Strength testing device for semiconductor plastic package

Abstract

The utility model relates to the field of strength test, concretely is a kind of strength testing device for semiconductor plastic package, including test box, still including cabinet door, testing mechanism and fixed mechanism, cabinet door is hinged in the surface of test box by hinge, the inside installation of cabinet door has visual window, testing mechanism is installed in the surface and inside of test box, lifting direction precision is high, ensure that test pressure accurately acts on preset point, substantially improve the authenticity and repeatability of test data, lifting plate adopts double-directional structure of limiting rod plus limiting slide, forms three-dimensional positioning constraint, simultaneously, test head is fixed in the center of the lower surface of lifting plate, under the guarantee of double direction, test head does not appear to deviate and press wrong point during lifting process, the problem that local pressure overload is caused by inclination, ensure that the pressure acting position of each test, stress direction is consistent, improve the repeatability and comparability of data, provide reliable basis for plastic package strength performance determination.

Description

Technical Field

[0001] This utility model relates to the field of strength testing technology, and specifically to a strength testing device for semiconductor plastic packages. Background Technology

[0002] In the semiconductor device manufacturing process, the semiconductor molding compound is a key structure that protects the core components of the chip and isolates them from external moisture and impurities. Its strength performance directly determines the service life and safety of the semiconductor device. Therefore, it is necessary to use a dedicated strength testing device to test the pressure resistance and deformation resistance of the molding compound, screen out qualified products, and avoid subsequent device failure due to substandard molding compound strength.

[0003] Existing strength testing devices for semiconductor plastic packages have the following shortcomings: 1. Existing devices often use a single guide structure for the lifting plate, which is prone to tilting and horizontal deviation. Furthermore, the initial positioning reference between the test head and the molding compound is difficult to align precisely, often resulting in misalignment and misplacing of the test head during testing, leading to localized overload of the molding compound. 2. The existing device's encapsulation clamping structure mostly adopts a unidirectional clamping or asynchronous clamping design, which is prone to uneven adhesion between the two sets of clamping blocks and the encapsulation body, resulting in excessive compression or poor adhesion on one side of the encapsulation body, and failing to accurately adapt to the corner position of the encapsulation body. Utility Model Content

[0004] The purpose of this invention is to provide a strength testing device for semiconductor encapsulation.

[0005] To achieve this objective, the present invention adopts the following technical solution: A strength testing device for semiconductor molded packages is provided, including a test chamber, a door, a testing mechanism, and a fixing mechanism. The door is hinged to the surface of the test chamber, and a viewing window is installed inside the door. The testing mechanism is installed on the surface and inside the test chamber, and includes a lifting plate, limiting slides, counterweights, and a test head. The lifting plate is located inside the test chamber, and two sets of limiting slides are symmetrically fixed on both sides of the surface of the lifting plate. The limiting slides are slidably connected to slide rails opened on the inner wall of the test chamber via pulleys. Four sets of counterweights are fixed in a rectangular array at the four corners of the surface of the lifting plate. The test head is bolted to the center of the lower surface of the lifting plate, and different specifications of test heads can be flexibly replaced according to testing requirements. The fixing mechanism is installed inside the test chamber and includes a fixing seat, clamps, and clamping plates. The fixing seat is fixed inside the test chamber, and two sets of clamps are symmetrically arranged above the fixing seat. There are four sets of clamping plates, and two sets of clamping plates on the same side are symmetrically slidably connected to the interior of the corresponding clamps.

[0006] Preferably, the testing mechanism further includes a take-up shaft, a take-up motor, a take-up roller, a lifting rope, and guide pulleys. The take-up shaft is rotatably connected to the bottom of the back surface of the test chamber via a bearing seat. The take-up motor is fixed to the bottom of the back surface of the test chamber, and the output shaft of the take-up motor is fixedly connected to one end of the take-up shaft. The take-up roller is fixedly connected to the surface of the take-up shaft. There are three sets of guide pulleys. Two sets of guide pulleys are rotatably connected to the two sides of the top inner wall of the test chamber via a bracket, and the other set of guide pulleys is rotatably connected to the bottom inner wall of the test chamber via a bracket. One end of the lifting rope is wound and fixed to the surface of the take-up roller, and the other end of the lifting rope passes around multiple sets of guide pulleys and is fixedly connected to the upper surface of the lifting plate. Starting the take-up motor can drive the take-up shaft and the take-up roller to rotate. The lifting plate is pulled by the lifting rope to drive the pulley of the limit slide to move up and down along the slide rail.

