A device for testing the heat dissipation performance of a heat-conductive adhesive

Abstract

The utility model relates to the technical field of heat conducting glue heat dissipation performance test, concretely relates to a device for testing heat conducting glue heat dissipation performance, including support frame, support frame bottom is equipped with constant temperature heating station, support frame top is equipped with the press, and the output of press is equipped with the compression assembly, and the bottom of compression assembly is connected with heat transfer assembly, and compression assembly contacts and compresses heat transfer assembly with constant temperature heating station under the pressure action of press, and heat transfer assembly includes heat conducting glue, and the upper surface of heat transfer assembly is equipped with the temperature acquisition appearance for gathering the upper surface temperature of heat transfer assembly, the device of the utility model simulates the heat transfer of heat conducting glue in electronic components, and the heat conducting glue heat dissipation performance is tested, thereby can verify the heat conducting glue monomer heat dissipation performance in advance, to assist research and development personnel to screen and select type.

Description

Technical Field

[0001] This utility model relates to the field of thermal conductive adhesive heat dissipation performance testing technology, specifically to a device for testing the heat dissipation performance of thermal conductive adhesive. Background Technology

[0002] With the rapid development of automobiles towards electrification and intelligence, extremely high demands are placed on the performance and heat dissipation of electronic components. In particular, the quality of heat dissipation directly affects the reliability and durability of parts. However, the heat dissipation capacity of electronic components is very limited, and in most cases, auxiliary heat dissipation is required. For example, thermally conductive adhesives, thermally conductive pads, and phase change thermal conductive films are used to transfer the heat generated by electronic components to the housing with cooling water circulation, so as to ensure that electronic components are not damaged by overheating and fail.

[0003] Thermal conductive adhesives are increasingly used in new energy products. However, there are many types of thermal conductive adhesives (different brands), and their thermal conductivity also varies (different thermal conductivity coefficients). Selecting the right thermal conductive adhesive during product development is very challenging. Therefore, a testing system that can verify the heat dissipation performance of individual thermal conductive adhesives in advance is needed to assist R&D personnel in screening and selection, and to avoid wasting development time and development costs due to improper selection of thermal conductive adhesives in subsequent DV / PV / road testing. Utility Model Content

[0004] To address the aforementioned technical issues, this invention provides a device for testing the heat dissipation performance of thermally conductive adhesives. This device can simulate the heat transfer of thermally conductive adhesives in electronic components and test the heat dissipation performance of the adhesives. This allows for early verification of the heat dissipation performance of individual thermally conductive adhesives, assisting R&D personnel in screening and selection. It also avoids wasting development time and costs due to improper selection of thermally conductive adhesives during subsequent DV / PV / road testing, thus saving time and costs.

[0005] This utility model is achieved through the following technical solution:

[0006] An apparatus for testing the heat dissipation performance of thermally conductive adhesive includes a support frame, a constant temperature heating platform at the bottom of the support frame, a press at the top of the support frame, a clamping component at the output end of the press, and a heat transfer component connected to the bottom end of the clamping component. Under the pressure of the press, the clamping component contacts and presses the heat transfer component with the constant temperature heating platform. The heat transfer component includes thermally conductive adhesive, and a temperature acquisition instrument for collecting the temperature of the upper surface of the heat transfer component is provided on the upper surface of the heat transfer component.

[0007] In a further preferred embodiment, the heat transfer assembly includes a printed circuit board, thermally conductive adhesive, and a thermally conductive block arranged sequentially from bottom to top. The thermally conductive adhesive is applied between the thermally conductive block and the printed circuit board, and the temperature acquisition device is attached to the upper surface of the thermally conductive block.

[0008] In a further preferred embodiment, a spring is provided between the bottom end of the pressing component and the heat-conducting block to provide continuous pressing force to the heat transfer component.

[0009] More preferably, the pressing assembly includes a connecting block connected to the output end of the press, the bottom end of the connecting block is provided with a plurality of connecting posts, the bottom end of each connecting post is provided with a pressing block, the bottom end of each pressing block is provided with a spring, and the bottom end of each pressing block is connected to a heat transfer assembly through the spring.

[0010] More preferably, the support frame has a support plate at the bottom, and the constant temperature heating table is mounted on the support plate.

