Reinforced fiber cloth processing apparatus for electronic substrates
Patent Information
- Application Number
- CN202521879228.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-29
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-08-29
AI Technical Summary
[0003]本实用新型实施例的目的在于提供一种用于电子基板的增强纤维布加工设备,以解决现有技术中存在的增强纤维布在切割后会产生散边、飞丝等技术问题
[0017]本实用新型提供的用于电子基板的增强纤维布加工设备的有益效果在于:与现有技术相比,本实用新型用于电子基板的增强纤维布加工设备包括切割机构和封边机构,切割机构用于切割增强纤维布的尾边区域,封边机构对目标区域进行热封或者胶封,可有效抑制增强纤维的边缘解理、飞丝及毛边,提高布料边缘的一致性与耐机械牵拉性能,还可以防止切边区域散边的纱线等进入至下一工艺流程,降低污染风险,提高电路板的生产质量。
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Figure CN224918178U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of circuit board technology, and more specifically, it relates to a processing equipment for reinforcing fiber cloth for electronic substrates. Background Technology
[0002] As a key basic material for circuit boards, copper-clad laminates are typically composed of copper foil, electronic-grade reinforcing fiber cloth, resin, and fillers. The electronic-grade reinforcing fiber cloth, woven from warp and weft yarns, often develops a few millimeters of tail edge during weaving and heat setting. If this tail edge is not treated before the resin impregnation process, it can lead to problems such as fiber shedding, uneven resin impregnation, resin waste, and fluctuations in lamination thickness. Therefore, it is necessary to trim the tail edge. Traditional mechanical trimming methods, after removing the tail edge, often result in frayed edges and loose fibers at the cut edge. Utility Model Content
[0003] The purpose of this utility model embodiment is to provide a processing equipment for reinforcing fiber cloth for electronic substrates, so as to solve the technical problems of fraying and flying filaments that occur after cutting the reinforcing fiber cloth in the prior art.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is: to provide a processing equipment for reinforcing fiber cloth for electronic substrates, comprising:
[0005] A cutting mechanism for cutting the tail edge area of the reinforcing fiber cloth;
[0006] An edge sealing mechanism is used to heat-seal and / or glue-seal a target area, which is the tail edge area of the reinforcing fiber cloth or the cut edge area formed after the reinforcing fiber cloth is cut.
[0007] Optionally, the electronic substrate is a printed circuit board, and the reinforcing fiber cloth is glass fiber cloth or carbon fiber cloth.
[0008] Optionally, the edge sealing mechanism includes an adhesive dispensing assembly for wrapping the edge sealing material around the target area.
[0009] Optionally, the edge sealing material includes materials that are resistant to high temperatures and / or capable of rapid curing.
[0010] Optionally, the edge sealing mechanism includes two mutually cooperating pressure rollers that press the reinforcing fiber cloth, a pressure roller drive for driving the pressure rollers to rotate, and a heater for increasing the temperature of the cut edge of the reinforcing fiber cloth.
[0011] Optionally, the heater is located inside the pressure roller, and the heater is used to heat the pressure roller.
[0012] Optionally, the heater is located outside the pressure roller and close to the cut edge of the pressure roller and the reinforcing fiber cloth.
[0013] Optionally, the cutting mechanism includes an ultrasonic generator, an ultrasonic transducer connected to the ultrasonic generator, and an ultrasonic vibrating cutter connected to the ultrasonic transducer.
[0014] Optionally, the equipment for processing reinforcing fiber cloth for electronic substrates further includes a dust collection mechanism, which includes a negative pressure source for generating negative pressure and an airflow channel communicating with the negative pressure source. The end of the airflow channel away from the negative pressure source is located close to the cutting mechanism.
[0015] Optionally, the equipment for processing reinforcing fiber cloth for electronic substrates further includes a vision inspection mechanism, the detection range of which is directly opposite the cutting point of the cutting mechanism, and both the vision inspection mechanism and the cutting mechanism are electrically connected to the controller.
[0016] Optionally, the equipment for processing reinforcing fiber cloth for electronic substrates further includes an unwinding mechanism for flattening the reinforcing fiber cloth and a winding mechanism for winding the reinforcing fiber cloth, wherein the unwinding mechanism, the cutting mechanism, the edge sealing mechanism and the winding mechanism are arranged in sequence.