[0007] Preferably, the testing mechanism further includes a ratchet, a support frame, a pawl, and a compression spring. The ratchet is fixedly connected to the surface of the take-up shaft, the support frame is fixed to the surface of the test box near the ratchet, the pawl is hinged to the surface of the support frame via a pivot and is engaged with the ratchet, and the compression spring is fixed between the pawl and the support frame to maintain the engagement between the pawl and the ratchet and prevent the take-up shaft from accidentally reversing.

[0008] Preferably, the surface of the pawl is hinged with a lifting frame, which is slidably connected to a lifting groove opened inside the support frame. The push-telescopic rod is fixed to the top of the support frame, and the output end of the push-telescopic rod faces the surface of the lifting frame. Activating the push-telescopic rod can push the lifting frame to drive the pawl to rotate around the pivot, thereby releasing the engagement limit between the pawl and the ratchet.

[0009] Preferably, the test chamber has two sets of limiting rods fixed inside. The lifting plate is slidably connected to the surface of the limiting rods through the opening limiting groove. A buffer spring is sleeved on the bottom surface of the limiting rod. The bottom end of the buffer spring is fixedly connected to the bottom wall of the test chamber. The top end of the buffer spring is directly opposite the lower surface of the lifting plate through the pressure ring, which is used to buffer the impact force when the lifting plate descends. The counterweight is composed of bolts, counterweights and nuts. The bolts are fixed at the four corners of the surface of the lifting plate. Multiple sets of counterweights are sleeved on the surface of the corresponding bolts. The nuts are threadedly connected to the surface of the bolts.

[0010] Preferably, the fixing mechanism further includes a transverse bidirectional lead screw, a chain, a fixing motor, and threaded blocks. The two sets of transverse bidirectional lead screws are rotatably connected to the inner sides of the fixing seat through bearings. The fixing motor is fixed to the outer wall of the fixing seat, and the output shaft of the fixing motor is fixedly connected to one end of one set of transverse bidirectional lead screws. The other ends of the two sets of transverse bidirectional lead screws are fixedly connected to sprockets. The chain is meshed with the surfaces of the two sets of sprockets. There are four sets of threaded blocks, two sets in total, which are symmetrically fixed to the bottom of the clamp. The threaded blocks are threadedly connected to the transverse bidirectional lead screws. Starting the fixing motor can drive the two sets of transverse bidirectional lead screws to rotate synchronously through the chain, driving the two sets of clamps to move relative to or in opposite directions.

[0011] Preferably, the interior of the clamp is rotatably connected to a longitudinally moving bidirectional lead screw via a bearing, and the clamping plates are threaded onto the surface of the longitudinally moving bidirectional lead screw. By rotating the longitudinally moving bidirectional lead screw, the two sets of clamping plates on the same side can be driven to move relative to each other, thereby achieving longitudinal clamping and fixing of the semiconductor encapsulation.

[0012] Preferably, the surface of the clamp is provided with anti-slip texture to increase the friction between the clamp and the semiconductor encapsulation and prevent slippage during testing.

[0013] The beneficial effects of this utility model are: 1. This utility model discloses a strength testing device for semiconductor molded bodies. The device features high lifting and guiding precision, ensuring that the test pressure is accurately applied to preset points, significantly improving the authenticity and repeatability of test data. The lifting plate employs a dual guiding structure of limiting rods and limiting slides, forming a three-dimensional positioning constraint. Longitudinally, it slides within the test chamber through a limiting groove, slidably fitting onto the surfaces of two sets of limiting rods fixed inside, limiting the horizontal, left-right, and forward-backward displacement of the lifting plate. Laterally, it is further constrained by two sets of limiting slides symmetrically fixed on both sides of the surface, which engage with the slide rails on the inner wall of the test chamber via pulleys. Simultaneously, the test head is fixed at the center of the lower surface of the lifting plate, precisely aligned with the initial reference of the molded body in the fixing mechanism. With this dual guiding guarantee, the test head will not deviate during lifting and lowering, preventing misalignment or tilting that could lead to localized pressure overload. This ensures consistent pressure application position and force direction for each test, reducing the deviation rate of test data for multiple molded bodies of the same specification, improving data repeatability and comparability, and providing a reliable basis for judging the strength performance of the molded body.

