IGBT substrate fixing jig
Patent Information
- Application Number
- CN202522154986.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-13
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-10-13
AI Technical Summary
[0004]本实用新型的目的在于提供一种IGBT基板固定夹具,通过设置有定位机构,解决了在对 IGBT 基板进行镀层操作时,传统方式很难在镀层过程中确保 IGBT 基板始终保持稳定位置,以往缺乏有效的定位措施,使得基板容易出现位置偏移,这会引发诸如镀层不均匀、厚度不一致等严重的问题
1、通过设置有定位机构,在需要对多个IGBT基板进行镀层时,可以分别拉动相应两个夹板,拉动多个弹簧,使得多个卡勾分别与IGBT基板上的槽口相对应并穿过槽口,在松开两个夹板后,多个卡勾在弹簧的反弹力的作用下,使得多个卡勾能够紧紧贴合在多个槽口的内壁上对多个IGBT基板进行定位,确保了在镀层过程中,IGBT 基板始终保持稳定的位置,避免因位置偏移而导致镀层不均匀、厚度不一致等问题,从而为后续高质量的镀层效果奠定了坚实基础,保证了整体装置在实际运行过程中的稳定性与可靠性。
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Figure CN224917969U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of IGBT substrate technology, and in particular relates to an IGBT substrate fixing clamp. Background Technology
[0002] In the plating immersion process of IGBT substrate manufacturing (such as electrochemical gold plating and nickel plating to improve the performance of the electrode area), the substrate is mostly a ceramic-metal composite structure, which has the characteristics of structural heterogeneity (ceramics are brittle and have a large difference in thermal expansion coefficient with metals, and are prone to warping and cracking due to thermal stress without fixation), diverse size and shape (size and irregular structure cause floating and air bubbles to be trapped when not fixed), and high surface precision and cleanliness requirements (traditional simple fixation is easy to scratch or leave contaminants). In addition, the plating immersion has strict requirements for uniformity and conductivity (without fixation, it will cause uneven current, incomplete plating and other defects). At the same time, mass production needs to ensure efficiency and consistency. Traditional fixation methods cannot meet the requirements. Therefore, special fixing fixtures must be used to fix the substrate to avoid damage to the substrate, ensure the quality of the plating, and adapt to the process and production requirements.
[0003] When performing plating operations on IGBT substrates, traditional methods make it difficult to ensure that the IGBT substrate remains in a stable position throughout the plating process. The lack of effective positioning measures in the past has made it easy for the substrate to shift position, which can cause serious problems such as uneven plating and inconsistent thickness, greatly affecting the plating quality and thus reducing the performance and quality of the IGBT substrate. Utility Model Content
[0004] The purpose of this utility model is to provide an IGBT substrate fixing fixture. By setting up a positioning mechanism, it solves the problem that when performing plating operations on IGBT substrates, it is difficult to ensure that the IGBT substrate maintains a stable position during the plating process using traditional methods. In the past, the lack of effective positioning measures made the substrate prone to positional displacement, which would cause serious problems such as uneven plating and inconsistent thickness.
[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model is an IGBT substrate fixing fixture, including a base plate and an IGBT substrate, wherein the base plate is provided with a positioning mechanism and a limiting mechanism; The positioning mechanism is located on the top of the base plate and is used to lock the position of the IGBT substrate. The limiting mechanism is located inside the positioning mechanism and is used to prevent the position of the IGBT substrate from loosening. The positioning mechanism includes four columns fixedly connected to the top of the base plate. Three connecting rings are fixedly connected to the outer walls of the four columns. Each of the four columns has a fixing ring fixedly connected to its outer wall. Each of the four columns has a clamping plate slidably connected to its outer wall. Each pair of clamping plates is symmetrical to each other. Each of the clamping plates has a hook fixedly connected to it. Each of the four hooks contacts the inner wall of one of the four slots on the IGBT substrate.
[0006] Furthermore, the outer walls of the four columns are all wound with springs, one end of the spring is fixedly connected to the fixing ring, and the other end of the spring is fixedly connected to the clamping plate. The springs are always in a compressed state.
[0007] Furthermore, the four columns and three connecting rings form an integral frame and are fixedly installed on the top of the base plate, with several IGBT substrates symmetrically and evenly distributed on the front and rear sides of the frame.
[0008] Furthermore, the limiting mechanism includes a fixed rod fixedly connected between two connecting rings, and the two fixed rods are symmetrically distributed inside the connecting rings.
[0009] Furthermore, an adjusting rod is rotatably connected to the top of the base plate, and the adjusting rod is located at the top center of the base plate and coincides with the central axis of the connecting ring.
