camera unit

Abstract

Provided is a camera unit capable of improving heat dissipation and reducing the risk of malfunction. A camera unit is provided on the top surface of a refrigerator, and includes a metal plate, a camera, and a first circuit board that controls the camera, the metal plate and the first circuit board being thermally connected via a heat transfer member.

Description

Technical Field

[0001] This disclosure relates to camera units. Background Technology

[0002] Patent document 1 discloses a technique of installing a camera at the top of a cold storage room to take pictures when an object passing through the opening of the cold storage room is detected.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-070476 Utility Model Content

[0006] Problems to be solved by the utility model

[0007] This disclosure provides a camera unit that can improve heat dissipation and reduce the risk of malfunctions during operation.

[0008] Technical solutions for solving the problem

[0009] This specification contains the entire contents of Japanese Patent Application No. 2023-109891, filed on July 4, 2023.

[0010] The camera unit disclosed herein is disposed on the top surface of a cold storage room. The camera unit includes a metal plate, a camera, and a first circuit board for controlling the camera. The metal plate and the first circuit board are thermally connected via a heat transfer component.

[0011] Utility Model Effect

[0012] In the camera unit disclosed herein, heat generated by the first circuit board is conducted to the metal plate via a heat transfer component. This improves the heat dissipation of the camera unit and reduces the risk of operational malfunctions. Attached Figure Description

[0013] Figure 1 This is the front view of the camera unit and the cold storage.

[0014] Figure 2 yes Figure 1 Sectional view II-II.

[0015] Figure 3 This is the main view of the cold storage unit with the camera unit and the door open.

[0016] Figure 4 This is a 3D view of the camera unit as seen from above.

[0017] Figure 5This is a 3D view of the camera unit as seen from below.

[0018] Figure 6 This is an exploded stereoscopic view of the camera unit.

[0019] Figure 7 This is an exploded perspective view of the camera unit with the metal plate removed from the housing component.

[0020] Figure 8 This is a top view of the shell component.

[0021] Figure 9 This is a cross-sectional view of the camera unit.

[0022] Figure 10 Is Figure 8 A three-dimensional view of the shell component cut at the XX section.

[0023] Figure 11 This is a top view of the camera unit in Embodiment 2.

[0024] Figure 12 This is a top view of the shell in Embodiment 2. Detailed Implementation

[0025] (Insights, etc., that form the basis of this disclosure)

[0026] When the inventors conceived of this disclosure, there was already a technology that involved installing a camera on the upper part of a cold storage unit to capture images when an object was detected passing through the opening of the cold storage. However, the inventors discovered that in the prior art, the circuit board and camera of the camera unit would overheat, causing malfunctions during operation, and the subject of this disclosure was formed in order to solve this problem.

[0027] Therefore, this disclosure provides a camera unit that can improve heat dissipation and reduce the risk of malfunctions.

[0028] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, sometimes the necessary detailed descriptions are omitted. For example, detailed descriptions of matters that are already well known, or repeated descriptions of substantially the same structures, may be omitted.

[0029] Furthermore, the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand this disclosure, and are not intended to limit the claimed technical solutions.

[0030] (Implementation Method 1)

[0031] [1-1. Structure]

[0032] Figure 1 This is a front view of the camera unit 1 and the cold storage 100 in Embodiment 1. Figure 2yes Figure 1 Section II-II shows a cross-section perpendicular to the left-right direction. In the following description, the direction indicated by the symbol X in the figure is the left direction, the direction indicated by the symbol Y is the front direction, and the direction indicated by the symbol Z is the top direction.

[0033] [1-1-1. Structure of a Cold Storage]

[0034] like Figure 1 and Figure 2 As shown, the cold storage 100 includes a main body 120 with an opening on the front surface. A cold storage compartment 121, an ice-making compartment 122, a fresh freezing compartment 123, a freezer compartment 124, and a vegetable compartment 125 are formed on the main body 120. These compartments are cooled by cold air. Horizontal doors 121A and 121B are provided at the opening on the front surface of the cold storage compartment 121. Figure 3 This is a front view of the cold storage 100 with camera unit 1 and doors 121A and 121B open.

[0035] Each of the ice-making compartment 122, the fresh-freezing compartment 123, the freezer compartment 124, and the vegetable compartment 125 is equipped with drawers 122A, 123A, 124A, and 125A, respectively, which are used to store items. When in use, the top surface of each of the drawers 122A to 125A is open.

[0036] Camera unit 1 is installed on the upper surface, or top surface 120A, of the outer side of the main body 120 of the cold storage 100. The top surface 120A of the main body 120 is made of metal. Furthermore, the metal constituting the top surface 120A is made of iron or other metal attracted by magnet 59.

[0037] [1-1-2. Structure of the Camera Unit]

[0038] Figure 4 This is a 3D view of camera unit 1, showing camera unit 1 as viewed from above. Figure 5 This is a 3D view of camera unit 1, showing camera unit 1 as viewed from below. Figure 6 This is an exploded perspective view of camera unit 1, showing camera unit 1 with cover component 30 removed from housing component 20. Figure 7 This is an exploded perspective view of camera unit 1, showing camera unit 1 with cover part 30 and metal plate 40 removed from housing part 20.

[0039] The camera unit 1 includes a housing component 20, a cover component 30, and a metal plate 40 housed inside the housing component. The housing component 20 is rectangular when viewed from above. The housing component 20 consists of a base 21A located at the rear and disposed on the top surface 120A, and a shooting section 21B extending forward of the base 21A and having a predetermined gap relative to the top surface 120A.

[0040] The shell component 20 is made of a flame-retardant resin. Examples of flame-retardant resins include ABS resin with added flame retardants.

[0041] Foot portions 22A1 are provided at the four outer corners of the bottom surface 22A of the base 21A. The foot portions 22A1 are components that are provided with a predetermined gap between the shell component 20 and the top surface 120A, and are made of, for example, rubber.

