Filter valve for a gumming and developing apparatus and gumming and developing apparatus

CN224919886UActive Publication Date: 2026-10-30BEIJING YANDONG MICROELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202522630238.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-11
Publication Date
2026-10-30
Estimated Expiration
2035-12-11

AI Technical Summary

Technical Problem

然而,随着机台长时间使用,冷却液供应箱内排出的液体带出的杂质越来越多,造成液体在经过过滤阀时内部遇阻而反向溢出,污染冷却液供应箱,从而造成机台故障

Benefits of technology

[0009]本实用新型提供的清洗机的清洗盘,通过使得第一直径小于第二直径,第二直径小于第三直径,并且第一直径、第二直径和第三直径满足关系式Ⅰ,至少抑制了冷却液的反向溢出,减少了因堵塞冷却液反向溢出污染却液供应箱的频率。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment provides filter valve and gumming developing equipment. Filter valve includes: valve body, valve body includes valve body cavity, valve body cavity includes liquid inlet, liquid outlet and is located between liquid inlet and liquid outlet's filter cavity, filter cavity has the liquid inlet close to liquid inlet and the liquid outlet away from liquid inlet, filter core is located in filter cavity, wherein, in the direction perpendicular to liquid inlet towards liquid outlet, the cross section shape of valve body cavity is circular, liquid inlet has first diameter, liquid inlet and liquid outlet have second diameter, and liquid outlet has third diameter, wherein, first diameter is less than second diameter, second diameter is less than third diameter, and first diameter, second diameter and third diameter satisfy the following relation formula: wherein, first diameter is D1, second diameter is D2, and third diameter is D3. The utility model at least has reduced the frequency of pollution liquid supply tank because of the blockage reverse overflow.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically providing a filter valve for a coating and developing equipment and a coating and developing equipment. Background Technology

[0002] Photoresist coating and developing equipment is a key piece of equipment in the photolithography process of semiconductor manufacturing. It is mainly used for the photoresist coating and developing processes in semiconductor photolithography. The performance of the photoresist coating and developing equipment directly affects the formation of fine exposure patterns in the photolithography process, as well as the pattern quality in the developing process. It has a significant impact on the pattern transfer results in subsequent processes such as etching and ion implantation, and is an indispensable key piece of equipment in the semiconductor integrated circuit manufacturing process.

[0003] The cooling unit, as an auxiliary structure of the coating and developing equipment, typically includes a connected spin coating / developing unit, a coolant supply tank, and a filtration module. Coolant from the supply tank is pumped into the spin coating / developing unit to cool the wafers; the cooled coolant, after heat exchange, returns to the supply tank via pipes. To maintain a constant temperature in the supply tank, coolant is typically replenished, and hotter liquid is drained. During the draining process, the liquid discharged from the supply tank is filtered to remove impurities (such as copper rust) before being discharged.

[0004] The filtration module includes a filter valve, whose valve body contains a filter element (also called a filter screen) to remove impurities from the liquid. However, with prolonged use, the liquid discharged from the coolant supply tank carries away increasing amounts of impurities. This causes the liquid to encounter resistance when passing through the filter valve, resulting in backflow and contamination of the coolant supply tank, leading to machine malfunctions. Furthermore, the difficulty in cleaning clogged pipes leads to lengthy repair times, reducing production output. Therefore, an improved filter valve is desired to facilitate liquid drainage, shorten repair time, and extend equipment lifespan. Utility Model Content

[0005] To address the aforementioned technical problems, the filter valve provided by this utility model at least suppresses the backflow of coolant when blockage occurs inside the filter valve, thereby reducing the frequency of coolant backflow contaminating the coolant supply tank due to blockage.

[0006] In one aspect, this utility model provides a filter valve for a cooling unit of a coating and developing equipment. The filter valve includes: a valve body, the valve body including a valve body cavity, the valve body cavity including a liquid inlet, a liquid outlet, and a filter cavity located between the liquid inlet and the liquid outlet, the filter cavity having a liquid inlet near the liquid inlet and a liquid outlet away from the liquid inlet; and a filter element located in the filter cavity; wherein, in a direction perpendicular to the liquid inlet towards the liquid outlet, the cross-sectional shape of the valve body cavity is circular, the liquid inlet has a first diameter, the liquid inlet and the liquid outlet have second diameters, and the liquid outlet has a third diameter, wherein the first diameter is smaller than the second diameter, the second diameter is smaller than the third diameter, and the first diameter, the second diameter, and the third diameter satisfy the following relationship:

[0007] ,

[0008] The first diameter is D1, the second diameter is D2, and the third diameter is D3.

