Semiconductor etching liquid centralized supply system

Abstract

The utility model relates to a semiconductor etching liquid centralized liquid supply system belongs to semiconductor etching equipment technical field, including etching pool, the top fixed mounting of etching pool has the support side plate, the top fixed mounting of support side plate has two support vertical board, the top fixed mounting of support vertical board has the support top plate, the inner bottom wall fixed mounting of etching pool has double -acting distribution pipe, double -acting distribution pipe includes the mounting block fixed mounting in the inner bottom wall of etching pool, the top fixed mounting of mounting block has annular distribution pipe. The semiconductor etching liquid centralized liquid supply system, through setting up annular distribution pipe in the inside of etching pool, setting up distribution cross -pipe in the inside of annular distribution pipe, setting up shower head on annular distribution pipe and distribution cross -pipe, respectively accessing etching liquid and clean water in annular distribution pipe, spraying from below through shower head, etching and cleaning to semiconductor, prompting semiconductor etching efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor etching equipment technology, specifically a centralized supply system for semiconductor etching solution. Background Technology

[0002] Semiconductor etching solutions are key chemical reagents for pattern transfer in semiconductor manufacturing. They precisely transfer the patterns defined by photoresist to metallized circuits by etching the metal, non-metal, or metal oxide materials on the wafer surface. Their compositions vary; for example, acidic etching solutions contain phosphoric acid and hydrofluoric acid, alkaline etching solutions contain ammonia, and buffered oxide etching solutions are a mixture of hydrofluoric acid and ammonium fluoride. As process nodes shrink to below 3nm, the requirements for the selectivity, uniformity, and environmental friendliness of etching solutions are increasing, driving the development of new technologies such as plasma etching and atomic layer etching, as well as green chemical solutions.

[0003] Utility model patent CN218447833U discloses a semiconductor etching device, including an etching solution tank, a support frame, and a top plate. The support frame is installed on the upper sides of both ends of the etching solution tank, and the top plate is installed on the upper end of the support frame. It also includes a multi-angle drying assembly for drying the etched semiconductor. The multi-angle drying assembly is installed on the support frame and the top plate, and includes a motor and a heating rod. The motor is installed on the outer side of the support frame. The beneficial effects of this utility model are: by placing the semiconductor between two sets of rotatable support plates, and then automatically immersing the semiconductor in the etching solution for etching, and automatically removing it after etching, the etching solution is heated by the heating rod to accelerate the etching of the semiconductor. A fan blows the heat from the heating rod onto the semiconductor, while the support plate drives the semiconductor to rotate and blow air, thus improving the drying efficiency of the semiconductor.

[0004] However, in common etching solution supply systems, only the etching solution is usually supplied. After etching, the semiconductor needs to be moved to a cleaning tank for cleaning, which requires more space. Therefore, a centralized semiconductor etching solution supply system is proposed to solve the problems mentioned above. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a centralized semiconductor etching solution supply system, which has the advantages of shared distribution pipelines for etching and cleaning semiconductors, thus solving the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A centralized supply system for semiconductor etching solution includes an etching tank, a supporting side plate fixedly installed on the top of the etching tank, two supporting vertical plates fixedly installed on the top of the supporting side plate, a supporting top plate fixedly installed on the top of the supporting vertical plate, and a double-acting distribution pipe fixedly installed on the inner bottom wall of the etching tank.

[0008] The dual-action distribution pipe includes a mounting block fixedly installed on the bottom wall of the etching pool. An annular distribution pipe is fixedly installed on the top of the mounting block, and a distribution horizontal pipe is fixedly installed on the inner side wall of the annular distribution pipe. A nozzle is fixedly installed on the top of both the annular distribution pipe and the distribution horizontal pipe. An etching inlet pipe and a cleaning inlet pipe are fixedly installed on the two opposite inner side walls of the etching pool, respectively. The etching inlet pipe and the cleaning inlet pipe are respectively connected to the annular distribution pipe. An etching valve is fixedly installed on the surface of the etching inlet pipe, and a cleaning valve is fixedly installed on the surface of the cleaning inlet pipe.

[0009] Furthermore, a lifting cylinder is fixedly installed on the top of the supporting top plate, a lifting top plate is fixedly installed on the movable end of the lifting cylinder, and two lifting vertical plates are fixedly installed on the bottom of the lifting top plate.