[0014] 2. This utility model provides a strength testing device for semiconductor encapsulated bodies. The testing process offers comprehensive protection, balancing device safety, test piece protection, and test data validity. It avoids various risks and hazards, providing reliable fall protection. After the winding motor is turned off and the lifting plate is raised to the preset height, the ratchet on the winding shaft surface automatically engages with the pawl on the support frame. A pressure spring continuously applies pressure to the pawl, ensuring it remains firmly against the ratchet tooth groove. This completely prevents the winding shaft from reversing due to the weight of the lifting plate and counterweight, avoiding sudden drops that could damage the encapsulated body or impact the fixing mechanism. It also prevents sudden pressure increases during falls that could prevent the recording of valid data. Limit release is convenient and controllable. To unlock, simply activate the push-pull rod to slide the lifting frame along the lifting groove, causing the pawl to rotate around the axis and disengage from the ratchet. No manual prying of the pawl is required, saving effort and avoiding incomplete release or accidental drops due to manual operation, ensuring operational safety.

[0015] 3. This utility model provides a strength testing device for semiconductor molded bodies. It features high clamping and positioning accuracy, establishing a solid data benchmark for strength testing and preventing test failures due to positioning deviations. The lateral bidirectional lead screw rotates, driving the clamps to move precisely relative to each other along a preset trajectory. This ensures uniform contact force between the two sets of clamps and both sides of the molded body, preventing excessive compression or poor fit on one side. Rotating the longitudinal bidirectional lead screw allows the two sets of clamps on the same side to simultaneously move towards the longitudinal corners of the molded body. Ultimately, the four sets of clamps form a four-corner positioning clamping structure, precisely wrapping the corners of the molded body without damaging it. This completely eliminates the risk of lateral and longitudinal displacement of the molded body under test pressure, ensuring that the pressure from the subsequent test head is accurately applied to the preset test points on the molded body, guaranteeing the authenticity and repeatability of the test data.

[0016] 4. This utility model provides a strength testing device for semiconductor molded packages. It has a wide clamping range, covering testing of various molded package specifications, reducing equipment investment costs. In the lateral direction, two sets of transverse bidirectional lead screws drive the clamps to move via threaded blocks. The travel distance is determined by the lead screw length and threaded segment distribution, allowing for flexible adjustment of the clamp spacing according to the lateral dimensions of the molded package. This eliminates the need for dedicated fixing components for molded packages with different lateral dimensions. In the longitudinal direction, the longitudinal bidirectional lead screws drive the sliding stroke of the clamping plates to adapt to differences in the longitudinal dimensions of the molded package. Furthermore, the four corner clamps are designed to independently adapt to the corners, ensuring a tight fit even with some non-standard rectangular molded packages by adjusting the clamping plate position. This avoids clamping problems caused by slight differences in the shape of the molded package, eliminating the need for frequent replacement of fixing components. It meets the fixing needs of various specifications and shapes of semiconductor molded packages, significantly reducing the procurement cost of dedicated testing equipment. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments of the present invention will be briefly described below.

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the structure of the test box and the winding roller of this utility model; Figure 3 This is a cross-sectional view of the test box of this utility model; Figure 4 This is a schematic diagram of the lifting plate and test head of this utility model; Figure 5 This is a schematic diagram of the structure of the winding roller and support frame of this utility model; Figure 6 This is a schematic diagram of the fixing mechanism of this utility model; In the diagram: 1. Test box; 2. Box door; 3. Test mechanism; 4. Rewind shaft; 5. Rewind motor; 6. Rewind roller; 7. Lifting rope; 8. Guide pulley; 9. Lifting plate; 10. Limiting slide; 11. Counterweight; 12. Limiting rod; 13. Buffer spring; 14. Test head; 15. Ratchet; 16. Support frame; 17. Pawl; 18. Compression spring; 19. Lifting frame; 20. Pushing telescopic rod; 21. Fixing mechanism; 22. Fixing seat; 23. Lateral double-acting lead screw; 24. Chain; 25. Fixing motor; 26. Threaded block; 27. Clamping seat; 28. Longitudinal double-acting lead screw; 29. ​​Clamping plate. Detailed Implementation

[0019] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0020] The accompanying drawings are for illustrative purposes only and are schematic diagrams, not actual images. They should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some parts in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product.

