A receiving sensor resistant to electromagnetic shield interference

Abstract

The utility model discloses a kind of receiving sensors of anti-electromagnetic shielding interference, including base, cover, convex lens, photosensitive chip, infrared receiving IC chip, first pin, second pin and third pin, the photosensitive chip is electrically connected with infrared receiving IC chip, cover middle part is equipped with the avoidance slot for exposing photosensitive chip, convex lens is used to gather optical signal on photosensitive chip, electromagnetic wave absorption coating is coated on the wall surface of avoidance slot, and the wall surface of avoidance slot and horizontal plane form included angle. The convex lens of the utility model can focus optical signal to photosensitive chip, and infrared receiving IC chip can convert optical signal into electrical signal;Cover middle part is provided with avoidance slot, the wall surface of avoidance slot and horizontal plane form 120-140 ° included angle, can reflect interference electromagnetic wave to non-photosensitive area, avoid its direct action on photosensitive chip, and the wall surface of avoidance slot is coated electromagnetic wave absorption coating, effectively improve the anti-electromagnetic interference capability of sensor.

Description

Technical Field

[0001] This utility model relates to the field of receiving sensors, and in particular to a receiving sensor that is resistant to electromagnetic shielding interference. Background Technology

[0002] A receiving sensor is a sensing device that receives external signals and converts them into electrical signals for output. It is widely used in fields such as photoelectric detection, image recognition, automatic control, and signal acquisition. In complex electromagnetic environments, external electromagnetic waves can easily enter the sensor through coupling gaps, line induction, and other paths, thereby interfering with the photosensitive element and causing problems such as false triggering, signal drift, or decreased sensitivity.

[0003] In the prior art, receiving sensors typically use metal shielding housings, filtering circuits, or grounding isolation to suppress electromagnetic interference signals. However, these methods often have problems such as complex structures and high manufacturing costs, and they are difficult to isolate electromagnetic wave reflection interference, thus affecting the signal reception stability of the receiving sensor.

[0004] Therefore, existing technologies have shortcomings and need to be improved. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a receiving sensor with stable signal reception, compact structure, and resistance to electromagnetic shielding interference.

[0006] To achieve this objective, the present invention adopts the following technical solution: a receiving sensor that resists electromagnetic shielding interference, comprising a base, a cover, a convex lens, a photosensitive chip, an infrared receiving IC chip, a first pin, a second pin, and a third pin; The photosensitive chip and the infrared receiving IC chip are respectively disposed in the middle area of ​​the base. The photosensitive chip is electrically connected to the infrared receiving IC chip through a first connecting line. The photosensitive chip is used to receive light signals, and the infrared receiving IC chip is used to convert the received light signals into electrical signals. Two first pins are located on one side of the base, and the second pin and the third pin are located on the other side of the base. The first pin is connected to the infrared receiving IC chip through a second connecting line, the second pin is connected to the infrared receiving IC chip through a third connecting line, and the third pin is connected to the infrared receiving IC chip through a fourth connecting line. The cover is located on the top of the base. The cover has a clearance groove in the middle for exposing the photosensitive chip. The convex lens is located on the cover above the clearance groove. The convex lens is used to focus the light signal onto the photosensitive chip. The wall of the clearance groove is coated with an electromagnetic wave absorbing coating, and the wall of the clearance groove forms an angle with the horizontal plane, the angle being 120-140°.

[0007] In the above technical solution, the electromagnetic interference-resistant receiving sensor has an optical colloid filling the space between the convex lens and the base surface. The optical colloid is used to protect the photosensitive chip and the infrared receiving IC chip.

[0008] In the above technical solution, the electromagnetic wave absorbing coating in the electromagnetic shielding interference receiving sensor is a carbon black coating or a graphite coating.

[0009] Using the above technical solution, the thickness of the electromagnetic wave absorbing coating in the electromagnetic shielding interference-resistant receiving sensor is 20-80μm.

[0010] In the above technical solution, the first connecting line, the second connecting line, the third connecting line and the fourth connecting line in the electromagnetic shielding interference receiving sensor are all gold wires.

