Macro-micro wafer defect detection device

Abstract

The utility model relates to a macro micro wafer defect detection device, include: macroscopic detection unit, it includes macroscopic adjusting assembly, macroscopic clamping assembly, light source and macro camera, macroscopic adjusting assembly includes R axle drive mechanism and fixed mounting in R axle drive mechanism drive end's F axle drive mechanism, macroscopic clamping assembly fixed mounting in F axle drive mechanism's drive end, and macroscopic clamping assembly is used for clamping wafer, microcosmic detection unit, it includes fixed mounting's microcosmic platform, fixed mounting in microcosmic platform's first linear drive mechanism, fixed in first linear drive mechanism drive end's wafer adsorption mechanism and fixed mounting in microcosmic platform's bright dark field detection mechanism, the drive direction of first linear drive mechanism is horizontal direction, and wafer adsorption mechanism is used for adsorbing wafer, and bright dark field detection mechanism is used for shooting wafer's front and back. The utility model can carry out macroscopic and microcosmic detection to wafer's surface, and relatively improve detection efficiency.

Description

Technical Field

[0001] This utility model relates to the field of machine vision inspection technology, and in particular to a macro- and micro-scale wafer defect detection device. Background Technology

[0002] In the semiconductor manufacturing industry, wafers, as the carriers of chips, directly determine the performance, yield, and reliability of the final product based on their surface quality. Therefore, wafer defect detection is a crucial and indispensable part of the semiconductor industry chain. By accurately identifying various defects on the wafer surface, such as scratches, cracks, contamination, and foreign particles, not only can defective products be promptly removed, but real-time data feedback can also be provided to upstream processes, thereby optimizing the manufacturing process and continuously improving overall yield.

[0003] Currently, the industry widely adopts machine vision-based automated inspection technology to accomplish this task. This type of technology typically utilizes a high-resolution CCD camera in conjunction with a specific light source system to capture the microscopic morphology of the wafer surface, and combines advanced image processing and artificial intelligence algorithms to achieve automatic defect identification and classification. These systems generally possess high-resolution imaging, rapid inspection capabilities, intelligent analysis, and a certain degree of flexibility and scalability to meet the demands of high-efficiency, high-precision production.

[0004] However, existing wafer defect detection technologies still face significant challenges in practical applications. Specifically, defects on the wafer surface vary greatly in size, type, and scope of impact. Macroscopic defects, such as large scratches, cracks, and regional contamination, can affect multiple chips or even the entire wafer in the early stages of production. If they are not detected in time upstream of the production line, they can lead to the scrapping of hundreds or even thousands of subsequent wafers, resulting in huge economic losses. On the other hand, microscopic defects, such as tiny pits, fine particles, and surface contamination, although small in size, directly affect the manufacturing precision of chips and the electrical performance of the final product, and are equally important to consider.

[0005] Currently available testing equipment often has relatively limited functionality, focusing either on macroscopic overall scanning or on high-precision microscopic imaging. This leads to the frequent need in actual production processes to transfer the same wafer between testing devices with different functions for both macroscopic preliminary inspection and microscopic fine inspection. This testing method significantly reduces testing efficiency and increases equipment investment costs.

[0006] Therefore, there is an urgent need for a comprehensive testing platform that integrates macroscopic and microscopic detection functions, enabling all-round defect detection at the same workstation, thereby achieving more efficient early defect detection, more comprehensive quality assessment, and lower overall costs. Utility Model Content

[0007] This invention provides a macro- and micro-scale wafer defect detection device, which can perform macro- and micro-scale detection on the surface of wafers, thereby improving detection efficiency.

[0008] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A macro- and micro-scale wafer defect detection device, comprising: The macroscopic inspection unit includes a macroscopic adjustment component, a macroscopic clamping component, a light source, and a macroscopic camera. The macroscopic adjustment component includes a fixedly mounted R-axis drive mechanism and an F-axis drive mechanism fixedly mounted on the drive end of the R-axis drive mechanism. The axis of rotation of the R-axis drive mechanism extends vertically, and the axis of rotation of the F-axis drive mechanism extends horizontally. The macroscopic clamping component is fixedly mounted on the drive end of the F-axis drive mechanism and is used to clamp the wafer. The microscopic detection unit includes a fixedly mounted microscopic platform, a first linear drive mechanism fixedly mounted on the microscopic platform, a wafer adsorption mechanism fixedly mounted on the drive end of the first linear drive mechanism, and a bright and dark field detection mechanism fixedly mounted on the microscopic platform. The drive direction of the first linear drive mechanism is horizontal. The wafer adsorption mechanism is used to adsorb wafers. The bright and dark field detection mechanism is used to photograph the front and back sides of the wafers.