[0021] Reference Figures 1 to 6The diagram shows a strength testing device for semiconductor molding compounds, including a test chamber 1, a door 2, a testing mechanism 3, and a fixing mechanism 21. The door 2 is hinged to the surface of the test chamber 1, and a viewing window is installed inside the door 2. The testing mechanism 3 is installed on the surface and inside the test chamber 1, and includes a lifting plate 9, limiting slides 10, a counterweight 11, and a test head 14. The lifting plate 9 is located inside the test chamber 1, and two sets of limiting slides 10 are symmetrically fixed on both sides of the surface of the lifting plate 9, and the limiting slides 10 are slidably connected to the inside of the test chamber 1 via pulleys. Inside the sliding rails cut into the wall, four sets of counterweights 11 are fixed in a rectangular array at the four corners of the surface of the lifting plate 9. The test head 14 is bolted to the center of the lower surface of the lifting plate 9, allowing for flexible replacement of test heads 14 of different specifications according to testing requirements. The fixing mechanism 21 is installed inside the test chamber 1. The fixing mechanism 21 includes a fixing seat 22, a clamping seat 27, and a clamping plate 29. The fixing seat 22 is fixed inside the test chamber 1. Two sets of clamping seats 27 are symmetrically arranged above the fixing seat 22. There are four sets of clamping plates 29, with two sets of clamping plates 29 on the same side symmetrically slidingly connected to the corresponding clamping seats 27. Internally, the selection and installation of the test head 14 are carried out according to the strength testing requirements of the semiconductor molding compound. The original test head 14 at the center of the lower surface of the lifting plate 9 is removed by bolts and replaced with a test head 14 of the corresponding specification. The bolts are then tightened to ensure that the test head 14 is firmly connected to the lifting plate 9 to prevent it from falling off during testing. For test pressure adjustment, the number of counterweights 11 at the four corners of the lifting plate 9 is adjusted according to the required test pressure parameters. First, the nuts on the surface of the bolts are unscrewed, and the corresponding number of counterweights are placed on the bolts. Then, the nuts are re-threaded onto the surface of the bolts and tightened. By increasing or decreasing the number of counterweights, the overall downward pressure of the lifting plate 9 and the test head 14 is precisely controlled to meet the testing requirements of different strength grades of plastic sealants. The lifting guide is calibrated, and the installation status of the lifting plate 9 is checked. The lifting plate 9 slides on the surface of two sets of limit rods 12 fixed inside the test chamber 1 through the opening limit groove. At the same time, two sets of limit slides 10 symmetrically fixed on both sides of its surface are engaged in the slide rail on the inner wall of the test chamber 1 by pulleys, ensuring that the lifting plate 9 does not tilt or deviate during subsequent lifting and lowering, and ensuring that the test head 14 can accurately act on the center of the plastic sealant.

[0022] Reference Figures 1 to 5The testing mechanism 3 also includes a take-up shaft 4, a take-up motor 5, a take-up roller 6, a lifting rope 7, and guide pulleys 8. The take-up shaft 4 is rotatably connected to the bottom of the back surface of the test chamber 1 via a bearing seat. The take-up motor 5 is fixed to the bottom of the back surface of the test chamber 1, and the output shaft of the take-up motor 5 is fixedly connected to one end of the take-up shaft 4. The take-up roller 6 is fixedly connected to the surface of the take-up shaft 4. There are three sets of guide pulleys 8. Two sets of guide pulleys 8 are rotatably connected to the two sides of the top inner wall of the test chamber 1 via a bracket, and the other set of guide pulleys 8 is rotatably connected to the bottom inner wall of the test chamber 1 via a bracket. One end of the lifting rope 7 is wound and fixed to the surface of the take-up roller 6, and the other end of the lifting rope 7 passes around multiple sets of guide pulleys 8 and is fixedly connected to the upper surface of the lifting plate 9. The winding motor 5 can drive the winding shaft 4 and the winding roller 6 to rotate. The lifting plate 9 is pulled by the lifting rope 7 to drive the pulley of the limiting slide 10 to move up and down along the slide rail. For the semiconductor encapsulation strength test, the winding motor 5 is started, and its output shaft drives the winding shaft 4, which is connected to the bottom of the back surface of the test box 1 through the bearing seat, to rotate. The winding roller 6, which is fixed on the surface of the winding shaft 4, rotates together. One end of the lifting rope 7 is wrapped around the surface of the winding roller 6, and the other end of the lifting rope 7 passes through three sets of guide pulleys 8 in sequence, pulling the lifting plate 9 to move upward. At this time, the lifting plate 9 drives the pulley of the limiting slide 10 to slide upward along the slide rail, and at the same time slides upward along the surface of the limiting rod 12 until the test head 14 is raised to a preset height above the fixed mechanism 21, and the winding motor 5 is turned off.

