A constant temperature melting device

Abstract

The utility model discloses a kind of constant-temperature smelting devices, it relates to heating equipment technical field, including smelting layer, the smelting layer is used to smelt material added externally;Constant-temperature layer, the constant-temperature layer is set to the outer wall of smelting layer, at least one resistance type heating body or magnetism heating body, heat-conducting solution are equipped in the heating layer;The resistance type heating body or magnetism heating body is set in heat-conducting solution, and heat-conducting solution is heated;Heat-conducting solution is coated in the outer wall of smelting layer, for the constant-temperature smelting of material in the smelting layer.

Description

Technical Field

[0001] This utility model relates to the field of heating equipment technology, and in particular to a constant temperature melting device. Background Technology

[0002] Existing smelting apparatuses typically employ a single heating method for the smelting vessel, such as heating only through the side wall of the vessel. Due to the distance effect of heat conduction and the limitations of the material's thermal conductivity, the efficiency of heat transfer from the vessel wall to the central region decreases sharply.

[0003] This can lead to a significant temperature gradient in the material inside the container, resulting in uneven heating. Specifically, the temperature at the edge near the heat source is too high, while the temperature in the center is insufficient.

[0004] Therefore, edge materials are at risk of coking, carbonization, or changes in properties due to prolonged overheating, while center materials cannot be completely melted or remain in a molten state due to insufficient heating, which seriously affects product quality and consistency.

[0005] Therefore, in view of the existing technical problems, a constant temperature melting device is provided. Summary of the Invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a constant temperature melting device that enables materials to be heated more uniformly.

[0007] To achieve the above objectives, this utility model provides the following technical solution: A constant-temperature melting apparatus, comprising: A melting layer, which is used to melt externally added materials; A constant temperature layer is provided on the outer wall of the melting layer. The constant temperature layer contains at least one resistive heating element or magnetic heating element and a heat-conducting solution. The resistive heating element or magnetic heating element is placed in the heat-conducting solution and heats the heat-conducting solution. The heat-conducting solution covers the outer wall of the melting layer and is used to perform constant temperature melting of the material in the melting layer.

[0008] Preferably, the melting layer includes a heating device and at least one first heat-conducting plate; the bottom surface of the melting layer is formed by at least one first heat-conducting plate, and the heating device is correspondingly disposed at the bottom of the first heat-conducting plate.

[0009] Preferably, the heating device includes at least one heating element, which includes a heating tube, a heating wire, or a heating furnace.

[0010] Preferably, at least one of the remaining five surfaces of the smelting layer is also configured as a first heat-conducting plate.

[0011] Preferably, the thermally conductive solution comprises thermally conductive oil.

[0012] Preferably, the constant temperature melting device further includes at least two temperature sensors, which are respectively disposed in the melting layer and the constant temperature layer.

[0013] Preferably, the temperature sensor includes a thermocouple, a resistance temperature detector (RTD), an infrared sensor, or a semiconductor temperature sensor.

[0014] Preferably, the smelting layer comprises: A melting tank, wherein the melting tank is used for melting materials; A liquid container is connected to a smelting tank and is used to contain the molten liquid that has been smelted in the smelting tank.

[0015] Preferably, the constant temperature melting device further includes at least one second heat-conducting plate, which is connected to the first heat-conducting plate. The second heat-conducting plate is used to divide the melting layer into at least two melting chambers.

[0016] Preferably, the two melting chambers conduct heat to each other and melt the material at a uniform and constant temperature.

[0017] Preferably, the two melting chambers are located inside the melting tank.

[0018] Preferably, the constant temperature melting device further includes a level gauge; the level gauge is located above the melting tank and is used to detect whether there is material or not.

[0019] Preferably, the constant temperature melting device further includes a liquid level switch, which is located at the upper end of the liquid tank and the detection end of the liquid level switch is located at the bottom end of the liquid tank.

[0020] Preferably, the constant temperature melting device further includes a filter, which is also located at the upper end of the liquid tank.