[0009] The cleaning disc of the cleaning machine provided by this utility model, by making the first diameter smaller than the second diameter, the second diameter smaller than the third diameter, and the first diameter, the second diameter and the third diameter satisfying relation I, at least suppresses the back overflow of coolant and reduces the frequency of back overflow of coolant contaminating the coolant supply tank due to blockage.

[0010] In some feasible embodiments of the filter valve for the cooling unit of the coating and developing equipment described above, the valve body cavity further includes a first buffer cavity connected between the inlet and the filter cavity, wherein the diameter of the first buffer cavity gradually increases from a first diameter to a second diameter in the direction from the inlet to the outlet.

[0011] In some feasible embodiments of the filter valve for the cooling unit of the coating and developing equipment described above, the valve body cavity further includes a second buffer cavity connected between the liquid outlet and the filter cavity, wherein the diameter of the second buffer cavity gradually increases from a second diameter to a third diameter in the direction from the liquid inlet to the liquid outlet.

[0012] In some feasible embodiments of the filter valve for the cooling unit of the coating and developing equipment described above, the diameter of the filter chamber remains constant.

[0013] In some feasible embodiments of the filter valve for the cooling unit of the coating and developing equipment described above, the diameter of the filter chamber gradually increases from the second diameter to the fourth diameter in the direction from the inlet to the outlet, and then gradually decreases from the fourth diameter to the second diameter, wherein the fourth diameter is smaller than the third diameter.

[0014] In some feasible embodiments of the filter valve for the cooling unit of the coating and developing equipment described above, the first diameter is greater than 9.5 mm and less than 12.13 mm, and the second and third diameters are both greater than 12.13 mm and less than 20 mm.

[0015] In some feasible embodiments of the filter valve for the cooling unit of the coating and developing equipment described above, the first diameter is greater than 9.5 mm and less than 12.13 mm, and the second, third and fourth diameters are all greater than 12.13 mm and less than 20 mm.

[0016] In one aspect of this utility model, a photoresist coating and developing apparatus is provided, comprising a loading unit configured to receive a wafer; a robotic arm configured to transfer the wafer from the loading unit to a photoresist coating / developing unit; a photoresist coating / developing unit configured to coat the wafer with photoresist and develop the photoresist; and a cooling unit configured to cool the cold plate of the photoresist coating / developing unit, wherein the cooling unit includes a filter valve as described in any of the foregoing technical solutions.

[0017] In some feasible embodiments of the above-described coating and developing equipment, the cooling unit includes: a coolant supply tank configured to store coolant; a supply pump configured to pump the coolant from the coolant supply tank to the coating / developing unit; a sensor configured to send a replenishment signal to the control module when the coolant temperature is higher than a first set temperature, and to send a replenishment stop signal to the control module when the coolant temperature is lower than a second set temperature; a control module configured to replenish and stop replenishing the coolant supply tank according to the replenishment signal and the replenishment stop signal sent by the sensor; and a filtration module including a filter valve configured to filter the coolant discharged from the coolant supply tank when replenishing the coolant supply tank.

[0018] Those skilled in the art will understand that, since the coating and developing equipment includes the filter valve in any of the aforementioned technical solutions, it possesses all the technical effects that the aforementioned coating and developing equipment can achieve, and will not be elaborated further here. Attached Figure Description

[0019] The preferred embodiments of this utility model are described below with reference to the accompanying drawings, in which:

[0020] Figure 1 A cross-sectional schematic diagram of the filter valve provided in an embodiment of this utility model;

[0021] Figure 2 for Figure 1 A top view of the filter valve;

[0022] Figure 3 A cross-sectional schematic diagram of a filter valve provided in another embodiment of the present invention;

[0023] Figure 4 for Figure 3 A top view of the filter valve;

[0024] Figure 5 A simplified block diagram of the coating and developing equipment provided in this embodiment of the utility model; Detailed Implementation

[0025] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. Those skilled in the art can make adjustments as needed to adapt to specific applications. To better illustrate the present invention, numerous specific details are provided in the following detailed description. Those skilled in the art should understand that the present invention can be implemented even without certain specific details.