[0023] Reference Figure 3 , Figure 5 The testing mechanism 3 also includes a ratchet 15, a support frame 16, a pawl 17, and a compression spring 18. The ratchet 15 is fixedly connected to the surface of the take-up shaft 4. The support frame 16 is fixed to the surface of the test box 1 near the ratchet 15. The pawl 17 is hinged to the surface of the support frame 16 via a pivot and is engaged with the ratchet 15. The compression spring 18 is fixed between the pawl 17 and the support frame 16 to maintain the engagement between the pawl 17 and the ratchet 15, preventing the take-up shaft 4 from accidentally reversing. After the take-up motor 5 is turned off, the ratchet 15 fixed to the surface of the take-up shaft 4 and the pawl 17 hinged to the support frame 16 remain engaged. The compression spring 18 fixed between the support frame 16 and the pawl 17 continuously applies pressure to the pawl 17 to ensure that the pawl 17 always fits tightly against the tooth groove of the ratchet 15, completely preventing the take-up shaft 4 from accidentally reversing due to the gravity of the lifting plate 9 and the counterweight 11, and avoiding the test head 14 from suddenly falling and damaging the plastic seal or device.

[0024] Reference Figure 5A lifting frame 19 is hinged to the surface of the pawl 17. The lifting frame 19 is slidably connected to the lifting groove inside the support frame 16. The push-telescopic rod 20 is fixed to the top of the support frame 16, and the output end of the push-telescopic rod 20 faces the surface of the lifting frame 19. Activating the push-telescopic rod 20 can push the lifting frame 19 to rotate the pawl 17 around the pivot, releasing the engagement limit between the pawl 17 and the ratchet 15. After the pressure test is performed and the limit is released, the push-telescopic rod 20 fixed to the top of the support frame 16 is activated, and its output end applies a push force to the lifting frame 19 below. The lifting frame 19 slides down along the lifting groove inside the support frame 16, causing the pawl 17 hinged to it to rotate around the pivot, so that the pawl 17 disengages from the ratchet 15 and releases the reverse rotation limit of the winding shaft 4.

[0025] Reference Figures 3 to 4 The test chamber 1 has two sets of limiting rods 12 fixed inside. The lifting plate 9 is slidably connected to the surface of the limiting rods 12 through the opening limiting grooves. A buffer spring 13 is sleeved on the bottom surface of the limiting rods 12. The bottom end of the buffer spring 13 is fixedly connected to the bottom wall of the test chamber 1. The top end of the buffer spring 13 faces the lower surface of the lifting plate 9 through the pressure ring to buffer the impact force when the lifting plate 9 descends. The counterweight 11 is composed of bolts, counterweights, and nuts. The bolts are fixed at the four corners of the surface of the lifting plate 9. Multiple sets of counterweights are sleeved on the corresponding bolt surfaces. The nuts are threadedly connected to the bolt surfaces. After the winding shaft 4 releases the limiting, the lifting plate 9, the counterweight 11, and the test head 14... Under the influence of gravity, the test head 14 slowly moves downward along the limiting rod 12 and the slide rail, gradually approaching and pressing the surface of the semiconductor molding compound to begin the strength test. During the test, the staff can observe the deformation of the molding compound in real time through the viewing window inside the door 2 and record the test data. When the lifting plate 9 descends to near the bottom of the test chamber 1, its lower surface contacts the pressure ring. The pressure ring squeezes the buffer spring 13 sleeved on the bottom surface of the limiting rod 12. The buffer spring 13 absorbs the impact force of the descending lifting plate 9 through its own deformation, preventing the lifting plate 9 from directly hitting the bottom of the test chamber 1, and preventing the molding compound from breaking instantly due to a sudden increase in test pressure, thus ensuring the accuracy of the test data and the safety of the device.

