Optical module, vehicle lamp and vehicle

CN224920227UActive Publication Date: 2026-10-30MIND ELECTRONICS APPLIANCE CO LTD
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Patent Information

Application Number
CN202522764828.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-26
Publication Date
2026-10-30
Estimated Expiration
2035-12-26

AI Technical Summary

Technical Problem

[0002]相关技术中,为了满足车灯照明更高的需求,使得照明模组的功率逐渐增加,热功率直线增加,同时,车灯中芯片式LED的应用愈发广泛,功率增加不可避免,现有的模组散热方式难以满足需求,目前,模组散热常见的是压铸或者冷锻的模组散热器,散热功率受限,散热面积受限于加工模具,散热器重量也比较重,且针对高度集中的热量,散热能力有限,无法满足热学需求,导致模组性能降低,影响车灯的正常使用与照明效果

Benefits of technology

[0013]在本申请的一些实施例中,所述散热器壳体形成有沿远离所述散热器壳体的方向延伸的安装座,所述第一管体与所述安装座连接。

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Abstract

The application discloses an optical module, a vehicle lamp and a vehicle. The optical module comprises a radiator shell, a circuit board arranged on the radiator shell, and a heat dissipation pipe arranged on a side of the radiator shell away from the circuit board, and part of the heat dissipation pipe extends in a direction away from the radiator shell. The outer surface of the heat dissipation pipe is provided with a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals in the direction away from the radiator shell. According to the optical module, the heat dissipation pipe structure is arranged to improve the overall heat dissipation efficiency, and the normal use and lighting effect of the vehicle lamp are met.
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Description

Technical Field

[0001] This application relates to the field of automotive lighting, and more particularly to an optical module, automotive lighting, and a vehicle. Background Technology

[0002] In related technologies, in order to meet the higher demands of vehicle lighting, the power of lighting modules has been gradually increasing, and the heat output has increased linearly. At the same time, the application of chip-type LEDs in vehicle lights is becoming more and more widespread, and the increase in power is inevitable. Existing module heat dissipation methods are difficult to meet the requirements. Currently, the most common module heat dissipation methods are die-cast or cold-forged module heat sinks, which have limited heat dissipation power, heat dissipation area is limited by the processing mold, and the heat sink is also relatively heavy. Moreover, for highly concentrated heat, the heat dissipation capacity is limited and cannot meet the thermal requirements, resulting in a decrease in module performance and affecting the normal use and lighting effect of vehicle lights. Utility Model Content

[0003] This application aims to at least solve one of the technical problems existing in the prior art. To this end, one objective of this application is to provide an optical module that improves the overall heat dissipation efficiency by setting a heat dissipation pipe structure, thereby meeting the normal use and lighting effect of vehicle lights.

[0004] This application also proposes a vehicle lamp having the aforementioned optical module.

[0005] This application also proposes a vehicle having the aforementioned headlights.

[0006] An optical module according to an embodiment of this application includes: a heat sink housing; a circuit board disposed on the heat sink housing; and a heat dissipation pipe disposed on the side of the heat sink housing away from the circuit board, with a portion of the heat dissipation pipe extending in a direction away from the heat sink housing. The outer surface of the heat dissipation pipe is provided with heat dissipation fins, and there are multiple heat dissipation fins, which are spaced apart along the direction away from the heat sink housing.

[0007] According to an embodiment of this application, the optical module has a circuit board and a heat sink. The circuit board and the heat sink can be respectively disposed on both sides of the radiator housing. The heat sink can exchange heat with the circuit board. A portion of the heat sink extends away from the radiator housing and has multiple heat sinks on its outer peripheral wall. The multiple heat sinks are spaced apart to increase the heat dissipation area, so that the heat from the heat sink can be transferred through the heat sinks, effectively improving the heat dissipation efficiency of the optical module and meeting the normal use and lighting effect of the vehicle lights.

[0008] In some embodiments of this application, the heat dissipation pipe includes: a first pipe body connected to the radiator housing; and a second pipe body connected to at least one end of the first pipe body along its extension direction and extending in a direction away from the radiator housing, wherein the outer surface of the second pipe body is provided with the heat dissipation fins.

[0009] In some embodiments of this application, each heat sink has a through-hole, and the air guide hole of each heat sink is correspondingly arranged in a direction away from the heat sink housing.

[0010] In some embodiments of this application, an air guide plate is further formed on the inner wall of the air guide hole, and the air guide plate extends in a direction away from the radiator housing.

[0011] In some embodiments of this application, the thickness of the heat sink is T and satisfies: 0.2mm≤T≤0.5mm.

[0012] In some embodiments of this application, the spacing between each heat sink is D and satisfies: 0.5mm≤D≤1.5mm.

[0013] In some embodiments of this application, the radiator housing is formed with a mounting base extending in a direction away from the radiator housing, and the first tube is connected to the mounting base.