[0026] In the description of this utility model, terms such as "upper," "lower," "inner," "outer," "left," "right," "front," and "rear," which indicate direction or positional relationships, are based on the actual direction or positional relationships in practical application. These terms are used merely for ease of description and do not indicate or imply that the device to be protected must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, ordinal numbers such as "first" and "second" are used only for convenience of explanation and are not used to indicate or imply relative importance.

[0027] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] To reduce the frequency of coolant backflow and contamination of the coolant supply tank due to filter valve blockage, embodiments of this application provide a filter valve for a coating and developing equipment, such as... Figures 1 to 2As shown, the filter valve includes a valve body 100 and a filter element (not shown). The valve body 100 includes a valve body cavity, which includes an inlet 100a, an outlet 100b, and a filter chamber 102 located between the inlet 100a and the outlet 100b. The filter element is located in the filter chamber 102. The filter chamber 102 has a liquid inlet 102a near the inlet 100a and a liquid outlet 102b away from the inlet 100b. The cross-sectional shape of the valve body cavity (i.e., the shape of the valve body cavity taken in a direction perpendicular to the inlet and outlet (i.e., perpendicular to the direction of liquid flow inside the valve body cavity) is circular. The inlet 100a of the valve body cavity has a first diameter D1, the liquid inlet 102a and the liquid outlet 102b of the filter chamber 102 both have a second diameter D2, and the outlet 100b of the valve body cavity has a third diameter D3. The second diameter D2 is greater than the first diameter D1 and less than the third diameter D3, and the first diameter D1, the second diameter D2, and the third diameter D3 are set to satisfy the following relationship (relationship I):

[0029] .

[0030] In this embodiment of the invention, the diameters of the liquid inlet and outlet of the filter chamber are set to be larger than the diameter of the liquid inlet of the valve body cavity and smaller than the diameter of the liquid outlet of the valve body cavity. Simultaneously, the diameters of the liquid inlet of the valve body cavity, the liquid inlet and outlet of the filter chamber, and the liquid outlet of the valve body cavity are set to satisfy the above relationship (Ⅰ). This ensures that the pressure of the coolant at the liquid inlet of the filter valve body cavity is greater than the pressure of the coolant at the liquid inlet and outlet of the filter chamber, and the pressure of the coolant at the liquid inlet and outlet of the filter chamber is greater than the pressure of the coolant at the liquid outlet of the filter valve body cavity. Furthermore, the pressure difference between the liquid inlet of the valve body cavity and the liquid inlet of the filter chamber is greater than the pressure difference between the liquid outlet of the filter chamber and the liquid outlet of the valve body cavity. Compared to existing filter valves with a constant valve body cavity diameter, the embodiment provided by this invention increases the liquid discharge efficiency, thereby suppressing the backflow of coolant when blockage occurs inside the filter valve and reducing the frequency of backflow contamination of the coolant supply tank due to blockage.

[0031] Specifically, based on the relationship between the coolant flow velocity V and the valve body cavity diameter D (relationship II), it can be determined that the coolant flow velocity V is inversely proportional to the square of the valve body cavity diameter D:

[0032] (II);

[0033] Where V is the flow velocity of the liquid through the filter valve, Q is the volume of liquid flowing through the filter valve per unit time, and S is the cross-sectional area of ​​the valve body cavity.

[0034] Based on Bernoulli's formula (relation III) and relation II above, relation IV can be derived:

[0035] (III)

[0036] (IV)

[0037] Where P is the pressure of the liquid flowing through the filter valve, and ρ is the density of the liquid. According to equation IV, when the diameter of the valve body cavity increases, the pressure P will decrease accordingly. Based on the pressure formula (equation V) and the above equation IV, equation VI can be derived:

[0038] (V)

[0039] (VI)

[0040] Where F is the pressure applied when the liquid flows through the filter valve.

[0041] Currently, the diameter of the valve body cavity in existing filter valves is uniform (e.g., 9mm), and the diameter of the pipe connected to the inlet of the filter valve body cavity (e.g., 9.5mm) is slightly larger than the diameter of the valve body cavity. In this case, when the coolant encounters impurities (such as copper rust) inside the filter element and becomes clogged, strong resistance is formed, resulting in the pressure inside the valve body cavity being greater than the pressure at the inlet of the valve body cavity. This causes the liquid flowing into the valve body cavity to flow back into the coolant supply tank. However, the pressure inside the valve body cavity cannot be too low either. If the pressure F1 inside the valve body cavity is too low, it will not be conducive to the discharge of liquid, and liquid accumulation will also occur.

