High-efficiency composite vehicle lamp radiator

Abstract

The utility model discloses a kind of efficient composite car light radiators, and the car light radiator is composed of passive heat dissipation module and active heat dissipation module;Temperature sensor is integrated in the passive heat dissipation module;The active heat dissipation module is set in the passive heat dissipation module, and it includes heat pipe radiator and fan;Wherein, the temperature sensor is linked with the active heat dissipation module and is set, and when the temperature T of the passive heat dissipation module detected by the temperature sensor reaches certain threshold value, the active heat dissipation module is triggered to start.The efficient composite car light radiator designed in the utility model solves the problem of low brightness of automobile headlamp caused by high light source center temperature, and the radiator can achieve good heat dissipation effect without relying on large size and high fan speed, solving the problems of large size and weight and large fan noise of existing radiator, in line with the development trend of automobile light weight and silence.

Description

Technical Field

[0001] This utility model relates to the field of vehicle lamp heat dissipation technology, specifically to a high-efficiency composite vehicle lamp heat sink. Background Technology

[0002] Car headlights are closely related to safe driving at night or in bad weather. While pursuing the aesthetics and intelligence of car lights, people are also paying more attention to the human-computer interaction experience. Micro-LED technology with tens of thousands of pixels provides a solution for intelligent lighting and projection display.

[0003] Currently, in existing technologies, most high-power and high-heat-flux-density Micro-LED light sources use finned or columnar metal heat sinks in conjunction with fans for heat dissipation. Heat is transferred from the Micro-LED to the heat sink via the circuit board and then carried away by the fan for heat dissipation. Therefore, in order to meet the lighting brightness requirements and ensure the stability of Micro-LED light source operation, the size of the heat sink is usually increased or the fan speed is increased to achieve this purpose.

[0004] However, as automotive lights gradually move towards flatter and quieter designs, simply increasing the size of the heat sink and raising the fan speed is insufficient to meet the requirements of these trends (i.e., it hinders the development of lightweight and quieter vehicles). Existing heat sink technology, without increasing the heat sink size or fan speed, cannot achieve adequate heat dissipation. Furthermore, due to the inherent function and packaging characteristics of Micro-LED light sources, heat is highly concentrated near the light source. Excessive localized heat can accelerate the light decay of Micro-LEDs, making it difficult to improve headlight brightness. Moreover, prolonged operation at high temperatures can reduce the lifespan of Micro-LED light sources, increasing the risk of failure and compromising safe driving. Utility Model Content

[0005] The purpose of this invention is to address the problems of existing vehicle headlight radiators, such as large size and loud fan noise, which are detrimental to the development of lightweight and quiet vehicles, as well as the problem of low brightness of vehicle headlights due to high center temperature of the light source. This invention designs a high-efficiency composite vehicle headlight radiator to solve the above problems.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0007] This invention designs a high-efficiency composite vehicle headlight radiator, which consists of a passive heat dissipation module and an active heat dissipation module. The passive heat dissipation module integrates a temperature sensor. The active heat dissipation module is disposed within the passive heat dissipation module and includes a heat pipe radiator and a fan. The temperature sensor is linked to the active heat dissipation module, and is configured to trigger the active heat dissipation module to start when the temperature T of the passive heat dissipation module reaches a certain threshold.

[0008] Furthermore, a high-efficiency composite vehicle headlight radiator: the passive heat dissipation module includes the following structural configuration:

[0009] The heat sink main substrate has a first bonding surface and a first heat dissipation surface, the first bonding surface being used to bond with the vehicle light circuit board (i.e., the circuit board of Micro-LED).

[0010] A temperature sensor, which is integrated into the main substrate of the radiator or disposed on the circuit board of the vehicle lamp;

[0011] And several corrugated fins, which are vertically arranged on the first heat dissipation surface.

[0012] Furthermore, a high-efficiency composite vehicle headlight radiator is provided: the main substrate of the radiator is made of magnesium alloy; the surface of the corrugated fins is provided with corrugated turbulence grooves.

[0013] Furthermore, a high-efficiency composite vehicle light radiator is provided: when the temperature sensor detects that the temperature T of the radiator's main substrate is ≥70℃, the active cooling module is triggered to start.

[0014] Furthermore, a high-efficiency composite vehicle lamp radiator is provided: several heat dissipation copper pipes are additionally embedded in the main substrate of the radiator, which are used to directly connect the corrugated fins to the heat source area of ​​the vehicle lamp.

[0015] Specifically, the corrugated turbulence grooves on the surface of the corrugated fins can further improve the heat dissipation effect, thereby accelerating the passive heat dissipation efficiency.