[0009] The beneficial effects of this utility model are: a macroscopic detection unit is used to detect large scratches, cracks and contamination on the surface of the wafer, and then a microscopic detection unit is used to perform bright field and dark field detection on the front and back of the wafer to detect small scratches, cracks, pits, particles and surface contamination on the wafer surface, thereby completing the all-round inspection of the wafer and improving the inspection efficiency.

[0010] Based on the above technical solution, the present invention can be further improved as follows.

[0011] Furthermore, the macroscopic adjustment assembly also includes a fixedly installed macroscopic base plate, a fixedly installed T-axis drive mechanism, and a P-axis drive mechanism fixedly installed at the drive end of the T-axis drive mechanism. The axis of rotation of the T-axis drive mechanism extends vertically and the axis of rotation of the T-axis drive mechanism extends horizontally. The R-axis drive mechanism is fixedly installed at the drive end of the P-axis drive mechanism.

[0012] Furthermore, the macroscopic clamping assembly includes a wafer base plate fixedly mounted on the drive end of the F-axis drive mechanism. The wafer base plate has a macroscopic adsorption groove, which is used to connect to a negative pressure generator and to adsorb the edge end of the wafer.

[0013] Furthermore, the macroscopic clamping assembly also includes a clamping motor fixed to the wafer substrate, and the drive shaft of the clamping motor is detachably connected to a pressure rod, which is used to press down the wafer.

[0014] Furthermore, the drive shaft of the pressing motor is fitted with a torsion spring, one end of which is fixed to the wafer base plate and the other end is fixed to the pressure rod.

[0015] Furthermore, the macroscopic adsorption tank has an upward opening structure, and the wafer base plate is fixed with a limiting stage surrounding the macroscopic adsorption tank, the limiting stage being used to abut against the radial side of the wafer.

[0016] Furthermore, the light source includes a macroscopic bright-field light source and a macroscopic dark-field light source, both of which are fixedly installed. The light from the macroscopic bright-field light source illuminates the wafer at an angle of 60°-80° with the horizontal plane, and the light from the macroscopic dark-field light source illuminates the wafer at an angle of 10°-30° with the horizontal plane.

[0017] Furthermore, the wafer adsorption mechanism includes a chuck base and multiple adsorption corner blocks. The chuck base has an open structure at the top and bottom and is fixed to the driving end of the first linear drive mechanism. Each of the adsorption corner blocks is evenly distributed circumferentially on the upper side of the chuck base, and each of the adsorption corner blocks is provided with a micro-adsorption groove. The micro-adsorption groove is used to connect to a negative pressure generator and is used to adsorb the edge end of the wafer.

[0018] Furthermore, the bright and dark field detection mechanism includes a microscopic front bright field light source, a microscopic front dark field light source, a microscopic front imager, a microscopic back bright field light source, a microscopic back dark field light source, and a microscopic back imager, all fixedly installed on the microscopic platform. The microscopic front bright field light source and the microscopic front dark field light source are used to illuminate the front side of the wafer, the microscopic front imager is used to photograph the front side of the wafer, the microscopic back bright field light source and the microscopic back dark field light source are used to illuminate the back side of the wafer, and the microscopic back imager is used to photograph the back side of the wafer.

[0019] Furthermore, the microscopic detection unit also includes a second linear drive mechanism fixedly installed on the microscopic platform, a third linear drive mechanism fixedly installed on the drive end of the second linear drive mechanism, and a fixed-point detector fixedly installed on the drive end of the third linear drive mechanism. The drive direction of the second linear drive mechanism is horizontal and perpendicular to the drive direction of the first linear drive mechanism, the drive direction of the third linear drive mechanism is vertical, and the fixed-point detector is used to photograph the front side of the wafer. Attached Figure Description

[0020] Figure 1This is a structural diagram of the macro- and micro-scale wafer defect detection device of this utility model; Figure 2 This is an exploded view of the macroscopic detection unit of the macroscopic and microscopic wafer defect detection device of this utility model. Figure 3 This is a structural diagram of the macroscopic clamping assembly of the macroscopic and microscopic wafer defect detection device of this utility model; Figure 4 For the present utility model Figure 3 A magnified view of the local structure; Figure 5 This is a structural diagram of the microscopic detection unit of the macro-microscopic wafer defect detection device of this utility model; Figure 6 This is a structural diagram of the wafer adsorption mechanism of the macro- and micro-scale wafer defect detection device of this utility model; Figure 7 This is a structural diagram of the bright and dark field detection mechanism of the macro-micro wafer defect detection device of this utility model.

