Chip dual-side imaging device

Abstract

The utility model discloses a kind of chip double-side imaging devices, including pedestal, two light source components, two reflection components, double-sided reflection prism and camera component. Pedestal has horizontal mounting surface;Two light source components are symmetrically arranged on the mounting surface, and the detection space for accommodating chip to be detected is formed between the two light source components, and the two light source components are used to irradiate the two side edges of the chip;Two reflection components are symmetrically arranged on the mounting surface and are respectively located on the side of the light source component away from the detection space, and the reflection component is used to reflect the light reflected by the chip;Double-sided reflection prism is arranged below the detection space, for receiving and reflecting the light reflected by the two reflection components;Camera component is arranged below the double-sided reflection prism, for receiving the light reflected by the double-sided reflection prism component and imaging. The chip double-side imaging device can detect the two side edges of the chip simultaneously, improve detection efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing technology, specifically relating to a chip bilateral imaging device. Background Technology

[0002] Chip testing is a crucial step in the integrated circuit manufacturing and packaging process, directly affecting chip quality, reliability, and the yield of the final product. With the miniaturization of chip structures and the increasing complexity of application scenarios, higher demands are placed on the accuracy, efficiency, and comprehensiveness of testing technologies.

[0003] Currently, optical imaging-based inspection methods are widely used due to their ease of operation and relatively low cost. One typical approach involves using a camera to photograph the edge of the chip to analyze its edge morphology or defects. However, this method has significant limitations: a single camera can only capture images of one side of the chip, failing to simultaneously capture the overall morphology of both sides or the circumference. This necessitates multiple adjustments to the chip's orientation or camera position during inspection, increasing operational complexity and time costs, making it difficult to meet the efficiency requirements of mass production. Especially for scenarios requiring full-perimeter inspection (such as scratches, debris, or coating uniformity on wafer edges), traditional imaging methods require repeated positioning, not only reducing throughput but also potentially introducing secondary damage due to repeated clamping.

[0004] In addition, existing detection imaging equipment has a limited detection area. When the chip size changes, the imaging distance changes, which may lead to blurred images and affect detection accuracy.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to provide a chip bilateral imaging device that can simultaneously detect both edges of a chip, thereby improving detection efficiency.

[0007] To achieve the above objectives, a specific embodiment of this utility model provides the following technical solution: a chip bilateral imaging device, comprising a base, two light source assemblies, two reflective assemblies, a double-sided reflective prism, and a camera assembly. The base has a horizontal mounting surface; the two light source assemblies are symmetrically arranged on the mounting surface, forming a detection space between them for accommodating the chip to be tested, and the two light source assemblies are used to illuminate the opposite two side edges of the chip; the two reflective assemblies are symmetrically arranged on the mounting surface and respectively located on the side of the light source assemblies away from the detection space, and the reflective assemblies are used to reflect the light reflected by the chip; the double-sided reflective prism is disposed below the detection space, and is used to receive and reflect the light reflected by the reflective assemblies on both sides; the camera assembly is disposed below the double-sided reflective prism, and is used to receive the light reflected by the double-sided reflective prism assembly and form an image.

[0008] In one or more embodiments of this utility model, the light source assembly includes a mounting frame and two light source arrays. The mounting frame is disposed on the mounting surface; the two light source arrays are symmetrically disposed on the mounting frame in a vertical direction, and a light-transmitting opening is disposed between the two light source arrays for light reflected by the chip to pass through, the light-transmitting opening extending along the length direction of the mounting frame.

[0009] In one or more embodiments of this utility model, each light source array extends obliquely from the edge of the light-transmitting opening toward the edge of the mounting frame to form an arc-shaped light source array.

[0010] In one or more embodiments of this utility model, the reflective assembly includes a mounting housing, a first reflector, and a second reflector. The mounting housing is disposed on the mounting surface; the first reflector is disposed within the mounting housing for receiving and reflecting light reflected by the chip; the second reflector is disposed within the mounting housing and located below the first reflector, and the second reflector is used to receive light reflected by the first reflector and reflect the light to the double-sided reflective prism.

[0011] In one or more embodiments of this utility model, the light-transmitting port, the first reflector, and the chip are coaxially arranged.

[0012] In one or more embodiments of the present invention, the double-sided reflecting prism has a first reflecting surface and a second reflecting surface, the first reflecting surface and the second reflecting surface facing the second reflecting mirrors on both sides respectively.

[0013] In one or more embodiments of this utility model, the first reflecting surface, the second reflecting surface, and the second reflecting mirror are coaxially arranged.