[0042] Next, refer to Figure 1 and Figure 2 When the coolant flows through the filter valve, assuming the pressure at the inlet 100a of the valve body cavity is the first pressure F1, the pressure at the liquid inlet 102a and liquid outlet 102b of the filter cavity 102 is the second pressure F2, and the pressure at the outlet 100b of the valve body cavity is the third pressure F3, the inventors discovered that the liquid flow effect is optimal when F1-F2>F2-F3, thus deriving the above relationship I.

[0043] Therefore, by using the filter valve provided by this utility model, the pressure of the coolant at the inlet of the valve body cavity is greater than the pressure of the coolant at the liquid inlet of the filter cavity, and the pressure at the liquid inlet of the filter cavity is greater than the pressure of the coolant at the outlet of the valve body cavity. Simultaneously, the first diameter, the second diameter, and the third diameter satisfy the aforementioned relationship I. This ensures that the pressure difference between the inlet 100a of the valve body cavity and the liquid inlet 102a of the filter cavity 102 is greater than the pressure difference between the liquid outlet 102b and the outlet 100b of the filter cavity 102. This facilitates the flow of liquid into the filter element to the outlet, thereby increasing the liquid discharge efficiency. Furthermore, it suppresses the backflow of coolant when blockage occurs inside the filter valve. It also reduces the frequency of backflow of coolant contaminating the coolant supply tank due to blockage. Accordingly, by modifying the internal structure of the filter valve body cavity, the stable operation of the spin coating and developing equipment is ensured while reducing maintenance difficulty, labor costs, and installation costs, and improving process stability.

[0044] Although the cross-sectional shape of the valve body cavity is circular in the direction perpendicular to the inlet and outlet (i.e., perpendicular to the direction of liquid flow inside the valve body cavity), the cross-section of the valve body 100 can be other suitable shapes, such as square or rectangular.

[0045] In some embodiments, the valve body cavity includes a first buffer cavity 104 connected between the inlet 100a and the filter cavity 102. The diameter of the first buffer cavity 104 gradually increases from a first diameter D1 to a second diameter D2 in the direction from the inlet 100a to the outlet 100b. By providing a first buffer cavity 104 with a gradually increasing diameter between the inlet 100a and the filter cavity 102, the high-pressure coolant can be buffered when it enters the valve body cavity from the inlet 100a, thereby reducing the pressure of the coolant reaching the filter element and increasing the utilization rate of the filter element.

[0046] In some embodiments, the valve body cavity further includes a second buffer cavity 106 connected between the outlet 100b and the filter cavity 102. In the direction from the inlet 100a to the outlet 100b, the diameter of the second buffer cavity 106 gradually increases from a second diameter D2 to a third diameter D3. By providing a second buffer cavity 106 with a gradually increasing diameter between the filter cavity 102 and the outlet 100b, the pressure of the coolant can be reduced when the coolant flows out of the filter cavity 102, thereby promoting the forward flow of the liquid. Furthermore, in the event of blockage, the backflow of the coolant can be further suppressed.

[0047] In some embodiments, the diameter of the filter cavity 102 is kept constant, that is, the diameter of the filter cavity 102 is always the second diameter D2, such as... Figure 1As shown. In other words, in the cross-section of the valve body cavity from the inlet 100a towards the outlet 100b, the first buffer chamber 104 and the second buffer chamber 106 are trapezoidal in shape, and the filter chamber 102 is rectangular in shape. See also Figure 2 As shown, in the cross-section of the filter valve perpendicular to the inlet 100a and toward the outlet, the first buffer chamber 104, the filter chamber 102, and the second buffer chamber 106 are concentric circles with gradually increasing diameters.

[0048] In other embodiments, the diameter of the filter cavity 102 can be varied. In one specific embodiment, such as Figure 3 and Figure 4 As shown, in the direction from the inlet 100a to the outlet, the diameter of the filter chamber 102 gradually increases from the second diameter D2 to the fourth diameter D4, and then gradually decreases from the fourth diameter D4 to the second diameter D2. In other words, in the cross-section of the valve body cavity in the direction from the inlet 100a to the outlet 100b, the first buffer chamber 104 and the second buffer chamber 106 are trapezoidal in shape, and the filter chamber 102 is a hexagonal shape symmetrical along the center line. In this case, the second diameter D2 of the liquid inlet 102a and the liquid outlet 102b of the filter chamber 102 is the minimum diameter of the filter chamber 102, and the fourth diameter D4 is the maximum diameter of the filter chamber 102. In the cross-section of the filter valve in the direction perpendicular to the inlet 100a to the outlet 100b (i.e., perpendicular to the flow direction of the coolant), the first buffer chamber 104, the filter chamber 102, and the second buffer chamber 106 are concentric circles with gradually increasing diameters.