[0011] The beneficial effects of this utility model are:

[0012] This invention relates to a device for testing the heat dissipation performance of thermally conductive adhesive. A constant-temperature heating stage serves as the heat source, simulating electronic components in actual applications. A heat transfer component simulates the heat transfer interface in actual applications. By pressing the component, the printed circuit board in the heat transfer component comes into contact with the constant-temperature heating stage, simulating the heat transfer of thermally conductive adhesive in electronic components. This allows for testing the heat dissipation performance of the thermally conductive adhesive, assisting R&D personnel in screening and selecting appropriate products. This avoids wasting development time and costs due to improper selection of thermally conductive adhesive during subsequent DV / PV / road testing, thus saving time and costs.

[0013] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the following detailed description to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of a device for testing the heat dissipation performance of thermally conductive adhesive according to the present invention.

[0016] 1-Support frame, 2-Support plate, 3-Constant temperature heating platform, 4-Temperature acquisition instrument, 5-Printed circuit board, 6-Thermal conductive adhesive, 7-Thermal conductive block, 8-Spring, 9-Connecting block, 10-Connecting column, 11-Pressure block. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0018] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0020] refer to Figure 1 A device for testing the heat dissipation performance of thermally conductive adhesive includes a support frame 1, a support plate 2 at the bottom of the support frame 1, and a constant-temperature heating stage 3 on the support plate 2. The constant-temperature heating stage 3 serves as a heat source, similar to electronic components in practical applications. The constant-temperature heating stage 3 is existing technology, employing electric heating tubes. It is available in both split and integrated structures. Core components include heating tubes, an aluminum / copper / iron-based work surface, and a PID microcomputer temperature control system with a temperature control accuracy of 0.2℃. The work surface is mirror-finished and fitted with a 1.5mm thick 304 stainless steel reflective layer to improve thermal efficiency. The enclosure uses a cold-rolled steel plate with a painted finish. Temperature control parameters are displayed in real-time via dual-row digital tubes and support physical button adjustment. During operation, contact with high-temperature components should be avoided.

[0021] A press (not shown in the figure) is installed on the top of the support frame 1. A press is a general term for a hydraulic press or oil press, typically using a hydraulic cylinder. Presses are classified as top-press or bottom-press based on the location of the main pressure cylinder. This device uses a bottom-press press, but a hydraulic cylinder can also be used instead. A clamping assembly is installed at the output end of the press, providing power to it. A heat transfer assembly is connected to the bottom of the clamping assembly, transferring heat from the constant-temperature heating platform 3. The heat transfer assembly acts as a heat transfer interface in practical applications.

[0022] A temperature acquisition unit 4, also known as a temperature acquisition and display unit, is installed on the upper surface of the heat transfer assembly. This device is used for temperature acquisition and display in industrial settings. Its core components include the DS18B20 intelligent integrated temperature sensor and an 89S52 microcontroller. The device measures 118mm × 35mm × 100mm and features a metal shielded housing to accommodate industrial installation requirements. Its RS485 communication interface is equipped with opto-isolation and ESD protection to ensure reliable signal transmission. The device can complete temperature conversion within 750 milliseconds, with a measurement range of -55℃ to +125℃, a programmable resolution of 9 to 12 bits, and an error range of ±0.5℃ (-10℃ to +85℃). The temperature acquisition unit 4 collects and displays the temperature after heat transfer from the constant-temperature heating platform 3 through the heat transfer assembly.

[0023] The heat transfer assembly includes a printed circuit board 5 (PCB), thermally conductive adhesive 6, and a thermally conductive block 7 arranged sequentially from bottom to top. The thermally conductive adhesive 6 is applied between the thermally conductive block 7 and the PCB, and its thickness is typically less than 1 mm, preferably 0.3-0.5 mm. A temperature sensor 4 is attached to the upper surface of the thermally conductive block 7 and is used to monitor the temperature rise of the thermally conductive block 7 in real time. Under the pressure of the press, the PCB 5 comes into contact with the constant temperature heating stage 3. The heat from the constant temperature heating stage 3 passes through the PCB 5, thermally conductive adhesive 6, and thermally conductive block 7, and is finally collected and displayed by the temperature sensor 4, thereby testing the heat transfer performance of the thermally conductive adhesive 6, i.e., evaluating the heat dissipation performance of the thermally conductive adhesive 6 in electronic components.