[0014] In one or more embodiments of this utility model, the angle between the first reflector, the second reflector, the first reflecting surface, the second reflecting surface, and the mounting surface is 45°.

[0015] In one or more embodiments of this utility model, the light source assembly is movably disposed on the mounting surface; a first pushing component is disposed on one side of each light source assembly for driving the light source assembly to move closer to or away from the chip to be tested along the mounting surface.

[0016] In one or more embodiments of the present invention, the reflective component is movably disposed on the mounting surface; a second pushing component is disposed on one side of each reflective component for driving the reflective component to move closer to or away from the light source component along the mounting surface.

[0017] Compared with existing technologies, this invention's chip bilateral imaging device, by setting up a reflective component and a double-sided reflective prism, alters the propagation path of light from both sides of the chip and converges it to the same camera component, displaying the chip's two edges on the same image. This eliminates the need to adjust the chip's position, allowing simultaneous observation of both sides of the chip, thus improving chip detection efficiency. The altered optical path also reduces the size of the chip bilateral imaging device, saving space. The arc-shaped and symmetrically arranged light source array ensures ample illumination of the chip, guaranteeing imaging quality. Furthermore, the light source and reflective components can be moved according to the chip size, adapting to the imaging distance of chips of different sizes to meet the imaging requirements of corresponding sizes. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a perspective view of a chip-based bilateral imaging device according to an embodiment of the present invention;

[0020] Figure 2 This is a cross-sectional view of a chip-based bilateral imaging device according to an embodiment of the present invention;

[0021] Figure 3 This is a perspective view of the light source assembly in one embodiment of the present invention;

[0022] Figure 4 This is a perspective view of a reflective component in one embodiment of the present invention.

[0023] Explanation of key figure labels:

[0024] 1-Base, 11-Mounting surface, 2-Light source assembly, 21-Mounting frame, 22-Light source array, 23-Light transmission port, 3-Reflection assembly, 31-Mounting housing, 32-First reflector, 33-Second reflector, 4-Double-sided reflecting prism, 41-First reflecting surface, 42-Second reflecting surface, 5-Camera assembly, 6-First pushing assembly, 7-Second pushing assembly, 8-Chip, 9-Detection space. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0026] like Figures 1-4 As shown, a chip-side imaging device according to one embodiment of the present invention includes a base 1, two light source assemblies 2, two reflective assemblies 3, a double-sided reflective prism 4, and a camera assembly 5. The base 1 has a horizontal mounting surface 11. The two light source assemblies 2 are symmetrically arranged on the mounting surface 11, forming a detection space 9 for accommodating a chip 8, illuminating the opposite side edges of the chip 8 to be detected. The two reflective assemblies 3 are symmetrically arranged on the mounting surface 11 and are respectively located on the side of the light source assembly 2 facing away from the detection space 9. The reflective assemblies 3 are used to reflect the light reflected by the chip 8. The double-sided reflective prism 4 is disposed below the detection space 9, and is used to receive and reflect the light reflected by the two reflective assemblies 3. The camera assembly 5 is disposed below the double-sided reflective prism 4, for example, directly below the double-sided reflective prism 4 and coaxially arranged, and is used to receive the light reflected by the double-sided reflective prism 4 and form an image at the center of the camera assembly 5.

[0027] In the above embodiments, such as Figure 2 The chip 8 to be tested is held in the detection space 9 between two light source components 2 by a robotic arm or other clamping components. The light source components 2 on both sides of the chip 8 simultaneously illuminate both sides of the chip 8. After being illuminated, the chip 8 reflects the light, and the light from both sides of the chip 8 enters the reflection components 3 on both sides respectively. Then, the reflection components 3 on both sides reflect the light to both sides of a double-sided reflecting prism 4, and then the light is reflected by the double-sided reflecting prism 4 to a camera component 5, which captures images of the edges on both sides of the chip 8.

[0028] This chip-based dual-sided imaging device alters the light paths on both sides of the chip 8 by symmetrically arranging reflective components 3 on both sides and a double-sided reflective prism 4 positioned below the chip 8. This convergence of light rays from both sides of the chip 8 to the same camera component 5 allows for simultaneous observation of both sides of the chip 8. This configuration eliminates the need for repositioning the chip 8, enabling simultaneous observation of both sides and thus improving the efficiency of chip 8 detection.

