Semiconductor special gas conveying pipeline heat preservation sleeve

Abstract

The utility model discloses a semiconductor special gas conveying pipeline heat preservation sleeve, including pipeline, pipeline is sleeved with heat preservation sleeve, and heat preservation sleeve includes upper heat preservation sleeve and lower heat preservation sleeve, and is wrapped with fixed frame on heat preservation sleeve, and the internal structure of upper heat preservation sleeve and lower heat preservation sleeve is same, and the outside of upper heat preservation sleeve and the front and back two sides are provided with heat insulating layer, and the inboard of heat insulating layer is fixed with mounting layer, and the inboard of mounting layer is provided with mounting groove, and the inside fixed setting of mounting groove has wireless heating plate, and the inboard fixed setting of mounting layer has heat conduction layer, and the heating piece is installed on wireless heating plate, and the wireless charging receiving coil is installed on heating piece, the utility model solves the majority of heat preservation sleeve of current adoption integral type structure, and when installing, need from pipeline end portion sleeve into, for the pipeline adaptability of having fixed or with complex connecting piece is poor, and the traditional heat preservation sleeve simultaneously lacks temperature regulation ability, and the problem that is difficult to adjust according to different special gas characteristics in real time.

Description

Technical Field

[0001] This utility model relates to the field of pipeline insulation sleeve technology, and in particular to an insulation sleeve for a semiconductor special gas transmission pipeline. Background Technology

[0002] In high-precision industrial fields such as semiconductor manufacturing, the stability of the medium temperature is extremely important in the pipelines transporting specialty gases. Many specialty gases involved in semiconductor processes, such as boron trichloride (BCI3), hydrosilane (SiH4), chlorine trifluoride (CIF3), and dichlorosilane (DCS), are susceptible to fluctuations in ambient temperature during transport, which can cause condensation in the gas path or nozzle. If liquefied gas enters the vacuum chamber, it will lead to an increase in wafer defect rate, thereby affecting process accuracy and product yield.

[0003] Most existing insulation sleeves adopt an integral structure, which needs to be inserted from the end of the pipe during installation. They are not well adapted to pipes that are already fixed or have complex connectors. At the same time, traditional insulation sleeves lack temperature regulation capabilities and are difficult to adjust in real time according to the characteristics of different special gases. Therefore, this utility model proposes an insulation sleeve for semiconductor special gas delivery pipelines to solve the above problems. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a heat insulation sleeve for semiconductor special gas transmission pipeline.

[0005] To achieve the above objectives, this utility model provides a heat insulation sleeve for a semiconductor special gas delivery pipeline, including a pipeline, on which a heat insulation sleeve is fitted. The heat insulation sleeve includes an upper heat insulation sleeve and a lower heat insulation sleeve, and a fixing frame is provided on the heat insulation sleeve. The upper and lower heat insulation sleeves have the same internal structure. A heat insulation layer is provided on the outer side and the front and rear sides of the upper heat insulation sleeve. An installation layer is fixedly provided on the inner side of the heat insulation layer. An installation groove is provided on the inner side of the installation layer. A wireless heating plate is fixedly installed in the installation groove. A heat-conducting layer is fixedly provided on the inner side of the installation layer. A heating element is installed on the wireless heating plate, and a wireless charging receiving coil is installed on the heating element. The wireless charging receiving coil is connected to an external wireless charger through an electromagnetic signal to achieve wireless heating.

[0006] Furthermore, the fixing frame includes an upper fixing frame and a lower fixing frame, which are fixedly connected. An upper fixing strap is fixedly provided at the end of the upper fixing frame, and a lower fixing strap is fixedly provided at the end of the lower fixing frame. The upper fixing strap and the lower fixing strap are detachable and can be installed and fixed.

[0007] Furthermore, a number of female buckles are fixedly installed through the upper fixing strap, and a number of male buckles are fixedly installed on the outer side of the lower fixing strap. The female buckles and male buckles are arranged in a one-to-one correspondence and are engaged and fixed together.