[0021] Preferably, the constant temperature melting apparatus further includes at least one dust cover, which is disposed above the constant temperature layer.

[0022] Preferably, the constant temperature melting device further includes a heat insulation layer, which is disposed on the outer wall of the corresponding constant temperature layer.

[0023] Preferably, the constant temperature melting device further includes a discharge port, one end of which passes through the insulation layer and the constant temperature layer in sequence and is connected to the liquid tank, and the other end of which is connected to a discharge switch and a pneumatic internal thread ball valve in sequence.

[0024] Preferably, the constant temperature melting device further includes a drain outlet, one end of which passes through the insulation layer and the constant temperature layer in sequence.

[0025] Preferably, the constant temperature melting device further includes a level gauge, and at least one level gauge is provided, which is located between the top and bottom of the constant temperature layer.

[0026] As can be seen from the above technical solution, this utility model has the following beneficial effects: This invention uses a resistive or magnetic heating element placed in a heat-conducting solution. When the heat-conducting solution is heated by the resistive or magnetic heating element, the temperature of the surface of the melting layer in contact with the heat-conducting solution rises synchronously with the temperature rise of the heat-conducting solution. Since the temperature of the heat-conducting solution is uniform after it rises, the temperature of each contact surface of the melting layer can also be uniform. Therefore, when the melting layer melts the material, it can maintain a constant temperature, thereby improving the quality of the material melting. Attached Figure Description

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the overall structure of the present invention from another perspective; Figure 3 This is a schematic diagram illustrating the overall structure of the insulation layer, the constant temperature layer, and the melting layer of this utility model. Figure 4 This is a top view schematic diagram of the overall structure of the insulation layer, the constant temperature layer, and the melting layer according to an embodiment of the present utility model; Figure 5 This is a schematic diagram of the overall structure of the melting layer according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the overall structure of the constant temperature layer and the melting layer according to an embodiment of the present invention; Figure 7 This is a top view schematic diagram of the overall structure of the constant temperature layer and the melting layer according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the internal structure of the melting layer in one embodiment of the present invention.

[0028] Icon labels: 1. Melting layer; 11. First heat-conducting plate; 12. Heating device; 13. Melting tank; 131. Melting chamber; 14. Liquid tank; 141. Filter screen; 2. Constant temperature layer; 21. Resistance heating element; 22. Thermal conductive solution; 23. Liquid level gauge; 3. Temperature sensor; 4. Second heat-conducting plate; 5. Material level gauge; 6. Liquid level switch; 7. Filter; 8. Dust cover; 9. Insulation layer; 10. Discharge port; 101. Drainage port. Detailed Implementation

[0029] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0030] In the description of this utility model, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] In the description of this utility model, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features or their sequential relationship.