[0049] This embodiment of the present invention provides a fourth diameter D4 with a larger diameter between the liquid inlet 102a and the liquid outlet 102b of the filter chamber 102, which allows for the installation of a larger filter element (also known as a filter screen) inside the valve body, thereby increasing the service life of the filter valve.

[0050] This utility model embodiment also provides a coating and developing device, see reference. Figure 5 As shown, the coating and developing equipment includes a loading unit (not shown), a robotic arm (not shown), a coating / developing unit 200, and a cooling unit 300.

[0051] In some embodiments, the loading unit is configured to receive wafers, for example, the loading unit receives wafers from a wafer pod (FOUP / cassette). Robotic arms (CSR and PSR) are configured to transfer the wafers from the loading unit to the spin coater / developer unit 200. The spin coater / developer unit 200 is configured to apply photoresist onto the wafers and develop the photoresist. The cooling unit 300 is configured to control the temperature of the spin coater / developer unit 200, and is therefore sometimes referred to as a temperature control unit. The cooling unit includes the filter valve described above.

[0052] In some embodiments, the spin coating / developing unit 200 includes multiple hot plates (not shown) and cooling plates (also called cold plates). The hot plates are mainly used for heat baking, such as soft baking, to remove solvents from the photoresist to increase its viscosity; post-baking, to remove residual solvents from the photoresist after exposure to stabilize its structure; and hard baking, to enhance the photoresist's corrosion resistance after development, which is beneficial for subsequent ion implantation or etching.

[0053] After the hot baking step, a cold plate can be used to quickly cool the wafer, which helps to quickly cure the photoresist, reduce thermal stress and thermal deformation, and improve production efficiency, allowing the wafer to smoothly enter the next work cell.

[0054] The cooling unit 300 typically includes a connected coolant supply tank 302, a supply pump 304, a filter module 306, and a control module (not shown). The coolant supply tank 302 stores a certain amount of coolant (e.g., cooling water, hence sometimes referred to as a water tank) and a sensor (not shown) for monitoring the liquid level. The supply pump 304 pumps the coolant from the coolant supply tank 302 to the cooling plate of the spin coating / developing unit 200 to cool the wafer. After heat exchange, the coolant returns to the coolant supply tank through pipes. The sensor is configured to send a replenishment signal to the control module when the coolant temperature is higher than a first set temperature, and to send a replenishment stop signal to the control module when the coolant temperature is lower than a second set temperature.

[0055] To ensure a constant temperature of the coolant in the coolant supply tank 302, the control module is configured to control whether to add coolant to the coolant supply tank 302 and to drain the liquid from the coolant supply tank 302 based on signals from sensors. During the coolant replenishment and drainage process, coolant is typically added to the coolant supply tank 302 through the plant process coolant system (PCW), and the warmer liquid in the coolant supply tank 302 is drained through the drain port. After the liquid is filtered by the filter module 302 to remove impurities (such as copper rust), it is returned to the plant system for further recycling.

[0056] The filter module 302 includes the aforementioned filter valve. The inlet of the valve body cavity is connected to the drain port of the coolant supply tank 302 via a supply tank drain pipe, and the outlet of the valve body cavity is connected to the plant process coolant system (PCW) via a plant inlet pipe. In some embodiments, the diameter of the supply tank drain pipe (e.g., 9.5 mm) is slightly larger than the diameter of the filter valve inlet (e.g., 9.0 mm). In some embodiments, the diameter of the plant inlet pipe is 20 mm. When the diameter of the plant inlet pipe is 20 mm, the first diameter D1 of the filter valve inlet is greater than 9.5 mm and less than 12.13 mm, and the second diameter D2 of the filter cavity outlet (and inlet) and the third diameter D3 of the filter valve outlet are both greater than 12.13 mm and less than 20 mm.