[0008] Furthermore, a support frame is provided below the pipe. The support frame includes a U-shaped plate. Fixing holes are provided on both sides of the bottom of the U-shaped plate. A sleeve is rotatably provided at the upper end of the U-shaped plate. The sleeve is installed below the lower fixing frame.

[0009] Furthermore, a connecting block is fixedly provided at the bottom of the lower fixed frame. The connecting block is arc-shaped and fixedly provided at the top of the sleeve.

[0010] Furthermore, a crossbar is rotatably provided through the upper end of the U-shaped plate, a sleeve is fixedly sleeved on the crossbar, and a threaded hole is provided through the side wall of the crossbar, into which a plug is threadedly inserted.

[0011] Furthermore, a rotating disk is fixedly provided at the top of the insertion rod, and the outer wall of the rotating disk is provided with anti-slip grooves.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. The insulation sleeve of this utility model is divided into an upper insulation sleeve and a lower insulation sleeve, which can be directly wrapped from the top and bottom of the pipe without the need to be put on from the end. This solves the problem of poor adaptability of traditional integral insulation sleeves to pipes that are already fixed or have complex connecting parts. The upper and lower fixing straps are fixed by the female and male buckles, making installation and disassembly convenient.

[0014] 2. The wireless heating plate of this utility model can adjust the heating power in real time by using a wireless charging receiving coil in conjunction with an external wireless charger to meet the temperature stability requirements of different semiconductor process characteristics.

[0015] 3. This utility model uses an inner heat-conducting layer to ensure that heat is evenly transferred to the pipe, while the outer heat insulation layer reduces heat loss, thereby improving insulation efficiency and reducing energy consumption. Attached Figure Description

[0016] To more clearly illustrate the solutions in this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a right-side perspective view provided by this utility model;

[0018] Figure 2 This is a left-side stereoscopic view provided by this utility model;

[0019] Figure 3 This is a side view provided by this utility model;

[0020] Figure 4 This is a schematic diagram of the upper insulation sleeve structure provided by this utility model;

[0021] Figure 5 This is an enlarged schematic diagram of part A provided by this utility model;

[0022] Figure 6 This is an enlarged schematic diagram of part B provided by this utility model;

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Lower fixing strap; 2. Upper fixing strap; 3. Fixing frame; 31. Upper fixing frame; 32. Lower fixing frame; 4. Insulation sleeve; 41. Upper insulation sleeve; 411. Insulation layer; 412. Mounting layer; 413. Mounting groove; 414. Wireless heating plate; 47. Heat-conducting layer; 42. Lower insulation sleeve; 5. Pipe; 6. Female buckle; 7. Crossbar; 8. U-shaped plate; 9. Sleeve; 10. Fixing hole; 11. Threaded hole; 12. Insert rod; 13. Connecting block; 14. Rotating disk. Detailed Implementation

[0025] The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings, so that the advantages and features of this utility model can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0026] The terms "comprising" and "having," and any variations thereof, used in the specification, claims, and accompanying drawings of this utility model are intended to cover non-exclusive inclusion. The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order.

[0027] Please see Figure 1-6A semiconductor special gas delivery pipeline insulation sleeve includes a pipeline 5, on which an insulation sleeve 4 is fitted. The insulation sleeve 4 includes an upper insulation sleeve 41 and a lower insulation sleeve 42. A fixing frame 3 is provided on the insulation sleeve 4. The upper insulation sleeve 41 and the lower insulation sleeve 42 have the same internal structure. A heat insulation layer 411 is provided on the outer side and the front and rear sides of the upper insulation sleeve 41. An installation layer 412 is fixedly provided on the inner side of the heat insulation layer 411. An installation groove 413 is provided on the inner side of the installation layer 412. A wireless heating plate 414 is fixedly provided in the installation groove 413. A heat conducting layer 47 is fixedly provided on the inner side of the installation layer 412. A heating element is installed on the wireless heating plate 414. A wireless charging receiving coil is installed on the heating element. The wireless charging receiving coil is connected to an external wireless charger through an electromagnetic signal to realize wireless heating. The external wireless charger sends energy to the wireless charging receiving coil on the wireless heating plate 414 through electromagnetic induction. The receiving coil converts electromagnetic energy into electrical energy and supplies it to the heating element. The heating element generates heat after being energized. Heat is evenly conducted to the outer wall of pipe 5 through heat-conducting layer 47, continuously heating and keeping the semiconductor special gas in the pipe; heat insulation layer 411 is located on the outermost side, effectively reducing heat loss to the outside, improving heat preservation efficiency and reducing energy consumption. According to the temperature characteristics requirements of different semiconductor process special gases, the heat generation of the heating element can be adjusted in real time by controlling the output power of the external wireless charger.

