Infrared proximity and ambient light level sensor

Abstract

The utility model discloses an infrared proximity and ambient light brightness sensor, including transmitting chip, receiving response chip and glass substrate, transmitting chip is equipped with first metal convex structure, and receiving response chip is equipped with second metal convex structure, and glass substrate is equipped with first blind slot and second blind slot, and first metal bonding pad is equipped in first blind slot, and second metal bonding pad is equipped in second blind slot, and transmitting chip is inverted in first blind slot and first metal convex structure electric connection first metal bonding pad, and receiving response chip is inverted in second blind slot and second metal convex structure electric connection second metal bonding pad. The utility model can further reduce the size of sensor, and the simple production technology is low in cost, and the consistency is good, and the reliability is high.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to an infrared proximity and ambient light brightness sensor. Background Technology

[0002] Infrared proximity sensors and ambient light sensors have become increasingly common in mobile phones, televisions, and portable devices. Currently, they are typically packaged together in a single unit to reduce device size. However, with increasing device integration and miniaturization, the size requirements for infrared proximity and ambient light sensors are becoming more stringent, and existing sensors still struggle to meet these demands. Further reducing the size of infrared proximity and ambient light sensors is a pressing technical challenge in this field. Utility Model Content

[0003] Therefore, this utility model provides an infrared proximity and ambient light brightness sensor, which can further reduce the sensor size, has a simple manufacturing process, low cost, and high consistency and reliability.

[0004] To solve the above-mentioned technical problems, this utility model provides an infrared proximity and ambient light intensity sensor, comprising: The transmitter chip has a first metal protrusion structure on its active surface; The receiving sensor chip has a second metal protrusion structure on its active surface; A glass substrate includes a first substrate region, a third substrate region, and a second substrate region sequentially disposed along a first direction perpendicular to the thickness direction of the glass substrate. The first substrate region has a first slot structure, which includes a first blind slot communicating with the front side of the glass substrate and a first through-hole penetrating the bottom of the first blind slot. First metal pads are provided at both ends of the first through-hole, and the first through-hole is filled with metal material to electrically connect the first metal pads at both ends of the first through-hole. The second substrate region has a second slot structure, which includes a second blind slot communicating with the front side of the glass substrate and a second through-hole communicating with the front side of the glass substrate. A second through hole penetrating the bottom of the second blind slot is provided. Second metal pads are provided at both ends of the second through hole. Metal material is filled in the second through hole to electrically connect the second metal pads at both ends of the second through hole. The third substrate area is provided with a third hole-groove structure. Infrared isolation material is provided in the third hole-groove structure. The infrared isolation material isolates the first blind slot and the second blind slot. A third metal pad is provided on the back side of the glass substrate. The third metal pad is connected to the first metal pad and the second metal pad through metal wiring. A third metal protrusion structure is provided on the side of the third metal pad away from the glass substrate. The transmitting chip is flip-mounted in the first blind slot and the first metal protrusion structure is electrically connected to the first metal pad; the receiving sensor chip is flip-mounted in the second blind slot and the second metal protrusion structure is electrically connected to the second metal pad.

[0005] Furthermore, the first metal protrusion structure, the second metal protrusion structure, and the third metal protrusion structure are all metal solder balls.

[0006] Furthermore, the first slot structure includes a first through hole.

[0007] Furthermore, the second hole structure includes two rows of second through holes arranged sequentially along a second direction, the second direction being perpendicular to the thickness direction of the glass substrate and the first direction, the two rows of second through holes being close to the two opposite groove walls of the second blind groove, and each row of second through holes including a plurality of second through holes arranged at intervals along the first direction.

[0008] Furthermore, the third hole structure includes at least two columns of third through holes arranged sequentially along the first direction, each column of the third through holes including a plurality of the third through holes arranged sequentially along the second direction, the second direction being perpendicular to the thickness direction of the glass substrate and the first direction, and adjacent columns of the third through holes being staggered.