[0042] A downwardly extending position limiting portion 26 is formed on the front end surface 21A1 of the base 21A. The position limiting portion 26 is formed as a flat plate perpendicular to the front-rear direction. The position limiting portion 26 contacts the front edge 120B of the main body 120 of the cold storage 100 from the front. The position limiting portion 26 restricts the rearward movement of the camera unit 1 by contacting the front edge 120B.

[0043] A first positioning part 26A is provided on the front surface of the position limiting part 26. In this embodiment, the first positioning part 26A is a mark that can be visually identified from the front. The first positioning part 26A is provided at the center in the left-right direction of the camera unit 1.

[0044] Figure 8 This is a top view of shell component 20.

[0045] like Figure 7 and Figure 8 As shown, a power circuit board 51 is fixed to the base 21A. The power circuit board 51 is connected to an external power source to supply the power required for the operation of each part of the camera unit 1. The power circuit board 51 is an example of a "circuit board" in this disclosure.

[0046] The power circuit board 51 is connected to a power harness 51B capable of transmitting power. The power harness 51B is arranged inside the housing component 20 on the right side of the power circuit board 51. The power harness 51B extends from the rear end of the housing component 20 to the outside of the housing component 20, connecting to an external power source. Power output from the external power source is supplied to the power circuit board 51 via the power harness 51B. In this embodiment, the power harness 51B is connected to a 100V industrial frequency power supply. Alternatively, the power harness 51B can also be connected to the power circuit board of the cold storage 100. In this case, the camera unit 1 and the cold storage 100 can also be connected via a USB cable or harness.

[0047] A sensor circuit board 53 is fixed to the base 21A. The sensor circuit board 53 is a circuit board that receives and transmits signals with various sensors such as the range sensor 65, the thermopile 67, and the illuminance sensor 69 disposed in the camera unit 1. The sensor circuit board 53 is located to the left of the power supply circuit board 51. The sensor circuit board 53 is an example of a "circuit board" in this disclosure.

[0048] Light-emitting parts 202 are respectively arranged at the two front corners of the housing component 20. The light-emitting parts 202 are, for example, LEDs (light-emitting diodes) and convey specified information. In addition, the light-emitting parts 202 can illuminate the drawer 125A, for example.

[0049] A buzzer 203 is disposed between the light-emitting part 202 and the ranging sensor 65 on the right side. The buzzer 203 emits a sound to notify when the cold storage 100 reaches a predetermined state.

[0050] The ranging sensor 65, the thermopile 67, the illuminance sensor 69, the light-emitting part 202, and the buzzer 203 are wired to the sensor circuit board 53 via cable 81.

[0051] A System on a Chip (SoC) circuit board 55 is fixed in the imaging unit 21B. The SoC circuit board 55 is a circuit board for controlling the wide-angle camera 61 and the narrow-angle camera 63. The SoC circuit board 55 is connected to the wide-angle camera 61 and the narrow-angle camera 63 via two Flexible Flat Cable (FFC) cables 83. The SoC circuit board 55 is an example of a "circuit board" in this disclosure.

[0052] Furthermore, a communication module 201 is disposed on the front side of the ranging sensor 65. The communication module 201 is, for example, a wireless communication module having wireless communication lines compliant with Bluetooth (registered trademark), Wi-Fi (registered trademark), or other wireless communication standards. The communication module 201 is wiredly connected to the SoC circuit board 55 via cable 81.

[0053] A partition 23 is formed on the housing component 20, surrounding the power circuit board 51 when viewed from above. Furthermore, a sensor circuit board 53, a SoC circuit board 55, a wide-angle camera 61, and a narrow-angle camera 63 are disposed inside the partition 23. The partition 23 is shaped to protrude upwards from the base 21A and the imaging portion 21B.

[0054] like Figure 7 and Figure 8 As shown, a wide-angle camera 61 and a narrow-angle camera 63 are mounted on the front end of the imaging section 21B of the housing component.

[0055] Wide-angle camera 61 captures images of all parts of the cold storage 100, including the cold storage compartment 121. Narrow-angle camera 63 captures images of the area including drawers 122A, 123A, 124A, and 125A. Additionally, the camera unit can also capture images of items being taken out and placed in the cold storage compartment 121, ice-making compartment 122, fresh-freezing compartment 123, freezer compartment 124, and vegetable compartment 125.

[0056] Figure 9 This is a sectional view of camera unit 1, showing the cross-section where camera unit 1 is cut off at the center in the left-right direction. Figure 10 This is a 3D view of camera unit 1, showing the path along... Figure 8 Camera unit 1 is in the state of being cut off at the XX section.

[0057] like Figures 7 to 10 As shown, the metal plate 40 is a component made of a thin metal sheet. The metal plate 40 is fixed relative to the imaging part 21B by fastening components such as screws, bolts, and bolts. The metal plate 40 covers the entire inner side of the partition part 23 from above.

[0058] That is, the metal plate 40 covers the power circuit board 51, sensor circuit board 53, SoC circuit board 55, wide-angle camera 61 and narrow-angle camera 63, sealing the area R1 surrounded by the partition 23.

[0059] The metal plate 40 includes a rear portion 40X that overlaps with the power supply circuit board 51 and the sensor circuit board 53 when viewed from above. A rib 43 is formed at the front end of the rear portion 40X. The rib 43 extends upwards along the entire width of the front end of the rear portion 40X in the left-right direction.

[0060] A central portion 40Y extending forward from the upper end of rib 43 is integrally formed at the front end of the rear portion 40X. The central portion 40Y is positioned across the base 21A and the camera section 21B when viewed from above. The central portion 40Y is positioned higher than the rear portion 40X. The central portion 40Y covers the SoC circuit board 55 from above.