[0017] The beneficial effects of the reinforcing fiber cloth processing equipment for electronic substrates provided by this utility model are as follows: Compared with the prior art, the reinforcing fiber cloth processing equipment for electronic substrates of this utility model includes a cutting mechanism and an edge sealing mechanism. The cutting mechanism is used to cut the tail edge area of the reinforcing fiber cloth, and the edge sealing mechanism heat seals or glues the target area, which can effectively suppress edge cleavage, fly filaments and burrs of the reinforcing fiber, improve the consistency of the cloth edge and the mechanical tensile performance, and also prevent the loose yarns in the cutting area from entering the next process flow, reduce the risk of contamination and improve the production quality of the circuit board. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 A schematic diagram of the structure of a reinforcing fiber cloth processing device for electronic substrates provided in an embodiment of this utility model;
[0020] Figure 2 A schematic diagram of the structure of the first edge-sealing mechanism provided in this embodiment of the utility model;
[0021] Figure 3 This is a schematic diagram of the structure of the second edge-sealing mechanism provided in the embodiment of the present utility model;
[0022] Figure 4 This is a schematic diagram of the cutting mechanism provided in an embodiment of the present invention.
[0023] The following are the labeling elements in the figure:
[0024] 10-Unwinding mechanism; 20-Cutting mechanism; 21-Ultrasonic vibrating cutter; 30-Edge sealing mechanism; 31-Dispensing assembly; 311-Dispensing nozzle; 32-Pressure roller; 33-Heater; 40-Rewinding mechanism; 50-Tension control platform; 60-Dust collection mechanism; 70-Vision inspection mechanism; 80-Reinforcing fiber cloth. Detailed Implementation
[0025] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0029] Traditional edge-cutting methods for reinforcing fiber cloth often result in frayed edges and loose fibers. To alleviate or solve these problems, this invention proposes a reinforcing fiber cloth processing device for electronic substrates. This device can cut the reinforcing fiber cloth and also heat-seal or glue-seal the target area. Heat-sealing or gluing the target area (tail edge region) before cutting ensures a stable structure, preventing frayed edges and loose fibers even after cutting. Furthermore, heat-sealing or gluing the target area (the cut edge region) before cutting traps any loose fibers within the cut edge area, creating a stable structure. Thus, heat-sealing or gluing the target area effectively prevents cleavage, loose fibers, and burrs at the edge of the limiting section.
[0030] The present invention will now describe the equipment for processing reinforcing fiber cloth for electronic substrates provided in the embodiments of the present invention. The electronic substrate referred to in the present invention is a substrate used to support electronic components or circuits and constitute the structural basis of electronic equipment, including but not limited to: rigid / flexible printed circuit boards (PCB / FPC), ceramic substrates, metal substrates (IMS), high-frequency substrates, semiconductor packaging carriers, etc.
[0031] Please refer to the following: Figure 1 Equipment for processing reinforcing fiber cloth for electronic substrates includes:
[0032] The cutting mechanism 20 is used to cut the tail edge area of the reinforcing fiber cloth 80;
[0033] The edge sealing mechanism 30 is used to heat seal and / or glue seal the target area, which is the tail edge area of the reinforcing fiber cloth 80 or the cut edge area formed after the reinforcing fiber cloth 80 is cut.
[0034] The reinforcing fiber cloth is generally a functional reinforcing fiber cloth that can meet the electrical performance requirements of the circuit board. For example, the reinforcing fiber cloth is glass fiber cloth or carbon fiber cloth.
[0035] The cutting mechanism 20 is used to cut the reinforcing fiber fabric 80, removing the tail edge area of the reinforcing fiber fabric 80. During the cutting process, the width or length of the reinforcing fiber fabric 80 can be altered. After the cutting mechanism 20 cuts the reinforcing fiber fabric 80, the cut area is called the trimmed edge area.
[0036] The edge sealing mechanism 30 is used to heat-seal and / or glue-seal the target area. Heat sealing refers to heating the target area to prevent fraying or loose fibers after cutting, forming a stable structure and thus a stable cut edge area that does not affect subsequent processes. Glue sealing refers to wrapping the target area with material, encapsulating any loose fibers after cutting within the sealing material, thereby forming a stable cut edge area that also does not affect subsequent processes.