[0009] Furthermore, the third slot structure includes three rows of the third through holes arranged sequentially along the first direction.

[0010] Furthermore, the infrared blocking material is a metallic material.

[0011] Furthermore, the back surface of the glass substrate is provided with two rows of the third metal pads arranged sequentially along a second direction, the second direction being perpendicular to the thickness direction of the glass substrate and the first direction, the two rows of the third metal pads being close to the two long sides of the glass substrate respectively, and each row of the third metal pads including a plurality of the third metal pads arranged sequentially along the first direction.

[0012] Furthermore, a passivation layer is provided on the back side of the glass substrate. The passivation layer covers the metal wiring and isolates the glass substrate and the metal wiring. The passivation layer is provided with a first opening, a second opening and a third opening. The first opening exposes the light-emitting area of ​​the bottom of the first blind trench, the second opening exposes the light-receiving area of ​​the bottom of the second blind trench, and the third opening exposes the third metal protrusion structure.

[0013] Compared with the prior art, the above-mentioned technical solution of this utility model has the following advantages: The infrared proximity and ambient light brightness sensor of this utility model adopts a glass substrate and chip flip-chip process. On the one hand, it does not require further lens setting, which can greatly reduce the thickness of the sensor and make the manufacturing process simpler. On the other hand, due to the excellent properties of the glass material itself, the sensor has lower cost, higher consistency and higher reliability. Attached Figure Description

[0014] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0015] Figure 1 This is a schematic diagram of the infrared proximity and ambient light intensity sensor disclosed in this utility model from one angle. Figure 2 This is a schematic diagram of the infrared proximity and ambient light intensity sensor disclosed in this utility model from another angle; Figure 3 This is a schematic diagram of the transmitting chip disclosed in this utility model; Figure 4 This is a schematic diagram of the receiving sensor chip disclosed in this utility model; Figure 5 This is a schematic diagram of the first, second, and third slot structures on the glass substrate disclosed in this utility model. Figure 6 Another schematic diagram of the first, second, and third hole groove structures on the glass substrate disclosed in this utility model; Figure 7 This is a schematic diagram of the formation of a first metal pad, a second metal pad, and an infrared isolation material on a glass substrate disclosed in this utility model. Figure 8 This is a schematic diagram of a first passivation film disposed on a glass substrate disclosed in this utility model. Figure 9 This is a schematic diagram of a first metal wiring disposed on a glass substrate disclosed in this utility model; Figure 10 This is a schematic diagram of a second passivation film disposed on a glass substrate disclosed in this utility model. Figure 11 This is a schematic diagram of a glass substrate with a third metal pad and a second metal wiring disclosed in this utility model. Figure 12 This is a schematic diagram of a third passivation film disposed on a glass substrate disclosed in this utility model.

[0016] Explanation of reference numerals in the accompanying drawings: 1. Transmitting chip; 11. First metal protrusion structure; 2. Receiving sensor chip; 21. Second metal protrusion structure; 3. Glass substrate; 31. First slot structure; 311. First blind slot; 312. First through hole; 313. Light emitting area; 32. First metal pad; 33. Second slot structure; 331. Second blind slot; 332. Second through hole; 333. Light entering area; 34. Second metal pad; 35. Third slot structure; 351. Third through hole; 36. Infrared isolation material; 37. Third metal pad; 38. Third metal protrusion structure; 391. First passivation film; 392. First metal wiring; 393. Second passivation film; 394. Second metal wiring; 395. Third passivation film. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0018] See Figures 1 to 12 The present invention discloses an embodiment of an infrared proximity and ambient light brightness sensor.