[0010] Furthermore, a lifting side plate is fixedly installed at the bottom of the lifting platform, a placement mesh frame is fixedly installed at the bottom of the lifting side plate, and an isolation mesh plate is fixedly installed on the inner side wall of the placement mesh frame.

[0011] Furthermore, mounting base plates are fixedly installed on both sides of the etching pool that are far apart from each other. An etching solution tank is fixedly installed on the top of one of the mounting base plates, and a cleaning water tank is fixedly installed on the top of the other mounting base plate.

[0012] Furthermore, an inlet valve is fixedly installed on the top of both the etching solution tank and the cleaning water tank, and a drain valve is fixedly installed on one side of both the etching solution tank and the cleaning water tank.

[0013] Furthermore, an input pump is fixedly installed on the top of the mounting base plate. The input ends of the two input pumps are respectively connected to the etching inlet pipe and the cleaning inlet pipe. The output ends of the two input pumps are fixedly installed with connecting pipes, which are respectively connected to the etching solution tank and the cleaning water tank.

[0014] Furthermore, a mounting plate is fixedly installed on one side of both the etching solution tank and the cleaning water tank. A drain pump is fixedly installed on the top of the mounting plate. A suction pipe is fixedly installed at the input end of the drain pump. One end of each suction pipe is connected to the etching solution tank and the cleaning water tank, respectively. A return pipe is fixedly installed at the output end of the drain pump. The two return pipes are connected to the etching solution tank and the cleaning water tank, respectively.

[0015] Furthermore, overflow pipes are fixedly installed between the etching solution tank and the etching pool, as well as between the cleaning water tank and the etching pool, and overflow valves are fixedly installed on the surface of the overflow pipes.

[0016] Compared with the prior art, the present invention provides a centralized supply system for semiconductor etching solution, which has the following advantages:

[0017] This centralized semiconductor etching solution supply system uses an annular distribution pipe inside the etching tank, a horizontal distribution pipe inside the annular distribution pipe, and nozzles on both the annular and horizontal distribution pipes. Etching solution and clean water are respectively introduced into the annular distribution pipe and sprayed out from below through the nozzles to etch and clean the semiconductor, improving the semiconductor etching efficiency. This solves the problem in common etching solution supply systems that typically only deliver etching solution, and after etching, the semiconductor still needs to be moved to a cleaning tank for cleaning, which takes up more space. Attached Figure Description

[0018] Figure 1 This is a front sectional view of the present invention;

[0019] Figure 2 This is a front sectional view of the mesh frame of this utility model;

[0020] Figure 3 This is a top view of the annular distribution tube of this utility model;

[0021] Figure 4 A three-dimensional view of the mesh frame for this utility model.

[0022] In the diagram: 1. Etching tank; 2. Supporting side plate; 3. Supporting vertical plate; 4. Supporting top plate; 5. Mounting block; 6. Annular distribution pipe; 7. Distribution horizontal pipe; 8. Nozzle; 9. Etching inlet pipe; 10. Etching valve; 11. Cleaning inlet pipe; 12. Cleaning valve; 13. Lifting cylinder; 14. Lifting top plate; 15. Lifting vertical plate; 16. Lifting side plate; 17. Placement frame; 18. Isolation mesh plate; 19. Mounting base plate; 20. Etching solution tank; 21. Cleaning water tank; 22. Inlet valve; 23. Drain valve; 24. Input pump; 25. Connecting pipe; 26. Mounting horizontal plate; 27. Drain pump; 28. Suction pipe; 29. ​​Return pipe; 30. Overflow pipe; 31. Overflow valve. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1 to 4 The semiconductor etching solution centralized supply system in this embodiment includes an etching pool 1, a supporting side plate 2 fixedly installed on the top of the etching pool 1, two supporting upright plates 3 fixedly installed on the top of the supporting side plate 2, a supporting top plate 4 fixedly installed on the top of the supporting upright plates 3, and a double-acting distribution pipe fixedly installed on the inner bottom wall of the etching pool 1.

[0025] The dual-action distribution pipe includes a mounting block 5 fixedly installed on the bottom wall of the etching pool 1. An annular distribution pipe 6 is fixedly installed on the top of the mounting block 5. A distribution horizontal pipe 7 is fixedly installed on the inner side wall of the annular distribution pipe 6. A nozzle 8 is fixedly installed on the top of both the annular distribution pipe 6 and the distribution horizontal pipe 7. An etching inlet pipe 9 and a cleaning inlet pipe 11 are fixedly installed on the two opposite inner side walls of the etching pool 1, respectively. The etching inlet pipe 9 and the cleaning inlet pipe 11 are respectively connected to the annular distribution pipe 6. An etching valve 10 is fixedly installed on the surface of the etching inlet pipe 9, and a cleaning valve 12 is fixedly installed on the surface of the cleaning inlet pipe 11.