[0014] In some embodiments of this application, the optical module further includes a heat-conducting element, which is disposed through the heat sink housing, with one end of the heat-conducting element attached to the circuit board and the other end of the heat-conducting element attached to or connected to the first tube body.

[0015] The following describes the vehicle lights according to embodiments of this application.

[0016] The vehicle lamp according to the embodiments of this application is provided with the optical module of the above embodiments. Since the vehicle lamp of the embodiments of this application is provided with the optical module of the above embodiments, the optical module of the vehicle lamp has a circuit board and a heat sink. The circuit board and the heat sink can be respectively disposed on both sides of the radiator housing. The heat sink can exchange heat with the circuit board. A portion of the heat sink extends away from the radiator housing and is provided with multiple heat sinks on its outer peripheral wall. The multiple heat sinks are spaced apart to increase the heat dissipation area, so that the heat of the heat sink can be transferred through the heat sinks, effectively improving the heat dissipation efficiency of the optical module and meeting the normal use and lighting effect of the vehicle lamp.

[0017] The vehicle of an embodiment of this application is described below.

[0018] The vehicle according to the embodiments of this application is equipped with the headlights of the above embodiments. Since the vehicle according to the embodiments of this application is equipped with the headlights of the above embodiments, the headlights of the vehicle have the above-mentioned optical modules. The optical modules have circuit boards and heat sinks. The circuit boards and heat sinks can be respectively disposed on both sides of the radiator housing. The heat sinks can exchange heat with the circuit boards. A portion of the heat sink extends away from the radiator housing and has multiple heat sinks on its outer peripheral wall. The multiple heat sinks are spaced apart to increase the heat dissipation area, so that the heat of the heat sink can be transferred through the heat sinks, effectively improving the heat dissipation efficiency of the optical module and meeting the normal use and lighting effect of the headlights.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of an optical module according to an embodiment of this application; Figure 2 yes Figure 1 Front view schematic diagram of the optical module; Figure 3 yes Figure 1 A cross-sectional schematic diagram of the optical module; Figure 4 yes Figure 1 A partial structural diagram of the optical module.

[0021] Figure label: 10. Optical module; 11. Heat sink housing; 111. Mounting bracket; 12. Circuit board; 13. Heat pipe; 131. First pipe body; 132. Second pipe body; 14. Heat sink; 141. Air vent; 142. Air guide plate; 15. Heat-conducting component. Detailed Implementation

[0022] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0023] The following is for reference. Figures 1-4The optical module 10 according to an embodiment of the present application is described. The optical module 10 includes a heat sink housing 11, a circuit board 12 and a heat pipe 13.

[0024] The circuit board 12 is disposed on the heat sink housing 11. The heat sink 13 is disposed on the side of the heat sink housing 11 away from the circuit board 12, and a portion of the heat sink 13 extends in a direction away from the heat sink housing 11. The outer surface of the heat sink 13 is provided with heat sink fins 14. There are multiple heat sink fins 14, which are spaced apart in a direction away from the heat sink housing 11.

[0025] Currently, the most common module heat dissipation methods are die-cast or cold-forged module heat sinks. These have limited heat dissipation power and heat dissipation area, which are limited by the processing mold. The heat sinks are also relatively heavy. Furthermore, they have limited heat dissipation capacity for highly concentrated heat, which cannot meet thermal requirements. This leads to a decrease in module performance and affects the normal use and lighting effect of vehicle lights.

[0026] In response, this application proposes an optical module 10, which improves the overall heat dissipation efficiency by setting a heat dissipation pipe 13 structure to meet the normal use and lighting effect of the vehicle lights.

[0027] Specifically, the optical module 10 may include a heat sink housing 11, a circuit board 12, and a heat pipe 13. The circuit board 12 may be disposed on the heat sink housing 11. Optionally, the circuit board 12 and the heat sink housing 11 may be detachably connected by screws or bolts, or by snap-fit ​​or plug-in connection. The heat pipe 13 may be disposed on the side of the heat sink housing 11 away from the circuit board 12. Optionally, the heat pipe 13 may be fixed to the heat sink housing 11 by direct welding of the contact surfaces, thereby ensuring the connection strength between the heat pipe 13 and the heat sink housing 11.

[0028] Furthermore, a portion of the heat pipe 13 can extend away from the heat sink housing 11, and a heat sink 14 can be provided on the outer surface of the heat pipe 13. There can be multiple heat sinks 14, which can be spaced apart along the direction away from the heat sink housing 11. It should be noted that the heat generated by the LED at the circuit board 12 can be transferred to the heat pipe 13 through the heat sink housing 11. The heat pipe 13 conducts the heat to the heat sink 14, thereby achieving the heat dissipation effect. By providing multiple heat sinks 14, the contact area with the air can be further increased, thereby improving the heat dissipation efficiency. The heat pipe 13 can be set in a specific location as needed, i.e., the location with the most heat, to quickly dissipate heat and cool down, thus improving the heat dissipation efficiency.

