An automatic dispensing and patching assembly equipment for a refrigeration detector

Abstract

The utility model provides a kind of refrigeration detector automatic dispensing patch assembly equipment, it is related to dispensing patch technical field, including the parallel arrangement of X direction and Y direction's dewar feeding assembly, substrate chip feeding assembly, lower vision, micro-motion component, dispensing assembly and manipulator component, micro-motion component includes the chip clamping assembly and UVW platform corresponding to center, UVW platform is equipped with angular positioning member and dewar positioning clamping assembly;Manipulator component grabs dewar tooling assembly in dewar feeding assembly and places on the UVW platform of micro-motion component, dispensing assembly is glued on the surface of dewar product in dewar tooling assembly, manipulator component absorbs substrate in substrate chip feeding assembly, through the central coordinates of lower vision identification, substrate chip is attached to the dewar product of micro-motion component, manipulator component unloads dewar tooling assembly after attaching substrate to dewar feeding assembly in it.The present application realizes the automatic dispensing patch assembly of refrigeration detector, and improves production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of dispensing and patching technology, and in particular to an automatic dispensing and patching assembly device for a cooling detector. Background Technology

[0002] Cooled infrared detectors, as a high-end military imaging product, have high sensitivity, high precision, and a sufficiently wide temperature measurement range, and are widely used in military applications.

[0003] The precision of the dispensing and patch assembly of cooled infrared detectors has a certain impact on the sensitivity and accuracy of the final product's imaging. With the increasing demand for high sensitivity and high accuracy, it is urgent to improve product performance by improving assembly technology.

[0004] Currently, the dispensing and assembly of high-precision cooled infrared detectors is still done manually under an electron microscope, which results in low production efficiency, high skill requirements for personnel, and low yield. There is an urgent need to achieve automated production to solve the problems in the current production process.

[0005] The ability to perform high-precision dispensing and bonding of cooled detectors based on existing dispensing and bonding technology will play a decisive role in the civilian application of cooled infrared detectors. Utility Model Content

[0006] To address the aforementioned problems, this utility model provides an automatic dispensing and bonding assembly device for cooled detectors. By setting up an automatic dispensing and bonding device, the low efficiency of manual dispensing and bonding of cooled detectors is solved, while improving the bonding accuracy and output of cooled detectors.

[0007] To achieve the above objectives, the technical solution of this utility model is implemented as follows:

[0008] An automated dispensing and bonding assembly equipment for a cooled detector includes: a Dewar loading assembly, a substrate chip loading assembly, a lower vision system, a micro-motion assembly, a dispensing assembly, and a robotic arm assembly, all mounted on a frame and arranged parallel to each other in the X and Y directions. The micro-motion assembly includes a chip clamping assembly and a UVW platform with corresponding centers. The UVW platform is provided with corner positioning components and a Dewar positioning and clamping assembly.

[0009] The robotic arm assembly picks up the Dewar fixture assembly from the Dewar loading assembly and places it on the UVW platform of the micro-motion assembly. The corner positioning component and the Dewar positioning clamping assembly limit and fix the Dewar fixture assembly. The dispensing assembly dispenses adhesive onto the surface of the Dewar product in the Dewar fixture assembly. The robotic arm assembly picks up the substrate from the substrate chip loading assembly and identifies the material center coordinates by capturing the lower surface of the substrate with the lower vision camera. Based on the center coordinates, the substrate chip is mounted onto the Dewar product of the micro-motion assembly. The chip clamping assembly restricts the center of the substrate chip to correspond with the center of the Dewar product. The robotic arm assembly unloads the Dewar fixture assembly after mounting the substrate into the Dewar loading assembly.

[0010] As a further improvement of this utility model, the Dewar feeding assembly includes a Dewar feeding TRAY, which has multiple placement positions for placing the Dewar tooling assembly.

[0011] The Dewar tooling assembly includes a Dewar tooling, on which a Dewar product is mounted via angular locating pins and locating pins.

