Vacuum pumping device and semiconductor production machine

Abstract

The utility model discloses a kind of vacuumizing device and semiconductor production machine platform, the vacuumizing device includes vacuum pump and gas delivery pipeline, the gas delivery pipeline includes gas extraction pipeline and gas extraction dilution pipeline;The gas extraction pipeline is installed between process cavity and vacuum pump, and pressure control valve is provided on the gas extraction pipeline;The gas inlet end of the gas extraction dilution pipeline is connected with gas source, and the gas outlet end of the gas extraction dilution pipeline is connected with the vacuum pump.The utility model is balanced by being provided with the gas extraction dilution pipeline connected with vacuum pump, the suction of vacuum pump, the pressure required by process cavity is controlled, and product quality is protected.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor process technology, specifically to a vacuum pumping device and a semiconductor production machine. Background Technology

[0002] In semiconductor manufacturing, the response time of pressure control is a crucial factor affecting the process results, and semiconductor processes require pressure control to be fast, stable, and highly accurate.

[0003] Currently, gas delivery pipeline systems designed and configured for furnace tube equipment executing specific process formulations have their end gas path directly connected to a vacuum pump, and the gas path is controlled by a pressure control valve. Due to the high production temperature and numerous byproducts inside the furnace tube equipment, if the pressure control valve is not fully open, byproducts can easily accumulate on it, leading to valve damage. Frequent opening and closing of the pressure control valve also easily causes damage. Since the pressure control valve is a one-way valve, damage to it can easily lead to backflow. When backflow occurs, unclean, untreated gas will rush into the chamber instantly, causing particulate contamination and affecting the product. Therefore, the pressure control valve needs to be fully opened to protect it as much as possible. However, while fully opening the pressure control valve allows gas in the process chamber to easily escape, the gas pressure will drop rapidly, causing damage to the product within the process chamber. Utility Model Content

[0004] The purpose of this invention is to overcome the above-mentioned technical deficiencies and provide a vacuum pumping device and a semiconductor production machine to slowly reduce the pressure inside the process chamber and protect product quality when the pressure control valve is fully open.

[0005] This utility model first provides a vacuum pumping device for extracting gas from a process chamber. The vacuum pumping device includes a vacuum pump and a gas delivery pipeline. The gas delivery pipeline includes an extraction pipeline and an extraction dilution pipeline. The extraction pipeline is installed between the process chamber and the vacuum pump, and a pressure control valve is provided on the extraction pipeline. The inlet end of the extraction dilution pipeline is connected to an external gas source, and the outlet end of the extraction dilution pipeline is connected to the vacuum pump.

[0006] Furthermore, the gas extraction and dilution pipeline includes a first pneumatic valve, a pressure control module, and a second pneumatic valve connected in series. The first pneumatic valve is connected to an external gas source, and the second pneumatic valve is connected to the vacuum pump. The pressure control module includes a control regulator and a mass flow controller connected in series. The mass flow controller is connected to the second pneumatic valve, and the control regulator is connected to the first pneumatic valve.

[0007] Furthermore, the control regulator is connected to a fourth pressure sensor, which is used to measure the pressure on the pipeline between the pressure control valve and the vacuum pump. The control regulator starts or stops the mass flow controller based on the pressure signal generated by the fourth pressure sensor.

[0008] Furthermore, a third isolation valve is provided between the fourth pressure detector and the vacuum pump.

[0009] This utility model also provides a semiconductor manufacturing machine, including a process chamber and any of the above-mentioned vacuum pumping devices, wherein the vacuum pumping device is connected to the process chamber and the vacuum pumping device evacuates the process chamber to a vacuum state.

[0010] Furthermore, a third pneumatic valve is installed between the process chamber and the pressure control valve.

[0011] Furthermore, a first pressure detector and a first isolation valve are provided between the process chamber and the pressure control valve. The first pressure detector is used to detect the pressure inside the process chamber, and the first isolation valve is used to cut off or connect the pipeline and cooperate with the first pressure detector to detect the pressure inside the process chamber.

[0012] Furthermore, a first pressure relief air path and a second pressure relief air path are provided between the process chamber and the pressure control valve; the first pressure relief air path includes a differential pressure gauge, a second isolation valve and a fifth pneumatic valve connected in series, and the second pressure relief air path includes a second pressure detector and a sixth pneumatic valve connected in series. The air inlet ends of the fifth pneumatic valve and the sixth pneumatic valve are connected to the process chamber, and the air outlet ends of the fifth pneumatic valve and the sixth pneumatic valve are connected in parallel.