[0026] Specifically, during etching, the cleaning valve 12 is closed, etching solution is introduced into the etching inlet pipe 9, and the etching solution is sprayed from the nozzle 8 from bottom to top to etch the semiconductor. After etching is completed and the etching solution is discharged, the etching valve 10 is closed, and clean water is introduced into the cleaning inlet pipe 11. The clean water is sprayed from the nozzle 8 from bottom to top to clean the semiconductor.

[0027] Please see Figure 1 and Figure 2 In this embodiment, a lifting cylinder 13 is fixedly installed on the top of the supporting top plate 4, a lifting top plate 14 is fixedly installed on the movable end of the lifting cylinder 13, and two lifting upright plates 15 are fixedly installed on the bottom of the lifting top plate 14.

[0028] The lifting plate 15 has a lifting side plate 16 fixedly installed at its bottom, and a placement frame 17 is fixedly installed at its bottom. An isolation mesh plate 18 is fixedly installed on the inner side wall of the placement frame 17. The lifting cylinder 13 drives the placement frame 17 to move up and down, placing the semiconductor into the placement frame 17. The semiconductor then follows the placement frame 17 into the etching bath 1 for processing.

[0029] Please see Figure 1 In this embodiment, mounting base plates 19 are fixedly installed on both sides of the etching pool 1 that are far apart from each other. An etching liquid tank 20 is fixedly installed on the top of one mounting base plate 19, and a cleaning water tank 21 is fixedly installed on the top of the other mounting base plate 19.

[0030] The top of both the etching solution tank 20 and the cleaning water tank 21 is fixedly equipped with an inlet valve 22, and the side of both the etching solution tank 20 and the cleaning water tank 21 is fixedly equipped with a drain valve 23.

[0031] Secondly, input pumps 24 are fixedly installed on the top of the mounting base plate 19. The input ends of the two input pumps 24 are connected to the etching inlet pipe 9 and the cleaning inlet pipe 11, respectively. The output ends of the two input pumps 24 are fixedly installed with connecting pipes 25, which are connected to the etching solution tank 20 and the cleaning water tank 21, respectively. Etching solution is added to the etching solution tank 20, and clean water is added to the cleaning water tank 21. The etching solution or clean water is then pumped into the annular distribution pipe 6 and the distribution horizontal pipe 7 by the input pumps 24.

[0032] Meanwhile, mounting plates 26 are fixedly installed on one side of both the etching solution tank 20 and the cleaning water tank 21. A drain pump 27 is fixedly installed on the top of the mounting plate 26. A suction pipe 28 is fixedly installed at the input end of the drain pump 27, with one end of each suction pipe 28 connected to the etching solution tank 20 and the cleaning water tank 21, respectively. A return pipe 29 is fixedly installed at the output end of the drain pump 27, with both return pipes 29 connected to the etching solution tank 20 and the cleaning water tank 21, respectively. After etching and cleaning are completed, the drain pump 27 draws the etching solution or clean water into the etching solution tank 20 or the cleaning water tank 21.

[0033] An overflow pipe 30 is fixedly installed between the etching solution tank 20 and the etching pool 1, and between the cleaning water tank 21 and the etching pool 1. An overflow valve 31 is fixedly installed on the surface of the overflow pipe 30. When the etching solution and clean water in the etching pool 1 are higher than the overflow pipe 30, they flow back from the overflow pipe 30 to the etching solution tank 20 or the cleaning water tank 21, so that the etching solution and clean water circulate and improve the etching and cleaning effect.

[0034] The working principle of the above embodiment is as follows: Etching solution is added to etching solution tank 20 and clean water is added to cleaning water tank 21. Etching solution or clean water is introduced into annular distribution pipe 6 and distribution horizontal pipe 7 through input pump 24. During etching, cleaning valve 12 is closed and etching solution is sprayed from nozzle 8 from bottom to top to etch semiconductor. After etching is completed, etching solution is discharged and etching valve 10 is closed. Clean water is sprayed from nozzle 8 from bottom to top to clean semiconductor. When the etching solution and clean water in etching pool 1 are higher than overflow pipe 30, they flow back from overflow pipe 30 to etching solution tank 20 or cleaning water tank 21, so that etching solution and clean water circulate.