[0037] When using equipment for processing reinforcing fiber cloth for electronic substrates, the tail edge area of the reinforcing fiber cloth 80 can be cut first by the cutting mechanism 20 to form a cut edge area, and then the target area (cut edge area) can be sealed and fixed by the sealing mechanism 30. Alternatively, the target area (tail edge area) can be sealed and fixed first by the sealing mechanism 30, and then the tail edge area of the reinforcing fiber cloth 80 can be cut by the cutting mechanism 20.
[0038] The reinforcing fiber cloth processing equipment for electronic substrates in the above embodiments includes a cutting mechanism 20 and an edge sealing mechanism 30. The cutting mechanism 20 is used to cut the tail edge area of the reinforcing fiber cloth, and the edge sealing mechanism 30 heat-seales and / or glues the target area. This can effectively suppress edge cleavage, fly filaments and burrs of the reinforcing fibers, improve the consistency of the cloth edge and its resistance to mechanical tension, and prevent the loose yarns in the cut edge area from entering the next process flow, reducing the risk of contamination and improving the production quality of the circuit board.
[0039] In some embodiments of this invention, the electronic substrate is a printed circuit board (PCB), and the reinforcing fiber cloth is either glass fiber cloth or carbon fiber cloth. Both glass fiber cloth and carbon fiber cloth are used to provide mechanical strength and stability for the PCB. During the manufacturing process of the PCB, the reinforcing fiber cloth needs to be impregnated in materials such as epoxy resin, and then the impregnated reinforcing fiber cloth is stacked for subsequent stacking and lamination processes. The reinforcing fiber cloth processing equipment in this embodiment is used to pre-treat the reinforcing fiber cloth before impregnation.
[0040] In some embodiments of this utility model, the electronic substrate is a metal substrate. When manufacturing the metal substrate, the metal substrate is first cleaned, micro-etched, or anodized. Then, an insulating layer is prepared. The insulating layer is generally formed by impregnating reinforcing fiber cloth in a highly thermally conductive epoxy resin. The treated metal substrate, insulating layer, and copper foil are then stacked in sequence and laminated and cured to form the metal substrate.
[0041] In some embodiments of this invention, the electronic substrate is a ceramic substrate. In manufacturing the ceramic substrate, a ceramic slurry is first prepared and then coated into a thin, uniform green ceramic strip. Pre-treated reinforcing fiber cloth is then embedded or laminated onto the green ceramic strip. Finally, circuit printing, lamination, and co-firing are performed to form the ceramic substrate.
[0042] Please refer to some embodiments of this utility model. Figure 1 The equipment for processing reinforcing fiber cloth for electronic substrates also includes an unwinding mechanism 10. The glass reinforcing fiber cloth 80 is in a rolled state upon arrival (before cutting). It needs to be flattened before cutting and edge sealing. The unwinding mechanism 10 can flatten the rolled glass reinforcing fiber cloth 80 to prepare it for subsequent processing. When the glass reinforcing fiber cloth 80 arrives, its wide edges often form a "tail edge" area of several millimeters. Therefore, it is necessary to cut off the "tail edge" area to prevent fibers from entering the impregnation process.
[0043] Please refer to some embodiments of this utility model. Figure 1 The equipment for processing reinforcing fiber cloth for electronic substrates also includes a winding mechanism 40. The winding mechanism 40 is used to wind up the edge-sealed reinforcing fiber cloth 80. After the edge-sealing mechanism 30 seals the reinforcing fiber cloth 80, the structure of its cut edge area is stable and there are no fibers that are easy to fall off. In this way, after the edge-sealed reinforcing fiber cloth 80 is wound up, the fibers on its edge will not fall to other positions of the reinforcing fiber cloth 80, ensuring that the wound reinforcing fiber cloth 80 is still in a relatively clean state.
[0044] Please refer to some embodiments of this utility model. Figure 1 The equipment for processing reinforcing fiber cloth for electronic substrates also includes an unwinding mechanism 10 and a winding mechanism 40. The unwinding mechanism 10, the cutting mechanism 20, the edge sealing mechanism 30 and the winding mechanism 40 are arranged in sequence, and the reinforcing fiber cloth 80 also gradually extends along the placement direction of the unwinding mechanism 10, the cutting mechanism 20, the edge sealing mechanism 30 and the winding mechanism 40.
