Electroplating solution circulation filter

Abstract

The utility model discloses a kind of electroplating liquid circulation filtering devices, including main body, collection mechanism, pretreatment mechanism and reduction mechanism, the collection mechanism includes collection piece and control valve, the pretreatment mechanism includes filter frame and mounting bracket, the reduction mechanism includes reduction box and electrolyzer, under the mutual cooperation of above mechanism, this device can effectively intercept and filter flocculate can effectively remove suspended impurities and solid particles in electroplating liquid, keep liquid clean, help to reduce electroplating defects, such as uneven deposition, bubble inclusion etc., in addition, the flocculate of this device regular cleaning interception helps to keep the operating efficiency of filter and system, avoid blockage or excessive pollution, so as to ensure that the quality of electroplating liquid is kept stable continuously.

Description

Technical Field

[0001] This utility model relates to the field of electroplating solution treatment technology, specifically to an electroplating solution circulation filtration device. Background Technology

[0002] Electroplating solution circulation filtration devices are used in the electroplating industry to filter, purify, and recycle electroplating solutions. During use, electroplating solutions are constantly contaminated with substances such as metal ions and impurity particles. These contaminants can affect the quality of electroplating, so a filtration system is needed to maintain the cleanliness and stability of the electroplating solution.

[0003] In traditional equipment, without effective interception and filtration functions, impurities in the electroplating solution may affect the uniformity and quality of electroplating deposition, leading to problems such as defects, bubbles, and roughness in the electroplated layer.

[0004] Secondly, if the filter does not have a convenient function for cleaning fibrous material, the cleaning work may be more cumbersome and time-consuming, leading to increased equipment downtime and affecting production efficiency.

[0005] Finally, without an electrolytic cell to remove metal ions, the concentration of metal ions in the electroplating solution may gradually increase, leading to instability of the electroplating solution and even affecting the subsequent electroplating process and quality. Utility Model Content

[0006] Technical problems to be solved In view of the shortcomings of the prior art, this utility model provides an electroplating solution circulation filtration device to solve the technical problems mentioned in the background art.

[0007] (II) Technical Solution To achieve the above objectives, this utility model provides the following technical solution: an electroplating solution circulating filtration device, comprising a main body, a collection mechanism, a pretreatment mechanism, and a reduction mechanism. The collection mechanism includes a collection component and a control valve. The collection component is fixedly installed at the bottom of the main body, and the control valve is fixedly installed on the collection component. A water pump is installed at the bottom of the main body, and the water pump is fixedly connected to the collection component. The pretreatment mechanism includes a filter frame and a mounting frame. One end of the filter frame is fixedly connected to the water pump, and the mounting frame is connected to the filter frame. A fixing block is installed on the mounting frame, and a first spring is provided on the fixing block. The fixing block is slidably connected to the mounting frame and connected to the filter frame.

[0008] Preferably, the reduction mechanism includes a reduction box and an electrolyzer. One end of the filter frame is fixedly connected to the reduction box. The electrolyzer is installed on the reduction box and is connected to the reduction box in cooperation. A positioning component is installed on the reduction box. A second spring is provided on the positioning component. The positioning component is connected to both the reduction box and the electrolyzer in cooperation.

[0009] In a further preferred embodiment, the filter frame is provided with a support frame, and a mating component is installed on the support frame. The mating component is rotatably connected to the support frame to facilitate the delivery of liquid.

[0010] In a further preferred embodiment, the filter frame is provided with fixing holes, the mounting frame is equipped with an interceptor, the interceptor is connected to the mounting frame, and the fixing block is connected to the fixing holes, so as to facilitate the fixing of the position of the mounting frame.

[0011] In a further preferred embodiment, the filter frame is provided with a sealing groove, and the mounting frame is provided with a sealing gasket, the sealing gasket being connected to the sealing groove to facilitate stable operation of the device.

[0012] In a further preferred embodiment, the electrolyzer is provided with a support plate, the support plate is provided with positioning holes, and the positioning element is connected to the positioning holes to facilitate the fixation of the position of the electrolyzer.

[0013] In a further preferred embodiment, the electrolyzer is provided with electrolysis plates arranged in a linear array on the electrolyzer, and the reduction tank is provided with support grooves, with the support plates cooperating and connecting with the support grooves to facilitate the installation and fixation of the electrolyzer.

[0014] In a further preferred embodiment, the reduction chamber is equipped with an exhaust pipe and a water return pipe to facilitate the discharge of byproducts during the reaction.

[0015] (III) Beneficial Effects Compared with the prior art, the present invention provides an electroplating solution circulation filtration device, which has the following beneficial effects: By setting up a collection mechanism, this device can effectively intercept and filter flocculent matter through the coordinated action of the collection components and control valves. It can effectively remove suspended impurities and solid particles from the electroplating solution, keep the liquid clean, and help reduce electroplating defects such as uneven deposition and bubble inclusions.