[0061] A downwardly recessed heat dissipation portion 45 is formed approximately at the center of the central portion 40Y of the board. The heat dissipation portion 45 contacts the upper surface of the heat-generating element mounted on the SoC circuit board 55 via a thermal conductive sheet 55A. As a result, heat from the heat-generating element can be rapidly transferred to the metal plate 40.

[0062] A front portion 40Z is integrally formed at the front end of the central portion 40Y of the plate, and its height is set lower than that of the central portion 40Y of the plate. The front portion 40Z covers the wide-angle camera 61 and the narrow-angle camera 63 from above.

[0063] The front part 40Z of the plate contacts the upper surfaces of the wide-angle camera 61 and the narrow-angle camera 63 through a heat-conducting plate. This allows the heat from the wide-angle camera 61 and the narrow-angle camera 63 to be quickly transferred to the metal plate 40.

[0064] like Figure 9As shown, a heat dissipation hole 31 is formed at the rear of the cover component 30 and at a position corresponding to the power circuit board 51. The heat dissipation hole 31 is a hole that passes through the cover component 30, allowing communication between the interior and exterior of the shell component 20. In this embodiment, the heat dissipation hole 31 is a hole formed with the length direction as the left-right direction, and multiple holes are arranged in the front-back direction.

[0065] The heat dissipation hole 31 makes it possible for air to enter and exit between the interior and exterior of the housing component 20. As a result, heat generated from the power circuit board 51 and the like can be easily discharged to the exterior of the housing component 20 through convective heat transfer.

[0066] like Figure 6 and Figure 7 As shown, the front portion 40Z of the plate is formed such that the left and right width W1 at the front is longer than the left and right width W2 at the rear. That is, the area of ​​the metal plate 40 at the front of the front portion 40Z along the front end of the shell member 20 is larger than the area at the rear of the front portion 40Z connected to the center portion 40Y of the plate. The front portion 40Z is formed such that it extends from the partition portion 23 when viewed from above.

[0067] like Figure 7 and Figure 8 As shown, the wide-angle camera 61 includes a first image sensor circuit board 61B at its upper part. Furthermore, the wide-angle camera 61 includes a lens below the first image sensor circuit board 61B. The narrow-angle camera 63 includes a second image sensor circuit board 63B at its upper part. Furthermore, the narrow-angle camera 63 includes a lens below the second image sensor circuit board 63B. The front portion 40Z of the board contacts the upper surface of the first image sensor circuit board 61B through a heat-conducting sheet 61A. The front portion 40Z of the board contacts the upper surface of the second image sensor circuit board 63B through a heat-conducting sheet 63A.

[0068] like Figure 6 and Figure 7 As shown, three heat transfer suppression portions 49 are formed between the central portion 40Y and the front portion 40Z of the metal plate 40. The heat transfer suppression portions 49 are formed in the front portion 40Z. The heat transfer suppression portions 49 are elliptical through holes, but are not limited to this; for example, they can also be notches or weight reduction portions. The metal plate 40 can also be composed of a first plate covering the first image sensor circuit board 61B and the second image sensor circuit board 63B and a second plate covering the SoC circuit board 55. In this embodiment, the front portion 40Z corresponds to one example of the "first plate", and the central portion 40Y and the rear portion 40X correspond to one example of the "second plate". As described above, a structure in which the heat transfer suppression portions 49 are formed between the first plate and the second plate can also be adopted.

[0069] A protrusion 47 is formed on the rear 40X of the board. The height of the power circuit board 51 is greater than that of the other circuit boards. The protrusion 47 is formed in a manner that does not contact the power circuit board 51 or the components contained therein.

[0070] Furthermore, the protrusion 47 is formed at a position that does not overlap with the heat dissipation hole 31 when viewed from above. For example... Figure 9 As shown, a predetermined interval W3 is provided between the lower end of the heat dissipation hole 31 and the metal plate 40. This helps to suppress static electricity generation between the cover member 30 and the metal plate 40. The predetermined interval W3 is, for example, 15 mm.

[0071] Additionally, heat-conducting sheets 55A, 61A, and 63A correspond to an example of a "heat transfer component." Wide-angle camera 61 and narrow-angle camera 63 correspond to an example of a "camera." SoC circuit board 55 corresponds to an example of a "first circuit board." Power supply circuit board 51 corresponds to an example of a "second circuit board." First image sensor circuit board 61B and second image sensor circuit board 63B correspond to an example of an "image sensor circuit board."

[0072] [1-2. Functions, etc.]

[0073] For the camera unit 1 configured as described above, the main reference is... Figure 6 and Figure 7 Its function and other aspects are explained.

[0074] When the camera unit 1 is in operation, the power supply circuit board 51, sensor circuit board 53, SoC circuit board 55, first image sensor circuit board 61B and second image sensor circuit board 63B generate heat.

[0075] Heat emitted from the SoC circuit board 55 is conducted to the heat dissipation section 45 of the metal plate 40 via the thermal conductive sheet 55A. The heat transfer suppression section 49 reduces the heat transfer area between the central portion 40Y and the front portion 40Z of the board. Therefore, the heat conducted to the heat dissipation section 45 is primarily conducted to the rear portion 40X of the board.

[0076] Without the heat transfer suppression part 49, more heat emitted from the SoC circuit board 55 would be conducted towards the front of the camera unit 1, which would not promote heat dissipation through heat exchange with the air entering and leaving the heat dissipation hole 31, and the overall heat dissipation efficiency of the camera unit 1 would decrease.

[0077] In addition, the heat generated by the power circuit board 51 is mainly conducted to the rear part 40X of the board via the air in region R1.

[0078] As described above, the heat generated by the SoC circuit board 55 and the power circuit board 51 is mainly dissipated through heat exchange between the air entering and exiting the heat dissipation hole 31 and the metal plate 40.

[0079] The heat emitted by the first image sensor circuit board 61B and the second image sensor circuit board 63B is conducted to the front part 40Z of the board via heat-conducting plates 61A and 63A, and then to the central part 40Y of the board.