[0028] As an improvement to the above technical solution, the fixing frame 3 includes an upper fixing frame 31 and a lower fixing frame 32, which are fixedly connected. An upper fixing band 2 is fixedly installed at the end of the upper fixing frame 31, and a lower fixing band 1 is fixedly installed at the end of the lower fixing frame 32. The upper fixing band 2 and the lower fixing band 1 can be detachably installed and fixed. Several female buckles 6 are fixedly installed through the upper fixing band 2, and several male buckles are fixedly installed on the outside of the lower fixing band 1. The female buckles 6 and the male buckles are set one-to-one and are locked together. When it is necessary to insulate the semiconductor special gas transmission pipeline, the upper insulation sleeve 41 and the lower insulation sleeve 42 are first directly wrapped from the upper and lower sides of the pipeline 5, respectively. The upper fixing frame 31 and the lower fixing frame 32 of the fixing frame 3 are fastened together, and the female buckles 6 and the male buckles on the upper fixing band 2 and the lower fixing band 1 are locked together to achieve quick installation.

[0029] As an improvement to the above technical solution, a support frame is provided below the pipe 5. The support frame includes a U-shaped plate 8, with fixing holes 10 on both sides of the bottom of the U-shaped plate 8. A sleeve 9 is rotatably installed at the upper end of the U-shaped plate 8. The sleeve 9 is installed below the lower fixing frame 32. A connecting block 13 is fixedly installed at the bottom of the lower fixing frame 32. The connecting block 13 is arc-shaped and fixedly installed at the top of the sleeve 9. A crossbar 7 is rotatably installed through the upper end of the U-shaped plate 8. The sleeve 9 is fixedly sleeved on the crossbar 7. The crossbar 7 can be used to adjust the pipe as needed. Adjust the angle of the sleeve 9 and the insulation sleeve and pipe above it so that the entire pipe can be fixed on the support frame. The side wall of the crossbar 7 is provided with a threaded hole 11. The insert rod 12 is threaded into the threaded hole 11. The insert rod 12 installed in the threaded hole 11 can limit the crossbar 7 and prevent the crossbar 7 from detaching from the U-shaped plate 8. The top of the insert rod 12 is fixed with a rotating disk 14. The outer wall of the rotating disk 14 is provided with anti-slip grooves. The anti-slip grooves improve the friction of holding the rotating disk 14, making it easier to screw the insert rod 12 into or out of the threaded hole 11.

[0030] The working principle and usage of this utility model:

[0031] In use, the upper insulation sleeve 41 and the lower insulation sleeve 42 are wrapped around the pipe 5 from the top and bottom respectively. They are initially positioned using the upper fixing frame 31 and the lower fixing frame 32 of the fixing frame 3. Then, the female buckle 6 of the upper fixing strap 2 and the male buckle of the lower fixing strap 1 are used to secure them, completing the assembly of the insulation sleeve and the pipe. The support frame is installed in the designated position through the fixing holes 10 at the bottom of the U-shaped plate 8. The arc-shaped connecting block 13 at the bottom of the lower fixing frame 32 is connected to the sleeve 9. The angle of the sleeve 9, the insulation sleeve above it, and the pipe can be adjusted as needed using the crossbar 7, allowing the pipe to... The entire unit can be fixed on the support frame. An external wireless charger emits electromagnetic signals, and the wireless charging receiving coil on the wireless heating plate 414 inside the insulation sleeve receives the signals, converts electromagnetic energy into electrical energy and transmits it to the heating element. After the heating element is powered on, it generates heat, and the heat generated is evenly transferred to the outer wall of the pipe 5 through the heat-conducting layer 47 to heat and insulate the special gas inside the pipe. The heat insulation layer 411 effectively reduces heat loss to the outside. By controlling the output power of the external wireless charger, the heat generation of the heating element can be adjusted in real time to adapt to the temperature requirements of special gas in different semiconductor processes.