[0032] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution. Example 1

[0033] Reference Figures 1 to 8 As shown, an embodiment of the present invention provides a constant temperature melting apparatus, comprising: Melting layer 1, which is used to melt externally added materials; A constant temperature layer 2 is provided on the outer wall of the melting layer 1. The constant temperature layer 2 contains at least one resistive heating element 21 or a magnetic heating element and a heat-conducting solution 22. The resistive heating element 21 or the magnetic heating element is placed in the heat-conducting solution 22 and heats the heat-conducting solution 22. The heat-conducting solution 22 covers the outer wall of the melting layer 1 and is used to perform constant temperature melting of the material in the melting layer 1. In this process, a resistive heat conductor is placed in the heat-conducting solution 22, and when the heat-conducting solution 22 is heated by the resistive heat conductor, the temperature of the surface of the melting layer 1 in contact with the heat-conducting solution 22 also rises synchronously as the heat-conducting solution 22 heats up. Since the temperature of the heat-conducting solution 22 is uniform after it heats up, the temperature of each contact surface of the melting layer 1 can also be uniform. Therefore, when the melting layer 1 melts the material, it can maintain a constant temperature, thereby improving the quality of the material melting. Similarly, when a magnetic heating element is placed in the heat-conducting solution 22 and the heat-conducting solution 22 is heated by the magnetic heating element, the temperature of the surface of the melting layer 1 in contact with the heat-conducting solution 22 will also rise synchronously as the heat-conducting solution 22 heats up. Since the temperature of the heat-conducting solution 22 is uniform after it heats up, the temperature of each contact surface of the melting layer 1 can also be uniform. Therefore, when the melting layer 1 melts the material, it can maintain a constant temperature, thereby improving the quality of the material melting. In addition, the resistive heat conductor mentioned above includes heating elements such as heating tubes and heating wires, while the magnetic heating element is self-heating by inducing eddy currents inside the magnetic heating element through an electromagnetic coil. The specific structure of the electromagnetic coil and the magnetic heating element is not specifically shown in the accompanying drawings of this specification, but the structure is a conventional technical solution in this field. Any electromagnetic coil and magnetic heating element that can be smelted by heating the heat conduction solution 22 can be used. At the same time, the number or position of the magnetic heating element can be set with reference to the resistive heat conductor in the accompanying drawings of this specification. Secondly, the heat-conducting solution 22 can cover the left, right, front, back, and bottom surfaces of the melting layer 1. This ensures that the melting layer 1 is covered by the heat-conducting solution 22 on all surfaces except the top surface where the material is added. Alternatively, one of the left, right, front, or back surfaces can be selected as the material-adding surface, but the remaining surfaces are covered by the heat-conducting solution 22. Alternatively, two surfaces can be left uncovered by the heat-conducting solution 22. In this embodiment, the top and bottom surfaces are preferably not covered by the heat-conducting solution 22, but the other two uncovered surfaces can be selected according to actual needs.

[0034] Furthermore, in this embodiment, heating tubes are preferred for heating the thermally conductive solution 22. Alternatively, heating wires or magnetic heating elements can be used to heat the thermally conductive solution 22 as needed. In this embodiment, two heating tubes are used, or one or more heating tubes can be selected as needed. Example 2

[0035] Reference Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, in this embodiment, the main focus is on further optimizing the technical solution of the melting layer 1 in Embodiment 1 to improve the quality of material melting: The melting layer 1 includes a heating device 12 and at least one first heat-conducting plate 11; the bottom surface of the melting layer 1 is formed by at least one first heat-conducting plate 11, and the heating device 12 is correspondingly disposed at the bottom of the first heat-conducting plate 11; the heating device 12 includes at least one heating element, which includes a heating tube, a heating wire, or a heating furnace; at least one of the remaining five surfaces of the melting layer 1 is also a first heat-conducting plate 11; In this embodiment, the top and bottom surfaces are not covered by the heat-conducting solution 22. That is, the top surface has the material inlet, while the bottom surface is set as the first heat-conducting plate 11. A heating device 12 is set below the first heat-conducting plate 11. In addition, the left, right, front, and back surfaces of the melting layer 1 are also set as the first heat-conducting plate 11, or one or two or more of them can be set as the first heat-conducting plate 11. This can be selected according to actual needs. By setting the first heat-conducting plate 11, when the heating element is preferably a heating tube and the number is selected as two or more, when the first heat-conducting plate 11 on the bottom surface of the melting layer 1 is heated, and when the heat-conducting solution 22 is used to heat the first heat-conducting plates 11 on the other surfaces, the five surfaces of the melting layer 1 (i.e., the left, right, front, back, and bottom surfaces) are heated at the same time and the heat is uniform. This allows the material to be melted evenly on five surfaces, thereby improving the efficiency and quality of material melting. In addition, the heating element in this embodiment can also be a heating wire, which can be selected according to actual needs. The heating element can also be a heating furnace. As for the selection of the heating furnace, existing heating furnaces on the market can be selected according to the different material melting temperatures. Example 3