[0057] The filter valve provided in this embodiment of the present invention increases the liquid discharge efficiency (or drainage efficiency) by setting the diameter of the liquid inlet and liquid outlet of the filter chamber to be larger than the diameter of the liquid inlet of the valve body cavity and smaller than the diameter of the liquid outlet of the valve body cavity. At the same time, the diameter of the liquid inlet of the valve body cavity, the diameter of the liquid inlet and liquid outlet of the filter chamber, and the diameter of the liquid outlet of the valve body cavity are set to satisfy the above relationship (Ⅰ). Compared with the existing filter valves where the valve body cavity diameter is constant, the embodiment provided in this invention increases the liquid discharge efficiency (or drainage efficiency), thereby suppressing the back overflow of coolant when blockage occurs inside the filter valve and reducing the frequency of back overflow contamination of the coolant supply tank due to blockage.

[0058] It should be noted that, without conflict, the aforementioned embodiments can be combined to form one or more embodiments, and this utility model will not elaborate on them one by one.

[0059] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A filter valve for a cooling unit of a coating and developing equipment, characterized in that, The filter valve includes: A valve body, the valve body including a valve body cavity, the valve body cavity including a liquid inlet, a liquid outlet and a filter cavity located between the liquid inlet and the liquid outlet, the filter cavity having a liquid inlet near the liquid inlet and a liquid outlet away from the liquid inlet; The filter element is located in the filter chamber; Specifically, in the direction perpendicular to the liquid inlet towards the liquid outlet, the cross-sectional shape of the valve body cavity is circular; the liquid inlet has a first diameter, the liquid inlet and liquid outlet have second diameters, and the liquid outlet has a third diameter. Wherein, the first diameter is smaller than the second diameter, the second diameter is smaller than the third diameter, and the first diameter, the second diameter, and the third diameter satisfy the following relationship: , Wherein, the first diameter is D1, the second diameter is D2, and the third diameter is D3.

2. The filter valve for the cooling unit of a coating and developing equipment according to claim 1, characterized in that, The valve body cavity further includes a first buffer cavity connected between the liquid inlet and the filter cavity, wherein, in the direction from the liquid inlet to the liquid outlet, the diameter of the first buffer cavity gradually increases from the first diameter to the second diameter.

3. The filter valve for the cooling unit of a coating and developing equipment according to claim 2, characterized in that, The valve body cavity further includes a second buffer cavity connected between the liquid outlet and the filter cavity, wherein, in the direction from the liquid inlet to the liquid outlet, the diameter of the second buffer cavity gradually increases from the second diameter to the third diameter.

4. The filter valve for the cooling unit of a coating and developing equipment according to claim 3, characterized in that, The diameter of the filter chamber remains constant.

5. The filter valve for the cooling unit of a coating and developing equipment according to claim 3, characterized in that, In the direction from the inlet to the outlet, the diameter of the filter chamber gradually increases from the second diameter to the fourth diameter, and then gradually decreases from the fourth diameter to the second diameter, wherein the fourth diameter is smaller than the third diameter.

6. The filter valve for the cooling unit of a coating and developing equipment according to claim 4, characterized in that, The first diameter is greater than 9.5 mm and less than 12.13 mm, and the second diameter and the third diameter are both greater than 12.13 mm and less than 20 mm.

7. The filter valve for the cooling unit of a coating and developing equipment according to claim 5, characterized in that, The first diameter is greater than 9.5 mm and less than 12.13 mm, and the second diameter, the third diameter and the fourth diameter are all greater than 12.13 mm and less than 20 mm.

8. A coating and developing apparatus, characterized in that, include Loading unit, configured to receive wafers; A robotic arm configured to transfer wafers from the loading unit to the spin coating / developing unit; The photoresist coating / developing unit is configured to coat the photoresist onto the wafer and develop the photoresist. A cooling unit configured to cool the cold plate of the spin coater / developer unit, the cooling unit comprising a filter valve according to any one of claims 1 to 7.

9. The coating and developing equipment according to claim 8, characterized in that, The cooling unit includes: A coolant supply tank, configured to store coolant; A supply pump is configured to pump coolant from the coolant supply tank to the spin coat / development unit; The sensor is configured to send a coolant replenishment signal to the control module when the temperature of the coolant is higher than a first set temperature, and to send a coolant replenishment stop signal to the control module when the temperature of the coolant is lower than a second set temperature. The control module is configured to replenish and stop replenishing the coolant supply tank based on the replenishment signal and replenishment stop signal emitted by the sensor. A filtration module, including the filter valve, is configured to filter the coolant discharged from the coolant supply tank when the coolant supply tank is replenished.