[0011] In the above technical solution, the base and the housing are bonded together by a hot melt adhesive layer in the electromagnetic interference-resistant receiving sensor.

[0012] In the above technical solution, the first pin, the second pin, and the third pin of the electromagnetic interference-resistant receiving sensor are all surface-mount pins.

[0013] In the above technical solution, the first pin of the electromagnetic interference shielding receiving sensor is a ground pin, the second pin is an output pin, and the third pin is a power supply pin.

[0014] Compared with the prior art, the present invention has the following beneficial effects: This invention places a photosensitive chip in the central area of ​​the base. Under the focusing effect of the convex lens, the photosensitive chip can receive light signals, and the infrared receiving IC chip can effectively convert the received light signals into electrical signals. The central part of the housing is provided with a relief groove for exposing the photosensitive chip, and the wall of the relief groove forms an angle of 120-140° with the horizontal plane. In this way, interfering electromagnetic waves can be effectively reflected to the non-photosensitive area, avoiding electromagnetic waves from directly acting on the surface of the photosensitive chip. In addition, the wall of the relief groove is coated with an electromagnetic wave absorbing coating, which can absorb electromagnetic waves entering the sensor, thereby improving the anti-electromagnetic interference capability of the receiving sensor. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is a schematic diagram of the photosensitive chip mounting structure of this utility model; Figure 4 This is a schematic diagram of the bottom structure of this utility model. Detailed Implementation

[0018] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0019] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0020] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] like Figures 1 to 4 As shown, this utility model embodiment provides a receiving sensor with electromagnetic shielding interference resistance, including a base 1, a housing 2, a convex lens 3, a photosensitive chip 4, an infrared receiving IC chip 5, a first pin 61, a second pin 62, and a third pin 63. The photosensitive chip 4 and the infrared receiving IC chip 5 are respectively disposed in the middle region of the base 1. The photosensitive chip 4 is electrically connected to the infrared receiving IC chip 5 through a first connecting line 71. The photosensitive chip 4 is used to receive light signals, and the infrared receiving IC chip 5 is used to convert the received light signals into electrical signals. As a light signal receiving element, the photosensitive chip 4 can convert light energy into electronic signals under light irradiation, while the infrared receiving IC chip 5 can further process these electronic signals and convert them into electrical signals that can be used for subsequent circuit analysis and processing.

[0022] Two first pins 61 are located on one side of the base 1, and the second pin 62 and the third pin 63 are located on the other side of the base 1. The first pin 61 is connected to the infrared receiving IC chip 5 through the second connecting line 72, the second pin 62 is connected to the infrared receiving IC chip 5 through the third connecting line 73, and the third pin 63 is connected to the infrared receiving IC chip 5 through the fourth connecting line 74. In this embodiment, the first pin 61, the second pin 62, and the third pin 63 are all surface mount pins. Specifically, the first pin 61 is a ground pin, the second pin 62 is an output pin, and the third pin 63 is a power supply pin.

[0023] The housing 2 is located on the top of the base 1. The housing 2 has a relief groove 20 in the middle for exposing the photosensitive chip 4. The convex lens 3 is located on the housing 2 above the relief groove 20. The convex lens 3 is used to focus the light signal onto the photosensitive chip 4. The wall surface of the relief groove 20 is coated with an electromagnetic wave absorbing coating 21, and the wall surface of the relief groove 20 forms an angle α with the horizontal plane. The angle α is 120-140°. A convex lens 3 is provided above the housing 2 to focus external light signals onto the photosensitive chip 4, thereby improving the light signal reception efficiency. The wall surface of the clearance groove 20 is coated with an electromagnetic wave absorbing coating 21, which can absorb and attenuate electromagnetic waves entering the sensor, preventing them from interfering with the operation of the photosensitive chip 4, thereby improving the sensor's anti-electromagnetic interference capability. In addition, the wall surface of the clearance groove 20 forms an angle α of 120-140° with the horizontal plane. This obtuse angle structure guides external electromagnetic waves to the non-photosensitive area through reflection, preventing electromagnetic waves from directly acting on the surface of the photosensitive chip 4, thereby effectively isolating electromagnetic interference and improving the sensor's anti-interference performance.