[0029] In short, the optical module 10 of this application embodiment has a circuit board 12 and a heat sink 13. The circuit board 12 and the heat sink 13 can be respectively disposed on both sides of the radiator housing 11. The heat sink 13 can exchange heat with the circuit board 12. A portion of the heat sink 13 extends away from the radiator housing 11 and is provided with a plurality of heat sinks 14 on its outer peripheral wall. The plurality of heat sinks 14 are spaced apart to increase the heat dissipation area, so that the heat of the heat sink 13 can be transferred through the heat sinks 14, effectively improving the heat dissipation efficiency of the optical module 10 and meeting the normal use and lighting effect of the vehicle lights.

[0030] like Figure 2 and Figure 3 As shown, in some embodiments of this application, the heat dissipation pipe 13 may include a first pipe body 131 and a second pipe body 132. The first pipe body 131 may be connected to the radiator housing 11. Optionally, the first pipe body 131 and the radiator housing 11 may be fixed by direct welding of the contact surfaces. The second pipe body 132 may be connected to at least one end of the first pipe body 131 along its extension direction. It is understood that the two ends of the first pipe body 131 along its extension direction are the first end and the second end, respectively. The second pipe body 132 may be connected to the first end or the second end, or there may be two second pipe bodies 132, which are respectively connected to the first end and the second end. Optionally, the first pipe body 131 and the second pipe body 132 may be fixed by direct welding of the contact surfaces, or the first pipe body 131 and the second pipe body 132 may be constructed as an integrally formed part.

[0031] The outer surface of the second tube 132 can be provided with a heat sink 14. By providing the first tube 131, the contact area between it and the heat sink housing 11 can be increased. The heat of the circuit board 12 is transferred to the first tube 131 through the heat sink housing 11, and then from the first tube 131 to the second tube 132, and then from the second tube 132 to the heat sink 14 to achieve heat dissipation.

[0032] like Figure 2 and Figure 4 As shown, in some embodiments of this application, each heat sink 14 has an air guide hole 141 formed therethrough. The air guide hole 141 can penetrate the heat dissipation pipe 13. The air guide hole 141 of each heat sink 14 is correspondingly arranged in the direction away from the heat sink housing 11. The air guide hole 141 can play the role of allowing airflow. Furthermore, an air guide plate 142 can be formed on the inner wall of the air guide hole 141. The air guide plate 142 extends in the direction away from the heat sink housing 11. The air guide plate 142 can guide the airflow.

[0033] It is understood that when airflow flows between the two heat sinks 14, it will move along the air guide plate 142 when it comes into contact with the air guide plate 142. Since the air guide plate 142 of one of the heat sinks 14 extends toward the air guide hole 141 of the adjacent heat sink 14, the airflow can flow to the air guide hole 141, which improves the heat dissipation efficiency. In some embodiments, the optical module 10 may also include a fan, which can play the role of airflow, thereby improving the heat dissipation effect of the optical module 10.

[0034] In some embodiments of this application, the thickness of the heat sink 14 is T, which satisfies the relationship: 0.2mm≤T≤0.5mm. That is, the thickness of the heat sink 14 can be any value between 0.2mm and 0.5mm. For example, the thickness of the heat sink 14 can be, but is not limited to, 0.2mm, 0.3mm, 0.4mm, 0.5mm, etc. If the thickness of the heat sink 14 is too small, it will lead to poor structural stability. If the thickness of the heat sink 14 is too large, it will increase the overall weight. Therefore, by setting the thickness of the heat sink 14 within the above range, the heat dissipation efficiency can be effectively guaranteed.

[0035] In some embodiments of this application, the spacing of each heat sink 14 is D, satisfying the relationship: 0.5mm≤D≤1.5mm. That is, the spacing of each heat sink 14 can be any value between 0.5mm and 1.5mm. For example, the spacing of each heat sink 14 can be, but is not limited to, 0.5mm, 0.8mm, 1.1mm, 1.5mm, etc. If the spacing of each heat sink 14 is too small, it will affect the airflow and thus affect the heat dissipation effect. If the spacing of each heat sink 14 is too large, it will result in excessive space occupation. Therefore, by setting the spacing of each heat sink 14 within the above range, the heat dissipation effect of the optical module 10 can be improved.

[0036] like Figure 4 As shown, in some embodiments of this application, the radiator housing 11 may have a mounting base 111, which may extend in a direction away from the radiator housing 11. The first tube 131 may be connected to the mounting base 111 to facilitate assembly of the first tube 131. Optionally, the first tube 131 and the mounting base 111 may be detachably connected by screws or bolts, or the first tube 131 and the mounting base 111 may be detachably connected by snap-fit ​​or plug-in. In a specific embodiment, the first tube 131 and the mounting base 111 are fixed by snap-fit, and the mounting base 111 may have claws to clamp the first tube 131.