[0016] By setting up a pretreatment mechanism, and with the cooperation of components such as the filter frame and the mounting frame, this device regularly cleans the intercepted flocculent matter, which helps maintain the operating efficiency of the filter and the system, avoids clogging or excessive pollution, and thus ensures that the quality of the electroplating solution remains stable.

[0017] In this invention, by setting up a reduction mechanism, under the cooperative action of components such as the reduction box and the electrolyzer, this device can reduce excess metal ions in the electroplating solution into metal and deposit them through the electrolytic action of the external electrolytic cell, thus avoiding the impact of excessive metal ion concentration on the electroplating quality. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of an electroplating solution circulation filtration device according to the present invention; Figure 2 This is a schematic diagram of the overall structure of this utility model from another angle; Figure 3 This is a cross-sectional view of the internal structure of the restoration box in this utility model; Figure 4 This is an exploded view of the pretreatment mechanism in this utility model; Figure 5 This is an exploded view of the reduction mechanism in this utility model.

[0019] In the diagram: 1. Main body; 2. Collector; 3. Control valve; 4. Water pump; 5. Filter frame; 6. Mounting frame; 7. Fixing block; 8. First spring; 9. Reduction box; 10. Electrolyzer; 11. Positioning component; 12. Second spring; 13. Support frame; 14. Fitting component; 15. Fixing hole; 16. Interceptor; 17. Sealing groove; 18. Sealing gasket; 19. Support plate; 20. Positioning hole; 21. Electrolysis plate; 22. Support groove; 23. Exhaust pipe; 24. Return water pipe. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1: Please see Figures 1-5 An electroplating solution circulating filtration device includes a main body 1, a collection mechanism, a pretreatment mechanism, and a reduction mechanism. The collection mechanism includes a collection component 2 and a control valve 3. The collection component 2 is fixedly installed at the bottom of the main body 1, and the control valve 3 is fixedly installed on the collection component 2. A water pump 4 is installed at the bottom of the main body 1 and is fixedly connected to the collection component 2. The pretreatment mechanism includes a filter frame 5 and a mounting frame 6. One end of the filter frame 5 is fixedly connected to the water pump 4, and the mounting frame 6 is connected to the filter frame 5. A fixing block 7 is installed on the mounting frame 6, and a first spring 8 is provided on the fixing block 7. The fixing block 7 is slidably connected to the mounting frame 6 and is connected to the filter frame 5.

[0022] In this embodiment, the collection mechanism includes a collection component 2 and a control valve 3. When in use, after the electroplating solution inside the main body 1 has been used up, the control valve 3 installed at the bottom of the collection component 2 is opened, so that the electroplating solution can be directly connected to the water pump 4 in the collection component 2, and the water pump 4 starts to run and directly transmits the electroplating solution to the filter frame 5.

[0023] In this embodiment, the pretreatment mechanism includes a filter frame 5 and a mounting frame 6. After the flocculent matter in the electroplating solution enters the main body 1, the mating part 14 rotates directly in the support frame 13 under force, allowing the electroplating solution to enter the filter frame 5 more smoothly. When the electroplating solution passes through the mounting frame 6 of the filter frame 5, the interceptor 16 installed in the mounting frame 6 intercepts the flocculent matter in the electroplating solution, facilitating the filtration of the flocculent matter. Subsequently, during cleaning, the fixing block 7 on the mounting frame 6 is pressed directly, allowing the fixing block 7 to slide in the mounting frame 6 and compress the first spring 8. The fixing block 7 then directly disengages from the fixing hole 15, facilitating the removal of the mounting frame 6. The interceptor 16 can then be removed from the mounting frame 6.

[0024] In this embodiment, the reduction mechanism includes a reduction tank 9 and an electrolyzer 10. In use, after the electroplating solution enters the reduction tank 9 through the filter frame 5, the electrolyzer 10 installed on the reduction tank 9 is directly driven, so that the metal ions react and are reduced on the electrolysis plate 21. When reducing different metal ions, different types of electrolyzers 10 can be replaced. At this time, the positioning member 11 can be pulled directly, so that the positioning member 11 can slide on the reduction tank 9 and directly squeeze the second spring 12. The positioning member 11 also directly disengages from the positioning hole 20. The support plate 19 on the electrolyzer 10 also disengages from the support groove 22 on the reduction tank 9 at the same time. The gas generated by the reaction in the reduction tank 9 flows into a special gas treatment device through the exhaust pipe 23. After the reaction is completed, the solution is also re-entered into the main body 1 through the return water pipe 24 by other external water pumps 4 to complete the circulation.