[0080] Furthermore, heat emitted by the first image sensor circuit board 61B and the second image sensor circuit board 63B is conducted to the housing component 20 via the front portion 40Z. Further, heat emitted by the first image sensor circuit board 61B and the second image sensor circuit board 63B is conducted to the cover component 30 via convective heat transfer. The wide-angle camera 61 and the narrow-angle camera 63 are positioned extending forward from the top surface 120A of the cold storage 100, located in an open space without other components. Moreover, the width W1 at the front of the front portion 40Z is greater than the width W2 at the rear. Therefore, heat emitted by the first image sensor circuit board 61B and the second image sensor circuit board 63B is efficiently dissipated in front of the camera unit 1.

[0081] Furthermore, since it is formed so that the front of the front part 40Z extends from the partition 23 when viewed from above, the heat emitted by the first image sensor circuit board 61B and the second image sensor circuit board 63B can also be exchanged in the space outside the partition 23 inside the housing component 20, resulting in high heat dissipation efficiency.

[0082] In this way, when viewed from above, the wide-angle camera 61, the narrow-angle camera 63, the SoC circuit board 55, and the heat dissipation holes 31 are arranged sequentially without overlapping each other, so that the heat dissipation is not concentrated in one part of the camera unit 1. In particular, the SoC circuit board 55 is most prone to heat generation, so it is preferable to separate the first image sensor circuit board 61B and the second image sensor circuit board 63B from the heat dissipation parts.

[0083] Camera unit 1 is used to manage items within the cold storage 100, therefore, it is preferable that it can operate continuously. In managing items within the cold storage 100, it is particularly preferable to efficiently dissipate heat from the first image sensor circuit board 61B and the second image sensor circuit board 63B to reduce the risk of malfunctions of the wide-angle camera 61 and the narrow-angle camera 63.

[0084] [1-3. Effects, etc.]

[0085] As explained above, in the camera unit 1 installed on the top surface 120A of the cold storage 100, the camera unit 1 includes a metal plate 40, a wide-angle camera 61 and a narrow-angle camera 63, and a SoC circuit board 55 for controlling the wide-angle camera 61 and the narrow-angle camera 63. The metal plate 40 and the SoC circuit board 55 are thermally connected via a heat-conducting sheet 55A.

[0086] Therefore, because the heat generated by the SoC circuit board 55 is conducted to the metal plate 40 through the heat-conducting sheet 55A, the heat dissipation of the camera unit 1 can be improved, and the risk of malfunctions can be reduced.

[0087] Furthermore, the metal plate 40, the first image sensor circuit board 61B of the wide-angle camera 61, and the second image sensor circuit board 63B of the narrow-angle camera 63 can be thermally connected via heat-conducting sheets 61A and 63A.

[0088] Therefore, since the heat emitted by the first image sensor circuit board 61B and the second image sensor circuit board 63B is conducted to the metal plate 40 through the heat-conducting sheets 61A and 63A, the heat dissipation of the camera unit 1 can be improved, and the risk of malfunctions can be reduced.

[0089] In addition, the housing component 20, which houses the wide-angle camera 61, the narrow-angle camera 63, and the SoC circuit board 55, and the cover component 30 covering the top of the housing component 20, may also include heat dissipation holes 31 that dissipate heat from the metal plate 40 to the outside.

[0090] Therefore, because the metal plate 40 exchanges heat with the air entering and exiting through the heat dissipation hole 31, the heat dissipation of the wide-angle camera 61, the narrow-angle camera 63, and the SoC circuit board 55 can be improved, and the risk of malfunction of the camera unit 1 can be reduced.

[0091] Furthermore, when viewed from above, the wide-angle camera 61, the narrow-angle camera 63, the SoC circuit board 55, and the heat dissipation hole 31 are arranged sequentially from the front, and the wide-angle camera 61, the narrow-angle camera 63, the SoC circuit board 55, and the heat dissipation hole 31 can be configured in a way that they do not overlap when viewed from above.

[0092] Therefore, since the SoC circuit board 55 is closer to the heat dissipation hole 31 than the wide-angle camera 61 and the narrow-angle camera 63, the heat dissipation efficiency of the SoC circuit board 55 based on the heat dissipation hole 31 can be improved.

[0093] In addition, when viewed from above, the metal plate 40 has a front portion 40Z covering the first image sensor circuit board 61B and the second image sensor circuit board 63B and a central portion 40Y covering the SoC circuit board 55, and may include a heat transfer suppression portion 49 to suppress heat transfer from the central portion 40Y to the front portion 40Z.

[0094] Therefore, because the heat emanating from the SoC circuit board 55 is conducted to the metal plate 40, it is more easily conducted to the rear heat dissipation hole 31 side rather than the wide-angle camera 61 and narrow-angle camera 63 side, i.e., the front part 40Z side of the board, thus improving the overall heat dissipation efficiency of the camera unit 1. Furthermore, because the heat dissipation of the wide-angle camera 61 and narrow-angle camera 63 is improved, the risk of malfunctions can be reduced during prolonged operation of the wide-angle camera 61 and narrow-angle camera 63.

[0095] In addition, a power board 51 is configured behind the SoC board 55. The power board 51 is connected to a power source. The metal plate 40 has a rear portion 40X covering the power board 51. The rear portion 40X includes a protrusion 47 formed in a manner that does not contact the power board 51. The heat dissipation hole 31 is formed in a manner that does not overlap with the protrusion 47 when viewed from above. It can be formed in a manner that maintains a predetermined distance W3 from the metal plate 40.

[0096] Therefore, since the heat generated by the power circuit board 51 can be dissipated through the metal plate 40, the risk of malfunction of the power circuit board 51 can be reduced. Furthermore, because the distance between the metal plate 40 and the heat dissipation hole 31 is maintained at a predetermined interval W3, static electricity is difficult to generate, improving safety. Moreover, because the protrusion 47 and the heat dissipation hole 31 do not overlap, static electricity generation can be suppressed, thereby miniaturizing the camera unit 1.