[0021] The attached diagram lists the components represented by each number as follows: 1. Wafer; 2. Macroscopic adjustment assembly; 21. R-axis drive mechanism; 22. F-axis drive mechanism; 23. Macroscopic base plate; 24. T-axis drive mechanism; 25. P-axis drive mechanism; 3. Macroscopic clamping assembly; 31. Wafer base plate; 311. Macroscopic adsorption groove; 312. Limiting stage; 32. Pressing motor; 33. Pressing rod; 34. Torsion spring; 4. Light source; 41. Macroscopic bright-field light source; 42. Macroscopic dark-field light source; 5. Macro camera; 6. Micro-platform; 61. Support frame; 611. Vibration-damping foot; 612. Vibration isolation pad; 613. First gantry frame; 614. Second gantry frame; 7. First linear drive mechanism; 8. Wafer adsorption mechanism; 81. Chuck base; 82. Adsorption corner block; 821. Microscopic adsorption groove; 9. Bright and dark field detection mechanism; 91. Microscopic front bright field light source; 911. Front mounting bracket; 92. Microscopic front dark field light source; 93. Microscopic front imager; 94. Microscopic back bright field light source; 941. Back mounting bracket; 95. Microscopic back dark field light source; 96. Microscopic back imager; 10. Second linear drive mechanism; 101. Third linear drive mechanism; 102. Fixed-point detector. Detailed Implementation

[0022] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0023] Example 1 like Figures 1-7 A macro- and micro-scale wafer defect detection device, comprising: The macroscopic inspection unit includes a macroscopic adjustment component 2, a macroscopic clamping component 3, a light source 4, and a macroscopic camera 5. The macroscopic adjustment component 2 includes a fixedly mounted R-axis drive mechanism 21 and an F-axis drive mechanism 22 fixedly mounted on the drive end of the R-axis drive mechanism 21. The axis of rotation of the R-axis drive mechanism 21 extends vertically, and the axis of rotation of the F-axis drive mechanism 22 extends horizontally. The macroscopic clamping component 3 is fixedly mounted on the drive end of the F-axis drive mechanism 22 and is used to clamp the wafer 1. The microscopic detection unit includes a fixedly mounted microscopic platform 6, a first linear drive mechanism 7 fixedly mounted on the microscopic platform 6, a wafer adsorption mechanism 8 fixedly mounted on the drive end of the first linear drive mechanism 7, and a bright and dark field detection mechanism 9 fixedly mounted on the microscopic platform 6. The drive direction of the first linear drive mechanism 7 is horizontal. The wafer adsorption mechanism 8 is used to adsorb the wafer 1, and the bright and dark field detection mechanism 9 is used to photograph the front and back sides of the wafer 1.

[0024] The beneficial effects of this embodiment are: a macroscopic detection unit is used to detect large scratches, cracks and contamination on the surface of wafer 1, and then a microscopic detection unit is used to detect small scratches, cracks, pits, particles and surface contamination on the front and back sides of wafer 1, thereby completing the all-round inspection of wafer 1 and improving the inspection efficiency.

[0025] Specifically, when using a macroscopic inspection unit to perform macroscopic inspection on wafer 1 to avoid the scrapping of hundreds or even thousands of wafers 1 through early detection, wafer 1 is clamped by macroscopic clamping assembly 3, and then photographed and recorded by macroscopic camera 5 under the illumination of light source 4. The light signal is received and converted into a visual image to detect defect information. During macroscopic inspection, wafer 1 can be indirectly driven to rotate by R-axis drive mechanism 21 and / or F-axis drive mechanism 22 to achieve multi-angle inspection. Of course, during macroscopic inspection, simultaneous inspection can also be performed by manual visual inspection.

[0026] When using a micro-inspection unit to perform micro-inspection on wafer 1 in order to avoid wafer 1 affecting chip manufacturing and final product performance through early detection, wafer 1 can be adsorbed and fixed by wafer adsorption mechanism 8, and then the wafer adsorption mechanism 8 can be moved by the first linear drive mechanism 7 to adjust the position of wafer 1, so that the front and back of wafer 1 can be photographed and recorded by the bright and dark field detection mechanism 9 to realize the micro-inspection operation.

[0027] Among them, the macro camera 5 can be an area scan camera, which is responsible for receiving light signals and converting them into visual images to facilitate the detection of defect information. It should be noted that area scan cameras and their working principles are well-known technologies to those skilled in the art, and therefore will not be described in detail here. Inspection personnel can simply purchase and install them.