[0036] Reference Figure 6 As shown, in this embodiment, the main focus is on further optimizing the technical solution of the heat-conducting solution 22 in Embodiment 1 or Embodiment 2, so as to improve the heating efficiency of the first heat-conducting plate 11. The heat-conducting solution 22 includes heat-conducting oil, which can be mineral-based or synthetic. The specific heating oil is selected according to the different materials being smelted. Example 4

[0037] Reference Figures 1 to 8 As shown, in this embodiment, the main focus is on collecting the temperature of the melting layer 1 and the heat transfer oil in Embodiments 1, 2, and 3, and adjusting the power of the heating tube at the bottom of the melting layer 1 and the heating tube in the heat transfer oil based on the collected temperature, thereby achieving the adjustment of the melting temperature. The constant temperature melting device also includes at least two temperature sensors 3, which are respectively disposed in the melting layer 1 and the constant temperature layer 2; the temperature sensors 3 include thermocouples, resistance temperature detectors, infrared sensors, and semiconductor temperature sensors 3; In this embodiment, the temperature sensor 3 is preferably a thermocouple. However, resistance temperature detectors (RTDs), infrared sensors, and semiconductor temperature sensors 3 can be used to replace the thermocouple depending on the specific requirements. In this embodiment, the thermocouples are located inside the melting layer 1 and the constant temperature layer 2, respectively. In addition, two thermocouples are currently used in this embodiment. However, in practical applications, four or more thermocouples can be used to ensure the accuracy of temperature acquisition in the melting layer 1 and the constant temperature layer 2. Example 5

[0038] Reference Figures 1 to 8 As shown, in this embodiment, the main focus is on optimizing the melting layer 1 of Embodiment 1 to improve the melting efficiency of the melting layer 1 and the quality of the liquid tank 14. The melting layer 1 includes: a melting tank 13, which is used to melt materials; and a liquid container 14, which is connected to the melting tank 13 and is used to contain the molten liquid melted by the melting tank 13. The melting tank 13 is mainly used for melting materials. In this embodiment, the melting tank 13 is designed to melt materials while the liquid tank 14 discharges the molten liquid. Materials can also be added to the melting tank 13 at any time through the material outlet, thereby ensuring the efficiency of the melting process. That is, materials can be added without stopping the melting process. In addition, the liquid tank 14 contains the molten liquid, which increases the heat conduction area between the material and the first heat-conducting plate 11, thereby improving the quality of the material melting. At the same time, in order to improve the purity of the molten liquid, a filter screen 141 is provided at the connection between the melting tank 13 and the liquid tank 14. Example 6

[0039] Reference Figure 3 , Figure 4 , Figure 5 , Figure 7 , Figure 8 As shown, in this embodiment, the main focus is on further optimizing the melting layer 1 in Embodiments 1, 2, 3, 4, and 5, so as to ensure that the temperature remains uniform during melting on the front, back, left, right, bottom, and middle surfaces of the material. The constant temperature melting device further includes at least one second heat-conducting plate 4, which is connected to the first heat-conducting plate 11. The second heat-conducting plate 4 is used to divide the melting layer 1 into at least two melting chambers 131. The two melting chambers 131 conduct heat to each other and melt the material uniformly at a constant temperature. The two melting chambers 131 are located in the melting tank 13. In this design, one second heat-conducting plate 4 is used to divide the melting tank 13 into two melting chambers 131. Alternatively, multiple second heat-conducting plates 4 can be used, dividing the melting tank 13 into multiple melting chambers 131. Each melting chamber 131 has at least two surfaces equipped with the second heat-conducting plate 4 and at least one surface equipped with the first heat-conducting plate 11. Furthermore, the second heat-conducting plate 4 is connected to the first heat-conducting plate 11, and the size of the second heat-conducting plate 4 is smaller than that of the first heat-conducting plate 11. This design... The large increase in the contact area between the material and the first heat-conducting plate 11 and the second heat-conducting plate 4, and the heat between the first heat-conducting plate 11 and the second heat-conducting plate 4 are mutually conducted, thereby ensuring that the melting temperature of each small melting chamber 131 is consistent. Moreover, each melting chamber 131 divides the corresponding material into multiple portions, which are then melted in the small melting chamber 131. Therefore, the material can be melted thoroughly and evenly, without the middle of the material not receiving the required temperature for melting, thus ensuring that multiple surfaces of the material can be heated and melted evenly. Example 7