[0035] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods, and any method that achieves the desired beneficial effect can be implemented. Furthermore, all electrical components in this embodiment are electrically connected to the main controller and power supply. The main controller can be a conventional, known device such as a computer that performs control functions. Those skilled in the art can control the electrical components through simple programming, and the existing disclosed power connection technologies are common knowledge in the field. Therefore, this embodiment will not elaborate further on their specific structural composition and working principles.

[0036] It should be noted that the orientations or positional relationships indicated herein are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the purpose of facilitating the description of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A centralized supply system for semiconductor etching solution, comprising an etching tank (1), characterized in that: The top of the etching pool (1) is fixedly installed with a support side plate (2), the top of the support side plate (2) is fixedly installed with two support upright plates (3), the top of the support upright plates (3) is fixedly installed with a support top plate (4), and the inner bottom wall of the etching pool (1) is fixedly installed with a double-acting distribution pipe. The dual-action distribution pipe includes a mounting block (5) fixedly installed on the bottom wall of the etching pool (1). An annular distribution pipe (6) is fixedly installed on the top of the mounting block (5). A distribution horizontal pipe (7) is fixedly installed on the inner side wall of the annular distribution pipe (6). A nozzle (8) is fixedly installed on the top of both the annular distribution pipe (6) and the distribution horizontal pipe (7). An etching inlet pipe (9) and a cleaning inlet pipe (11) are fixedly installed on the two opposite inner side walls of the etching pool (1). The etching inlet pipe (9) and the cleaning inlet pipe (11) are respectively connected to the annular distribution pipe (6). An etching valve (10) is fixedly installed on the surface of the etching inlet pipe (9). A cleaning valve (12) is fixedly installed on the surface of the cleaning inlet pipe (11).

2. The centralized semiconductor etching solution supply system according to claim 1, characterized in that: A lifting cylinder (13) is fixedly installed on the top of the supporting top plate (4), a lifting top plate (14) is fixedly installed on the movable end of the lifting cylinder (13), and two lifting upright plates (15) are fixedly installed on the bottom of the lifting top plate (14).

3. The centralized semiconductor etching solution supply system according to claim 2, characterized in that: The bottom of the lifting plate (15) is fixedly installed with a lifting side plate (16), the bottom of the lifting side plate (16) is fixedly installed with a placement frame (17), and the inner side wall of the placement frame (17) is fixedly installed with an isolation mesh plate (18).

4. The centralized semiconductor etching solution supply system according to claim 1, characterized in that: The etching pool (1) is fixedly installed on two sides away from each other, with an etching liquid tank (20) fixedly installed on the top of one of the mounting base plates (19) and a cleaning water tank (21) fixedly installed on the top of the other mounting base plate (19).

5. The centralized semiconductor etching solution supply system according to claim 4, characterized in that: The top of the etching solution tank (20) and the cleaning water tank (21) are both fixedly equipped with inlet valves (22), and the side of the etching solution tank (20) and the cleaning water tank (21) are both fixedly equipped with drain valves (23).

6. The centralized semiconductor etching solution supply system according to claim 5, characterized in that: An input pump (24) is fixedly installed on the top of the mounting base plate (19). The input ends of the two input pumps (24) are connected to the etching inlet pipe (9) and the cleaning inlet pipe (11) respectively. The output ends of the two input pumps (24) are fixedly installed with connecting pipes (25). The two connecting pipes (25) are connected to the etching solution tank (20) and the cleaning water tank (21) respectively.

7. The centralized semiconductor etching solution supply system according to claim 6, characterized in that: A mounting plate (26) is fixedly installed on one side of both the etching solution tank (20) and the cleaning water tank (21). A drain pump (27) is fixedly installed on the top of the mounting plate (26). A suction pipe (28) is fixedly installed at the input end of the drain pump (27). One end of each suction pipe (28) is connected to the etching solution tank (20) and the cleaning water tank (21) respectively. A return pipe (29) is fixedly installed at the output end of the drain pump (27). The two return pipes (29) are connected to the etching solution tank (20) and the cleaning water tank (21) respectively.

8. The centralized semiconductor etching solution supply system according to claim 7, characterized in that: An overflow pipe (30) is fixedly installed between the etching solution tank (20) and the etching pool (1) and between the cleaning water tank (21) and the etching pool (1). An overflow valve (31) is fixedly installed on the surface of the overflow pipe (30).

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