[0025] Example 2: In summary, during use, firstly, after the electroplating solution inside the main body 1 is used up, the control valve 3 installed at the bottom of the collection component 2 opens, allowing the electroplating solution to be directly connected to the water pump 4 in the collection component 2. The water pump 4 then starts running, directly transferring the electroplating solution to the filter frame 5. When flocculent matter in the electroplating solution enters the main body 1, the mating component 14 is subjected to force and rotates directly in the support frame 13, allowing the electroplating solution to flow more smoothly into the filter frame 5. When the electroplating solution passes through the mounting frame 6 of the filter frame 5, the interceptor 16 installed in the mounting frame 6 intercepts the flocculent matter in the electroplating solution, facilitating the filtration of the flocculent matter. Subsequently, during cleaning, the fixing block 7 on the mounting frame 6 is pressed directly, allowing the fixing block 7 to slide in the mounting frame 6 and compress the first spring 8. The fixing block 7 then directly disengages from the fixing hole 15, facilitating the installation of the mounting frame 6. After the interceptor 16 is removed, it can be taken out of the mounting frame 6. Then, when the electroplating solution enters the reduction box 9 through the filter frame 5, the electrolyzer 10 installed on the reduction box 9 is directly driven, so that the metal ions react and are reduced on the electrolysis plate 21. When reducing different metal ions, different types of electrolyzers 10 can be replaced. At this time, the positioning part 11 can be pulled directly, so that the positioning part 11 can slide on the reduction box 9 and directly squeeze the second spring 12. The positioning part 11 also directly disengages from the positioning hole 20. The support plate 19 on the electrolyzer 10 also disengages from the support groove 22 on the reduction box 9 at the same time. The gas generated by the reaction in the reduction box 9 flows into the special gas treatment device through the exhaust pipe 23. After the reaction is completed, the solution is also re-entered into the main body 1 through the return water pipe 24 by other external water pumps 4 to complete the circulation.

[0026] Of all the solutions mentioned above, those involving the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

Claims

1. An electroplating solution circulating filtration device, comprising a main body (1), a collection mechanism, a pretreatment mechanism, and a reduction mechanism, characterized in that, The collection mechanism includes a collection component (2) and a control valve (3). The collection component (2) is fixedly installed at the bottom of the main body (1). The control valve (3) is fixedly installed on the collection component (2). A water pump (4) is installed at the bottom of the main body (1). The water pump (4) is fixedly connected to the collection component (2). The pretreatment mechanism includes a filter frame (5) and a mounting frame (6). One end of the filter frame (5) is fixedly connected to the water pump (4). The mounting frame (6) is connected to the filter frame (5). A fixing block (7) is installed on the mounting frame (6). A first spring (8) is provided on the fixing block (7). The fixing block (7) is slidably connected to the mounting frame (6) and connected to the filter frame (5).

2. The electroplating solution circulating filtration device according to claim 1, characterized in that: The reduction mechanism includes a reduction box (9) and an electrolyzer (10). One end of the filter frame (5) is fixedly connected to the reduction box (9). The electrolyzer (10) is installed on the reduction box (9) and is connected to the reduction box (9). A positioning component (11) is installed on the reduction box (9). A second spring (12) is provided on the positioning component (11). The positioning component (11) is connected to the reduction box (9) and the electrolyzer (10) respectively.

3. The electroplating solution circulating filtration device according to claim 2, characterized in that: The filter frame (5) is provided with a support frame (13), and a mating part (14) is installed on the support frame (13). The mating part (14) is rotatably connected to the support frame (13).

4. The electroplating solution circulating filtration device according to claim 1, characterized in that: The filter frame (5) is provided with a fixing hole (15), the mounting frame (6) is provided with an interceptor (16), the interceptor (16) is connected to the mounting frame (6), and the fixing block (7) is connected to the fixing hole (15).

5. The electroplating solution circulating filtration device according to claim 4, characterized in that: The filter frame (5) is provided with a sealing groove (17), and the mounting frame (6) is provided with a sealing gasket (18). The sealing gasket (18) is connected to the sealing groove (17).

6. The electroplating solution circulating filtration device according to claim 2, characterized in that: The electrolyzer (10) is provided with a support plate (19), and the support plate (19) is provided with a positioning hole (20). The positioning element (11) is connected to the positioning hole (20).

7. The electroplating solution circulating filtration device according to claim 6, characterized in that: Electrolysis plates (21) are provided on the electrolyzer (10), and the electrolysis plates (21) are arranged in a linear array on the electrolyzer (10). A support groove (22) is provided on the reduction box (9), and the support plate (19) is connected to the support groove (22).

8. The electroplating solution circulating filtration device according to claim 7, characterized in that: The reduction box (9) is equipped with an exhaust pipe (23) and a water return pipe (24).

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