Integrated sensor of pressure, temperature and humidity

Abstract

The utility model relates to air suspension accessory technical field, and disclose a kind of integrated sensor of pressure temperature humidity, including pedestal, the pedestal sleeve joint has circuit board and support seat, the one side of circuit board close to pedestal is fixedly installed with pressure sensing module and temperature and humidity sensor module, the one side of circuit board close to support seat is fixedly installed with microcontroller, the edge side in the inside of support seat is equipped with mounting hole, spring is placed in the inside of mounting hole.This integrated sensor of pressure temperature humidity, pressure sensing module, temperature and humidity sensor module and microcontroller are integrated in the upper and lower ends of circuit board respectively, and O type sealing ring is matched to seal the upper portion of circuit board, while circuit board and support seat are integrated in the inboard of pedestal, can reduce the volume of sensor, by the design of pressure sensing module and temperature and humidity sensor module, ensure that client ECU can obtain accurate detection data in time, can real-time monitoring the change of pressure, temperature and temperature and humidity.

Description

Technical Field

[0001] This utility model relates to the field of air suspension accessories technology, specifically an integrated sensor for pressure, temperature and humidity. Background Technology

[0002] As a core chassis component of modern commercial vehicles, passenger cars, and special vehicles, the air suspension system significantly improves vehicle ride comfort, handling stability, and load adaptability due to its ability to dynamically adjust suspension height, stiffness, and damping characteristics. It has become the mainstream choice for high-end vehicle chassis configurations. The normal operation of this system is highly dependent on the pressure stability and dryness of the medium in the pneumatic circuit. The pressure of compressed air directly determines the suspension support force and adjustment accuracy, while the temperature and humidity of the air affect the sealing performance, service life, and system reliability of the pneumatic components.

[0003] Currently, air suspension systems on the market typically only have pressure sensors (0-2MPa), which can only monitor pressure fluctuations and cannot monitor temperature and humidity changes in real time. Customers can only passively follow a fixed strategy to heat the dryer to achieve regeneration and water absorption capabilities. Even if customers install additional temperature and humidity sensors, the measurement error is much greater than the product's normal pressure accuracy specification (+ / -2%RH), with the maximum error reaching 10%RH. According to actual measurement data, for every 1MPa increase in pressure, the measurement accuracy deviation is about 5%RH. Therefore, we propose an integrated sensor for pressure, temperature, and humidity. Summary of the Invention

[0004] The technical problem to be solved by this invention is to provide an integrated sensor for pressure, temperature and humidity, which can effectively solve the problems in the prior art.

[0005] The technical solution adopted by this utility model is: an integrated pressure, temperature, and humidity sensor, including a base, a circuit board and a support base sleeved on the base, a pressure sensing module and a temperature and humidity sensing module fixedly installed on the side of the circuit board near the base, a microcontroller fixedly installed on the side of the circuit board near the support base, a mounting hole is opened on the side inside the support base, a spring is placed inside the mounting hole, an O-ring is provided between the base and the circuit board, an inner groove is opened at the top of the base, a pipe connection port is provided at the top of the base, and a lower notch is opened at the top of the support base.

[0006] Preferably, the mounting holes are provided with three identical holes, the mounting holes are shaped like a larger top and a smaller bottom, the spring is also shaped like a larger top and a smaller bottom, the lower end of the spring extends to the lower part of the support base, and the top end of the spring is in contact with the signal output terminal of the microcontroller.

[0007] The above technical solution adapts the mounting hole, which is wider at the top and narrower at the bottom, to the structure of the spring. This effectively limits the radial displacement of the spring within the mounting hole, ensuring that the spring is securely installed. The spring design ensures that the top of the spring contacts the signal output terminal of the microcontroller, and also allows the output signal of the microcontroller to be stably transmitted to the client ECU based on the characteristics of the spring.

[0008] Preferably, the pressure sensing module and the temperature and humidity sensing module are both located inside the recess, the outer diameter of the circuit board is adapted to the inner diameter of the base, and the vertical axes of the circuit board and the base are on the same vertical line.

[0009] The above technical solution, by designing the circuit board and the base to be on the same vertical axis, ensures that the circuit board is stably inserted into the base, preventing the circuit board from shaking inside the base during use.

[0010] Preferably, the O-ring is located on the upper side of the circuit board, and the O-ring is in contact with both the circuit board and the base. The pipe connection port is interconnected with the inner groove.

[0011] Through the above technical solution, the O-ring forms a tight sealing structure between the circuit board and the base, ensuring that the gas in the pipeline can communicate with the inner groove, and enabling real-time detection of temperature, humidity and pressure.

[0012] Preferably, both the pressure sensing module and the temperature and humidity sensing module are electrically connected to the microcontroller, and the microcontroller is electrically connected to the external client ECU.