[0019] Infrared proximity and ambient light sensors include: The transmitter chip 1 has a first metal protrusion structure 11 on its active surface; The receiving sensor chip 2 has a second metal protrusion structure 21 on its active surface; The glass substrate 3 includes a first substrate region, a third substrate region, and a second substrate region arranged sequentially along a first direction, which is perpendicular to the thickness direction of the glass substrate 3. The first substrate region is provided with a first slot structure 31, which includes a first blind slot 311 communicating with the front side of the glass substrate 3 and a first through hole 312 penetrating the bottom of the first blind slot 311. The first through hole 312 is provided with first metal pads 32 at both ends, and the first through hole 312 is filled with metal material to electrically connect the first metal pads 32 at both ends of the first through hole 312. The second substrate region is provided with a second slot structure 33, which includes a second blind slot 331 communicating with the front side of the glass substrate 3 and a through slot 331 penetrating the second blind slot. The bottom of the 331 groove has a second through hole 332. The two ends of the second through hole 332 are provided with second metal pads 34. The second through hole 332 is filled with metal material to electrically connect the two ends of the second metal pads 34. The third substrate area is provided with a third hole groove structure 35. The third hole groove structure 35 is provided with an infrared isolation material 36. The infrared isolation material 36 isolates the first hole groove structure 31 and the second hole groove structure 33. The back side of the glass substrate 3 is provided with a third metal pad 37. The third metal pad 37 is connected to the first metal pad 32 and the second metal pad 34 through metal wiring. The side of the third metal pad 37 away from the glass substrate 3 is also provided with a third metal protrusion structure 38. The transmitting chip 1 is flip-mounted in the first blind slot 311 and the first metal protrusion structure 11 is electrically connected to the first metal pad 32. The receiving sensor chip 2 is flip-mounted in the second blind slot 331 and the second metal protrusion structure 21 is electrically connected to the second metal pad 34.

[0020] In the above text, the emitting chip 1 is an infrared light source used to emit infrared rays. The first metal protrusion structure 11 is a conductive structure that connects the emitting chip 1 to the outside. The active surface of the emitting chip 1 faces the bottom of the first blind slot 311 and makes the first metal protrusion structure 11 and the first metal pad 32 electrically connected.

[0021] The receiving sensor chip 2 is a photosensitive sensor that can capture reflected infrared light and ambient light. The second metal protrusion structure 21 is a conductive structure that connects the receiving sensor chip 2 to the outside. The active surface of the receiving sensor chip 2 faces the bottom of the second blind slot 331, and the second metal protrusion structure 21 and the second metal pad 34 are electrically connected.

[0022] The glass substrate 3 serves as the base of the entire sensor and is generally designed as a regular rectangular shape. The first direction is, for example, the length or width direction of the glass substrate 3. The front and back sides of the glass substrate 3 are the two surfaces of the glass substrate 3, and the glass substrate 3 includes three substrate areas arranged sequentially along its length or width direction. The first slot structure 31, the second slot structure 33, and the third slot structure 35 are cavity structures formed on the glass substrate 3. The first blind slot 311 and the second blind slot 331 are equivalent to two recessed structures on the front side of the glass substrate 3. The size and shape of the first blind slot 311 and the second blind slot 331 are adapted to the transmitting chip 1 and the receiving sensing chip 2, respectively. The bottom of the first blind slot 311 is the bottom plane of the first blind slot 311, which is approximately perpendicular to the thickness direction of the glass substrate 3. The bottom of the second blind slot 331 is the bottom plane of the second blind slot 331, which is approximately perpendicular to the thickness direction of the glass substrate 3. The position of the first through-hole 312 is adapted to the position of the first metal protrusion structure 11 on the transmitting chip 1. The first through-hole 312 penetrates the bottom of the first blind groove 311 along the thickness direction of the glass substrate 3. The position of the second through-hole 332 is adapted to the position of the second metal protrusion structure 21 on the receiving sensor chip 2. The second through-hole 332 penetrates the bottom of the second blind groove 331 along the thickness direction of the glass substrate 3. The first metal pad 32 passes through the first through-hole 312, and the second metal pad 34 passes through the second through-hole 332. The position, number, and size of the first metal pad 32 are adapted to the first metal protrusion structure 11, and the position, number, and size of the second metal pad 34 are adapted to the second metal protrusion structure 21. After the infrared isolation material 36 is filled into the third hole-groove structure 35, the infrared isolation material 36 can prevent the infrared rays emitted by the transmitting chip 1 from reaching the receiving sensor chip 2. The function of the third metal pad 37 and the metal wiring is to rearrange the connection positions with the external circuit, so that the third metal pad 37 is evenly distributed and adapted to the position of the external circuit. The third metal protrusion structure 38 is a conductive structure for the entire sensor to connect to the outside. The position, size and number of the third metal protrusion structure 38 are adapted to the external circuit.