[0045] Please refer to some embodiments of this utility model. Figure 2 The edge sealing mechanism 30 includes a dispensing assembly 31, which is used to wrap the edge sealing material around the target area. In this embodiment, the target area is sealed with adhesive by the dispensing assembly 31. The dispensing assembly 31 generally has a nozzle 311 from which the edge sealing material flows and drips onto the edge sealing area, thereby wrapping the target area with the edge sealing material. It should be noted that the edge sealing material is in a liquid state inside the dispensing assembly 31 and when it drips down from the nozzle 311 of the dispensing machine. After the edge sealing material wraps the target area, it can cure under natural conditions or under light, thereby stabilizing the target area.
[0046] By using the dispensing assembly 31 to seal the target area, impurities in the target area and its surroundings can be effectively contained, achieving effective edge sealing, preventing fraying and wire breakage, and improving the edge stability of the material during storage and transportation. Furthermore, sealing the target area using the dispensing assembly 31 is relatively low-cost, thereby reducing the production cost of the circuit board.
[0047] In some embodiments, the width of the dispensing area formed by the dispensing assembly 31 is greater than or equal to 3 mm and less than or equal to 10 mm. The width of the dispensing area is the width of the sealing material after it has dripped onto the target area and cured. If the width of the dispensing area is too large, the dispensing cost will be too high, and if the reinforcing fiber cloth 80 covered by the sealing material is too large, it may affect the signal transmission of the circuit board. If the width of the dispensing area is too small, it may not be able to completely cover the impurities on the cut edge of the reinforcing fiber cloth 80, resulting in fraying and flying wires still occurring, affecting the sealing effect. Therefore, the width of the dispensing area is set to be greater than or equal to 3 mm and less than or equal to 10 mm.
[0048] Optionally, the width of the dispensing area can be 3mm, 5mm, 7mm, 8mm, etc.
[0049] Optionally, the edge line of the reinforced fiber cloth after 80 cutting is a symmetrical line, and the glue application area is symmetrically set about the symmetrical line. This can make the particles, debris, and fibers on both sides of the symmetrical line wrapped in the glue application area, thereby improving the edge sealing effect.
[0050] In some embodiments, the edge sealing material includes a high-temperature resistant and / or rapidly curing material. The high-temperature resistant property of the edge sealing material allows for heat sealing after dispensing the adhesive to the target area, further improving the edge sealing effect. And / or, the edge sealing material has a rapid curing property, enabling rapid curing after dispensing the adhesive to the target area without affecting the overall efficiency of the reinforcing fiber cloth processing equipment used for electronic substrates.
[0051] Alternatively, the edge banding material can be rapidly cured by thermosetting or photosetting.
[0052] Optionally, the edge sealing material includes water-soluble resin. Water-soluble resin is a polymer material that can dissolve or disperse in water to form a stable solution. Its most significant characteristic is that it uses water instead of traditional organic solvents as a medium, offering advantages such as safe operation, environmental friendliness (low VOC), lower cost, and ease of cleaning. Furthermore, it can be transformed into a water-insoluble, durable coating or cured product under specific conditions by adjusting the formulation (e.g., pH value, temperature) or adding crosslinking agents. Of course, edge sealing materials can also be made from other materials.
[0053] In some embodiments, the dispensing assembly 31 includes a moving mechanism, a dispensing mechanism, and a nozzle 311 connected in sequence. The moving mechanism is capable of moving in at least two horizontal directions. When the moving mechanism is in operation, it can drive the dispensing mechanism and the nozzle 311 to move, thereby adjusting the horizontal position of the nozzle 311. The dispensing mechanism allows sealing material to flow from the nozzle 311. When the nozzle 311 is aligned with the target area of the reinforcing fiber cloth 80, the dispensing mechanism causes the sealing material to drip onto the target area.