[0097] In addition, a heat dissipation portion 45 may be included in the central portion 40Y of the board in a manner that is recessed into the SoC circuit board 55.

[0098] Therefore, since the SoC circuit board 55 can be thermally connected to the metal plate 40 without changing the height of the SoC circuit board 55 disposed on the housing component 20, the layout is good.

[0099] In addition, the heat transfer suppression part 49 may be formed on the front part 40Z of the plate.

[0100] Therefore, because the heat emanating from the SoC circuit board 55 is conducted to the metal plate 40 more easily to the heat dissipation hole 31 side rather than the wide-angle camera 61 and narrow-angle camera 63 side, the overall heat dissipation efficiency of the camera unit 1 is improved. Furthermore, because the heat dissipation of the wide-angle camera 61 and narrow-angle camera 63 is improved, the risk of operational malfunctions can be reduced during prolonged operation.

[0101] In addition, the metal plate 40 may be composed of a first plate covering the first image sensor circuit board 61B and the second image sensor circuit board 63B and a second plate covering the SoC circuit board 55.

[0102] Therefore, because the heat emanating from the SoC circuit board 55 is conducted to the metal plate 40, it is more easily conducted to the rear heat dissipation hole 31 side rather than the wide-angle camera 61 and narrow-angle camera 63 side, i.e., the first board side, thus improving the overall heat dissipation efficiency of the camera unit. Furthermore, because the heat dissipation of the wide-angle camera 61 and narrow-angle camera 63 is improved, the risk of malfunctions can be reduced during prolonged operation of the wide-angle camera 61 and narrow-angle camera 63.

[0103] (Implementation Method 2)

[0104] [2-1. Structure]

[0105] [2-1-1. Second Metal Plate]

[0106] Figure 11 This is a top view of camera unit 1A in embodiment 2. Figure 11 The image shows the state with the metal plate 40 removed, but the camera unit 1A includes the metal plate 40. Figure 12 This is a top view of the shell component 20 in Embodiment 2.

[0107] Structures identical to those in Implementation 1 are labeled with the same symbols and their descriptions are omitted.

[0108] like Figure 11 As shown, the camera unit 1A includes a second metal plate 210 below the power supply circuit board 51, sensor circuit board 53, and SoC circuit board 55. The second metal plate 210 is disposed inside the partition 23. The second metal plate 210 is an example of "metal plate" or "second metal plate".

[0109] like Figure 12 As shown, the second metal plate 210 has a rear portion 211, a central portion 213, and a front portion 212.

[0110] The rear part 211 of the second board overlaps with the left end of the power circuit board 51 and the sensor circuit board 53.

[0111] The central portion 213 of the second board is positioned between the power supply board 51 and the SoC board 55. A ground wire G extending from the power supply board 51 is grounded at the central portion 213 of the second board. The second metal plate 210 functions as a ground in the camera unit 1A.

[0112] The front portion 212 of the second board overlaps with the SoC circuit board 55. The front portion 212 of the second board includes a first curved portion 217 formed in an upward-facing manner at the center of the portion overlapping with the SoC circuit board 55. A heat-conducting sheet 218 is attached to the upper surface of the first curved portion 217. The heat-conducting sheet 218 is in thermal contact with the SoC circuit board 55.

[0113] Furthermore, the front portion 212 of the second plate includes five flange portions 215A, 215B, 215C, 215D, and 215E. The flange portions 215A to 215E are formed by bending upwards. The flange portions 215A to 215D each include through holes 216A, 216B, 216C, and 216D. On the metal plate 40 (not shown), through holes are formed at positions corresponding to the through holes 216A to 216D. By inserting fastening components into these through holes, the second metal plate 210 and the metal plate 40 can be fastened together. The metal plate 40 and the second metal plate 210 are electrically connected.

[0114] Metal plate 40 and second metal plate 210 function as shielding components to reduce noise generated from power circuit board 51, sensor circuit board 53 and SoC circuit board 55 and to strengthen grounding. In addition, metal plate 40 functions as grounding for camera unit 1A by abutting against second metal plate 210, thereby achieving grounding enhancement.

[0115] Furthermore, two flanges 215A and 215B located on the rear side electrically connect the SoC circuit board 55 and the second metal plate 210. Flange 215A is positioned near the left front corner of the SoC circuit board 55, and flange 215B is positioned near the right front corner of the SoC circuit board 55. Flanges 215A and 215B can improve assembly workability by also functioning as a base supporting the SoC circuit board 55.

[0116] Two flanges 215C and 215D located on the front side electrically connect the second image sensor circuit board 63B and the second metal plate 210. Flange 215C is positioned near the left rear corner of the second image sensor circuit board 63B, and flange 215D is positioned near the right rear corner of the second image sensor circuit board 63B. Flanges 215C and 215D improve assembly workability by functioning as a base supporting the second image sensor circuit board 63B.

[0117] Furthermore, two flanges 215D and 215E electrically connect the first image sensor circuit board 61B and the second metal plate 210. Flange 215D is located near the left rear corner of the first image sensor circuit board 61B, and flange 215E is located near the right rear corner of the first image sensor circuit board 61B. Flanges 215D and 215E improve assembly workability by functioning as a base supporting the first image sensor circuit board 61B.

[0118] The metal plate 40 is secured to the housing component 20 by screws that correspond to external threads. An internally threaded hole is formed in the housing component 20 at the location corresponding to the screw. The internally threaded hole is for the screw to engage with the externally threaded screw. Hereinafter, it will be used... Figure 11 and Figure 12 The relationship between each component and screw is explained.