[0023] Specifically, during proximity detection, the emitting chip 1 emits infrared light through the light-emitting area 313 to the outside of the sensor. When an object approaches, the infrared light is reflected back from the object and returns to the sensor through the light-receiving area 333. The receiving chip 2 captures the reflected light and determines the distance to the object by observing changes in the electrical signal. During ambient light detection, the receiving chip 2 simultaneously senses the intensity of ambient light, converts the ambient light signal into an electrical signal, and outputs it to determine the external brightness.

[0024] With the above technical solution, by using glass substrate and chip flip-chip process, on the one hand, there is no need to set up a lens, which can significantly reduce the thickness of the sensor and make the manufacturing process simpler. On the other hand, due to the excellent properties of glass material itself, the sensor has lower cost, better consistency and higher reliability.

[0025] In this embodiment, the first metal protrusion structure 11, the second metal protrusion structure 21, and the third metal protrusion structure 38 are all metal solder balls.

[0026] In the above text, metal solder balls refer to spherical structures that can be soldered. The active surface of the transmitting chip 1 is provided with metal solder balls that are adapted to the first metal pad 32, the active surface of the receiving sensor chip 2 is provided with metal solder balls that are adapted to the second metal pad 34, and the back side of the glass substrate 3 is provided with metal solder balls that are adapted to external circuits.

[0027] Specifically, metal solder balls are a common structure in flip-chip bonding. The flip-chip bonding process with metal solder balls has the following advantages: First, it can achieve high-precision self-alignment and reduce the difficulty of mounting; second, it improves the mechanical reliability and stress resistance of the connection after soldering; third, it is compatible with high-density miniaturized interconnects and reduces the size of sensors; and fourth, it simplifies the process flow and improves the yield of mass production.

[0028] The above technical solution, by setting metal solder balls, ensures a reliable connection between the sensor itself and the external circuit.

[0029] In this embodiment, the first slot structure 31 includes a first through hole 312.

[0030] In the above description, the transmitter chip 1 is provided with a first metal protrusion structure 11, which is located at or near the center of the transmitter chip 1. The bottom of the first blind slot 311 is provided with the aforementioned first through hole 312 and the aforementioned first metal pad 32, which are located at or near the center of the first blind slot 311. The transmitter chip 1 achieves mechanical fixation and electrical signal transmission through the first metal protrusion structure 11 and the first metal pad 32.

[0031] Specifically, the core function of the emitting chip 1 is to emit infrared light. It is small in size and its circuit structure is usually simple. A first metal protrusion structure 11 and a first metal pad 32 are sufficient to achieve mechanical fixation and electrical signal transmission of the emitting chip 1. Specifically, the center of the emitting chip 1 is connected to the glass substrate 3, which is adapted to the circuit on the emitting chip 1 and the force is more even.

[0032] By using the above technical solution, a first through hole is set on the glass substrate, which ensures the reliability of the transmitter chip connection while avoiding structural redundancy.

[0033] In this embodiment, the second hole groove structure 33 includes two rows of the second through holes 332 arranged sequentially along the second direction. The second direction is perpendicular to the thickness direction of the glass substrate 3 and the first direction. The two rows of the second through holes 332 are respectively close to the two opposite groove walls of the second blind groove 331. Each row of the second through holes 332 includes a plurality of the second through holes 332 arranged at intervals along the first direction.