[0012] As a further improvement of this utility model, the substrate chip loading assembly includes a substrate chip loading TRAY and a diode loading TRAY. Both the substrate chip loading TRAY and the diode loading TRAY are provided with multiple placement positions, which are used to place the substrate chip and the diode, respectively.

[0013] As a further improvement of this utility model, the lower vision includes a lower camera and a lower light source. The lower light source provides light for the lower camera to capture the lower surface of the substrate chip, and the lower camera fits the outer contour of the substrate chip to identify the center coordinates.

[0014] As a further improvement of this utility model, the chip clamping assembly is mounted on the frame by a clamping fixing plate. The chip clamping assembly includes a Z module, and a horizontal clamping mounting plate is connected to the Z module. The clamping mounting plate has a U-shaped notch in the center, and two sets of adjustment structures are installed opposite to each other on both sides of the notch.

[0015] The adjustment structure includes an adjustment guide rail slider and an adjustment sliding plate connected together, and a clamping guide rail slider and a clamping sliding plate connected together are mounted on the adjustment sliding plate. A spring, a clamping head and a guide shaft are mounted on the clamping sliding plate. The clamping sliding plate is connected to the output shaft of the clamping cylinder on the clamping mounting plate.

[0016] The cylinder drives the clamping sliding plate, spring, clamping head, and clamping guide slider to slide along the adjusting sliding plate. The two adjusting structures slide relative to each other, and the two clamping heads clamp the chip on the substrate of the Dewar product after the chip is attached at the notch.

[0017] As a further improvement of this utility model, the dispensing assembly includes a vertically mounted and connected dispensing X module, a dispensing Y module, and a dispensing Z module. The dispensing Y module is mounted on the dispensing X module, and a dispensing controller and a syringe are mounted on the dispensing Z module. The dispensing controller and syringe are moved to the Dewar product based on the dispensing X module, the dispensing Y module, and the dispensing Z module. The controller controls the syringe to complete the dispensing operation.

[0018] As a further improvement of this utility model, the robotic arm assembly includes a vertically mounted and connected Y-axis guide rail slider, an X-axis guide rail slider, and a Z-axis assembly. The Y-axis guide rail slider and the X-axis guide rail slider are respectively connected to a Y-axis linear motor and an X-axis linear motor. The Z-axis assembly is mounted on the X-axis guide rail slider structure via a Z-axis mounting plate. The Z-axis assembly includes a first KK module, on which an electric gripper is mounted. The first electric gripper grips the Dewar tooling assembly in the Dewar feeding assembly and places it on the UVW platform of the micro-motion assembly.

[0019] As a further improvement of this utility model, a first voice coil actuator and a second voice coil actuator are also mounted on the Z-axis mounting plate. The first voice coil actuator is used to pick up the chip and the substrate; the second voice coil actuator is used to pick up the diode.

[0020] As a further improvement of this utility model, a second KK module is also installed on the Z-axis mounting plate. The second KK module includes a first upper vision, which includes a first upper light source, a second upper light source, and a first upper camera that are installed in conjunction with it.

[0021] The first upper camera and the second upper light source identify defects and dirt on the substrate and chip surface during the substrate or chip loading process, and identify the coordinate position of the chip or substrate when the first voice coil actuator picks up the chip or substrate. The first upper camera and the first upper light source determine whether the state of the Dewar product after dispensing adhesive meets the mounting requirements.

[0022] As a further improvement of this utility model, the second KK module also includes a second upper vision, which includes a third upper light source and a second upper camera that are installed in conjunction with it.

[0023] The second upper camera and the third upper light source identify the position of the diode when the second voice coil actuator picks up the diode, and identify the coordinates of the marked points on the substrate and chip during the chip position fine-tuning process.

[0024] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0025] This utility model has been approved. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the complete structure of an automatic dispensing and patching assembly device for a cooling detector, as disclosed in one embodiment of this utility model.