[0028] The R-axis drive mechanism 21 includes a five-phase stepper motor and an R-axis disk component coaxially fixedly connected to the drive end of the five-phase stepper motor. The axis of the R-axis disk component extends vertically, and its end is fixedly connected to two opposing brackets that both extend upward. The brackets are used to fix the F-axis drive mechanism 22 so that the R-axis disk component can be driven to rotate by the five-phase stepper motor, thereby driving the F-axis drive mechanism 22 to rotate, realizing the 360° rotation of wafer 1. At this time, the rotation axis of wafer 1 is a vertical straight line.

[0029] The F-axis drive mechanism 22 includes a low-voltage DC servo motor fixedly mounted on one of the brackets of the R-axis drive mechanism 21 and a coupling connected to the drive end of the low-voltage DC servo motor. The axis of the low-voltage DC servo motor extends horizontally, and the coupling is connected to the macro clamping assembly 3. The wafer 1 can be rotated 360° by the drive of the low-voltage DC servo motor and the transmission of the coupling. At this time, the rotation axis of the wafer 1 is a horizontal straight line.

[0030] Based on the above embodiments, a pneumatic slip ring is fixedly connected to another bracket of the R-axis drive mechanism 21. The pneumatic slip ring is arranged opposite to the low-voltage DC servo motor and is rotatably connected to the macro clamping assembly 3 to support the macro clamping assembly 3. At the same time, the pneumatic slip ring fixes the path of the wires and air pipes to prevent the wires from getting tangled with the air pipes when the wafer 1 rotates, thus ensuring the stability and reliability of the transmission.

[0031] The micro-platform 6 can be a marble platform, supported by a support frame 61, which is further supported at its lower end by multiple vibration-damping feet 611 to ensure stability. Multiple vibration-damping pads 612 are fixedly connected to the upper side of the support frame 61 to support the micro-platform 6. The elastic deformation of the vibration-damping pads 612 absorbs vibration energy, effectively isolating environmental vibrations. The vibration-damping pads 612 can be made of rubber.

[0032] A first gantry 613 is fixedly connected to the micro platform 6 to provide synchronous support for the light and dark field detection mechanism 9.

[0033] The first linear drive mechanism 7 can be a lead screw guide rail slide mechanism, and two of them are arranged opposite each other to support the two ends of the wafer adsorption mechanism 8, so as to achieve stable support and stable drive movement of the wafer adsorption mechanism 8.

[0034] Of course, the first linear drive mechanism 7 can also adopt linear drive mechanisms such as ball screw transmission mechanism, synchronous belt transmission, electric push rod, electric cylinder, cam mechanism, cylinder mechanism and linear motor drive mechanism.

[0035] In this embodiment, the macroscopic detection unit and the microscopic detection unit can work simultaneously or independently.

[0036] As disclosed by those skilled in the art, both the macroscopic detection unit and the microscopic detection unit are equipped with a cabinet cover to provide protection and dust prevention. The cabinet is equipped with relevant operation and safety buttons.

[0037] Both the macroscopic and microscopic inspection units are connected to an automated wafer loading and unloading system to perform wafer loading and unloading operations. The automated wafer loading and unloading system is existing technology; applying it to the loading and unloading of wafer 1 requires no creative effort and will not be elaborated upon here. Of course, the loading and unloading of wafer 1 can also be directly performed by a robot.

[0038] Example 2 like Figures 2-4 Based on embodiment 1, the macroscopic adjustment component 2 also includes a fixedly installed macroscopic base plate 23, a fixedly installed T-axis drive mechanism 24, and a fixedly installed P-axis drive mechanism 25 at the drive end of the T-axis drive mechanism 24. The axis of rotation of the T-axis drive mechanism 24 extends vertically and horizontally. The R-axis drive mechanism 21 is fixedly installed at the drive end of the P-axis drive mechanism 25.

[0039] The beneficial effect of adopting the preferred solution in the above embodiments is that, during the inspection process, the wafer 1 can be indirectly driven to rotate in its horizontal direction through the T-axis drive mechanism 24, with the rotation plane being the horizontal plane, thus changing the angle. At the same time, the wafer 1 can be indirectly driven to rotate in the vertical plane through the P-axis drive mechanism 25, thus changing the angle, thereby realizing multi-angle inspection operations.

[0040] The macro base plate 23 can be fixed to the rack of an external cabinet or to the support frame 61. Vibration damping pads are also used at the bottom of the macro base plate 23 for vibration reduction.