[0026] Reference Figure 3 , Figure 6The fixing mechanism 21 also includes a transverse bidirectional lead screw 23, a chain 24, a fixing motor 25, and threaded blocks 26. Two sets of transverse bidirectional lead screws 23 are rotatably connected to the inner sides of the fixing base 22 via bearings. The fixing motor 25 is fixed to the outer wall of the fixing base 22, and the output shaft of the fixing motor 25 is fixedly connected to one end of one set of transverse bidirectional lead screws 23. The other ends of both sets of transverse bidirectional lead screws 23 are fixedly connected to sprockets. The chain 24 meshes with the surfaces of the two sets of sprockets. There are four sets of threaded blocks 26, two sets symmetrically fixed to the bottom of the clamping base 27. The threaded blocks 26 are threadedly connected to the transverse bidirectional lead screws 23. Starting the fixing motor 25 can drive the two sets of transverse bidirectional lead screws 23 to rotate synchronously via the chain 24, driving the two sets of clamping bases 27 to move relative to or in opposite directions. The semiconductor molding compound to be tested is placed at the center of the upper surface of the fixing base 22, ensuring that the surface of the molding compound is not offset, providing a reference for subsequent clamping. Lateral clamping adjustment is performed, and the fixing motor 25 is started. Its output shaft drives a set of transverse bidirectional lead screws 23 fixed to it to rotate. The sprocket at the end of the transverse bidirectional lead screw 23 drives another set of transverse bidirectional lead screws 23 to rotate synchronously in the same direction through the chain 24. The surfaces of the two sets of transverse bidirectional lead screws 23 are threaded with two sets of threaded blocks 26, and the two sets of threaded blocks 26 on the same side correspond to the forward thread section and the reverse thread section of the transverse bidirectional lead screw 23, respectively. As the lead screws rotate, the two sets of threaded blocks 26 on the same side drive the corresponding clamps 27 to move relative to each other until the two sets of clamps 27 are close to the lateral sides of the semiconductor molding compound, initially limiting the lateral displacement of the molding compound.

[0027] Reference Figure 6 The clamp 27 has a longitudinally moving bidirectional lead screw 28 rotatably connected to it via bearings. Clamping plates 29 are threaded onto the surface of the longitudinally moving bidirectional lead screw 28. Rotating the longitudinally moving bidirectional lead screw 28 drives the two sets of clamping plates 29 on the same side to move relative to each other, achieving longitudinal clamping and fixation of the semiconductor package. The surface of the clamping plates 29 has anti-slip textures to increase the friction between the clamping plates 29 and the semiconductor package, preventing slippage during testing. The longitudinally clamping and fixing mechanism is achieved by rotating the longitudinally moving bidirectional lead screw 28 connected to the clamp 27 via bearings. The lead screw 28 is connected to the surface of the longitudinally moving bidirectional lead screw 28 by the clamping plates 29. The two sets of clamping plates 29 on the same side correspond to the forward thread section and the reverse thread section of the longitudinally moving bidirectional lead screw 28, respectively. The rotation of the lead screw drives the two sets of clamping plates 29 on the same side to slide relative to each other along the inside of the clamping seat 27 until all four sets of clamping plates 29 are tightly attached to the longitudinal corners of the semiconductor molding compound. At the same time, the anti-slip texture on the surface of the clamping plates 29 can increase the friction between them and the molding compound, completely preventing the molding compound from slipping during the test and completing the fixing operation.

[0028] After device reset and subsequent preparation, the lifting plate 9 is reset, the winding motor 5 is started and rotated in reverse, driving the winding shaft 4 and winding roller 6 to rotate in reverse. The lifting plate 9 is pulled upward to the initial height by the lifting rope 7. The winding motor 5 is turned off, and the pawl 17 automatically engages and locks with the ratchet 15. The fixed motor 25 is started and rotated in reverse, driving the two sets of transverse bidirectional lead screws 23 to rotate in reverse through the chain 24, causing the two sets of clamps 27 to move in reverse to both sides along the fixed seat 22. Then, the longitudinal bidirectional lead screw 28 is rotated in reverse, causing the two sets of clamps 29 on the same side to separate to both sides, releasing the clamping of the plastic seal. The tested plastic seal is taken out, and the device returns to the initial state, ready for the next test.