[0029] In one implementation, such as Figure 3 As shown, the light source assembly 2 includes a mounting frame 21 and two light source arrays 22. The mounting frame 21 is disposed on the mounting surface 11. The two light source arrays 22 are symmetrically disposed on the mounting frame 21 in the vertical direction, so that one light source array 22 illuminates the chip 8 from above, and the other light source array 22 illuminates the chip 8 from below. A light-transmitting aperture 23 is disposed between the two light source arrays 22 for the light reflected by the chip 8 to pass through. The light-transmitting aperture 23 extends along the length direction of the mounting frame 21. Preferably, the length of the light-transmitting aperture 23 is approximately equal to the length of the mounting frame 21, so that a larger amount of light reflected by the chip 8 can pass through, thereby ensuring the clarity of the image at the camera assembly 5. At the same time, the chip 8 is coaxially disposed with the light-transmitting aperture 23, so that the light reflected by the chip 8 can be reflected horizontally to the reflective assembly 3.

[0030] Furthermore, each light source array 22 extends obliquely from the edge of the light-transmitting aperture 23 towards the edge of the mounting frame 21 to form an arc-shaped light source array 22. It can be understood that the light source array 22 located above the light-transmitting aperture 23 extends from the upper edge of the light-transmitting aperture 23 towards the upper edge of the mounting frame 21 to form an arc-shaped light source array 22. The light source array 22 located below the light-transmitting aperture 23 extends from the lower edge of the light-transmitting aperture 23 towards the lower edge of the mounting frame 21 to form an arc-shaped light source array 22. The edge of the chip 8 is approximately located at the center of each arc-shaped light source array 22, thereby ensuring that the light source array 22 can uniformly illuminate the chip 8.

[0031] Since the chip 8 is positioned between the two light source components 2, changes in the size of the chip 8 will alter the position of the light source components 2 illuminating the chip 8, resulting in insufficient light at the edges of the chip 8. This leads to unclear or insufficiently bright imaging at the camera component 5. Therefore, in one embodiment, the light source components 2 are movably mounted on the mounting surface 11 to adjust their distance from the chip 8. Each light source component 2 has a first pushing component 6 on one side, used to drive the light source component 2 to move closer to or further away from the chip 8 to be tested along the mounting surface 11. Specifically, a guide rail can be provided on the mounting surface 11, and the light source components 2 are mounted on the guide rail, for example, a mounting frame 21 can be mounted on the guide rail. The first pushing component 6 can be a drive cylinder, thereby driving the light source component 2 to move along the guide rail to adjust the distance between it and the chip 8 to be tested, ensuring effective imaging.

[0032] In one implementation, such as Figure 4 The reflective assembly 3 includes a mounting housing 31, a first reflector 32, and a second reflector 33. The mounting housing 31 is disposed on the mounting surface 11. The first reflector 32 is disposed inside the housing and is used to receive and reflect the light reflected by the chip 8. The second reflector 33 is disposed inside the mounting housing 31 and located below the first reflector 32. The second reflector 33 is used to receive the light reflected by the first reflector 32 and reflect the light to the double-sided reflecting prism 4.

[0033] Preferably, the light-transmitting aperture 23, the first reflector 32, and the chip 8 are coaxially arranged so that the light reflected from the chip 8 horizontally illuminates the first reflector 32. Further, the first reflector 32 is inclined upwards at a 45° angle to the mounting surface 11. The second reflector 33 is inclined downwards at a 45° angle to the mounting surface 11. Therefore, the angle between the first reflector 32 and the second reflector 33 is 90°. With this arrangement, the light horizontally reflected from the chip 8 can be vertically reflected by the first reflector 32 to the second reflector 33, and then illuminated by the second reflector 33 to the double-sided reflecting prism 4.

[0034] In one embodiment, the double-sided reflecting prism 4 has a first reflecting surface 41 and a second reflecting surface 42, which face the second reflecting mirrors 33 on both sides. Preferably, the first reflecting surface 41, the second reflecting surface 42 and the second reflecting mirror 33 are coaxially arranged, so that light can be horizontally incident on the double-sided reflecting prism 4 from the second reflecting mirror 33.

[0035] Furthermore, the angle between the first reflective surface 41 and the second reflective surface 42 and the mounting surface 11 is 45°. Thus, when light shines horizontally on the first reflective surface 41 and the second reflective surface 42, since the angle between the second reflective mirror 33 and the mounting surface 11 is 45°, the light can shine vertically downward on the camera assembly 5, maximizing the amount of light entering the camera assembly 5, ensuring the imaging effect, and also ensuring that the image is located in the center of the camera assembly 5, avoiding image shift.

[0036] With the above configuration, the light from the edges on both sides of the chip 8 can simultaneously pass through the first reflector 32, the second reflector 33, and the first reflective surface 41 / second reflective surface 42 and then enter the camera assembly 5, forming a corresponding image at the camera assembly 5, thereby allowing simultaneous observation of the edges on both sides of the chip 8.