[0024] The clamping assembly is used to clamp the printed circuit board 5 and the constant temperature heating stage 3 to ensure reliable heat transfer. Preferably, a spring 8 is provided between the bottom end of the clamping assembly and the heat-conducting block 7 to output a continuous clamping force to the heat transfer assembly, so that the clamping assembly can apply pressure to the entire heat transfer assembly and make the printed circuit board 5 contact the constant temperature heating stage 3.

[0025] Preferably, the pressing assembly includes a connecting block 9 connected to the output end of the press. The bottom end of the connecting block 9 is provided with multiple connecting posts 10. The bottom end of each connecting post 10 is provided with a pressure block 11. The bottom end of each pressure block 11 is provided with a spring 8. The bottom end of each pressure block 11 is connected to a heat-conducting block 7 of a heat transfer assembly through the spring 8. That is, the same press can press down multiple pressure blocks 11 and heat transfer assemblies at the same time, and can simultaneously perform heat dissipation tests on the thermally conductive adhesive 6 in multiple heat transfer assemblies. For example, there are four connecting posts 10 and four pressure blocks 11 at the bottom end of the connecting block 9, and there are also four corresponding heat transfer assemblies. At this time, the device can simultaneously test four different types of thermally conductive adhesive 6. By comparing the slope of the temperature rise curve, the performance comparison of different thermally conductive adhesives 6 becomes more valuable.

[0026] The working principle of this utility model is as follows:

[0027] The constant-temperature heating stage 3 serves as a heat source, simulating electronic components in real-world applications. Once the heating stage 3 reaches and stabilizes at a specified temperature, the press compresses the clamping assembly, bringing the printed circuit board 5 in the heat transfer assembly into contact with the heating stage 3. The clamping assembly outputs continuous clamping force to ensure tight contact between the printed circuit board 5 and the heating stage 3. The heat transfer assembly simulates the heat transfer interface in real-world applications. After clamping, heat is rapidly transferred from the high temperature (heating stage 3) to the low temperature (heat transfer assembly), minimizing environmental influences when collecting temperature data. The temperature is then collected and displayed by the temperature acquisition instrument 4 to evaluate the heat transfer performance of different thermally conductive adhesives 6.

[0028] The above descriptions are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are knowledgeable of all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Therefore, those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in conjunction with their own capabilities. Typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. An apparatus for testing the heat dissipation performance of thermally conductive adhesive, characterized in that: The support frame (1) is provided with a constant temperature heating platform (3) at the bottom of the support frame (1) and a press at the top of the support frame (1). The output end of the press is provided with a pressing component and the bottom end of the pressing component is connected to a heat transfer component. Under the pressure of the press, the pressing component contacts and presses the heat transfer component with the constant temperature heating platform (3). The heat transfer component includes thermally conductive adhesive (6) and a temperature acquisition instrument (4) for collecting the temperature of the upper surface of the heat transfer component is provided on the upper surface of the heat transfer component.

2. The apparatus for testing the heat dissipation performance of thermally conductive adhesive according to claim 1, characterized in that: The heat transfer assembly includes a printed circuit board (5), thermally conductive adhesive (6) and a thermally conductive block (7) arranged sequentially from bottom to top. The thermally conductive adhesive (6) is applied between the thermally conductive block (7) and the printed circuit board (5), and the temperature acquisition instrument (4) is attached to the upper surface of the thermally conductive block (7).

3. The apparatus for testing the heat dissipation performance of thermally conductive adhesive according to claim 2, characterized in that: A spring (8) is provided between the bottom end of the pressing component and the heat-conducting block (7) to output a continuous pressing force to the heat transfer component.

4. The apparatus for testing the heat dissipation performance of thermally conductive adhesive according to claim 3, characterized in that: The pressing assembly includes a connecting block (9) connected to the output end of the press. The bottom end of the connecting block (9) is provided with a plurality of connecting posts (10). The bottom end of each connecting post (10) is provided with a pressing block (11). The bottom end of each pressing block (11) is provided with a spring (8). The bottom end of each pressing block (11) is connected to a heat transfer assembly through the spring (8).

5. The apparatus for testing the heat dissipation performance of thermally conductive adhesive according to claim 1, characterized in that: The support frame (1) has a support plate (2) at its bottom, and the constant temperature heating table (3) is installed on the support plate (2).

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