[0041] The T-axis drive mechanism 24 includes a fixedly mounted linear motor and a U-shaped frame with an upwardly open structure. The U-shaped frame is rotatably mounted on the upper surface of the macro base plate 23 and is connected to the drive end of the linear motor. Its rotation plane is horizontal.

[0042] The P-axis drive mechanism 25 includes a low-voltage DC servo motor and a P-axis frame that is driven by the low-voltage DC servo motor. The two ends of the P-axis frame are rotatably connected to the two straight arms of the U-shaped frame, and the rotation axis of the P-axis frame extends horizontally so that the P-axis frame can be driven to rotate by the low-voltage DC servo motor, thereby indirectly realizing the pitch angle adjustment of the wafer 1.

[0043] Based on the above embodiments, the R-axis disk component of the R-axis drive mechanism 21 is rotatably connected to the P-axis frame of the P-axis drive mechanism 25.

[0044] Example 3 like Figure 3 and Figure 4 Based on embodiments 1 and 2, the macro clamping assembly 3 includes a wafer base plate 31 fixedly installed on the driving end of the F-axis drive mechanism 22. The wafer base plate 31 has a macro adsorption groove 311, which is used to connect to the negative pressure generator and to adsorb the edge end of the wafer 1.

[0045] The beneficial effect of the preferred solution in the above embodiments is that, during testing, wafer 1 is placed on wafer substrate 31, and the edge of wafer 1 covers the upper opening of macroscopic adsorption tank 311. Then, the negative pressure generator is activated, and the closed macroscopic adsorption tank 311 generates negative pressure to adsorb and fix wafer 1.

[0046] Based on the above embodiment, the wafer base plate 31 has a vertical through-opening structure so that the front and back sides of the wafer 1 can be inspected under the drive of the F-axis drive mechanism 22.

[0047] Furthermore, the sidewall of the wafer base plate 31 has a through opening to form an operating space, which facilitates the robot to perform pick-up and put-down actions.

[0048] The macroscopic adsorption tank 311 has an open top structure, and its side wall is continuous and connected to a first pipe joint to connect with the negative pressure generator via a pipe. Furthermore, the negative pressure generator can be a vacuum pump or a jet-type negative pressure generator commonly used by those skilled in the art; the technician can select and use the appropriate model as needed.

[0049] Example 4 like Figure 3 and Figure 4Based on embodiments 1-3, the macro clamping assembly 3 also includes a clamping motor 32 fixed to the wafer base plate 31. The drive shaft of the clamping motor 32 is detachably connected to a pressure rod 33, which is used to press down the wafer 1.

[0050] The beneficial effect of the preferred solution in the above embodiments is that after the wafer 1 is adsorbed and fixed by negative pressure adsorption, the pressure rod 33 can be rotated and pressed down on the upper side of the wafer 1 by starting the pressure motor 32, so as to prevent the wafer 1 from falling off due to power failure or other uncontrollable factors during the inspection process.

[0051] The pressure bar 33 can be made of a flexible material, such as flexible rubber or silicone, to prevent damage to the wafer 1.

[0052] Based on the above embodiments, the pressing motor 32 and the pressing rod 33 are grouped together, and multiple groups are distributed on the wafer base plate 31 to form multiple pressing points on the wafer 1, thereby improving the voltage stabilization effect.

[0053] Example 5 like Figure 3 and Figure 4 Based on embodiments 1-4, the drive shaft of the pressing motor 32 is fitted with a torsion spring 34, one end of the torsion spring 34 is fixed to the wafer base plate 31, and the other end is fixed to the pressure rod 33.

[0054] The beneficial effect of adopting the preferred solution in the above embodiments is that, under the action of the torsion spring 34, the pressure rod 33 can effectively press down on the wafer 1. That is, even after the clamping motor 32 is de-energized, the wafer 1 can still be pressed down under the standby action of the torsion spring 34. Obviously, in the pressing state, the torsion spring 34 can be in its natural state. After the detection is completed, force is applied to the pressure rod 33 to rotate it away from the axial projection area of ​​the wafer 1, and the wafer 1 can be removed.

[0055] Example 6 like Figure 3 and Figure 4 Based on Examples 1-5, the macroscopic adsorption tank 311 has an open structure at the top, and the wafer base plate 31 is fixed with a limiting stage 312 surrounding the macroscopic adsorption tank 311. The limiting stage 312 is used to abut against the radial side of the wafer 1.

[0056] The advantage of the preferred solution in the above embodiments is that the wafer 1 is radially limited by the limiting stage 312, which ensures the stability of the wafer 1 during the detection process.