[0119] A heat-conducting plate 61A is disposed between screw A300 and screw B301. Screw A300 engages with an internally threaded hole located on the -X direction side, i.e., the right side, of the first image sensor circuit board 61B. Screw B301 is inserted through the through hole 216D and engages with the internally threaded hole.

[0120] Furthermore, a heat-conducting sheet 61A is provided between the metal plate 40 and the first image sensor circuit board 61B. The metal plate 40 is fixed by screws A300 and B301. With this structure, because the metal plate 40 is tightened by screws A300 and B301, the distance between the metal plate 40 and the first image sensor circuit board 61B can be smaller than the thickness of the heat-conducting sheet 61A. Therefore, the adhesion between the heat-conducting sheet 61A and the metal plate 40 can be improved, and heat generated by the first image sensor circuit board 61B can be dissipated efficiently.

[0121] In addition, a heat-conducting plate 63A is disposed between screw B301 and screw C302. Screw C302 engages with an internal threaded hole disposed on the +X direction side, i.e., the left side, of the second image sensor circuit board 63B.

[0122] A heat-conducting sheet 63A is disposed between the metal plate 40 and the second image sensor circuit board 63B. The metal plate 40 is fixed by screws B301 and C302. With the above structure, the distance between the metal plate 40 and the second image sensor circuit board 63B can be smaller than the thickness of the heat-conducting sheet 63A. Therefore, the adhesion between the heat-conducting sheet 63A and the metal plate 40 can be improved, and heat generated by the second image sensor circuit board 63B can be dissipated efficiently.

[0123] The second metal plate 210 is connected to the first image sensor circuit board 61B and the second image sensor circuit board 63B by screws. Specifically, the first image sensor circuit board 61B is connected to the second metal plate 210 using a sensor screw 310 that passes through the flange 215D and a sensor screw 311 that passes through the flange 215E. Furthermore, the second image sensor circuit board 63B is connected to the second metal plate 210 using a sensor screw 312 that passes through the flange 215D and a sensor screw 313 that passes through the flange 215C.

[0124] Furthermore, the metal plate 40 and the second metal plate 210 are secured by screws B301 and D303. Screw D303 is inserted through the through hole 216C and engages with the internal threaded hole. Through the above structure, the second metal plate 210, the first image sensor circuit board 61B, the second image sensor circuit board 63B, and the metal plate 40 are electrically connected. This strengthens the grounding of the first image sensor circuit board 61B and the second image sensor circuit board 63B. Therefore, noise generated from the first image sensor circuit board 61B and the second image sensor circuit board 63B can be reduced.

[0125] In addition, screw B301 is provided to efficiently dissipate heat and / or reduce noise generated from the first image sensor circuit board 61B and the second image sensor circuit board 63B.

[0126] A heat-conducting plate 55A is positioned between screws E304, F305, and G306. Screw E304 is inserted through the through hole 216B and engages with the internal threaded hole. Screw F305 is inserted through the through hole 216A and engages with the internal threaded hole. Screw G306 is positioned on the -Y direction side of the SoC circuit board 55, near the rear edge, and is inserted through the through hole of the second metal plate 210, engaging with the internal threaded hole formed in the housing component 20.

[0127] A heat-conducting pad 55A is disposed between the metal plate 40 and the SoC circuit board 55. The metal plate 40 is fixed to the housing component 20 using screws E304, F305, and G306. This structure allows the distance between the metal plate 40 and the SoC circuit board 55 to be smaller than the thickness of the heat-conducting pad 55A. Therefore, the adhesion between the heat-conducting pad 55A and the metal plate 40 is improved, and heat generated by the SoC circuit board 55 is dissipated efficiently.

[0128] In addition, screws A300, B301, C302, D303, E304, F305, and G306 each correspond to an example of the screws used to fix the metal plate 40 to the housing component 20.

[0129] The second metal plate 210 and the SoC circuit board 55 are connected by circuit board screws 321, 322, and 323, which are external threads. Specifically, circuit board screw 321 is connected to the base of flange portion 215A, and circuit board screw 322 is connected to the base of flange portion 215B. Furthermore, the metal plate 40 and the second metal plate 210 are secured by screws E304 and F305. Thus, the second metal plate 210, the SoC circuit board 55, and the metal plate 40 are electrically connected. By strengthening the grounding of the SoC circuit board 55, noise generated from the SoC circuit board 55 can be reduced.

[0130] In addition, the SoC circuit board 55 is tightened to the second metal plate 210 using circuit board screws 321, 322, and 323. Therefore, the fit between the second metal plate 210 and the SoC circuit board 55 can be improved, and the heat generated by the SoC circuit board 55 can be dissipated efficiently.

[0131] [2-1-2. Wiring]

[0132] The wiring 65A of the left-side ranging sensor 65 is routed through the first notch 231 formed in the partition 23. The wiring 202A of the left-side light-emitting part 202 is routed through the second notch 232 formed in the partition 23.

[0133] The wiring 65A of the ranging sensor 65, the wiring 67A of the thermopile 67, and the wiring 203A of the buzzer 203 on the right side are routed through the third notch 233 formed in the partition 23. The wiring 202A of the light-emitting part 202 on the right side is routed through the fourth notch 234 formed in the partition 23.

[0134] The wirings 65A, 67A, 203A, and 202A on the right side are gathered within the partition 23 and held by a clamping member 215 located in the center 213 of the second plate. For example, the clamping member 215 may contain a metal such as copper foil. The clamping member 215 is fixed to the center 213 of the second plate by a clamping member fixing member 215A. This allows the second metal plate 210 to reduce noise generated from the wirings 65A, 67A, 203A, and 202A on the right side.

[0135] The communication wiring 201A of the communication module 201 is routed through the fifth notch 235 formed by the partition 23 located between the communication module 201 and the SoC circuit board 55. The communication wiring 201A is not routed together with other wiring, thus improving the noise immunity of the communication module 201.