[0029] Test head 14 adopts a bolt-detachable connection structure and is fixed to the center of the lower surface of lifting plate 9. Replacement is simple: just remove the old bolts, replace with the corresponding test head 14, and tighten the bolts. No professional tools are required. It allows for quick switching between different testing methods such as point pressure, surface pressure, and line pressure. For example, when testing the local strength of a small chip encapsulation, a needle-tip type test head 14 can be used; when testing the overall compressive strength of a modular encapsulation, a flat plate type test head 14 can be used. This adapts to the testing needs of different encapsulation scenarios, avoiding the need to purchase multiple devices due to differences in testing methods. The test pressure adjustment is achieved through the counterweights 11 at the four corners of the lifting plate 9. The counterweights 11 adopt a combination structure of bolts, counterweights, and nuts. During adjustment, it is only necessary to unscrew the nuts, add or remove the number of counterweights, and retighten the nuts. By controlling the overall gravity of the lifting plate 9, the test head 14, and the counterweights, the pressure can be precisely adjusted. There is no need to rely on complex pressure sensors and electronic control adjustment systems. This can meet the pressure difference requirements of low-strength micro-encapsulated bodies and high-strength industrial-grade encapsulated bodies, while reducing the operation threshold and equipment maintenance costs of pressure adjustment.

[0030] With proper end-of-line buffer protection, when the lifting plate 9 descends to near the bottom of the test chamber 1, its lower surface first contacts the pressure ring, and then the pressure ring squeezes the buffer spring 13 at the bottom of the limiting rod 12. The buffer spring 13 gradually absorbs the impact force of the descent of the lifting plate 9 through its own deformation. On the one hand, this prevents the lifting plate 9 from directly hitting the bottom of the test chamber 1, reducing the wear and vibration of the device components and extending the service life of the equipment. On the other hand, it prevents the lifting plate 9 from rapidly touching the bottom, which would cause a sudden increase in test pressure and prevent the plastic sealant from breaking instantly before the complete deformation data is recorded. This ensures that the entire process data of the plastic sealant from stress deformation to failure and damage can be completely captured, thus improving the effectiveness of the test data.

Claims

1. A strength testing device for semiconductor molded packages, comprising a test chamber (1), characterized in that: It also includes a door (2), a testing mechanism (3), and a fixing mechanism (21). The door (2) is hinged to the surface of the test box (1) by a hinge. A viewing window is installed inside the door (2). The testing mechanism (3) is installed on the surface and inside the test box (1). The testing mechanism (3) includes a lifting plate (9), a limiting slide (10), a counterweight (11), and a testing head (14). The lifting plate (9) is set inside the test box (1). Two sets of limiting slides (10) are symmetrically fixed on both sides of the surface of the lifting plate (9). The limiting slides (10) are slidably connected to the slide rail opened on the inner wall of the test box (1) by pulleys. Four sets of counterweights Blocks (11) are fixed in a rectangular array at the four corners of the surface of the lifting plate (9). The test head (14) is bolted to the center of the lower surface of the lifting plate (9). Different specifications of test heads (14) can be flexibly replaced according to test requirements. The fixing mechanism (21) is installed inside the test box (1). The fixing mechanism (21) includes a fixing seat (22), a clamp (27) and a clamp plate (29). The fixing seat (22) is fixed inside the test box (1). Two sets of clamps (27) are symmetrically arranged above the fixing seat (22). There are four sets of clamp plates (29). Two sets of clamp plates (29) on the same side are symmetrically slidably connected inside the corresponding clamp (27).

2. The strength testing device for semiconductor molded packages according to claim 1, characterized in that: The testing mechanism (3) also includes a take-up shaft (4), a take-up motor (5), a take-up roller (6), a lifting rope (7), and guide pulleys (8). The take-up shaft (4) is rotatably connected to the bottom of the back surface of the test box (1) through a bearing seat. The take-up motor (5) is fixed to the bottom of the back surface of the test box (1), and the output shaft of the take-up motor (5) is fixedly connected to one end of the take-up shaft (4). The take-up roller (6) is fixedly connected to the surface of the take-up shaft (4). There are three sets of guide pulleys (8), two of which are connected to the support through a bracket. The top inner wall of the test box (1) is connected to both sides. Another set of guide pulleys (8) is rotatably connected to the bottom inner wall of the test box (1) through the bracket. One end of the lifting rope (7) is wrapped and fixed to the surface of the take-up roller (6). The other end of the lifting rope (7) passes around multiple sets of guide pulleys (8) and is fixedly connected to the upper surface of the lifting plate (9). Starting the take-up motor (5) can drive the take-up shaft (4) and the take-up roller (6) to rotate. The lifting plate (9) is pulled by the lifting rope (7) to drive the pulley of the limit slide (10) to move up and down along the slide rail.