[0027] Figure 2 This is a schematic diagram of the Dewar feeding structure disclosed in one embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the Dewar tooling assembly structure disclosed in one embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of a substrate chip loading structure disclosed in one embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of a substrate chip shaping structure disclosed in one embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of the lower visual structure disclosed in one embodiment of the present utility model;

[0032] Figure 7 This is a schematic diagram of the micro-motion component structure disclosed in one embodiment of the present invention;

[0033] Figure 8 This is a schematic diagram of the chip clamping assembly structure disclosed in one embodiment of the present invention;

[0034] Figure 9 This is a schematic diagram of the dispensing assembly structure disclosed in one embodiment of the present utility model;

[0035] Figure 10 This is a schematic diagram of the robotic arm component structure disclosed in one embodiment of the present invention;

[0036] Figure 11 This is a schematic diagram of the Z-axis assembly structure of a robotic arm disclosed in one embodiment of the present invention;

[0037] Figure 12 This is a schematic diagram of the frame structure disclosed in one embodiment of the present utility model.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Dewar loading assembly; 1.1 Dewar loading tray; 1.2 Dewar tooling assembly; 1.2.1 Dewar tooling; 1.2.2 Angle positioning pin; 1.2.3 Positioning pin; 1.2.4 Dewar product; 2. Substrate chip loading assembly; 2.1 Positioning component; 2.2 Substrate chip loading tray; 2.3 Cam quick-lock clamp;

[0040] 2.4 Diode loading tray; 2.5 Corner positioning component; 2.6 Chip shaping assembly; 2.6.1 Shaping platform; 2.6.2 Cylinder mounting component; 2.6.3 Single-acting miniature cylinder; 2.6.4 Shaping push rod;

[0041] 2.6.5, Adsorption port; 2.6.7, Pipe connector; 3, Lower vision; 3.1, Lower camera; 3.2, Lower light source;

[0042] 4. Micro-motion components; 4.1. Dewar positioning and clamping components; 4.2. UVW platform; 4.3. Corner positioning components;

[0043] 4.4 Chip clamping assembly; 4.4.1 Clamping fixing plate; 4.4.2 Clamping mounting plate; 4.4.3 Adjusting guide rail slider; 4.4.4 Adjusting sliding plate; 4.4.5 Clamping guide rail slider; 4.4.6 Clamping sliding plate; 4.4.7 Spring; 4.4.8 Clamping head; 4.4.9 Guide shaft; 4.4.10 Clamping cylinder; 4.4.11 Z-module; 5. Dispensing assembly; 5.1 Dispensing controller and syringe; 5.2 Pre-dispensing position; 5.3 Needle calibration sensor; 5.4 Dispensing X-module; 5.5 Dispensing Y-module; 5.6 Dispensing Z-module; 6. Robotic arm assembly; 6.1 Y-axis guide rail slider; 6.2 Y-axis linear motor; 6.3 Z-axis assembly;

[0044] 6.3.1 Z-axis mounting plate; 6.3.2 First KK module; 6.3.3 Electric gripper; 6.3.4 First voice coil actuator; 6.3.5 Second voice coil actuator; 6.3.6 First upper light source; 6.3.7 Second upper light source; 6.3.8 First upper camera; 6.3.9 Third upper light source; 6.3.10 Second upper camera; 6.3.11 Second KK module; 6.4 X-axis linear motor; 6.5 X-axis guide rail slider; 7. Frame; 7.1 Marble platform; 7.2 Welded steel frame. Detailed Implementation

[0045] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0046] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0047] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0048] The present invention will now be described in further detail with reference to the accompanying drawings:

[0049] like Figure 1 As shown, an automated dispensing and assembly equipment for a cooled detector includes: a Dewar loading assembly 1, a substrate chip loading assembly 2, a lower vision system 3, a micro-motion assembly 4, a dispensing assembly 5, and a robotic arm assembly 6, all arranged parallel to each other in the X and Y directions on a marble platform 7.1 above a frame 7. During the handling and transfer of the Dewar tooling assembly, no angular rotation is required. Figure 7 As shown, the micro-motion component 4 includes a chip clamping component 4.4 and a UVW platform 4.2 with the center corresponding to each other. The UVW platform 4.2 is provided with corner positioning components 4.3, 2.5, 2.1 and Dewar positioning clamping component 4.1.