[0136] Furthermore, the wiring 202A of the light-emitting unit 202 and the communication wiring 201A are configured as twisted cables. Additionally, the wiring connecting the power supply board 51 and the sensor board 53, as well as the wiring connecting the sensor board 53 and the SoC board 55, are configured as twisted cables. Therefore, noise generation can be suppressed.

[0137] Furthermore, the power supply board 51, sensor board 53, and SoC board 55 include bypass capacitors for noise reduction purposes.

[0138] [2-2. Effects]

[0139] As described above, the camera unit 1A is located on the top surface 120A of the cold storage 100. The camera unit 1A includes a second metal plate 210, a wide-angle camera 61 and a narrow-angle camera 63, and a SoC circuit board 55 for controlling the wide-angle camera 61 and the narrow-angle camera 63. The second metal plate 210 and the SoC circuit board 55 are thermally connected via a heat-conducting sheet 218.

[0140] Therefore, since the heat generated by the SoC circuit board 55 is conducted to the second metal plate 210 through the heat-conducting sheet 218, the heat dissipation of the camera unit 1A can be improved, and the risk of malfunction can be reduced.

[0141] In addition, a second metal plate 210 is disposed below the SoC circuit board 55, and a metal plate 40 is disposed above the SoC circuit board 55. The SoC circuit board 55 and the metal plate 40 can be thermally connected via a heat-conducting sheet 55A.

[0142] Therefore, the SoC circuit board 55 can be clamped from two directions using metal components, grounding reinforcement can be achieved, and the risk of malfunctions in the operation of the camera unit 1A can be reduced. Furthermore, because the heat generated by the SoC circuit board 55 can be dissipated to the metal plate 40 and the second metal plate 210, the heat dissipation of the camera unit 1A can be improved, further reducing the risk of malfunctions in operation.

[0143] (Other implementation methods)

[0144] As described above, the embodiments described herein are examples disclosed in this application. However, the technology in this disclosure is not limited to this and can be applied to embodiments with modifications, substitutions, additions, omissions, etc. Furthermore, new embodiments can be formed by combining the constituent elements described in the above embodiments.

[0145] Therefore, other implementation methods are exemplified below.

[0146] In the above embodiments, the heat-conducting sheets 55A, 61A, 63A, and 218 are TIM (Thermal Interface Material) of SARCON (registered trademark) sheets. However, as long as efficient heat conduction between the heating component and the metal plate 40 is achieved, the heat-conducting sheets 55A, 61A, 63A, and 218 can be, for example, gels. In this case, because of their flexibility, they have the advantage of being less affected by the shape of the heating component. In addition, the SARCON (registered trademark) sheets are made of silicone rubber, which has excellent thermal conductivity, heat resistance, insulation, and flexibility.

[0147] Furthermore, since the above embodiments are for illustrative purposes only, various changes, substitutions, additions, or omissions can be made within the scope of the claimed technical solution or its equivalents.

[0148] [Structure supported by the above embodiments]

[0149] The above implementation supports the following structures.

[0150] (Postscript)

[0151] (Technology 1) A camera unit disposed on the top surface of a cold storage room, the camera unit including a metal plate, a camera and a first circuit board for controlling the camera, the metal plate and the first circuit board being thermally connected via a heat transfer component.

[0152] Therefore, the heat generated by the first circuit board is conducted to the metal plate through the heat transfer component. As a result, the heat dissipation of the camera unit 1 can be improved, and the risk of malfunctions can be reduced.

[0153] (Technology 2) The camera unit as described in Technology 1, wherein the metal plate and the image sensor circuit board of the camera are thermally connected via the heat transfer component.

[0154] Therefore, the heat generated by the image sensor circuit board of the camera is conducted to the metal plate through the heat transfer component. As a result, the heat dissipation of the camera unit 1 can be improved, and the risk of malfunctions can be reduced.

[0155] (Technology 3) The camera unit as described in Technology 1, wherein it includes a housing component capable of mounting the camera and the first circuit board and a cover component covering the top of the housing component, the cover component including heat dissipation holes for dissipating heat from the metal plate to the outside.

[0156] Therefore, because the metal plate exchanges heat with the air entering and exiting through the heat dissipation holes, the heat dissipation of the camera and the first circuit board can be improved, and the risk of malfunctions in the camera unit can be reduced.

[0157] (Technology 4) The camera unit as described in any one of Technologies 1 to 3, wherein the camera, the first circuit board and the heat dissipation hole are arranged sequentially from the front, and the camera, the first circuit board and the heat dissipation hole are configured in a manner that does not overlap each other when viewed from above.

[0158] Therefore, since the first circuit board is closer to the heat dissipation hole than the camera, the heat dissipation efficiency of the first circuit board based on the heat dissipation hole can be improved.

[0159] (Technology 5) The camera unit according to any one of Technologies 1 to 4, wherein the metal plate has a front portion covering the image sensor circuit board and a central portion covering the first circuit board, and includes a heat transfer suppression portion that suppresses heat transfer from the central portion to the front portion.

[0160] Therefore, because the heat emanating from the first circuit board is easily conducted to the rear heat dissipation vents rather than the camera side (i.e., the front side of the board), the overall heat dissipation efficiency of the camera unit is improved. Furthermore, because of the improved heat dissipation of the camera, the risk of malfunctions is reduced during prolonged camera operation.

[0161] (Technology 6) The camera unit as described in any one of Technologies 2 to 5, wherein the metal plate is composed of a first plate covering the image sensor circuit board and a second plate covering the first circuit board.

[0162] Therefore, because the heat emanating from the first circuit board is easily conducted to the rear heat dissipation vents rather than the camera side (i.e., the front side of the board), the overall heat dissipation efficiency of the camera unit is improved. Furthermore, because of the improved heat dissipation of the camera, the risk of malfunctions is reduced during prolonged camera operation.