3. The strength testing device for semiconductor molded packages according to claim 2, characterized in that: The testing mechanism (3) also includes a ratchet (15), a support frame (16), a pawl (17), and a compression spring (18). The ratchet (15) is fixedly connected to the surface of the take-up shaft (4). The support frame (16) is fixed to the surface of the test box (1) on the side close to the ratchet (15). The pawl (17) is hinged to the surface of the support frame (16) through a pivot, and the pawl (17) is engaged with the ratchet (15). The compression spring (18) is fixed between the pawl (17) and the support frame (16) to maintain the engagement state of the pawl (17) and the ratchet (15) and prevent the take-up shaft (4) from accidentally reversing.

4. The strength testing device for semiconductor molded packages according to claim 3, characterized in that: The surface of the pawl (17) is hinged to a lifting frame (19), which is slidably connected to the lifting groove inside the support frame (16). The push-telescopic rod (20) is fixed to the top of the support frame (16), and the output end of the push-telescopic rod (20) faces the surface of the lifting frame (19). Activating the push-telescopic rod (20) can push the lifting frame (19) to drive the pawl (17) to rotate around the pivot, thereby releasing the engagement limit between the pawl (17) and the ratchet (15).

5. The strength testing device for semiconductor molded packages according to claim 1, characterized in that: The test box (1) has two sets of limiting rods (12) fixed inside. The lifting plate (9) is slidably connected to the surface of the limiting rod (12) through the opening limiting groove. The bottom surface of the limiting rod (12) is fitted with a buffer spring (13). The bottom end of the buffer spring (13) is fixedly connected to the bottom wall of the test box (1). The top end of the buffer spring (13) is directly opposite the lower surface of the lifting plate (9) through the pressure ring, which is used to buffer the impact force when the lifting plate (9) descends. The counterweight (11) is composed of bolts, counterweights and nuts. The bolts are fixed at the four corners of the surface of the lifting plate (9). Multiple sets of counterweights are fitted on the surface of the corresponding bolts. The nuts are threadedly connected to the surface of the bolts.

6. The strength testing device for semiconductor molded packages according to claim 1, characterized in that: The fixing mechanism (21) also includes a transverse bidirectional lead screw (23), a chain (24), a fixing motor (25), and a threaded block (26). The two sets of transverse bidirectional lead screws (23) are rotatably connected to the two sides inside the fixing seat (22) through bearings. The fixing motor (25) is fixed to the outer wall of the fixing seat (22), and the output shaft of the fixing motor (25) is fixedly connected to one end of one set of transverse bidirectional lead screws (23). The other ends of the two sets of transverse bidirectional lead screws (23) are fixedly connected to sprockets. The chain (24) is meshed with the surfaces of the two sets of sprockets. There are four sets of threaded blocks (26). Two sets are symmetrically fixed to the bottom of the clamp (27). The threaded blocks (26) are threadedly connected to the transverse bidirectional lead screws (23). Starting the fixing motor (25) can drive the two sets of transverse bidirectional lead screws (23) to rotate synchronously through the chain (24), driving the two sets of clamps (27) to move relative to or in opposite directions.

7. The strength testing device for semiconductor molded packages according to claim 1, characterized in that: The interior of the clamp (27) is rotatably connected to a longitudinally moving bidirectional lead screw (28) via a bearing. The clamping plate (29) is threaded onto the surface of the longitudinally moving bidirectional lead screw (28). By rotating the longitudinally moving bidirectional lead screw (28), the two sets of clamping plates (29) on the same side can be driven to move relative to each other, thereby achieving longitudinal clamping and fixing of the semiconductor encapsulation.

8. The strength testing device for semiconductor molded packages according to claim 1, characterized in that: The surface of the clamp (29) is provided with anti-slip texture to increase the friction between the clamp (29) and the semiconductor molding compound and prevent slippage during the test.

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