[0013] Through the above technical solution, the pressure sensing module converts gas pressure into an electrical signal and amplifies it into a standard signal, and the temperature and humidity sensing module converts gas temperature and humidity into electrical signals and amplifies and amplifies them into standard signals. Both signals can be quickly transmitted to the microcontroller via electrical connection. After the microcontroller obtains accurate temperature, humidity, and pressure signals through algorithm compensation processing, it outputs the signals through electrical connection with the external client ECU. This realizes the coordinated work of each functional module and ensures that the client ECU can obtain accurate detection data in a timely manner.

[0014] Preferably, the microcontroller is located inside the lower notch, and the vertical axis of the microcontroller and the lower notch are on the same vertical line.

[0015] The above technical solution ensures that the microcontroller can be stably inserted into the lower notch, reducing the size of the integrated sensor.

[0016] Compared with the prior art, this utility model provides an integrated sensor for pressure, temperature and humidity, which has the following advantages: 1. This integrated pressure, temperature, and humidity sensor integrates the pressure sensing module, temperature and humidity sensing module, and microcontroller on the upper and lower ends of the circuit board, respectively, and uses O-rings to seal the upper part of the circuit board. At the same time, the circuit board and the support base are integrated inside the base, which can reduce the size of the sensor. 2. This integrated pressure, temperature, and humidity sensor, through the design of pressure sensing modules and temperature and humidity sensing modules, converts gas pressure into an electrical signal and amplifies it into a standard signal. The pressure sensing module converts gas temperature and humidity into electrical signals and amplifies and amplifies them into standard signals. Both can be quickly transmitted to the microcontroller via electrical connection. After the microcontroller obtains accurate temperature, humidity, and pressure signals through algorithm compensation processing, it outputs the signals through electrical connection with the external client ECU. This realizes the coordinated work of various functional modules, ensuring that the client ECU can obtain accurate detection data in a timely manner and monitor changes in pressure, temperature, and humidity in real time. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of a half-section of the base structure of this utility model; Figure 3 This is a schematic diagram of the disassembled structure of the circuit board and support base of this utility model; Figure 4 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ; Figure 5 This is a schematic diagram of the half-section structure of this utility model; Figure 6 This is a hardware principle block diagram of the present invention.

[0018] The components include: 1. Base; 2. Circuit board; 3. Support base; 4. Pressure sensing module; 5. Temperature and humidity sensing module; 6. Microcontroller; 7. Mounting hole; 8. Spring; 9. O-ring seal; 10. Inner groove; 11. Pipe connection port; 12. Lower notch. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1: As Figure 1-6As shown, the present invention provides an integrated pressure, temperature, and humidity sensor, including a base 1, a circuit board 2 and a support 3 fitted onto the base 1, a pressure sensing module 4 and a temperature and humidity sensing module 5 fixedly mounted on the side of the circuit board 2 near the base 1, a microcontroller 6 fixedly mounted on the side of the circuit board 2 near the support 3, a mounting hole 7 opened on the side inside the support 3, a spring 8 placed inside the mounting hole 7, an O-ring seal 9 provided between the base 1 and the circuit board 2, an inner groove 10 opened at the top inside the base 1, a pipe connection port 11 provided at the top of the base 1, and a lower notch 12 opened at the top of the support 3.

[0021] Specifically, there are three identical mounting holes 7, which are wider at the top and narrower at the bottom. The spring 8 also has a similar shape, with its lower end extending to the lower part of the support base 3. The top end of the spring 8 is in contact with the signal output terminal of the microcontroller 6. The advantage is that the top-to-bottom shape of the mounting holes 7 matches the structure of the spring 8, effectively limiting the radial displacement of the spring 8 within the mounting holes 7, ensuring a secure installation. The design of the spring 8 ensures that its top end contacts the signal output terminal of the microcontroller 6, and also allows for stable transmission of the microcontroller 6's output signal to the client ECU.

[0022] Example 2: like Figure 2-6 As shown, this is an improvement on the previous embodiment.

[0023] Specifically, the pressure sensing module 4 and the temperature and humidity sensing module 5 are both located inside the recess 10. The outer diameter of the circuit board 2 is matched with the inner diameter of the base 1, and the vertical axes of the circuit board 2 and the base 1 are on the same vertical line. The advantage is that the design of the vertical axes of the circuit board 2 and the base 1 being on the same vertical line ensures that the circuit board 2 is stably inserted into the base 1, preventing the circuit board 2 from shaking inside the base 1 during use.

[0024] Specifically, the O-ring 9 is located on the upper side of the circuit board 2. The O-ring 9 is in contact with both the circuit board 2 and the base 1, and the pipe connection port 11 is interconnected with the inner groove 10. The advantage is that the O-ring 9 forms a tight sealing structure between the circuit board 2 and the base 1, ensuring that the gas in the pipe can communicate with the inner groove 10, and enabling real-time detection of temperature, humidity, and pressure.