[0016] Furthermore, a high-efficiency composite vehicle headlight radiator is provided: the fan is disposed on the corrugated fins and located on the side of the passive heat dissipation module, and the fan is used to dissipate heat from the passive heat dissipation module and the heat pipe radiator.

[0017] Furthermore, a high-efficiency composite vehicle headlight radiator: the passive heat dissipation module further includes a heat-dissipating graphite coating, which is disposed on the first bonding surface.

[0018] Furthermore, a high-efficiency composite vehicle lamp radiator: the heat pipe radiator includes the following structural configuration:

[0019] A heat pipe radiator substrate has a second bonding surface and a second heat dissipation surface, wherein the second bonding surface is bonded to the first heat dissipation surface of the radiator body substrate.

[0020] A semiconductor refrigeration chip has a cooling surface and a heat dissipation surface, the semiconductor refrigeration chip is embedded in the heat pipe radiator substrate, and the cooling surface is also in contact with the first heat dissipation surface of the radiator main substrate.

[0021] Several heat dissipation pipes are vertically arranged on the second heat dissipation surface;

[0022] And several heat sinks, which are disposed on the heat pipe.

[0023] Furthermore, a high-efficiency composite vehicle headlight radiator is provided: the heat pipe radiator substrate is attached to the middle of the first heat dissipation surface; and coolant is also provided in the heat dissipation pipe.

[0024] Furthermore, a high-efficiency composite vehicle light radiator is provided: when the temperature sensor detects an ambient temperature ≤-10℃, the semiconductor cooling chip operates in reverse to preheat the vehicle light.

[0025] The beneficial effects of this utility model are:

[0026] (1) The high-efficiency composite automotive lamp heat sink designed in this utility model uses a magnesium alloy processed heat sink main substrate to replace the traditional die-cast aluminum, which can reduce the weight by more than 30%, which is more in line with the development trend of automotive lightweighting. At the same time, the use of heat-dissipating graphite coating in this automotive lamp heat sink helps to improve the lateral thermal conductivity of the heat sink, which can carry away the heat generated by the Micro-LED light source more quickly, thereby avoiding the problem of excessive local heat leading to accelerated Micro-LED light decay, reducing the difficulty of improving the brightness of the headlight, and facilitating the improvement of headlight brightness.

[0027] (2) The high-efficiency composite vehicle lamp radiator designed in this utility model integrates a semiconductor cooling chip within the heat pipe radiator substrate of its active cooling module. This enables directional active cooling of the area near the light source. Combined with intelligent control of the semiconductor cooling chip's start and stop by a temperature sensor, intelligent control is achieved, balancing energy consumption and heat dissipation requirements and extending the device's lifespan. Moreover, the radiator is lightweight, low-noise, and meets the development requirements of automotive lightweighting and quiet operation. Furthermore, when the temperature sensor detects an ambient temperature below -10℃, the semiconductor cooling chip can also operate in reverse, providing preheating for the vehicle lamp and preventing cold start failure. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A front view of a high-efficiency composite vehicle lamp radiator designed for Example 1;

[0030] Figure 2 This is a front view of the passive heat dissipation module in Example 1;

[0031] Figure 3 This is a front view of the heat pipe radiator in Example 1;

[0032] Figure 4 This is a schematic diagram of the corrugated fin structure in Example 1.

[0033] The markings in the image are as follows:

[0034] 1-Passive heat dissipation module, 2-Heat pipe radiator, 3-Fan, 11-Radiator main substrate, 12-First bonding surface, 13-First heat dissipation surface, 14-Temperature sensor, 15-Corrugated fins, 21-Heat pipe radiator substrate, 22-Second bonding surface, 23-Second heat dissipation surface, 24-Semiconductor cooling chip, 25-Cooling surface, 26-Heat dissipation surface, 27-Heat pipe, 28-Heat fin. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0036] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "top," and "bottom," etc., indicating orientation or positional relationships, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this utility model described herein can be implemented in orders other than those illustrated or described herein.

[0037] Example 1

[0038] like Figures 1-4 As shown, this embodiment 1 designs a high-efficiency composite vehicle lamp radiator, which consists of a passive heat dissipation module 1 and an active heat dissipation module;

[0039] The passive heat dissipation module 1 includes: a heat sink main substrate 11, a temperature sensor 14, and a plurality of corrugated fins 15. The heat sink main substrate 11 is made of magnesium alloy and has a first bonding surface 12 and a first heat dissipation surface 13. The temperature sensor 14 is integrated into the heat sink main substrate 11. A heat-spreading graphite coating is provided on the first bonding surface 12. The heat-spreading graphite coating is bonded to the circuit board of the Micro-LED light source by thermally conductive adhesive. The surface of the corrugated fins 15 is provided with corrugated turbulence grooves. A plurality of corrugated fins 15 are vertically arranged on the first heat dissipation surface 13 except for the middle position.