[0054] Please refer to some embodiments of this utility model. Figure 3 The edge sealing mechanism 30 includes two mutually cooperating pressure rollers 32 that press the reinforcing fiber cloth 80, a pressure roller drive component that drives the pressure rollers 32 to rotate, and a heater 33 for increasing the temperature of the cut edge of the reinforcing fiber cloth 80. In this embodiment, the edge sealing mechanism 30 heat-seals the target area. The pressure roller drive component is a power component used to provide power to drive the pressure rollers 32 to rotate. The pressure rollers 32 are generally cylindrical in shape, and the reinforcing fiber cloth 80 is located between the two pressure rollers 32. When the two pressure rollers 32 rotate, they can not only roll and press the target area of the reinforcing fiber cloth 80, but also heat the target area of the reinforcing fiber cloth 80, thereby enabling the structure of the target area to be pressed at high temperature to form a stable edge sealing structure. The heater 33 is used to heat the reinforcing fiber cloth 80, specifically, it can directly heat the reinforcing fiber cloth 80 or indirectly heat the reinforcing fiber cloth 80.
[0055] By setting the pressure roller 32 to press the target area of the reinforcing fiber cloth 80 and heating the reinforcing fiber cloth 80, the edge cleavage, burrs and rough edges of the glass fiber can be effectively suppressed, and the uniformity of the fabric edge and its mechanical tensile resistance can be improved.
[0056] In some embodiments, the pressure roller drive is a motor.
[0057] In some embodiments, there are two pressure roller drivers, which are used to drive the two pressure rollers 32 to rotate.
[0058] In some embodiments, there is one pressure roller drive member, and a transmission assembly is provided between the pressure roller drive member and the pressure roller 32. By providing the transmission assembly, one pressure roller drive member can drive two pressure rollers 32 to rotate simultaneously. Optionally, the transmission assembly includes two meshing gears.
[0059] In some embodiments, the linear speed of the pressure roller 32 is in the range of 1 to 5 m / s. If the linear speed of the pressure roller 32 is too high, it may result in insufficient compression of the edge area, easily leading to poor edge sealing. If the linear speed of the pressure roller 32 is too low, it may result in excessive compression time on the target area, excessive deformation of the edge area, and possibly excessive heating time in the target area, causing burning and deformation of the reinforcing fiber cloth 80 edges. Therefore, controlling the linear speed of the pressure roller 32 within the range of 1 to 5 m / s can be adjusted according to the thickness of the reinforcing fiber cloth 80 and the speed of the production line. For example, the linear speed of the pressure roller 32 can be 2 m / s, 3 m / s, 5 m / s, etc.
[0060] In some embodiments, the width of the pressure roller 32 is 1 cm to 3 cm. If the width of the pressure roller 32 is too wide, the area of the reinforcing fiber fabric 80 that is pressed by the roller is too large, which can easily lead to deformation in areas other than the target area; if the width of the pressure roller 32 is too narrow, it will result in insufficient pressing of the target area and unstable edge sealing. Therefore, the width of the pressure roller 32 is set to 1 cm to 3 cm. For example, the width of the pressure roller 32 is 1 cm, 2 cm, or 3 cm.
[0061] Please refer to some embodiments of this utility model. Figure 2 The heater 33 is located inside the pressure roller 32 and is used to heat the pressure roller 32. When operating, the heater 33 generates heat. When located inside the pressure roller 32, the heater 33 first heats the pressure roller 32. Then, when the pressure roller 32 comes into contact with the reinforcing fiber cloth 80, the heat from the pressure roller 32 is transferred to the target area of the reinforcing fiber cloth 80, thereby effectively suppressing edge cleavage, fraying, and rough edges of the glass fibers, and improving the uniformity of the fabric edges and its resistance to mechanical tension. This embodiment can be understood as the heater 33 indirectly heating the reinforcing fiber cloth 80.
[0062] Optionally, the heater 33 is located at the center of the pressure roller 32, or the heater 33 is located on the inner surface of the pressure roller 32.
[0063] Optionally, the temperature of heater 33 is controlled between 400°C and 850°C. If the temperature of heater 33 is too high, it may easily burn the target area of the reinforcing fiber cloth 80; if the temperature of heater 33 is too low, it is impossible to press and shape the target area of the reinforcing fiber cloth, resulting in poor edge sealing. Therefore, the temperature of heater 33 is controlled between 400°C and 850°C.
[0064] In some embodiments of this invention, the heater 33 is located outside the pressure roller 32 and close to the cut edge of the pressure roller 32 and the reinforcing fiber cloth 80. The heater 33 being located outside the pressure roller 32 can be understood as the heater 33 being fixed to the outer surface of the pressure roller 32 and in contact with it. Alternatively, it can be understood as the heater 33 being located outside the pressure roller 32 and not in contact with it, radiating heat outwards to raise the temperature of the reinforcing fiber cloth 80. This embodiment can be understood as the heater 33 directly heating the reinforcing fiber cloth 80.