[0010] Furthermore, the adjusting rod has three bidirectional threaded grooves, which are arranged in a row on the outer wall of the adjusting rod.
[0011] Furthermore, the inner walls of the corresponding bidirectional threaded grooves are each threaded with two clamping plates, and the two fixing rods slide through several clamping plates.
[0012] Furthermore, slots are provided on the sides of the two clamps that are close to each other, and the clamps are in contact with the inner walls of the slots respectively.
[0013] This utility model has the following beneficial effects: 1. By incorporating a positioning mechanism, when multiple IGBT substrates need to be plated, two corresponding clamps can be pulled to activate multiple springs. This causes multiple hooks to align with and pass through the slots on the IGBT substrates. After releasing the clamps, the hooks, under the rebound force of the springs, firmly adhere to the inner walls of the slots, positioning the multiple IGBT substrates. This ensures that the IGBT substrates maintain a stable position during the plating process, avoiding uneven plating and inconsistent thickness caused by positional shifts. This lays a solid foundation for high-quality plating results and guarantees the stability and reliability of the entire device during actual operation.
[0014] 2. By setting up a limiting mechanism, under the limiting action of two fixed rods, the torsion adjusting rod drives the two clamping plates to move away from or towards each other on the bidirectional threaded groove, thereby enabling the two clamping plates to contact the inner wall of the groove. The limiting spring rebounds, further improving the stability of the IGBT substrate after fixation. The limiting mechanism and the positioning mechanism work together to enhance the overall limiting effect and also play a key role in buffering and fine-tuning in the whole system, ensuring that the limiting operation is more accurate and reliable. From different levels, it ensures the positional accuracy and stability of the IGBT substrate in the entire manufacturing process, and together provides solid and powerful support for the processing of the IGBT substrate.
[0015] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description
[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the positioning mechanism of this utility model; Figure 3 for Figure 1 Enlarged structural diagram at point A; Figure 4 for Figure 2 A magnified structural diagram at point B in the middle.
[0018] The attached diagram lists the components represented by each number as follows: 1. Base plate; 2. Positioning mechanism; 3. Limiting mechanism; 4. IGBT substrate; 21. Column; 22. Connecting ring; 23. Fixing ring; 24. Clamping plate; 25. Hook; 26. Spring; 31. Fixing rod; 32. Adjusting rod; 33. Bidirectional threaded groove; 34. Clamping plate; 35. Clamping slot. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0020] Please see Figure 1-4 As shown, this utility model is an IGBT substrate fixing fixture, including a base plate 1 and an IGBT substrate 4. The base plate 1 is provided with a positioning mechanism 2 and a limiting mechanism 3. The positioning mechanism 2 is located on the top of the base plate 1 and is used to lock the position of the IGBT substrate 4. The limiting mechanism 3 is located inside the positioning mechanism 2 and is used to prevent the IGBT substrate 4 from becoming loose. The positioning mechanism 2 includes four columns 21 fixedly connected to the top of the base plate 1. Three connecting rings 22 are fixedly connected to the outer wall of the four columns 21. Fixing rings 23 are fixedly connected to the outer wall of each of the four columns 21. Clamping plates 24 are slidably connected to the outer wall of each of the four columns 21. Corresponding clamping plates 24 are symmetrical to each other. Several clamping plates Each of the four pillars 21 is fixedly connected with a hook 25, and the four hooks 25 respectively contact the inner wall of the four slots on the IGBT substrate 4. The outer wall of each of the four pillars 21 is wrapped with a spring 26. One end of the spring 26 is fixedly connected to the fixing ring 23, and the other end of the spring 26 is fixedly connected to the clamping plate 24. The spring 26 is always in a compressed state. The four pillars 21 and the three connecting rings 22 form an integral frame and are fixedly installed on the top of the base plate 1. Several IGBT substrates 4 are symmetrically and evenly distributed on the front and rear sides of the frame.
[0021] The limiting mechanism 3 includes a fixed rod 31 fixedly connected between two connecting rings 22. The two fixed rods 31 are symmetrically distributed inside the connecting rings 22. An adjusting rod 32 is rotatably connected to the top of the base plate 1. The adjusting rod 32 is located at the top center of the base plate 1 and coincides with the central axis of the connecting rings 22. The adjusting rod 32 has three bidirectional threaded grooves 33. The three bidirectional threaded grooves 33 are arranged in a row on the outer wall of the adjusting rod 32. The inner wall of each bidirectional threaded groove 33 is threaded with two clamping plates 34. The two fixed rods 31 slide through several clamping plates 34. The two clamping plates 24 have slots 35 on their adjacent sides. The slots 34 contact the inner walls of the slots 35 respectively.