[0024] like Figure 2 and Figure 3 As shown, furthermore, an optical colloid is filled between the convex lens 3 and the surface of the base 1. The optical colloid is used to protect the photosensitive chip 4 and the infrared receiving IC chip 5. The optical colloid can reduce the reflection and loss of light signals during transmission, and avoid interference with the focusing effect of light. Secondly, the optical colloid also provides physical protection for the photosensitive chip 4 and the infrared receiving IC chip 5, preventing external dust, moisture, etc. from entering the sensor, and improving the reliability of the receiving sensor in long-term use.

[0025] Furthermore, the electromagnetic wave absorbing coating 21 is a carbon black coating or a graphite coating. In this embodiment, the electromagnetic wave absorbing coating 21 is a carbon black coating. The carbon black coating can generate resistive loss and dielectric loss on the incident electromagnetic waves, thereby effectively absorbing and attenuating electromagnetic energy and preventing it from causing interference in the photosensitive chip 4 area.

[0026] Furthermore, the thickness of the electromagnetic wave absorbing coating 21 is 20-80 μm. In this embodiment, the thickness of the electromagnetic wave absorbing coating 21 is 20 μm.

[0027] Furthermore, the first connecting line 71, the second connecting line 72, the third connecting line 73, and the fourth connecting line 74 are all gold wires. Gold wires have good conductivity and oxidation resistance, which can ensure stable electrical signal transmission of the photosensitive chip 4 and avoid signal attenuation due to excessive resistance of the connecting material.

[0028] Furthermore, the base 1 and the cover 2 are bonded together by a hot melt adhesive layer, thereby improving the overall sealing effect and preventing external impurities such as dust and moisture from entering the sensor and affecting the stability of the photosensitive chip 4.

[0029] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A receiving sensor resistant to electromagnetic interference, characterized in that, Includes a base, a housing, a convex lens, a photosensitive chip, an infrared receiver IC chip, a first pin, a second pin, and a third pin; The photosensitive chip and the infrared receiving IC chip are respectively disposed in the middle area of ​​the base. The photosensitive chip is electrically connected to the infrared receiving IC chip through a first connecting line. The photosensitive chip is used to receive light signals, and the infrared receiving IC chip is used to convert the received light signals into electrical signals. Two first pins are located on one side of the base, and the second pin and the third pin are located on the other side of the base. The first pin is connected to the infrared receiving IC chip through a second connecting line, the second pin is connected to the infrared receiving IC chip through a third connecting line, and the third pin is connected to the infrared receiving IC chip through a fourth connecting line. The cover is located on the top of the base. The cover has a clearance groove in the middle for exposing the photosensitive chip. The convex lens is located on the cover above the clearance groove. The convex lens is used to focus the light signal onto the photosensitive chip. The wall of the clearance groove is coated with an electromagnetic wave absorbing coating, and the wall of the clearance groove forms an angle with the horizontal plane, the angle being 120-140°.

2. The electromagnetic interference-resistant receiving sensor according to claim 1, characterized in that, An optical colloid is filled between the convex lens and the base surface to protect the photosensitive chip and the infrared receiving IC chip.

3. The electromagnetic interference-resistant receiving sensor according to claim 1, characterized in that, The electromagnetic wave absorbing coating is a carbon black coating or a graphite coating.

4. The electromagnetic interference-resistant receiving sensor according to claim 1, characterized in that, The thickness of the electromagnetic wave absorbing coating is 20-80 μm.

5. The electromagnetic interference resistant receiving sensor according to claim 1, characterized in that, The first, second, third, and fourth connecting lines are all gold wires.

6. The electromagnetic interference-resistant receiving sensor according to claim 1, characterized in that, The base and the cover are bonded together by a hot melt adhesive layer.

7. The electromagnetic interference resistant receiving sensor according to claim 1, characterized in that, The first, second, and third pins are all surface mount pins.

8. The electromagnetic interference resistant receiving sensor according to claim 1, characterized in that, The first pin is a ground pin, the second pin is an output pin, and the third pin is a power supply pin.

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