[0065] When the heater 33 is located outside the pressure roller 32, the heater 33 does not need to be combined with the pressure roller 32. This solution has a lower structural cost and can both roll the reinforcing fiber cloth 80 and heat the reinforcing fiber cloth 80 at the same time.
[0066] Please refer to some embodiments of this utility model. Figure 4 The cutting mechanism 20 includes an ultrasonic generator, an ultrasonic transducer connected to the ultrasonic generator, and an ultrasonic vibrating cutter 21 connected to the ultrasonic transducer. The ultrasonic generator generates high-frequency (typically above 20kHz, the upper limit of human hearing) electrical oscillation signals, converting ordinary alternating current or direct current into high-frequency alternating current of specific frequency and power to drive the ultrasonic transducer connected to it. The ultrasonic transducer efficiently converts electrical energy into mechanical vibration (ultrasound), which is transmitted to the ultrasonic vibrating cutter 21, thereby achieving the cutting of the reinforcing fiber cloth 80.
[0067] The ultrasonic vibrating cutter 21 uses high-frequency micro-vibration to locally shear and break the edges of the reinforcing fiber cloth 80, achieving a dry cutting effect with no blade marks, low dust, high cleanliness, low stress, no flying debris, and no edge fraying. Moreover, the entire cutting process is carried out in a dry state, without the use of sizing agents, cutting fluids, or edge sealing resins, avoiding potential pollution and performance degradation problems caused by chemical residues or damp heat treatment.
[0068] In some embodiments, the ultrasonic transducer is a piezoelectric ceramic, which is widely used and has a mature transduction method.
[0069] In some embodiments, the ultrasonic transducer operates in the frequency range of 20kHz to 40kHz, and generates high-frequency mechanical vibrations through the ultrasonic transducer, which drive the ultrasonic vibrating cutter 21 to generate longitudinal vibrations, with the amplitude adjustable in the range of 30μm to 50μm.
[0070] In some embodiments, the ultrasonic vibrating cutter 21 is a tungsten carbide cutter head, or the surface of the ultrasonic vibrating cutter 21 is coated with a wear-resistant layer. By using different materials or coatings for the ultrasonic vibrating cutter 21, the cutting requirements of different reinforcing fiber cloths 80 can be adapted.
[0071] Please refer to some embodiments of this utility model. Figure 1 The equipment for processing reinforcing fiber cloth for electronic substrates also includes a dust collection mechanism 60. The dust collection mechanism 60 includes a negative pressure source for generating negative pressure and an airflow channel connected to the negative pressure source. The end of the airflow channel away from the negative pressure source is located near the cutting area of the ultrasonic vibrating cutter 21. When the negative pressure source is working, it can generate negative pressure, thus generating negative pressure inside the airflow channel. The end of the airflow channel away from the negative pressure source has adsorption capacity, adsorbing debris, burrs, and fly filaments generated during the cutting process into the airflow channel.
[0072] By setting up a dust collection mechanism 60, the fine glass fiber dust generated during the cutting process can be drawn and filtered in real time by the dust collection mechanism 60, thereby effectively controlling particulate pollution in the target area and meeting the requirements of a high-cleanliness environment.
[0073] In some embodiments, the inlet of the airflow channel of the dust collection mechanism 60 is located downstream of the cutting mechanism 20 and operates synchronously with the cutting mechanism 20. The inlet of the airflow channel is located away from the negative pressure source.
[0074] In some embodiments, the negative pressure source may be a vacuum pump or a vacuum generator.
[0075] In some embodiments, the airflow channel is a flexible tube structure. Alternatively, the airflow channel is located inside a rigid structure.
[0076] Please refer to some embodiments of this utility model. Figure 1 The equipment for processing reinforcing fiber cloth for electronic substrates also includes a vision inspection mechanism 70. The detection range of the vision inspection mechanism 70 is directly opposite the cutting area of the cutting mechanism 20. Both the vision inspection mechanism 70 and the cutting mechanism 20 are electrically connected to the controller. The detection range of the vision inspection mechanism 70 can be understood as its imaging range, which covers the cutting area of the ultrasonic vibrating cutter 21. Since both the vision inspection mechanism 70 and the cutting mechanism 20 are electrically connected to the controller, the vision inspection mechanism 70 can monitor in real time when the cutting trajectory deviates and transmit the deviation information to the controller. The controller outputs cutting information to the cutting mechanism 20 based on the deviation information and adjusts the position of the cutting mechanism 20. This ensures accurate cutting trajectory and neat edges, and provides feedback for automatic correction.