[0034] In the above description, the receiving sensor chip 2 is provided with multiple second metal protrusion structures 21, which are located at the edge of the receiving sensor chip 2. Multiple second through holes 332 and multiple second metal pads 34 are provided in the second blind slot 331. The aforementioned second metal protrusion structures 21, second through holes 332 and second metal pads 34 are arranged in an array. The second through holes 332 and second metal pads 34 are both located near the edge of the bottom of the second blind slot 331. The receiving sensor chip 2 achieves mechanical fixation and electrical signal transmission through the multiple second metal protrusion structures 21 and multiple second metal pads 34.

[0035] Specifically, the receiving sensor chip 2 needs to simultaneously detect infrared reflection signals and ambient light intensity. Due to its large size and complex circuitry, multiple second metal protrusions 21 and multiple second metal pads 34 are used to mechanically fix the receiving sensor chip 2 and transmit electrical signals. Specifically, the edges of the second metal protrusions 21 are connected to the edges of the bottom of the second blind slot 331, adapting to the circuitry on the receiving sensor chip 2 and ensuring more even force distribution.

[0036] By using the above technical solution, two rows of second through holes are set on the glass substrate, which not only ensures the connection reliability of the receiving sensor chip, but also makes the layout more reasonable.

[0037] In this embodiment, the third hole groove structure 35 includes multiple rows of third through holes 351 arranged sequentially along the first direction. Each row of the third through holes 351 includes multiple rows of the third through holes 351 arranged sequentially along the second direction. The second direction is perpendicular to the thickness direction of the glass substrate 3 and the first direction. Adjacent rows of the third through holes 351 are staggered.

[0038] In the above text, a plurality of third through holes 351 are provided on the third substrate area. The third through holes 351 penetrate along the thickness direction of the glass substrate 3. The staggered arrangement of adjacent columns of third through holes 351 means that the orthographic projections of two adjacent columns of third through holes 351 on the projection plane perpendicular to the first direction are staggered and partially overlap. After each third through hole 351 is filled with infrared insulating material 36, multiple insulating pillars are formed.

[0039] Specifically, the infrared insulating material 36 filled in the third through-hole 351 has the core function of blocking the infrared light emitted directly from the emitting chip 1 to the receiving sensor chip 2. If the through-holes are arranged in a single row, or if two adjacent columns of through-holes are aligned, there will be a problem of light leakage through the gaps. The multi-column staggered design can fill these gaps and ensure that the infrared light is blocked by the infrared insulating material 36 no matter which angle it shines from.

[0040] By using the above technical solution, multiple rows of third through holes are set and staggered to ensure the reliability of blocking infrared light and improve the accuracy of detection.

[0041] In this embodiment, the third hole and groove structure 35 includes three rows of the third through holes 351 arranged sequentially along the first direction.

[0042] In the above text, three rows of third through holes 351 are provided on the third substrate area. The orthographic projections of the two rows of third through holes 351 on both sides on the projection plane perpendicular to the first direction overlap. The orthographic projections of the middle row of third through holes 351 and the row of third through holes 351 on each side on the projection plane perpendicular to the first direction are offset. There is no straight channel between the three rows of third through holes 351.

[0043] Specifically, regardless of the angle from which the infrared light emitted by the transmitting chip 1 is scattered, it can be blocked by the infrared isolation material 36, preventing the infrared signal from penetrating through the gap between the isolation pillars.

[0044] By using the above technical solution and setting three rows of third through holes, the signal isolation between the transmitting chip and the receiving sensing chip is greatly improved, ensuring detection accuracy.

[0045] In this embodiment, the infrared blocking material 36 is a metallic material.

[0046] In the above text, a metal material is used as the infrared blocking material 36. The metal material is filled into the third through hole 351 to obtain a metal column, which blocks infrared light.

