed zones 13, thereby adsorbing multiple areas on the workpiece to be electroplated, thus stably adsorbing the workpiece. Each recessed zone 13 is provided with a second protrusion 14 to abut against the workpiece adsorbed on the recessed zone 13. A negative pressure is formed in the recessed zone 13 to adsorb specific areas on the workpiece covered by the recessed zone 13, and the second protrusion 14 abuts against the specific areas on the workpiece adsorbed on the recessed zone 13, thereby facilitating stable electrical conductivity to the specific areas on the workpiece.

[0045] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. An electroplating suction cup, characterized in that, Includes a suction cup base, on which a first protrusion is provided, and on which multiple recessed areas are provided, each of which is provided with an adsorption hole to extract air from the recessed area, thereby creating a negative pressure in the recessed area to adsorb the part to be electroplated covered on the recessed area. Each of the sunken areas is provided with a second protrusion to abut against the workpiece to be electroplated that is adsorbed on the sunken area.

2. The electroplating suction cup according to claim 1, characterized in that: Each of the sunken regions is provided with a plurality of second protrusions, and the plurality of second protrusions in each sunken region are evenly distributed in the sunken region.

3. The electroplating chuck according to claim 2, characterized in that: The intervals between the plurality of second protrusions in each of the sunken regions constitute a negative pressure gap.

4. The electroplating chuck according to claim 3, characterized in that: If the second protrusion is adjacent to the inner wall of the sunken area, the gap between the second protrusion and the inner wall of the sunken area constitutes a negative pressure gap.

5. The electroplating chuck according to claim 3 or 4, characterized in that: The width of the negative pressure gap is 1-2.5mm.

6. The electroplating chuck according to claim 3, characterized in that: Each of the sinking regions is provided with multiple adsorption holes, which are evenly distributed in the negative pressure gap.

7. The electroplating chuck according to claim 1, characterized in that: The height of the second boss is lower than or equal to the height of the first boss.

8. The electroplating chuck according to claim 1, characterized in that: The suction cup substrate has a first vent hole, which is connected to a plurality of the adsorption holes.

9. The electroplating chuck according to claim 1, characterized in that: The roughness of the first boss is 0.1-0.4 μm, and / or the roughness of the second boss is 0.1-0.4 μm.

10. An electroplating device, characterized in that: The electroplating chuck includes any one of claims 1-9.

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