[0057] Example 7 like Figure 1 and Figure 2Based on Examples 1-6, the light source 4 includes a macroscopic bright field light source 41 and a macroscopic dark field light source 42, both of which are fixedly installed. The light from the macroscopic bright field light source 41 illuminates the wafer 1 at an angle of 60°-80° with the horizontal plane, and the light from the macroscopic dark field light source 42 illuminates the wafer 1 at an angle of 10°-30° with the horizontal plane.

[0058] The beneficial effect of adopting the preferred solution in the above embodiments is that the macroscopic bright field light source 41 illuminates the surface of the wafer 1, and the wafer 1 absorbs or scatters part of the light to form an image with contrast between light and dark. At the same time, the macroscopic dark field light source 42 illuminates the surface of the wafer 1 at an angle, and the surface of the wafer 1 scatters and diffracts light to form a high-contrast image.

[0059] Among them, the macroscopic bright field light source 41 is a square surface light source, fixed on the external rack, located on the upper side of the wafer. The angle between its light and the horizontal plane can be 60°, 65°, 70°, 75° or 80°.

[0060] The macroscopic dark field light source 42 is a strip-shaped surface light source, fixed on an external rack and located on the side of the wafer. The angle between its light and the horizontal plane can be 10°, 15°, 20°, 25° or 30°.

[0061] Example 8 like Figure 1 , Figure 5 as well as Figure 6 Based on embodiments 1-7, the wafer adsorption mechanism 8 includes a chuck base 81 and multiple adsorption corner blocks 82. The chuck base 81 has an open structure at the top and bottom and is fixed to the driving end of the first linear drive mechanism 7. Each adsorption corner block 82 is evenly distributed on the upper side of the chuck base 81 in a circumferential direction, and each adsorption corner block 82 is provided with a micro-adsorption groove 821. The micro-adsorption groove 821 is used to connect to the negative pressure generator and is used to adsorb the edge end of the wafer 1.

[0062] The beneficial effect of the preferred solution in the above embodiments is that, during testing, the wafer 1 is placed on each adsorption corner block 82, and the edge of the wafer 1 covers the upper opening of the micro-adsorption groove 821. Then, the negative pressure generator is activated, and the closed micro-adsorption groove 821 generates negative pressure to adsorb and fix the wafer 1.

[0063] Based on the above embodiment, the chuck base 81 has a vertically through-hole annular structure to ensure that the bright and dark field detection mechanism 9 can smoothly perform the detection operations on the front and back sides of the wafer 1.

[0064] Furthermore, an opening is formed between two adjacent adsorption corner blocks 82 to create an operating space, facilitating the robot's pick-up and put-down actions. Specifically, each adsorption corner block 82 can be two, three, four, five, or six, etc.

[0065] The micro-adsorption tank 821 has an open top structure, and the side wall of the macro-adsorption tank 311 is continuous and connected to a second pipe joint to connect with the negative pressure generator through a pipe. Furthermore, the negative pressure generator can be a vacuum pump or a jet-type negative pressure generator commonly used by those skilled in the art; technicians can select and use the appropriate model as needed.

[0066] Example 9 like Figure 1 , Figure 5 as well as Figure 7 Based on Examples 1-8, the bright and dark field detection mechanism 9 includes a microscopic front bright field light source 91, a microscopic front dark field light source 92, a microscopic front imager 93, a microscopic back bright field light source 94, a microscopic back dark field light source 95, and a microscopic back imager 96, all of which are fixedly installed on the microscopic platform 6. The microscopic front bright field light source 91 and the microscopic front dark field light source 92 are used to illuminate the front side of the wafer 1, the microscopic front imager 93 is used to photograph the front side of the wafer 1, the microscopic back bright field light source 94 and the microscopic back dark field light source 95 are used to illuminate the back side of the wafer 1, and the microscopic back imager 96 is used to photograph the back side of the wafer 1.

[0067] The beneficial effect of adopting the preferred scheme in the above embodiments is that, during detection, the microscopic front bright field light source 91 and the microscopic front dark field light source 92 provide bright field and dark field illumination downwards to the front of the wafer 1, while the microscopic front imager 93 performs front-side imaging, recording, and detection, and the microscopic back bright field light source 94 and the microscopic back dark field light source 95 provide bright field and dark field illumination upwards to the back of the wafer 1, while the microscopic back imager 96 performs back-side imaging, recording, and detection.

[0068] Based on the above embodiments, the microscopic front bright field light source 91, the microscopic front dark field light source 92, and the microscopic front imager 93 form a group, located directly above the chuck base 81 of the wafer adsorption mechanism 8, while the microscopic back bright field light source 94, the microscopic back dark field light source 95, and the microscopic back imager 96 form another group, located directly below the chuck base 81 of the wafer adsorption mechanism 8.