[0050] The robotic arm assembly 6 picks up the Dewar tooling assembly from the Dewar loading assembly 1 and places it on the UVW platform 4.2 of the micro-motion assembly 4. The corner positioning components 4.3, 2.5, and 2.1 and the Dewar positioning and clamping assembly 4.1 limit and fix the Dewar tooling assembly. The dispensing assembly 5 dispenses adhesive onto the surface of the Dewar product 1.2.4 in the Dewar tooling assembly. The robotic arm assembly 6 picks up the substrate from the substrate chip loading assembly 2 and uses the lower vision 3 to capture the material center coordinates on the lower surface of the substrate. Based on the center coordinates, the substrate chip is mounted onto the Dewar product 1.2.4 of the micro-motion assembly 4. The chip clamping assembly 4.4 restricts the center of the substrate chip to correspond with the center of the Dewar product 1.2.4. The robotic arm assembly 6 then unloads the Dewar tooling assembly after mounting the substrate into the Dewar loading assembly 1.

[0051] Specifically,

[0052] In this utility model, such as Figure 2 As shown, the Dewar feeding assembly 1 includes a Dewar feeding TRAY1.1, which has multiple placement positions for placing Dewar tooling assemblies;

[0053] like Figure 3 As shown, the Dewar tooling assembly includes a Dewar tooling, on which a Dewar product 1.2.4 is mounted via angle positioning pins 1.2.3 and 1.2.2 and positioning pin 1.2.3. After being positioned on the Dewar tooling, the Dewar product 1.2.4 is placed on the Dewar loading TRAY1.1 for loading. Throughout the loading process, pins and pin holes are provided for coarse positioning and error prevention.

[0054] In this utility model, such as Figure 4 As shown, the substrate chip loading assembly 2 includes a substrate chip loading TRAY 2.2, a diode loading TRAY, and a chip shaping assembly 2.6. Both the substrate chip loading TRAY 2.2 and the diode loading TRAY have multiple placement positions for placing the substrate chip and the diode, respectively. The substrate chip loading TRAY 2.2 has a positioning component 2.1 mounted on its side, and both the substrate chip loading TRAY 2.2 and the diode loading TRAY have cam quick-lock clamps 2.3 mounted on their sides. The cam quick-lock clamps 2.3 cooperate with the positioning component 2.1 and the corner positioning components 4.3, 2.5, and 2.1 to form a positioning + clamping closed loop, ensuring the positional accuracy of the substrate and chip in the substrate chip loading TRAY 2.2 and the diode in the diode loading TRAY.

[0055] like Figure 5As shown, the shaping platform 2.6.1 is mounted on the substrate chip loading assembly 2. The shaping platform 2.6.1 is provided with adsorption holes 2.6.5, which communicate with the pipe connector 2.6.7 mounted on it. A shaping push rod 2.6.4 is also installed below the shaping platform 2.6.1. The shaping push rod 2.6.4 is mounted on a single-acting micro cylinder 2.6.3 and is mounted on the lower side of the shaping platform 2.6.1 through a cylinder mounting part 2.6.2. When the chip is placed on the adsorption hole 2.6.5 on the shaping platform 2.6.1, the single-acting micro cylinder 2.6.3 drives the shaping push rod 2.6.4 to push the chip to adjust its position. Then, the chip is fixed by vacuum through the pipe connector 2.6.7.

[0056] like Figure 6 As shown, the lower vision 3 includes a lower camera 3.1 and a lower light source 3.2. The lower light source 3.2 provides light for the lower camera 3.1 to capture images of the lower surface of the substrate chip. On the one hand, the lower vision 3 is used to detect defects on the lower surface of the substrate and chip during substrate and chip loading. On the other hand, after the substrate and chip are picked up, the lower vision 3 fits the outer contour of the substrate chip to identify the center coordinates, which serves as the basis for alignment and improves the accuracy of material attachment. At the same time, the lower vision 3 archives each recognition process and result.