[0040] Reference Figures 1 to 8 As shown, in this embodiment, the optimization mainly focuses on the material detection in the melting tank 13 and the solution detection in the liquid tank 14 in Embodiments 5 and 6: The constant temperature melting device also includes a level gauge 5; the level gauge 5 is located above the melting tank 13 and is used to detect whether there is material or not; the constant temperature melting device also includes a liquid level switch 6, the liquid level switch 6 is located at the upper end of the liquid tank 14, and the detection end of the liquid level switch 6 is located at the bottom end of the liquid tank 14; the constant temperature melting device also includes a filter 7, the filter 7 is also located at the upper end of the liquid tank 14; the constant temperature melting device also includes at least one dust cover 8, at least one dust cover 8 is located above the constant temperature layer 2; Among them, the level gauge 5 is used to detect whether the material in the melting tank 13 is at a high level. If the level is detected to be high, the melting tank 13 stops feeding. If no high level is detected, feeding continues. When the material reaches the high level, feeding stops. Feeding is interlocked with the liquid level switch 6. The liquid level switch 6 is used to detect whether the liquid tank 14 is at a low level. If the liquid level is low, the power of the heating tube needs to be adjusted to increase the melting of the material. In this embodiment, the liquid level switch 6 is a float liquid level switch. The filter 7 is a drain filter. It is used to release air pressure when the pressure is too high during the melting process to ensure the safety of melting. The dust cover 8 is to prevent large particles of powder from overflowing. Example 8

[0041] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, this embodiment mainly focuses on Implementation 1, specifically optimizing the insulation of the constant temperature layer 2: The constant temperature melting device also includes a heat insulation layer 9, which is disposed on the outer wall of the constant temperature layer 2; the constant temperature melting device also includes a discharge port 10, one end of which passes through the heat insulation layer 9 and the constant temperature layer 2 in sequence and is connected to the liquid tank 14, and the other end of which is connected to a discharge switch and a pneumatic internal thread ball valve in sequence; the constant temperature melting device also includes a drain port 101, one end of which passes through the heat insulation layer 9 and the constant temperature layer 2 in sequence.

[0042] The insulation layer 9 can be fitted with insulation material to prevent heat leakage from the constant temperature layer 2. Additionally, a drain switch allows waste material to be discharged from the liquid tank 14 to ensure the quality of the molten liquid within 14. Furthermore, details are provided in the instruction manual. Figure 1 As can be seen, a cover plate is provided on the top of the insulation layer 9, the constant temperature layer 2, and the melting layer 1. The cover plate on the top of the corresponding melting tank 13 is provided with a material outlet. The other attached drawings in the instruction manual do not show the cover plate. It is not that the cover plate is not there, but that the structure is omitted. Example 9

[0043] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 , Figure 7 As shown, this embodiment mainly focuses on optimizing the oil level detection of the heat-conducting oil in Example 1, namely: The constant temperature melting device also includes a level gauge 23. At least one level gauge 23 is provided, which is located between the top and bottom of the constant temperature layer 2. Alternatively, two level gauges 23 can be provided as needed, with one level gauge 23 located at the top of the constant temperature layer 2 and the other level gauge 23 located at the bottom of the constant temperature layer.

[0044] Among them, a level gauge 23 is designed at the top of the constant temperature layer 2 to detect the oil level of the heat transfer oil, thereby preventing overflow or excessive oil pressure caused by the oil level of the heat transfer oil being too high; a level gauge 23 is designed at the bottom of the constant temperature layer 2 to detect that the oil level of the heat transfer oil is too low, which would affect the constant temperature or melting effect.