[0025] Specifically, both the pressure sensing module 4 and the temperature and humidity sensing module 5 are electrically connected to the microcontroller 6, which in turn is electrically connected to the external client ECU. The advantage is that the pressure sensing module 4 converts gas pressure into an electrical signal and amplifies it to a standard signal, while the temperature and humidity sensing module 5 converts gas temperature and humidity into electrical signals and amplifies and amplifies them to a standard signal. Both signals are then quickly transmitted to the microcontroller 6 via electrical connection. The microcontroller 6 processes these signals using an algorithm to obtain accurate temperature, humidity, and pressure signals, and then outputs the signals through the electrical connection to the external client ECU. This achieves coordinated operation of the various functional modules, ensuring that the client ECU can obtain accurate detection data in a timely manner.

[0026] Specifically, the microcontroller 6 is located inside the lower notch 12, and the vertical axis of the microcontroller 6 and the lower notch 12 are on the same vertical line. The advantage is that it ensures that the microcontroller 6 can be stably inserted into the lower notch 12, thus reducing the size of the integrated sensor.

[0027] Working principle: During assembly, the pressure sensing module 4, temperature and humidity sensing module 5, and microcontroller 6 are integrated at the upper and lower ends of the circuit board 2, respectively. The pressure sensing module 4 and temperature and humidity sensing module 5 are inserted into the inner side of the inner groove 10, and the microcontroller 6 is inserted into the inner side of the lower notch 12. At the same time, the O-ring 9 abuts against the base 1 and the circuit board 2. The support 3 is sleeved under the circuit board 2. First, the integrated sensor is connected to the gas pipeline to be detected through the pipeline connection port 11 at the top of the base 1. At this time, the gas to be detected can enter between the circuit board 2 and the base 1 through the pipeline connection port 11, located between the base 1 and the circuit board 2. The pressure sensing module 4 and the temperature and humidity sensing module 5 between the two can detect the pressure, temperature and humidity of the gas. The pressure sensing module 4 converts the gas pressure into an electrical signal and amplifies it into a standard signal. The temperature and humidity sensing module 5 converts the gas temperature and humidity into electrical signals and amplifies and amplifies them into standard signals. Both signals can be quickly transmitted to the microcontroller 6 through electrical connection. After the microcontroller 6 obtains accurate temperature, humidity and pressure signals through algorithm compensation processing, it outputs the signals through electrical connection with the external client ECU. This realizes the coordinated work of each functional module and ensures that the client ECU can obtain accurate detection data in a timely manner.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated pressure, temperature, and humidity sensor, comprising a base (1), characterized in that: The base (1) is fitted with a circuit board (2) and a support base (3). A pressure sensing module (4) and a temperature and humidity sensing module (5) are fixedly installed on the side of the circuit board (2) near the base (1). A microcontroller (6) is fixedly installed on the side of the circuit board (2) near the support base (3). An installation hole (7) is opened on the side inside the support base (3). A spring (8) is placed inside the installation hole (7). An O-ring (9) is provided between the base (1) and the circuit board (2). An inner groove (10) is opened at the top inside the base (1). A pipe connection port (11) is provided at the top of the base (1). A lower notch (12) is opened at the top of the support base (3).

2. The integrated pressure, temperature, and humidity sensor according to claim 1, characterized in that: The mounting holes (7) are provided in three identical shapes. The mounting holes (7) are larger at the top and smaller at the bottom. The spring (8) is also larger at the top and smaller at the bottom. The lower end of the spring (8) extends to the lower part of the support base (3). The top end of the spring (8) is in contact with the signal output end of the microcontroller (6).

3. The integrated pressure, temperature, and humidity sensor according to claim 1, characterized in that: The pressure sensing module (4) and the temperature and humidity sensing module (5) are both located inside the inner groove (10). The outer diameter of the circuit board (2) is adapted to the inner diameter of the base (1). The vertical axes of the circuit board (2) and the base (1) are on the same vertical line.

4. The integrated pressure, temperature, and humidity sensor according to claim 1, characterized in that: The O-ring (9) is located on the upper side of the circuit board (2). The O-ring (9) is in contact with both the circuit board (2) and the base (1). The pipe connection port (11) is interconnected with the inner groove (10).

5. The integrated pressure, temperature, and humidity sensor according to claim 1, characterized in that: The pressure sensing module (4) and the temperature and humidity sensing module (5) are both electrically connected to the microcontroller (6), and the microcontroller (6) is electrically connected to the external client ECU.

6. The integrated pressure, temperature, and humidity sensor according to claim 1, characterized in that: The microcontroller (6) is located inside the lower notch (12), and the vertical axis of the microcontroller (6) and the lower notch (12) are on the same vertical line.

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