[0057] like Figure 8 As shown, the components on the left and right sides of the chip clamping assembly 4.4 are symmetrically arranged, and the chip clamping assembly 4.4 is mounted on the marble platform 7.1 of the frame 7 via the clamping fixing plate 4.4.1. The chip clamping assembly 4.4 includes a Z module 4.4.11, and a horizontal clamping mounting plate 4.4.2 is connected to the Z module 4.4.11. The clamping mounting plate 4.4.2 has a U-shaped notch in the center, and two sets of adjustment structures are installed opposite each other on both sides of the notch.

[0058] The adjustment structure includes an adjustment guide rail slider 4.4.3 and an adjustment sliding plate 4.4.4 connected together. The adjustment sliding plate 4.4.4 is equipped with a clamping guide rail slider 4.4.5 and a clamping sliding plate 4.4.6 connected together. The clamping sliding plate 4.4.6 is equipped with a spring 4.4.7, a clamping head 4.4.8 and a guide shaft 4.4.9. The clamping sliding plate 4.4.6 is connected to the output shaft of the clamping cylinder 4.4.10 on the clamping mounting plate 4.4.2.

[0059] The cylinder drives the clamping sliding plate 4.4.6, spring 4.4.7, clamping head 4.4.8, and clamping guide slider 4.4.5 to slide along the adjusting sliding plate 4.4.4. The two adjusting structures slide relative to each other. The two clamping heads 4.4.8 clamp the chip on the substrate of the Dewar product 1.2.4 after it has been attached at the notch. The upper vision on the robot arm assembly 6 captures the coordinates of the Mark point on the chip and the Mark point on the substrate, and calculates the offset of X / Y / θ between the Mark point coordinates of the chip and the Mark point coordinates of the substrate. Then the UVW platform 4.2 moves to achieve precise adjustment of the chip position after it has been attached.

[0060] In this utility model, such as Figure 9 As shown, the dispensing assembly 5 includes a vertically mounted and connected dispensing X module 5.4, a dispensing Y module 5.5, and a dispensing Z module 5.64.4.11. The dispensing Y module 5.5 is mounted on the dispensing X module 5.4. The dispensing Z module 5.64.4.11 is equipped with a dispensing controller and a syringe 5.1. The dispensing controller and syringe 5.1 are moved to the Dewar product 1.2.4 based on the dispensing X module 5.4, the dispensing Y module 5.5, and the dispensing Z module 5.64.4.11. The controller controls the syringe to complete the dispensing operation.

[0061] The dispensing X module 5.4 is equipped with a pre-dispensing position 5.2 and a needle calibration sensor 5.3 on its side. Before the actual dispensing operation, the needle calibration sensor 5.3 identifies the X, Y, and Z coordinates of the needle in the replacement syringe and compares them with the X, Y, and Z coordinates of the previously tested needle. The difference is then supplemented to achieve automatic calibration of the needle. A small amount of test glue is then applied at the pre-dispensing position 5.2 to stabilize the glue volume, shape, and position. During dispensing, the dispensing controller and syringe 5.1 are precisely moved along the dispensing X module 5.4, dispensing Y module 5.5, and dispensing Z module 5.6 to the Dewar product 1.2.4. The controller controls the syringe to dispense the preset dispensing pattern on the patch mounting surface of the Dewar product 1.2.4 with a precise glue volume, completing the synchronous shape and precise dispensing operation.