[0013] Furthermore, a third pressure detector is also installed between the process chamber and the pressure control valve.

[0014] Furthermore, a first main valve is installed between the third pressure detector and the pressure control valve, a second main valve is installed between the third isolation valve and the gas extraction and dilution pipeline, and a fourth pneumatic valve and an adjustable manual valve are connected in series between the first main valve and the second main valve.

[0015] This invention balances the pumping force of the vacuum pump by setting up a pumping and dilution pipeline connected to the vacuum pump, controls the pressure required in the process chamber, and protects product quality. Attached Figure Description

[0016] Figure 1 This is a block diagram of the semiconductor processing equipment of this utility model; Figure 2 for Figure 1 A block diagram of the central extraction dilution pipeline; Figure 3 for Figure 2 A block diagram of the medium pressure control module; Figure 4 This is a schematic diagram of the semiconductor processing equipment of this utility model. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0018] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0019] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0020] Please see Figure 1 A preferred embodiment of this utility model provides a vacuum pumping device 30, which is used to extract gas from the process chamber 20, so that the process chamber 20 slowly reaches a vacuum state. Figure 1As shown, the vacuum pumping device 30 includes a vacuum pump 40 and a gas delivery pipeline 60. The gas delivery pipeline 60 includes a vacuum line 62 and a vacuum dilution line 64. The vacuum line 62 is installed between the process chamber 20 and the vacuum pump 40, and a pressure control valve 622 is installed on the vacuum line 62, which is fully open. The inlet of the vacuum dilution line 64 is connected to a gas source 65, and the outlet of the vacuum line 64 is connected to the vacuum pump 40. The gas source 65 provides dilution gas, such as nitrogen, to the vacuum dilution line 64. The pressure control valve 622 can be a diaphragm control valve, used to open, close, and regulate the flow rate when the vacuum pump evacuates the process chamber.

[0021] When the pressure control valve 622 between the process chamber 20 and the vacuum pump 40 is fully open, byproducts can be discharged through the pipeline, preventing damage to the pressure control valve 622 due to byproduct accumulation and extending its service life. However, fully opening the pressure control valve 622 will cause a rapid drop in the gas pressure inside the process chamber 20, which may damage the processed products inside. By setting up a gas dilution pipeline 64 connected to the vacuum pump 40, dilution gas is supplied to the vacuum pump, which can balance the pumping force of the vacuum pump 40, preventing the gas pressure in the process chamber 20 from dropping rapidly and thus preventing damage to the processed products inside the process chamber 20.

[0022] Please see Figure 2 and Figure 3 The vacuum dilution pipeline 64 includes a first pneumatic valve 642, a pressure control module 644, and a second pneumatic valve 646 connected in sequence. The first pneumatic valve 642 is connected to an external air source 65, and the second pneumatic valve 646 is connected to the vacuum pump 40. The pressure control module 644 includes a control regulator 643 and a mass flow controller 645 connected in series. The control regulator 643 is connected to the first pneumatic valve 642, and the mass flow controller 645 is connected to the second pneumatic valve 646. The control regulator 643 controls the mass flow controller 645 to open at a certain degree, and the initial value of the opening of the mass flow controller 645 is preset.

[0023] The pressure control module 644 is the "brain" of the system. It receives signals from the pressure sensor and precisely adjusts the connected pneumatic valves or proportional valves using internal algorithms (such as PID) to maintain ultra-high precision and stability of the downstream pressure. The pressure control module 644 is connected to a dilution gas source and uses the dilution gas as a control medium to drive the pneumatic components. The dilution gas can be, for example, nitrogen. The first pneumatic valve 642 and the second pneumatic valve 646 control the inflow and outflow of dilution gas at both ends. Based on the required pressure of the equipment and the initial set value, the controller 643 automatically adjusts the flow rate of the dilution gas supplied to the mass flow controller 645 to balance the suction force of the vacuum pump and control the pressure required for the process. When the system enters a low-pressure state, the pressure control module 644 causes the gas dilution pipeline 64 to supply dilution gas to the vacuum pump 40. The control regulator 643 is connected to a fourth pressure sensor VG3 for measuring the pressure in the pipeline between the pressure control valve 622 and the vacuum pump 40. The control regulator 643 activates or deactivates the mass flow controller 645 based on the pressure signal generated by the fourth pressure sensor VG3. A third isolation valve IV7 is provided between the fourth pressure sensor VG3 and the vacuum pump 40. The third isolation valve IV7 does not open simultaneously with the pressure control valve 622. The fourth pressure sensor VG3 measures the pressure in the pipeline between the pressure control valve 622 and the vacuum pump 40 when the third isolation valve IV7 is open. The third isolation valve IV7 is a switch valve used to isolate the gas pipeline from the vacuum pipeline. The fourth pressure sensor VG3 and the third isolation valve IV7 are connected in series.