[0040] The active heat dissipation module is located in the middle of the first heat dissipation surface 13. The active heat dissipation module includes a heat pipe radiator 2 and a fan 3. The fan 3 is located on the corrugated fins 15 and on the side of the passive heat dissipation module 1. The fan 3 is used to dissipate heat from the passive heat dissipation module 1 and the heat pipe radiator 2.

[0041] Specifically, the heat pipe radiator 2 includes: a heat pipe radiator substrate 21, a semiconductor cooling chip 24, a plurality of heat dissipation pipes (using copper heat dissipation pipes) 27, and a plurality of heat dissipation fins (using ultra-thin fins) 28. The heat pipe radiator substrate 21 is made of magnesium alloy and has a second bonding surface 22 and a second heat dissipation surface 23. The second bonding surface 22 is attached to the middle of the first heat dissipation surface 13 by thermally conductive adhesive. The semiconductor cooling chip 24 has a cooling surface 25 and a heat dissipation surface 26. The semiconductor cooling chip 24 is embedded in the heat pipe radiator substrate 21 through the second bonding surface 22. The cooling surface 25 is also attached to the first heat dissipation surface 13 by thermally conductive adhesive. A plurality of heat dissipation pipes 27 are vertically arranged on the second heat dissipation surface 23. A plurality of heat dissipation fins 28 are welded to the heat dissipation pipes (copper heat dissipation pipes) 27. Coolant is also provided in the heat dissipation pipes 27.

[0042] The temperature sensor 14 is linked to the active heat dissipation module. When the temperature sensor 14 detects that the temperature T of the heat sink main substrate 11 (passive heat dissipation module 1) is ≥70℃, the active heat dissipation module 2 is triggered to start.

[0043] Specifically, in the above embodiment 1, the heat sink main substrate 11 is made of magnesium alloy, and its overall weight can be reduced by more than 30% compared with die-cast aluminum, which is in line with the development trend of automotive lightweighting. The bonding surface between the heat sink main substrate 11 and the Micro-LED light source circuit board is provided with a heat-dissipating graphite coating, which can quickly and evenly distribute the concentrated heat generated by the Micro-LED light source, avoiding excessive local heat and causing Micro-LED light decay. The surface of the corrugated fins 15 is provided with corrugated turbulence grooves, which can increase the heat exchange area and effectively increase the degree of airflow turbulence, which is conducive to accelerating the heat dissipation efficiency of the passive heat dissipation module 1. A temperature sensor 14 is also integrated in the heat sink main substrate 11, which can adjust the working mode of the active heat dissipation module according to the temperature.

[0044] When the car headlights are working normally, the heat generated by the Micro-LED light source is concentrated near the light source. After the heat is transferred to the surface of the heat sink substrate 11, it is quickly and evenly distributed under the action of the heat-equalizing graphite coating, and then diffused into the environment through convection and radiation heat transfer. When the operating temperature of the headlights changes and the temperature sensor 14 detects that the temperature of the heat sink substrate 11 exceeds 70°C, the active heat dissipation module is triggered, the semiconductor cooling chip 24 is activated, and the fan 3 starts running. The temperature of the cooling surface 25 of the semiconductor cooling chip 24 drops sharply to balance the temperature of the central area of ​​the Micro-LED light source. The heat generated by the heat dissipation surface 26 is transferred to the heat dissipation copper pipe 27. The coolant in the pipe absorbs heat under negative pressure, undergoes a phase change, and begins to move spontaneously. After reaching the cold end of the heat dissipation copper pipe 27, it re-condenses into liquid coolant. The released heat is carried into the environment by the fan 3.

[0045] Example 2

[0046] The difference between Example 2 and Example 1 is that Example 2 can also place the temperature sensor 14 on the circuit board of the Micro-LED light source, so as to control the start and stop of the active heat dissipation module according to the temperature near the light source;

[0047] In Example 2, based on Example 1, several additional heat dissipation copper pipes can be embedded in the heat sink main substrate 11. These heat dissipation copper pipes are used to directly connect the heat source area of ​​the vehicle lamp to the end of the corrugated fins 15. This allows some of the heat from the heat source area to be directly transferred to the corrugated fins 15 through the heat dissipation copper pipes. Through the dual heat conduction of the heat dissipation copper pipes and the heat-spreading graphite coating, the heat dissipation efficiency of the passive heat dissipation module 1 can be further improved.