[0062] In this utility model, such as Figure 10As shown, the robotic arm assembly 6 includes a vertically mounted and connected Y-axis guide rail slider 6.1, X-axis guide rail slider 6.5, and Z-axis assembly 6.3. The Y-axis guide rail slider 6.1 and X-axis guide rail slider 6.5 are respectively connected to a Y-axis linear motor 6.2 and an X-axis linear motor 6.4. The Y-axis guide rail slider 6.1 and the Y-axis linear motor 6.2 are arranged in parallel to each other to increase structural rigidity, and the X-axis guide rail slider 6.5 and the X-axis linear motor 6.4 are also arranged in parallel to each other to increase structural rigidity. The Z-axis assembly 6.3 is mounted on the X-axis guide rail slider 6.5 structure via a Z-axis mounting plate 6.3.1. The Z-axis assembly 6.3 includes a first KK module 6.3.2, on which an electric gripper 6.3.3 is mounted. The first electric gripper 6.3.3 grasps the Dewar tooling assembly in the Dewar loading assembly 1 and places it on the UVW platform 4.2 of the micro-motion assembly 4.

[0063] Among them, such as Figure 11 As shown, a first voice coil actuator 6.3.4 and a second voice coil actuator 6.3.5 are also mounted on the Z-axis mounting plate 6.3.1. The first voice coil actuator 6.3.4 is used to pick up the chip and the substrate; the second voice coil actuator 6.3.5 is used to pick up the diode.

[0064] Furthermore, such as Figure 11 The Z-axis mounting plate 6.3.1 shown is also equipped with a second KK module 6.3.11. The second KK module 6.3.11 includes a first upper vision, which includes a first upper light source 6.3.6, a second upper light source 6.3.7, and a first upper camera 6.3.8 that are installed in conjunction with it.

[0065] The first upper camera 6.3.8 and the second upper light source 6.3.7 identify defects and dirt on the surface of the substrate and chip during the substrate or chip loading process, and the first voice coil actuator 6.3.4 identifies the coordinate position of the chip or substrate when picking it up. The first upper camera 6.3.8 and the first upper light source 6.3.6 determine whether the state of the Dewar product 1.2.4 after dispensing meets the mounting requirements.

[0066] The second KK module 6.3.11 also includes a second upper vision, which includes a third upper light source 6.3.9 and a second upper camera 6.3.10 that are installed in conjunction with it;

[0067] The second upper camera 6.3.10 and the third upper light source 6.3.9 identify the position of the diode when the second voice coil actuator 6.3.5 picks up the diode, and identify the coordinates of the marked points on the substrate and the chip during the chip position fine adjustment process.

[0068] The system archives each recognition process and result.

[0069] Example:

[0070] The automatic dispensing and bonding equipment of this invention is used for the automatic dispensing and bonding of cooling detectors. The process includes:

[0071] Step 1: The robotic arm component 6 controls the electric gripper 6.3.3 to move to the position of a Dewar tooling component in the Dewar loading TRAY1.1 and grab the Dewar tooling component;

[0072] Step 2: The robotic arm assembly 6 controls the electric gripper 6.3.3 and the Dewar tooling assembly to move onto the UVW platform 4.2 of the micro-motion assembly 4. The Dewar positioning and clamping assembly 4.1 on the UVW platform 4.2 clamps the Dewar tooling assembly and cooperates with the corner positioning parts 4.32.52.1 to limit the Dewar tooling assembly.

[0073] Step 3: The dispensing assembly 5 controls the dispensing controller and syringe 5.1 to move precisely in the X, Y, and Z directions, so that the lower end of the syringe is aligned with the patch mounting surface of the Dewar product 1.2.4 on the UVW platform 4.2. The syringe is controlled to accurately dispense the glue amount to complete the precise dispensing of the preset dispensing pattern on the patch mounting surface of the Dewar product 1.2.4.

[0074] Step 4: The robotic arm assembly 6 uses the first upper vision to identify defects and dirt on the substrate and chip surface. If there are no defects or dirt, it further identifies the coordinate position of the substrate or chip.

[0075] Step 5: The first voice coil actuator 6.3.4 picks up the substrate or chip according to the coordinate position of the substrate or chip identified by the first upper vision. The robot arm assembly 6 controls the first voice coil actuator 6.3.4 to move the substrate or chip to above the surface of the Dewar product 1.2.4 on the UVW platform 4.2.