[0163] (Technology 7) A camera unit as described in any one of Technologies 1 to 6, wherein a second circuit board is disposed rearward of the first circuit board, the second circuit board being connected to a power source, the metal plate having a rear portion covering the second circuit board, the rear portion including a protrusion formed in a manner not in contact with the second circuit board, including a housing component and a cover component covering the upper part of the housing component, the cover component including heat dissipation holes for dissipating heat from the metal plate to the outside, the heat dissipation holes being formed in a manner not overlapping the protrusion when viewed from above and being formed at a predetermined interval from the metal plate.

[0164] Therefore, since the heat generated by the second circuit board can be dissipated through the metal plate, the risk of malfunctions in the second circuit board can be reduced. Furthermore, because the distance between the metal plate and the heat dissipation holes is maintained at a predetermined interval, static electricity is difficult to generate, improving safety. Moreover, because the protrusions and heat dissipation holes do not overlap, static electricity generation can be suppressed, thereby enabling miniaturization of the camera unit.

[0165] (Technology 8) The camera unit as described in Technology 5 or 7, wherein a heat dissipation portion is included in the central portion of the board, which is formed in a recessed manner into the first circuit board.

[0166] Therefore, the layout is good because the first circuit board can be thermally connected to the metal plate without changing the height of the first circuit board provided in the housing component.

[0167] (Technology 9) The camera unit as described in any one of Technologies 5, 7, and 8, wherein the heat transfer suppression portion is formed at the front of the plate.

[0168] Therefore, because the heat emanating from the first circuit board is conducted to the metal plate more easily to the heat dissipation vents rather than the camera side, the overall heat dissipation efficiency of the camera unit is improved. Furthermore, because of the improved heat dissipation of the camera, the risk of operational malfunctions is reduced during prolonged operation.

[0169] (Technology 10) A camera unit as described in any one of technologies 1 to 9, wherein the metal plate is disposed on one side of the first circuit board, and a second metal plate is disposed on the other side of the first circuit board, and the first circuit board and the second metal plate are thermally connected via the heat transfer component.

[0170] Therefore, the first circuit board can be clamped from two directions using metal components, grounding reinforcement can be achieved, and the risk of malfunctions in the camera unit's operation can be reduced. Furthermore, because heat generated on the first circuit board can be dissipated to the metal plates and the second metal plate, the heat dissipation of the camera unit can be improved, further reducing the risk of malfunctions in its operation.

[0171] Industrial availability

[0172] As described above, the camera unit of this invention can be used for managing items stored in a cold storage facility.

[0173] Explanation of reference numerals in the attached figures

[0174] 1 Camera Unit

[0175] 20 Shell components

[0176] 30 Cover components

[0177] 31 ventilation holes

[0178] 40 Metal Plate

[0179] 40X rear panel

[0180] 40Y board center section

[0181] 40Z plate front

[0182] 45 Heat dissipation section

[0183] 47 convex part

[0184] 49 Heat transfer suppression section

[0185] 51 Power Supply Circuit Board (Circuit 2)

[0186] 53 Sensor Circuit Board

[0187] 55 SoC board (board 1)

[0188] 55A Thermal Conductor (Heat Transfer Component)

[0189] 61 Wide-angle camera (camera)

[0190] 61A Thermal Conductor (Heat Transfer Component)

[0191] 61B First Image Sensor Circuit Board (Image Sensor Circuit Board)

[0192] 63 Narrow-angle camera (camera)

[0193] 63A Thermal Conductor (Heat Transfer Component)

[0194] 63B Second Image Sensor Circuit Board (Image Sensor Circuit Board)

[0195] W3 interval.

Claims

1. A camera unit, installed on the top surface of a cold storage room, characterized in that: Includes a metal plate, a camera, and a first circuit board for controlling the camera. The metal plate and the first circuit board are thermally connected via a heat transfer component.

2. The camera unit as described in claim 1, characterized in that: The metal plate and the image sensor circuit board of the camera are thermally connected via the heat transfer component.

3. The camera unit as described in claim 1 or 2, characterized in that: This includes a housing component on which the camera and the first circuit board are mounted, and a cover component that covers the top of the housing component. The cover component includes heat dissipation holes that release heat from the metal plate to the outside.

4. The camera unit as described in claim 3, characterized in that: The camera, the first circuit board, and the heat dissipation hole are arranged sequentially from the front, and the camera, the first circuit board, and the heat dissipation hole are configured so as not to overlap when viewed from above.

5. The camera unit as described in claim 2, characterized in that: The metal plate has a front portion covering the image sensor circuit board and a central portion covering the first circuit board. The camera unit includes a heat transfer suppression section that suppresses heat transfer from the center of the plate to the front of the plate.

6. The camera unit as described in claim 2, characterized in that: The metal plate consists of a first plate covering the image sensor circuit board and a second plate covering the first circuit board.

7. The camera unit as described in claim 5, characterized in that: The camera unit includes a second circuit board disposed behind the first circuit board. The second circuit board is connected to the power supply. The metal plate has a rear portion that covers the second circuit board. The rear portion of the board includes a protrusion formed in a manner that does not contact the second circuit board. The camera unit includes a housing component and a cover component that covers the top of the housing component. The cover component includes heat dissipation holes that release heat from the metal plate to the outside. The heat dissipation holes are formed in a manner that does not overlap with the protrusion when viewed from above, and are formed at a predetermined interval from the metal plate.

8. The camera unit as claimed in claim 7, characterized in that: The central portion of the board includes a heat dissipation section, which is formed in a recessed manner into the first circuit board.

9. The camera unit as claimed in claim 8, characterized in that: The heat transfer suppression section is formed at the front of the plate.

10. The camera unit as claimed in claim 1 or 2, characterized in that: The metal plate is disposed on one side of the first circuit board, and the second metal plate is disposed on the other side of the first circuit board. The first circuit board and the second metal plate are thermally connected via the heat transfer component.

Images