[0032] The above description is only used to illustrate the technical solution of this utility model, and is not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any equivalent structural or procedural transformations made using the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A heat insulation sleeve for a semiconductor special gas conveying pipeline, characterized in that: The device includes a pipe (5), on which a heat insulation sleeve (4) is fitted. The heat insulation sleeve (4) includes an upper heat insulation sleeve (41) and a lower heat insulation sleeve (42). A fixing frame (3) is provided on the heat insulation sleeve (4). The upper heat insulation sleeve (41) and the lower heat insulation sleeve (42) have the same internal structure. A heat insulation layer (411) is provided on the outer side and the front and rear sides of the upper heat insulation sleeve (41). An installation layer (412) is fixedly provided on the inner side of the heat insulation layer (411). An installation groove (413) is provided on the inner side of the installation layer (412). A wireless heating plate (414) is fixedly provided in the installation groove (413). A heat-conducting layer (47) is fixedly provided on the inner side of the installation layer (412). A heating element is installed on the wireless heating plate (414). A wireless charging receiving coil is installed on the heating element. The wireless charging receiving coil is connected to an external wireless charger through an electromagnetic signal to achieve wireless heating.

2. The insulation sleeve for a semiconductor special gas conveying pipeline according to claim 1, characterized in that: The fixed frame (3) includes an upper fixed frame (31) and a lower fixed frame (32). The upper fixed frame (31) and the lower fixed frame (32) are fixedly connected. An upper fixing strap (2) is fixedly provided at the end of the upper fixed frame (31), and a lower fixing strap (1) is fixedly provided at the end of the lower fixed frame (32). The upper fixing strap (2) and the lower fixing strap (1) can be detachably installed and fixed.

3. The insulation sleeve for a semiconductor special gas conveying pipeline according to claim 2, characterized in that: A number of female buckles (6) are fixedly installed through the upper fixing band (2), and a number of male buckles are fixedly installed on the outer side of the lower fixing band (1). The female buckles (6) and the male buckles are set in a one-to-one correspondence, and the female buckles (6) and the male buckles are engaged and fixed.

4. The insulation sleeve for a semiconductor special gas conveying pipeline according to claim 3, characterized in that: A support frame is provided below the pipe (5). The support frame includes a U-shaped plate (8). Fixing holes (10) are provided on both sides of the bottom of the U-shaped plate (8). A sleeve (9) is rotatably provided at the upper end of the U-shaped plate (8). The sleeve (9) is installed below the lower fixing frame (32).

5. The insulation sleeve for a semiconductor special gas conveying pipeline according to claim 4, characterized in that: A connecting block (13) is fixedly provided at the bottom of the lower fixed frame (32). The connecting block (13) is arc-shaped and is fixedly provided at the top of the sleeve (9).

6. The insulation sleeve for a semiconductor special gas conveying pipeline according to claim 5, characterized in that: A crossbar (7) is rotatably mounted on the upper end of the U-shaped plate (8). A sleeve (9) is fixedly mounted on the crossbar (7). A threaded hole (11) is provided through the side wall of the crossbar (7). A plug rod (12) is threaded into the threaded hole (11).

7. The insulation sleeve for a semiconductor special gas conveying pipeline according to claim 6, characterized in that: A rotating disk (14) is fixedly provided at the top of the insertion rod (12), and the outer wall of the rotating disk (14) is provided with anti-slip grooves.

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