[0076] Step 6: The first upper vision determines whether the state of the Dewar product 1.2.4 after dispensing meets the mounting requirements. The lower vision 3 captures the lower surface of the substrate and the chip. By fitting the outer contour of the material, the center coordinates of the material are identified, and these coordinates are used as the basis for alignment.

[0077] Step 7: Apply adhesive to Dewar product 1.2.4 to meet the mounting requirements. The first voice coil actuator 6.3.4 mounts the substrate and chip onto the Dewar product 1.2.4 of the micro-motion component 4 according to the center coordinates of the lower surface of the substrate and the chip obtained by the lower vision 3.

[0078] Step 8: The chip clamping component 4.4 of the micro-motion component 4 clamps the chip after it is mounted. The upper vision system captures the coordinates of the Mark point on the chip and the Mark point on the substrate, calculates the X / Y / θ offset between the Mark point coordinates of the chip and the Mark point coordinates of the substrate, and then the UVW platform 4.2 moves to precisely adjust the position of the chip after it is mounted.

[0079] Step 9: The electric gripper 6.3.3 of the robotic arm assembly 6 unloads the Dewar tooling assembly after the substrate is mounted into the Dewar loading assembly 1.

[0080] Advantages of this utility model:

[0081] This invention uses suction cups of different sizes on the first and second voice coil motors of the robotic arm assembly to pick up chips, substrates and diodes of different sizes. At the same time, the second KK module is equipped with large field of view and small field of view vision to achieve high-precision identification and positioning of products of different sizes. This enables a single device to perform one-time surface mount assembly of chips, substrates and diodes with large differences in shape and size.

[0082] This invention improves the assembly accuracy of patch mounting by using a robotic arm component for initial patch assembly and then using a UVW micro-motion platform in conjunction with vision for micro-adjustment.

[0083] This invention uses top and bottom vision to visually inspect and archive the product code, the top and bottom surfaces of the patch product, and the effect after dispensing, thus achieving pre-assembly inspection and traceability of the product manufacturing process.

[0084] The above are merely preferred embodiments of this utility model and do not limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An automatic dispensing and assembly equipment for a cooled detector, characterized in that, include: The Dewar loading assembly, substrate chip loading assembly, lower vision, micro-motion assembly, dispensing assembly and robot assembly are arranged on the rack with the X and Y directions parallel to each other. The micro-motion assembly includes a chip clamping assembly and a UVW platform with corresponding centers. The UVW platform is provided with corner positioning components and Dewar positioning clamping assembly. The robotic arm assembly picks up the Dewar fixture assembly from the Dewar loading assembly and places it on the UVW platform of the micro-motion assembly. The corner positioning component and the Dewar positioning clamping assembly limit and fix the Dewar fixture assembly. The dispensing assembly dispenses adhesive onto the surface of the Dewar product in the Dewar fixture assembly. The robotic arm assembly picks up the substrate from the substrate chip loading assembly and identifies the material center coordinates by capturing the lower surface of the substrate with the lower vision camera. Based on the center coordinates, the substrate chip is mounted onto the Dewar product of the micro-motion assembly. The chip clamping assembly restricts the center of the substrate chip to correspond with the center of the Dewar product. The robotic arm assembly unloads the Dewar fixture assembly after mounting the substrate into the Dewar loading assembly.

2. The automatic dispensing and bonding assembly equipment for cooled detectors according to claim 1, characterized in that: The Dewar feeding assembly includes a Dewar feeding TRAY, which has multiple placement positions for placing the Dewar tooling assembly; The Dewar tooling assembly includes a Dewar tooling, on which a Dewar product is mounted via angular locating pins and locating pins.

3. The automatic dispensing and bonding assembly equipment for the cooled detector according to claim 1, characterized in that: The substrate chip loading assembly includes a substrate chip loading TRAY and a diode loading TRAY. Both the substrate chip loading TRAY and the diode loading TRAY are provided with multiple placement positions for placing the substrate chip and the diode, respectively.