[0024] See again Figure 1 This utility model also provides a semiconductor manufacturing machine 100, including a process chamber 20 and a vacuum pumping device 30 as described above. The vacuum pumping device 30 is connected to the process chamber 20, and the vacuum pumping device 30 evacuates the process chamber 20 to a vacuum state. Please see Figure 4 The inlet end of the process chamber 20 can be equipped with five start valves, namely NG1, NG2, NG3, NG4 and NG5, which can be connected to the gas source interface of the equipment process gas box.

[0025] Please continue reading. Figure 4A third pneumatic valve VC1 is installed between the process chamber 20 and the pressure control valve 622. The third pneumatic valve VC1 controls the flow of HF gas into a specific pipeline during the cleaning process. The third pneumatic valve VC1 can be fully open / fully closed and has strong flow capacity. A first pressure sensor VG1 and a first isolation valve IV1 are installed between the process chamber 20 and the pressure control valve 622. The first pressure sensor VG1 is used to detect the pressure inside the process chamber 20, and the first isolation valve IV1 is used to cut off or connect the pipeline and works in conjunction with the first pressure sensor VG1 to detect the pressure inside the process chamber 20. It is a diaphragm valve that works in conjunction with the first pressure sensor VG1 to detect the pressure in the process chamber 20.

[0026] Continue reading Figure 4 A first pressure relief air path 82 and a second pressure relief air path 84 are also provided between the process chamber 20 and the pressure control valve 622. The first pressure relief air path 82 is used to detect the pressure difference between the process chamber 20 and the outside of the equipment. The first pressure relief air path 82 includes a differential pressure gauge PSW11, a second isolation valve IV2, and a fifth pneumatic valve VV1 connected in series. The second pressure relief air path 84 is used to detect the pressure value inside the process chamber 20. It is a large-range pressure gauge and is used when the pressure value inside the process chamber 20 is greater than 10 torr. The second pressure relief air path 84 includes a second pressure detector VG2 and a sixth pneumatic valve VV2 connected in series. The inlet ends of the fifth pneumatic valve VV1 and the sixth pneumatic valve VV2 are connected to the process chamber 20, and the outlet ends of the fifth pneumatic valve VV1 and the sixth pneumatic valve VV2 are connected in parallel, forming an exhaust pressure relief pipeline EXH VENT. This pipeline is used to release pressure when the chamber pressure is too high and is connected to the plant exhaust system to discharge the released gas into the plant system. The differential pressure gauge PSW11 is used to measure and detect the pressure difference between the chamber and the outside. When the pressure is too high, an alarm is triggered to indicate an abnormal pressure, suggesting that the product cannot be unloaded from the chamber. The fifth pneumatic valve VV1 and the sixth pneumatic valve VV2 are used to activate the switch when the chamber pressure is too high and pressure relief is required.

[0027] Continue reading Figure 4 A third pressure sensor PSW21 is also installed between the process chamber 20 and the pressure control valve 622. The third pressure sensor PSW21 is used to detect the pressure inside the process chamber 20 when the second pressure sensor VG2 fails, and displays the monitored value to help technicians confirm whether the process chamber has reached the pressure required by the process.

[0028] Continue reading Figure 4A first main valve HV1 is installed between the third pressure detector PSW21 and the pressure control valve 622. A second main valve HV2 is installed between the third isolation valve IV7 and the vacuum dilution pipeline 64. A fourth pneumatic valve SSV1 and an adjustable manual valve NV1 are connected in series between the first main valve HV1 and the second main valve HV2. The first main valve HV1 and the second main valve HV2 can be manual valves, used to isolate parts of the pipeline during manual intervention or system maintenance. The fourth pneumatic valve SSV1 is used as a switch valve on the pipeline between the first main valve HV1 and the second main valve HV2 when the vacuum pump is drawing a vacuum. The adjustable manual valve NV1 is a valve for adjusting the pumping force during small pumping operations, used to regulate the airflow in the pipeline. The first main valve HV1, the fourth pneumatic valve SSV1, the adjustable manual valve NV1, and the second main valve HV2 are used in conjunction with the third pressure detector PSW21 and the fourth pressure detector VG3 to detect pressure signals.