[0037] When the size of chip 8 changes, its imaging distance on camera assembly 5 also changes. To ensure image clarity on camera assembly 5, in one embodiment, reflective component 3 is movably mounted on mounting surface 11. A second pushing component 7 is provided on one side of each reflective component 3 to drive the reflective component 3 to move closer to or further away from light source assembly 2 along mounting surface 11, thereby changing the distance from chip 8. Specifically, a guide rail can be provided on mounting surface 11, and the reflective component 3 is mounted on the guide rail, for example, a mounting housing 31 can be mounted on the guide rail. The reflective component 3 and light source assembly 2 can share the same guide rail. The second pushing component 7 can be a drive cylinder or a stepper motor, etc. After the position of reflective component 3 changes, its distance from chip 8 is also adjusted accordingly, thereby matching the imaging distance of different chips 8 and meeting the imaging requirements of different chips 8.

[0038] In summary, the chip-side imaging device of this invention, by setting up the reflective component 3 and the double-sided reflective prism 4, changes the propagation path of light from both sides of the chip 8 and converges it to the same camera component 5, displaying the edges of both sides of the chip 8 on the same image. This allows for simultaneous observation of both edges of the chip 8 without adjusting its position, improving the efficiency of chip 8 detection. The change in light path also reduces the size of the chip-side imaging device, saving space. The arc-shaped and symmetrical arrangement of the light source array 22 ensures sufficient illumination of the chip 8, guaranteeing imaging quality. Furthermore, the light source component 2 and the reflective component 3 can be moved according to the size of the chip 8, adapting to the imaging distance of chips of different sizes to achieve the imaging requirements of corresponding sizes.

[0039] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0040] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A chip-based bilateral imaging device, characterized in that, include: The base has a horizontal mounting surface; Two light source assemblies are symmetrically arranged on the mounting surface, and a detection space is formed between the two light source assemblies to accommodate and illuminate the chip to be tested. The two light source assemblies are used to illuminate the opposite two side edges of the chip. Two reflective components are symmetrically arranged on the mounting surface and are respectively located on the side of the light source assembly away from the detection space. The reflective components are used to reflect the light reflected by the chip. A double-sided reflecting prism is disposed below the detection space to receive and reflect the light reflected by the reflecting components on both sides; and A camera assembly, positioned below the double-sided reflecting prism, is used to receive the light reflected by the double-sided reflecting prism assembly and to form an image.

2. The chip-based bilateral imaging device according to claim 1, characterized in that, The light source assembly includes: A mounting frame is provided on the mounting surface; and Two light source arrays are symmetrically arranged on the mounting frame along the vertical direction, and a light-transmitting port is provided between the two light source arrays for the light reflected by the chip to pass through. The light-transmitting port extends along the length direction of the mounting frame.

3. The chip-based bilateral imaging device according to claim 2, characterized in that, Each light source array extends obliquely from the edge of the light-transmitting opening toward the edge of the mounting frame to form an arc-shaped light source array.

4. The chip-based bilateral imaging device according to claim 2, characterized in that, The reflective component includes: A mounting housing is disposed on the mounting surface; A first reflector, disposed within the mounting housing, is used to receive and reflect light reflected by the chip; and The second reflector is disposed inside the mounting housing and located below the first reflector. The second reflector is used to receive the light reflected by the first reflector and reflect the light to the double-sided reflective prism.

5. The chip-based bilateral imaging device according to claim 4, characterized in that, The light-transmitting port, the first reflector, and the chip are arranged coaxially.

6. The chip-based bilateral imaging device according to claim 4, characterized in that, The double-sided reflecting prism has a first reflecting surface and a second reflecting surface, with the first reflecting surface and the second reflecting surface facing the second reflecting mirrors on both sides respectively.

7. The chip-based bilateral imaging device according to claim 6, characterized in that, The first reflective surface, the second reflective surface, and the second reflective mirror are arranged coaxially.

8. The chip-based bilateral imaging device according to claim 6, characterized in that, The angle between the first reflector, the second reflector, the first reflecting surface, the second reflecting surface, and the mounting surface is 45°.

9. The chip-based bilateral imaging device according to claim 1, characterized in that, The light source assembly is movably disposed on the mounting surface; a first pushing component is provided on one side of each light source assembly for driving the light source assembly to move closer to or away from the chip to be tested along the mounting surface.

10. The chip-based bilateral imaging device according to claim 1, characterized in that, The reflective components are movably disposed on the mounting surface; a second pushing component is provided on one side of each reflective component for driving the reflective component to move closer to or away from the light source component along the mounting surface.

Images