[0022] One specific application of this embodiment is as follows: By setting up the positioning mechanism 2, when multiple IGBT substrates 4 need to be plated, the corresponding two clamps 24 can be pulled to pull multiple springs 26, so that multiple hooks 25 correspond to the slots on the IGBT substrates 4 and pass through the slots. After the two clamps 24 are released, the multiple hooks 25 can be tightly attached to the inner wall of the multiple slots under the action of the rebound force of the springs 26 to position the multiple IGBT substrates 4. This ensures that the IGBT substrates 4 always maintain a stable position during the plating process, avoiding problems such as uneven plating and inconsistent thickness caused by positional deviation. This lays a solid foundation for the subsequent high-quality plating effect, effectively improves the performance and quality of the IGBT substrates 4, and ensures the stability and reliability of the overall device in actual operation. By setting a limiting mechanism 3, under the limiting action of two fixed rods 31, the torsion adjusting rod 32 drives the two clamping plates 34 to move away from or towards each other on the bidirectional threaded groove 33, thereby enabling the two clamping plates 34 to contact the inner wall of the groove 35. The limiting spring 26 rebounds, further improving the stability of the IGBT substrate 4 after it is fixed. The limiting mechanism 3 and the positioning mechanism 2 work together to enhance the overall limiting effect and also play a key role in buffering and fine-tuning in the whole system, ensuring that the limiting operation is more accurate and reliable. From different levels, they ensure the positional accuracy and stability of the IGBT substrate 4 in the whole manufacturing process, and together provide solid and powerful support for the processing of the IGBT substrate 4.
[0023] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0024] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.
Claims
1. An IGBT substrate fixing fixture, characterized in that: It includes a base plate (1) and an IGBT substrate (4), wherein the base plate (1) is provided with a positioning mechanism (2) and a limiting mechanism (3); The positioning mechanism (2) is set on the top of the base plate (1) to lock the position of the IGBT substrate (4). The limiting mechanism (3) is set inside the positioning mechanism (2) to prevent the position of the IGBT substrate (4) from loosening. The positioning mechanism (2) includes four columns (21) fixedly connected to the top of the base plate (1). Three connecting rings (22) are fixedly connected to the outer wall of the four columns (21). A fixing ring (23) is fixedly connected to the outer wall of each of the four columns (21). A clamping plate (24) is slidably connected to the outer wall of each of the four columns (21). The corresponding two clamping plates (24) are symmetrical to each other. Hooks (25) are fixedly connected to several clamping plates (24). The corresponding four hooks (25) are respectively in contact with the inner wall of the four slots on the IGBT substrate (4).
2. The IGBT substrate fixing fixture according to claim 1, characterized in that, The outer walls of the four columns (21) are all wrapped with springs (26). One end of the spring (26) is fixedly connected to the fixing ring (23), and the other end of the spring (26) is fixedly connected to the clamp (24). The spring (26) is always in a compressed state.
3. The IGBT substrate fixing fixture according to claim 2, characterized in that, The four columns (21) and three connecting rings (22) form an integral frame and are fixedly installed on the top of the base plate (1). Several IGBT substrates (4) are symmetrically and evenly distributed on the front and rear sides of the frame.
4. The IGBT substrate fixing fixture according to claim 3, characterized in that, The limiting mechanism (3) includes a fixing rod (31) fixedly connected between two connecting rings (22), and the two fixing rods (31) are symmetrically distributed inside the connecting rings (22).
5. The IGBT substrate fixing fixture according to claim 4, characterized in that, An adjusting rod (32) is rotatably connected to the top of the base plate (1). The adjusting rod (32) is located at the top center of the base plate (1) and coincides with the central axis of the connecting ring (22).
6. The IGBT substrate fixing fixture according to claim 5, characterized in that, The adjusting rod (32) has three bidirectional threaded grooves (33), which are arranged in a row on the outer wall of the adjusting rod (32).
7. The IGBT substrate fixing fixture according to claim 6, characterized in that, The inner wall of the corresponding bidirectional threaded groove (33) is threadedly connected to two clamping plates (34), and the two fixing rods (31) slide through several clamping plates (34).
8. The IGBT substrate fixing fixture according to claim 7, characterized in that, Each of the two clamping plates (24) has a slot (35) on one side that is close to each other, and the several clamping plates (34) respectively contact the inner wall of the several slots (35).