[0077] In some embodiments, the visual inspection agency 70 may be a CCD inspection agency.
[0078] In some embodiments of the utility model, please refer to Figure 1The equipment for processing reinforcing fiber cloth for electronic substrates also includes a tension control platform 50. The tension control platform 50 is used to tension the reinforcing fiber cloth 80 to ensure that the cloth is smoothly transported to the tension control platform. The tension control platform has an active tensioning mechanism and a position guiding function to flatten and accurately position the reinforcing fiber cloth 80, providing stable support for subsequent high-precision cutting.
[0079] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A processing device for reinforcing fiber cloth for electronic substrates, characterized in that, include: A cutting mechanism for cutting the tail edge region of reinforcing fiber cloth, the cutting mechanism comprising an ultrasonic vibrating cutter; An edge sealing mechanism is used to heat-seal and / or glue-seal a target area, which is the tail edge area of the reinforcing fiber cloth or the cut edge area formed after the reinforcing fiber cloth is cut.
2. The equipment for processing reinforcing fiber cloth for electronic substrates as described in claim 1, characterized in that: The electronic substrate is a printed circuit board, and the reinforcing fiber cloth is glass fiber cloth or carbon fiber cloth.
3. The equipment for processing reinforcing fiber cloth for electronic substrates as described in claim 1, characterized in that: The edge sealing mechanism includes an adhesive dispensing assembly for wrapping the edge sealing material around the target area.
4. The equipment for processing reinforcing fiber cloth for electronic substrates as described in claim 3, characterized in that: The edge sealing material includes materials that are resistant to high temperatures and / or capable of rapid curing.
5. The equipment for processing reinforcing fiber cloth for electronic substrates as described in claim 1, characterized in that: The edge sealing mechanism includes two pressure rollers that cooperate to press the reinforcing fiber cloth, a pressure roller drive component that drives the pressure rollers to rotate, and a heater for increasing the temperature of the cut edge of the reinforcing fiber cloth.
6. The equipment for processing reinforcing fiber cloth for electronic substrates as described in claim 5, characterized in that: The heater is located inside the pressure roller and is used to heat the pressure roller.
7. The equipment for processing reinforcing fiber cloth for electronic substrates as described in claim 5, characterized in that: The heater is located outside the pressure roller and close to the cut edge of the pressure roller and the reinforcing fiber cloth.
8. The equipment for processing reinforcing fiber cloth for electronic substrates as described in any one of claims 1-7, characterized in that: The cutting mechanism includes an ultrasonic generator, an ultrasonic transducer connected to the ultrasonic generator, and an ultrasonic vibrating cutter connected to the ultrasonic transducer.
9. The equipment for processing reinforcing fiber cloth for electronic substrates as described in any one of claims 1-7, characterized in that: The equipment for processing reinforcing fiber cloth for electronic substrates also includes a dust collection mechanism, which includes a negative pressure source for generating negative pressure and an airflow channel communicating with the negative pressure source. The end of the airflow channel away from the negative pressure source is located close to the cutting mechanism.
10. The equipment for processing reinforcing fiber cloth for electronic substrates as described in any one of claims 1-7, characterized in that: The equipment for processing reinforcing fiber cloth for electronic substrates also includes a vision inspection mechanism. The detection range of the vision inspection mechanism is directly opposite the cutting point of the cutting mechanism. Both the vision inspection mechanism and the cutting mechanism are electrically connected to the controller.
11. The equipment for processing reinforcing fiber cloth for electronic substrates as described in any one of claims 1-7, characterized in that: The equipment for processing reinforcing fiber cloth for electronic substrates further includes an unwinding mechanism for flattening the reinforcing fiber cloth and a winding mechanism for winding the reinforcing fiber cloth, wherein the unwinding mechanism, the cutting mechanism, the edge sealing mechanism and the winding mechanism are arranged in sequence.