[0045] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A constant-temperature melting apparatus, characterized in that, include: A melting layer, which is used to melt externally added materials; A constant temperature layer is provided on the outer wall of the melting layer, and at least one resistive heating element or magnetic heating element and a heat-conducting solution are provided inside the constant temperature layer. The resistive heating element or the magnetic heating element is placed in the heat-conducting solution and heats the heat-conducting solution; The heat-conducting solution is coated on the outer wall of the melting layer and is used to perform constant-temperature melting of the material in the melting layer.

2. The isothermal melting apparatus according to claim 1, characterized in that: The melting layer includes a heating device and at least one first heat-conducting plate; the bottom surface of the melting layer is formed by at least one first heat-conducting plate, and the heating device is correspondingly disposed at the bottom of the first heat-conducting plate.

3. The constant temperature melting apparatus according to claim 2, characterized in that: The heating device includes at least one heating element, which includes a heating tube, a heating wire, or a heating furnace.

4. The isothermal melting apparatus according to claim 2, characterized in that: At least one of the remaining five surfaces of the melting layer is also designated as the first heat-conducting plate.

5. The isothermal melting apparatus according to claim 1, characterized in that: The thermally conductive solution includes thermally conductive oil.

6. The isothermal melting apparatus according to claim 1, characterized in that: The constant temperature melting device also includes at least two temperature sensors, which are respectively installed in the melting layer and the constant temperature layer.

7. The isothermal melting apparatus according to claim 6, characterized in that: The temperature sensors include thermocouples, resistance temperature detectors (RTDs), infrared sensors, and semiconductor temperature sensors.

8. The constant temperature melting apparatus according to claim 2, characterized in that: The smelting layer includes: A melting tank, wherein the melting tank is used for melting materials; A liquid container is connected to a smelting tank and is used to contain the molten liquid that has been smelted in the smelting tank.

9. The constant temperature melting apparatus according to claim 8, characterized in that: The constant temperature melting device further includes at least one second heat-conducting plate, which is connected to the first heat-conducting plate. The second heat-conducting plate is used to divide the melting layer into at least two melting chambers.

10. The isothermal melting apparatus according to claim 9, characterized in that: The two melting chambers conduct heat to each other and melt the material at a uniform and constant temperature.

11. The isothermal melting apparatus according to claim 10, characterized in that: The two smelting chambers are located inside the smelting tank.

12. The isothermal melting apparatus according to claim 8, characterized in that: The constant temperature melting device also includes a level gauge; the level gauge is located above the melting tank and is used to detect whether there is material or not.

13. The isothermal melting apparatus according to claim 8, characterized in that: The constant temperature melting device also includes a liquid level switch, which is located at the upper end of the liquid tank and the detection end of the liquid level switch is located at the bottom end of the liquid tank.

14. The isothermal melting apparatus according to claim 8, characterized in that: The constant temperature melting device also includes a filter, which is also located at the upper end of the liquid tank.

15. The isothermal melting apparatus according to claim 1, characterized in that: The constant temperature melting apparatus also includes at least one dust cover, which is located above the constant temperature layer.

16. The isothermal melting apparatus according to claim 1, characterized in that: The constant temperature melting device also includes a heat insulation layer, which is disposed on the outer wall of the corresponding constant temperature layer.

17. The isothermal melting apparatus according to claim 16, characterized in that: The constant temperature melting device also includes a discharge port. One end of the discharge port passes through the insulation layer and the constant temperature layer in sequence and is connected to the liquid tank. The other end of the discharge port is connected to a discharge switch and a pneumatic internal thread ball valve in sequence.

18. The isothermal melting apparatus according to claim 16, characterized in that: The constant temperature melting device also includes a drain outlet, one end of which passes through the insulation layer and the constant temperature layer in sequence.

19. The isothermal melting apparatus according to claim 1, characterized in that: The constant temperature melting device also includes a level gauge, and at least one level gauge is provided, which is located between the top and bottom of the constant temperature layer.

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