[0069] Based on the above embodiments, the bright and dark field detection mechanism 9 also includes a front mounting bracket 911 fixedly connected to the first gantry 613 of the micro platform 6. The micro front bright field light source 91 and the micro front dark field light source 92 are both fixedly installed on the front mounting bracket 911, and the micro front imager 93 is also fixedly connected to the first gantry 613 of the micro platform 6.

[0070] The bright and dark field detection mechanism 9 also includes a back mounting bracket 941 fixedly connected to the micro platform 6. The micro back bright field light source 94 and the micro back dark field light source 95 are both fixedly installed on the back mounting bracket 941, and the micro back imager 96 is also fixedly connected to the micro platform 6.

[0071] Example 10 like Figure 1 and Figure 5 Based on embodiments 1-9, the microscopic detection unit further includes a second linear drive mechanism 10 fixedly installed on the microscopic platform 6, a third linear drive mechanism 101 fixedly installed on the drive end of the second linear drive mechanism 10, and a fixed-point detector 102 fixedly installed on the drive end of the third linear drive mechanism 101. The driving direction of the second linear drive mechanism 10 is horizontal and perpendicular to the driving direction of the first linear drive mechanism 7. The driving direction of the third linear drive mechanism 101 is vertical. The fixed-point detector 102 is used to photograph the front side of the wafer 1.

[0072] The beneficial effect of adopting the preferred solution in the above embodiments is that after the microscopic detection is completed by the bright and dark field detection mechanism 9, the wafer adsorption mechanism 8 and the wafer 1 adsorbed and fixed by the wafer adsorption mechanism 8 can be driven by the first linear drive mechanism 7 to move out of the range of the bright and dark field detection mechanism 9 and move to the direct below the fixed point detector 102. At the same time, the position of the fixed point detector 102 can be indirectly adjusted by the second linear drive mechanism 10 and the third linear drive mechanism 101 so as to perform fixed point detection on the wafer 1 through the fixed point detector 102 and realize re-inspection.

[0073] The second linear drive mechanism 10 and the third linear drive mechanism 101 can be linear drive mechanisms such as lead screw guide slide mechanism, ball screw transmission mechanism, synchronous belt transmission, electric push rod, electric cylinder, cam mechanism, cylinder mechanism or linear motor drive mechanism. Furthermore, the driving horizontal plane of the second linear drive mechanism 10 is higher than the driving horizontal plane of the first linear drive mechanism 7.

[0074] The fixed-point detector 102 can be a microscope.

[0075] Based on the above embodiment, a second gantry 614 is fixed on the micro platform 6, and a second linear drive mechanism 10 is fixed on the second gantry 614.

[0076] By employing this inspection device, inspection and camera capture at any spatial angle can be achieved in a single inspection process. During the inspection process, interaction between manual visual inspection and machine vision inspection can be realized, such as recording defects after visual observation using a camera. Simultaneously, the rotation axes of the R-axis drive mechanism 21, F-axis drive mechanism 22, and T-axis drive mechanism 24 can drive the wafer to achieve continuous 360° rotation, rather than -180° to 180°, resulting in a wider inspection range. The macroscopic inspection unit has the function of simultaneous bright-field and dark-field inspection; the microscopic inspection unit has the function of simultaneous front and back inspection; in addition, the macroscopic inspection unit and the microscopic inspection unit can also perform re-inspection independently.

[0077] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0078] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0079] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0080] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0081] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0082] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A macro- and micro-scale wafer defect detection device, characterized in that, include: The macroscopic inspection unit includes a macroscopic adjustment component (2), a macroscopic clamping component (3), a light source (4), and a macroscopic camera (5). The macroscopic adjustment component (2) includes a fixedly installed R-axis drive mechanism (21) and an F-axis drive mechanism (22) fixedly installed at the drive end of the R-axis drive mechanism (21). The axis of rotation of the R-axis drive mechanism (21) extends vertically, and the axis of rotation of the F-axis drive mechanism (22) extends horizontally. The macroscopic clamping component (3) is fixedly installed at the drive end of the F-axis drive mechanism (22) and is used to clamp the wafer (1). The microscopic detection unit includes a fixedly installed microscopic platform (6), a first linear drive mechanism (7) fixedly installed on the microscopic platform (6), a wafer adsorption mechanism (8) fixedly installed on the drive end of the first linear drive mechanism (7), and a bright and dark field detection mechanism (9) fixedly installed on the microscopic platform (6). The drive direction of the first linear drive mechanism (7) is horizontal. The wafer adsorption mechanism (8) is used to adsorb the wafer (1). The bright and dark field detection mechanism (9) is used to photograph the front and back sides of the wafer (1).