[0029] Continue reading Figure 4 The vacuum pump 40 includes a first vacuum pump 402 and a second vacuum pump 404, wherein the second vacuum pump 404 has a greater pumping force than the first vacuum pump 402. The first vacuum pump 402 is used to achieve a higher vacuum level in the process chamber 20 based on the mechanical pump, with a slightly smaller pumping force. The second vacuum pump 404 is also used to achieve a higher vacuum level in the process chamber 20 based on the mechanical pump, with a greater pumping force.

[0030] This invention, with the pressure control valve 622 between the process chamber 20 and the vacuum pump 40 fully open, includes a gas extraction and dilution pipeline 64 connected to the vacuum pump 40, thereby balancing the pumping force of the vacuum pump 40, controlling the pressure required by the process chamber 20, and protecting product quality.

[0031] The above description is merely a preferred embodiment of this utility model and is not intended to limit this utility model in any form or substance. It should be noted that those skilled in the art can make various improvements and additions without departing from the method of this utility model, and these improvements and additions should also be considered within the protection scope of this utility model. Any modifications, alterations, and equivalent changes made by those skilled in the art without departing from the spirit and scope of this utility model using the disclosed technical content are equivalent embodiments of this utility model. Furthermore, any modifications, alterations, and evolutions made to the above embodiments based on the essential technology of this utility model still fall within the scope of the technical solution of this utility model.

Claims

1. A vacuum extraction device for extracting gas from a process chamber, characterized in that: The vacuuming device includes a vacuum pump and a gas delivery pipeline. The gas delivery pipeline includes an extraction pipeline and an extraction dilution pipeline. The extraction pipeline is installed between the process chamber and the vacuum pump, and a pressure control valve is provided on the extraction pipeline. The inlet of the extraction dilution pipeline is connected to an external gas source, and the outlet of the extraction dilution pipeline is connected to the vacuum pump.

2. The vacuum pumping device according to claim 1, characterized in that: The gas extraction and dilution pipeline includes a first pneumatic valve, a pressure control module, and a second pneumatic valve connected in series. The first pneumatic valve is connected to an external gas source, and the second pneumatic valve is connected to the vacuum pump. The pressure control module includes a control regulator and a mass flow controller connected in series. The mass flow controller is connected to the second pneumatic valve, and the control regulator is connected to the first pneumatic valve.

3. The vacuum pumping device according to claim 2, characterized in that: The control regulator is connected to a fourth pressure sensor, which measures the pressure in the pipeline between the pressure control valve and the vacuum pump. The control regulator starts or stops the mass flow controller based on the pressure signal generated by the fourth pressure sensor.

4. The vacuum pumping device according to claim 3, characterized in that: A third isolation valve is provided between the fourth pressure detector and the vacuum pump.

5. A semiconductor manufacturing machine, characterized in that: It includes a process chamber and a vacuum pumping device as described in any one of claims 1-4, wherein the vacuum pumping device is connected to the process chamber and the vacuum pumping device evacuates the process chamber to a vacuum state.

6. The semiconductor manufacturing machine according to claim 5, characterized in that: A third pneumatic valve is installed between the process chamber and the pressure control valve.

7. The semiconductor manufacturing machine according to claim 6, characterized in that: A first pressure detector and a first isolation valve are also provided between the process chamber and the pressure control valve. The first pressure detector is used to detect the pressure in the process chamber, and the first isolation valve is used to disconnect or connect the first pressure detector to the process chamber.

8. The semiconductor manufacturing machine according to claim 7, characterized in that: A first pressure relief air path and a second pressure relief air path are also provided between the process chamber and the pressure control valve; the first pressure relief air path includes a differential pressure gauge, a second isolation valve and a fifth pneumatic valve connected in series, and the second pressure relief air path includes a second pressure detector and a sixth pneumatic valve connected in series. The air inlet ends of the fifth pneumatic valve and the sixth pneumatic valve are connected to the process chamber, and the air outlet ends of the fifth pneumatic valve and the sixth pneumatic valve are connected in parallel.

9. The semiconductor manufacturing machine according to claim 8, characterized in that: A third pressure detector is also installed between the process chamber and the pressure control valve.

10. The semiconductor manufacturing machine according to claim 9, characterized in that: A first main valve is installed between the third pressure detector and the pressure control valve, a second main valve is installed between the third isolation valve and the gas extraction and dilution pipeline, and a fourth pneumatic valve and an adjustable manual valve are connected in series between the first main valve and the second main valve.

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