[0048] Example 2 can also be configured to cause the semiconductor cooling chip 24 to work in reverse when the temperature sensor 14 detects that the ambient temperature is below -10°C, so as to provide a preheating function for the vehicle lights and thus avoid cold start failure.

[0049] This utility model designs a high-efficiency composite headlight radiator, which solves the problem of low brightness in car headlights caused by high temperature in the center area of ​​the light source. At the same time, this radiator can achieve good heat dissipation without relying on a large volume and high fan speed. Therefore, it solves the problem that the existing radiator body needs to increase the volume of the radiator and increase the fan speed to achieve a good heat dissipation effect, thereby avoiding the problems of large radiator weight and high fan noise, which is more in line with the development trend of lightweight and quiet automotive.

[0050] The above-described preferred embodiments of this utility model are for illustrative purposes only and are not intended to limit the scope of this utility model. Any obvious variations or modifications derived from the technical solutions of this utility model are still within the protection scope of this utility model.

Claims

1. A high-efficiency composite vehicle lamp radiator, characterized in that, The headlight radiator consists of a passive cooling module (1) and an active cooling module; The passive heat dissipation module (1) integrates a temperature sensor (14). The active heat dissipation module is disposed in the passive heat dissipation module (1), and includes a heat pipe radiator (2) and a fan (3). The temperature sensor (14) is linked to the active heat dissipation module, and the active heat dissipation module is triggered to start when the temperature sensor (14) detects that the temperature T of the passive heat dissipation module (1) reaches a certain threshold. The passive heat dissipation module (1) includes the following structural configuration: The heat sink main substrate (11) has a first bonding surface (12) and a first heat dissipation surface (13) opposite to each other, the first bonding surface (12) being used to bond with the vehicle lamp circuit board; Temperature sensor (14), which is integrated in the heat sink main substrate (11) or disposed on the circuit board of the vehicle lamp; And several corrugated fins (15), which are vertically arranged on the first heat dissipation surface (13); The heat pipe radiator (2) includes the following structural configuration: The heat pipe radiator substrate (21) has a second bonding surface (22) and a second heat dissipation surface (23) opposite to each other, the second bonding surface (22) being bonded to the first heat dissipation surface (13) of the radiator body substrate (11); A semiconductor cooling chip (24) has a cooling surface (25) and a heat dissipation surface (26) opposite to each other. The semiconductor cooling chip (24) is embedded in the heat pipe radiator substrate (21). The cooling surface (25) is also in contact with the first heat dissipation surface (13). Several heat dissipation pipes (27) are vertically arranged on the second heat dissipation surface (23); And several heat sinks (28) are disposed on the heat sink (27).

2. The high-efficiency composite vehicle lamp radiator according to claim 1, characterized in that, The heat sink main substrate (11) is made of magnesium alloy; the surface of the corrugated fins (15) is provided with corrugated turbulence grooves.

3. The high-efficiency composite vehicle lamp radiator according to claim 1, characterized in that, When the temperature sensor (14) detects a temperature T ≥ 70°C on the heat sink main substrate (11), the active heat dissipation module is triggered to start.

4. The high-efficiency composite vehicle lamp radiator according to claim 1, characterized in that, The radiator main substrate (11) is also additionally embedded with several heat dissipation copper pipes, which are used to connect the corrugated fins (15) to the heat source area of ​​the vehicle lamp.

5. The high-efficiency composite vehicle lamp radiator according to claim 1, characterized in that, The fan (3) is mounted on the corrugated fins (15) and located on the side of the passive heat dissipation module (1). The fan (3) is used to dissipate heat from the passive heat dissipation module (1) and the heat pipe radiator (2).

6. The high-efficiency composite vehicle lamp radiator according to claim 1, characterized in that, The passive heat dissipation module (1) also includes a heat-spreading graphite coating, which is disposed on the first bonding surface (12).

7. The high-efficiency composite vehicle lamp radiator according to claim 1, characterized in that, The heat pipe radiator substrate (21) is attached to the middle of the first heat dissipation surface (13); the heat pipe (27) is also provided with coolant.

8. The high-efficiency composite vehicle lamp radiator according to claim 1, characterized in that, When the temperature sensor (14) detects an ambient temperature ≤ -10℃, the semiconductor cooling chip (24) operates in reverse to preheat the vehicle lights.

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