2. The macro- and micro-scale wafer defect detection device according to claim 1, characterized in that, The macro adjustment component (2) also includes a fixedly installed macro base plate (23), a fixedly installed T-axis drive mechanism (24), and a fixedly installed P-axis drive mechanism (25) at the drive end of the T-axis drive mechanism (24). The axis of rotation of the T-axis drive mechanism (24) extends vertically and the axis of rotation of the T-axis drive mechanism (24) extends horizontally. The R-axis drive mechanism (21) is fixedly installed at the drive end of the P-axis drive mechanism (25).

3. The macro- and micro-scale wafer defect detection device according to claim 1, characterized in that, The macro clamping assembly (3) includes a wafer base plate (31) fixedly installed on the drive end of the F-axis drive mechanism (22). The wafer base plate (31) has a macro adsorption groove (311). The macro adsorption groove (311) is used to connect to the negative pressure generator and is used to adsorb the edge end of the wafer (1).

4. The macro- and micro-scale wafer defect detection device according to claim 3, characterized in that, The macro clamping assembly (3) also includes a clamping motor (32) fixed to the wafer base plate (31), and the drive shaft of the clamping motor (32) is detachably connected to a pressure rod (33), which is used to press down the wafer (1).

5. The macro- and micro-scale wafer defect detection device according to claim 4, characterized in that, The drive shaft of the pressing motor (32) is fitted with a torsion spring (34), one end of which is fixed to the wafer base plate (31) and the other end is fixed to the pressure rod (33).

6. The macro- and micro-scale wafer defect detection device according to claim 3, characterized in that, The macroscopic adsorption tank (311) has an open structure at the top, and the wafer base plate (31) is fixed with a limiting stage (312) surrounding the macroscopic adsorption tank (311), the limiting stage (312) being used to abut against the radial side of the wafer (1).

7. The macro- and micro-scale wafer defect detection device according to claim 1, characterized in that, The light source (4) includes a macroscopic bright field light source (41) and a macroscopic dark field light source (42) that are both fixedly installed. The light from the macroscopic bright field light source (41) illuminates the wafer (1) at an angle of 60°-80° with the horizontal plane, and the light from the macroscopic dark field light source (42) illuminates the wafer (1) at an angle of 10°-30° with the horizontal plane.

8. The macro- and micro-scale wafer defect detection device according to claim 1, characterized in that, The wafer adsorption mechanism (8) includes a chuck base (81) and multiple adsorption corner blocks (82). The chuck base (81) has an open structure at the top and bottom and is fixed to the driving end of the first linear drive mechanism (7). Each adsorption corner block (82) is evenly distributed on the upper side of the chuck base (81) in a circumferential direction, and each adsorption corner block (82) is provided with a micro-adsorption groove (821). The micro-adsorption groove (821) is used to connect to the negative pressure generator and is used to adsorb the edge end of the wafer (1).

9. The macro- and micro-scale wafer defect detection device according to claim 1, characterized in that, The bright and dark field detection mechanism (9) includes a microscopic front bright field light source (91), a microscopic front dark field light source (92), a microscopic front imager (93), a microscopic back bright field light source (94), a microscopic back dark field light source (95), and a microscopic back imager (96), all of which are fixedly installed on the microscopic platform (6). The microscopic front bright field light source (91) and the microscopic front dark field light source (92) are used to illuminate the front side of the wafer (1). The microscopic front imager (93) is used to take pictures of the front side of the wafer (1). The microscopic back bright field light source (94) and the microscopic back dark field light source (95) are used to illuminate the back side of the wafer (1). The microscopic back imager (96) is used to take pictures of the back side of the wafer (1).

10. A macro- and micro-scale wafer defect detection device according to any one of claims 1-9, characterized in that, The microscopic detection unit further includes a second linear drive mechanism (10) fixedly installed on the microscopic platform (6), a third linear drive mechanism (101) fixedly installed on the drive end of the second linear drive mechanism (10), and a fixed-point detector (102) fixedly installed on the drive end of the third linear drive mechanism (101). The driving direction of the second linear drive mechanism (10) is horizontal and perpendicular to the driving direction of the first linear drive mechanism (7). The driving direction of the third linear drive mechanism (101) is vertical. The fixed-point detector (102) is used to photograph the front side of the wafer (1).

Images