[0047] Specifically, there are a large number of free electrons in the internal structure of metallic materials. When infrared light shines on the metal surface, the free electrons will undergo collective vibration under the action of the electric field of the electromagnetic wave. This process will quickly absorb the energy of the infrared light and convert it into the kinetic energy of the electrons, which will eventually be dissipated in the form of heat energy. At the same time, the unabsorbed part will undergo specular reflection due to the electromagnetic properties of the metal surface and will not form transmitted light.

[0048] The above technical solution uses metal materials as infrared isolation materials. Metal materials have high reflectivity and absorption characteristics for infrared light, which can block the infrared light emitted by the transmitting chip to the receiving sensing chip.

[0049] In this embodiment, the back surface of the glass substrate 3 is provided with two rows of the third metal pads 37 arranged sequentially along a second direction. The second direction is perpendicular to the thickness direction of the glass substrate 3 and the first direction. The two rows of the third metal pads 37 are respectively close to the two long sides of the glass substrate 3. Each row of the third metal pads 37 includes a plurality of the third metal pads 37 arranged sequentially along the first direction.

[0050] In the above text, multiple third metal pads 37 and multiple third metal protrusions 38 are provided on the back side of the glass substrate 3. The multiple third metal pads 37 and multiple third metal protrusions 38 are located near the edge of the glass substrate 3. The third metal pads 37 and the third metal protrusions 38 are arranged in an array. The sensor achieves external mechanical fixation and electrical signal transmission through the multiple third metal protrusions 38.

[0051] Specifically, the sensor needs to simultaneously emit infrared light, detect infrared reflection signals, and ambient light intensity. Due to its large size and complex circuitry, multiple third metal protrusion structures 38 are used to mechanically fix the sensor and transmit electrical signals to accommodate its size and complex circuitry. Specifically, the edges of the third metal protrusion structures 38 are connected to external circuitry, ensuring a more even distribution of force.

[0052] By using the above technical solution, two rows of third metal protrusions are set on the glass substrate, which not only ensures the reliability of the sensor connection, but also makes the layout more reasonable.

[0053] In this embodiment, a passivation layer is also provided on the back side of the glass substrate 3. The passivation layer covers the metal wiring and isolates the glass substrate 3 and the metal wiring. The passivation layer is provided with a first opening, a second opening and a third opening. The first opening exposes the light-emitting area 313 at the bottom of the first blind groove 311. The second opening exposes the light-entering area 333 at the bottom of the second blind groove 331. The third opening exposes the third metal protrusion structure 38.

[0054] In the above text, the passivation layer is an insulating protective dielectric film, which is formed in three stages. First, a first passivation film 391 is coated on the surface of the glass substrate 3, exposing the first metal pad 32 and the second metal pad 34. Then, a first metal wiring 392 is formed on the first passivation film 391. Next, a second passivation film 393 is formed on the outside of the first metal wiring 392, exposing the first metal pad 32 and the second metal pad 34. Then, a second metal wiring 394 and a third metal pad 37 are formed on the outside of the second passivation film 393. Then, a third passivation film 395 is formed on the outside of the second metal wiring 394 and the third metal pad 37, exposing the third metal pad 37. Finally, a third metal protrusion structure 38 is formed on the outside of the third metal pad 37.

[0055] Specifically, the passivation layer covers the surface of the metal wiring to prevent the metal wiring from being directly exposed to the air. On the one hand, it prevents short circuits or poor contact caused by dust and moisture, and at the same time isolates the wiring from the corrosion of materials such as solder and resin in subsequent packaging processes. On the other hand, it can prevent the metal wiring (such as copper and aluminum) from oxidizing and corroding, ensuring the long-term stability of the wiring's conductivity and extending the sensor's service life. In addition, it can also prevent the metal wiring from contacting external circuits, improving the anti-interference capability of signal transmission.

[0056] The above technical solution involves setting a passivation layer on the back of the glass substrate to protect the metal wiring while ensuring normal signal transmission and reception and connection with external circuits.