4. The automatic dispensing and assembly equipment for cooled detectors according to claim 1, characterized in that: The lower vision includes a lower camera and a lower light source. The lower light source provides light for the lower camera to capture images of the lower surface of the substrate chip. The lower camera fits the outer contour of the substrate chip to identify the center coordinates.

5. The automatic dispensing and bonding assembly equipment for cooled detectors according to claim 1, characterized in that: The chip clamping assembly is mounted on the frame via a clamping fixing plate. The chip clamping assembly includes a Z module, on which a horizontal clamping mounting plate is connected. The clamping mounting plate has a U-shaped notch in the center, and two sets of adjustment structures are installed opposite each other on both sides of the notch. The adjustment structure includes an adjustment guide rail slider and an adjustment sliding plate connected together, and a clamping guide rail slider and a clamping sliding plate connected together are mounted on the adjustment sliding plate. A spring, a clamping head and a guide shaft are mounted on the clamping sliding plate. The clamping sliding plate is connected to the output shaft of the clamping cylinder on the clamping mounting plate. The cylinder drives the clamping sliding plate, spring, clamping head, and clamping guide slider to slide along the adjusting sliding plate. The two adjusting structures slide relative to each other, and the two clamping heads clamp the chip on the substrate of the Dewar product after the chip is attached at the notch.

6. The automatic dispensing and bonding assembly equipment for cooled detectors according to claim 1, characterized in that: The dispensing assembly includes a vertically mounted and connected dispensing X module, a dispensing Y module, and a dispensing Z module. The dispensing Y module is mounted on the dispensing X module, and the dispensing Z module is equipped with a dispensing controller and a syringe. The dispensing controller and syringe are moved onto the Dewar product based on the dispensing X module, the dispensing Y module, and the dispensing Z module. The controller controls the syringe to complete the dispensing operation.

7. The automatic dispensing and bonding assembly equipment for cooled detectors according to claim 1, characterized in that: The robotic arm assembly includes a vertically mounted and connected Y-axis guide rail slider, an X-axis guide rail slider, and a Z-axis assembly. The Y-axis guide rail slider and the X-axis guide rail slider are respectively connected to a Y-axis linear motor and an X-axis linear motor. The Z-axis assembly is mounted on the X-axis guide rail slider structure via a Z-axis mounting plate. The Z-axis assembly includes a first KK module, on which an electric gripper is mounted. The first electric gripper grasps the Dewar tooling assembly in the Dewar feeding assembly and places it on the UVW platform of the micro-motion assembly.

8. The automatic dispensing and assembly equipment for cooled detectors according to claim 7, characterized in that: The Z-axis mounting plate is also equipped with a first voice coil actuator and a second voice coil actuator. The first voice coil actuator is used to pick up the chip and the substrate; the second voice coil actuator is used to pick up the diode.

9. The automatic dispensing and bonding assembly equipment for the cooled detector according to claim 8, characterized in that: The Z-axis mounting plate is also equipped with a second KK module, which includes a first upper vision, and the first upper vision includes a first upper light source, a second upper light source and a first upper camera that are installed in conjunction with it. The first upper camera and the second upper light source identify defects and dirt on the substrate and chip surface during the substrate or chip loading process, and identify the coordinate position of the chip or substrate when the first voice coil actuator picks up the chip or substrate. The first upper camera and the first upper light source determine whether the state of the Dewar product after dispensing adhesive meets the mounting requirements.

10. The automatic dispensing and bonding assembly equipment for the cooled detector according to claim 9, characterized in that: The second KK module also includes a second upper vision, which includes a third upper light source and a second upper camera that are installed in conjunction with it. The second upper camera and the third upper light source identify the position of the diode when the second voice coil actuator picks up the diode, and identify the coordinates of the marked points on the substrate and chip during the chip position fine-tuning process.

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