[0037] like Figure 3As shown, in some embodiments of this application, the optical module 10 further includes a heat-conducting element 15. The heat-conducting element 15 can be disposed in the heat sink housing 11, and one end of the heat-conducting element 15 can be attached to the circuit board 12, and the other end of the heat-conducting element 15 can be attached to or welded to the first tube 131. The heat-conducting element 15 can quickly transfer the heat of the circuit board 12 to the first tube 131. In some embodiments, the heat-conducting element 15 can be a metal part.

[0038] The following describes the vehicle lights according to embodiments of this application.

[0039] The vehicle lamp according to the embodiment of this application is provided with the optical module 10 of the above embodiment. Since the vehicle lamp of the embodiment of this application is provided with the optical module 10 of the above embodiment, the optical module 10 of the vehicle lamp has a circuit board 12 and a heat sink 13. The circuit board 12 and the heat sink 13 can be respectively disposed on both sides of the radiator housing 11. The heat sink 13 can exchange heat with the circuit board 12. A portion of the heat sink 13 extends away from the radiator housing 11 and is provided with a plurality of heat sinks 14 on its outer peripheral wall. The plurality of heat sinks 14 are spaced apart to increase the heat dissipation area, so that the heat of the heat sink 13 can be transferred through the heat sinks 14, effectively improving the heat dissipation efficiency of the optical module 10 and meeting the normal use and lighting effect of the vehicle lamp.

[0040] The vehicle of an embodiment of this application is described below.

[0041] The vehicle according to the embodiments of this application is equipped with the headlights of the above embodiments. Since the vehicle according to the embodiments of this application is equipped with the headlights of the above embodiments, the headlights of the vehicle have the above-mentioned optical module 10. The optical module 10 has a circuit board 12 and a heat sink 13. The circuit board 12 and the heat sink 13 can be respectively disposed on both sides of the radiator housing 11. The heat sink 13 can exchange heat with the circuit board 12. A portion of the heat sink 13 extends away from the radiator housing 11 and a plurality of heat sinks 14 are disposed on its outer peripheral wall. The plurality of heat sinks 14 are spaced apart to increase the heat dissipation area, so that the heat of the heat sink 13 can be transferred through the heat sinks 14, effectively improving the heat dissipation efficiency of the optical module 10 and meeting the normal use and lighting effect of the headlights.

[0042] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0043] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0044] In the description of this application, "multiple" means two or more.

[0045] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0046] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0047] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0048] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An optical module, characterized in that, include: Radiator housing (11); Circuit board (12), said circuit board (12) is disposed on the heat sink housing (11); A heat sink (13) is disposed on the side of the radiator housing (11) away from the circuit board (12), and a portion of the heat sink (13) extends in a direction away from the radiator housing (11). A heat sink fin (14) is disposed on the outer surface of the heat sink (13). There are multiple heat sink fins (14), and the multiple heat sink fins (14) are spaced apart in a direction away from the radiator housing (11).

2. The optical module according to claim 1, characterized in that, The heat pipe (13) includes: The first tube (131) is connected to the radiator housing (11); The second tube (132) is connected to at least one end of the first tube (131) along its extension direction and extends in a direction away from the radiator housing (11). The outer surface of the second tube (132) is provided with the heat sink (14).

3. The optical module according to claim 2, characterized in that, Each of the heat sinks (14) has a through-hole (141) formed therethrough, and the air guide hole (141) of each heat sink (14) is arranged in a direction away from the heat sink housing (11).

4. The optical module according to claim 3, characterized in that, The inner wall of the air guide hole (141) is also formed with an air guide plate (142), which extends in a direction away from the radiator housing (11).

5. The optical module according to claim 1, characterized in that, The thickness of the heat sink (14) is T and satisfies: 0.2mm≤T≤0.5mm.

6. The optical module according to claim 5, characterized in that, The spacing between each heat sink (14) is D and satisfies: 0.5mm≤D≤1.5mm.

7. The optical module according to claim 2, characterized in that, The radiator housing (11) has a mounting base (111) extending in a direction away from the radiator housing (11), and the first tube (131) is connected to the mounting base (111).

8. The optical module according to claim 2, characterized in that, Also includes: A heat-conducting component (15) is inserted through the heat sink housing (11), and one end of the heat-conducting component (15) is attached to the circuit board (12), and the other end of the heat-conducting component (15) is attached to or connected to the first tube body (131).

9. A vehicle light, characterized in that, Includes the optical module as described in any one of claims 1-8.

10. A vehicle, characterized in that, Including the vehicle lights as described in claim 9.