[0057] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. An infrared proximity and ambient light brightness sensor, characterized in that, include: The transmitter chip has a first metal protrusion structure on its active surface; The receiving sensor chip has a second metal protrusion structure on its active surface; A glass substrate includes a first substrate region, a third substrate region, and a second substrate region sequentially arranged along a first direction perpendicular to the thickness direction of the glass substrate. The first substrate region has a first slot structure, which includes a first blind slot communicating with the front side of the glass substrate and a first through hole penetrating the bottom of the first blind slot. First metal pads are provided at both ends of the first through hole, and the first through hole is filled with metal material to electrically connect the first metal pads at both ends of the first through hole. The second substrate region has a second slot structure, which includes a second blind slot communicating with the front side of the glass substrate and a through hole penetrating the bottom of the first blind slot. A second through hole passes through the bottom of the second blind slot. The two ends of the second through hole are provided with second metal pads. The second through hole is filled with metal material to electrically connect the two ends of the second through hole with the second metal pads. The third substrate area is provided with a third hole structure. The third hole structure is filled with infrared isolation material. The infrared isolation material isolates the first blind slot and the second blind slot. A third metal pad is provided on the back of the glass substrate. The third metal pad is connected to the first metal pad and the second metal pad through metal wiring. A third metal protrusion structure is provided on the side of the third metal pad away from the glass substrate. The transmitting chip is flip-mounted in the first blind slot and the first metal protrusion structure is electrically connected to the first metal pad; the receiving sensor chip is flip-mounted in the second blind slot and the second metal protrusion structure is electrically connected to the second metal pad.

2. The infrared proximity and ambient light intensity sensor according to claim 1, characterized in that, The first metal protrusion structure, the second metal protrusion structure, and the third metal protrusion structure are all metal solder balls.

3. The infrared proximity and ambient light intensity sensor according to claim 1, characterized in that, The first slot structure includes a first through hole.

4. The infrared proximity and ambient light intensity sensor according to claim 1, characterized in that, The second hole structure includes two rows of second through holes arranged sequentially along a second direction, the second direction being perpendicular to the thickness direction of the glass substrate and the first direction. The two rows of second through holes are respectively close to the two opposite groove walls of the second blind groove. Each row of second through holes includes a plurality of second through holes arranged at intervals along the first direction.

5. The infrared proximity and ambient light intensity sensor according to claim 1, characterized in that, The third hole structure includes at least two columns of third through holes arranged sequentially along the first direction. Each column of the third through holes includes a plurality of the third through holes arranged sequentially along the second direction, which is perpendicular to the thickness direction of the glass substrate and the first direction. Adjacent columns of the third through holes are staggered.

6. The infrared proximity and ambient light intensity sensor according to claim 5, characterized in that, The third slot structure includes three rows of the third through holes arranged sequentially along the first direction.

7. The infrared proximity and ambient light intensity sensor according to claim 1, characterized in that, The infrared shielding material is a metallic material.

8. The infrared proximity and ambient light intensity sensor according to claim 1, characterized in that, The back of the glass substrate is provided with two rows of third metal pads arranged sequentially along a second direction. The second direction is perpendicular to the thickness direction of the glass substrate and the first direction. The two rows of third metal pads are respectively close to the two long sides of the glass substrate. Each row of third metal pads includes a plurality of third metal pads arranged sequentially along the first direction.

9. The infrared proximity and ambient light intensity sensor according to claim 1, characterized in that, A passivation layer is also provided on the back side of the glass substrate. The passivation layer covers the metal wiring and isolates the glass substrate and the metal wiring. The passivation layer is provided with a first opening, a second opening and a third opening. The first opening exposes the light-emitting area of ​​the bottom of the first blind trench, the second opening exposes the light-receiving area of ​​the bottom of the second blind trench, and the third opening exposes the third metal protrusion structure.

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