Semiconductor wafer double-side detection probe station
Patent Information
- Application Number
- CN202521929830.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-09
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2035-09-09
AI Technical Summary
[0003]在现有技术中,双面检测探针台可用于同步接触和测试晶圆正反两面的电性能,确保晶圆在切割前的电气特性符合要求,而工作人员在需要对晶圆进行检测时,会将晶圆放置在放料台后进行固定,再使用双面检测探针对晶圆进行检验,此方法虽然可以有效的对晶圆进行检验,传统的双面放料台大多采用镂空的设置,导致底部无法主动闭合,长期使用下,会导致灰尘、颗粒的侵入,使得清洁难度增加的同时,还可能会造成晶圆的污染,同时传统的双面放料台本身不方便进行转动,从而导致工作人员在对晶圆测试时,经常需要将晶圆测试、取出旋转、重新定位,此方法较为耗时,且还会在一定程度上降低工作效率
[0014]本实用新型通过启动伺服电机,并通过伺服电机的运作带动拨杆进行转动,而拨杆转动时,会带动空心环块同步转动,并通过空心环块与连接空心板的连接拉动移动块,而移动块因被连接杆所限位,只会以有限位效果的连接杆为圆心进行转动,从而解除移动块对放料台底部的关闭,并通过与放料台的连接使得放料台进行转动,从而实现了对放料台底部的开合,并通过空心环块的设计,可使得放料台具备一定的转动能力,使得工作人员在对晶源进行检测时,无需频繁的将晶源拿出并调换位置,而移动块还可主动闭合并对环形连接座的内部进行防护,使得灰尘不易进入环形连接座的内部,解决了传统的双面放料台大多采用镂空的设置,导致底部无法主动闭合,长期使用下,会导致灰尘、颗粒的侵入,使得清洁难度增加的同时,还可能会造成晶圆的污染,同时传统的双面放料台本身不方便进行转动,从而导致工作人员在对晶圆测试时,经常需要将晶圆测试、取出旋转、重新定位,此方法较为耗时,且还会再一定程度上降低工作效率的问题。
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Figure CN224921877U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor testing, specifically a double-sided testing probe station for semiconductor wafers. Background Technology
[0002] A semiconductor wafer double-sided inspection probe station is a key piece of equipment used for wafer-level electrical testing. Its core function is to measure electrical parameters such as resistance, current, and voltage on both sides of the wafer by having probes on both sides simultaneously contact the electrodes on the front and back sides of the wafer. It is mainly used in semiconductor manufacturing and R&D processes that require double-sided interconnection, such as 3D stacked chips, TSV (Through Silicon Via) technology, and advanced packaging, to ensure that the electrical performance of the wafer meets design standards before dicing.
[0003] In existing technologies, double-sided inspection probe stations can be used to simultaneously contact and test the electrical properties of both sides of a wafer, ensuring that the electrical characteristics of the wafer meet the requirements before dicing. When inspecting a wafer, the operator places it on a loading table for fixation and then uses the double-sided inspection probes to inspect it. While this method is effective for wafer inspection, traditional double-sided loading tables mostly use a perforated design, which prevents the bottom from closing actively. Over time, this leads to the intrusion of dust and particles, increasing the difficulty of cleaning and potentially causing wafer contamination. In addition, traditional double-sided loading tables are not easy to rotate, so operators often need to test, remove, rotate, and reposition the wafer during testing. This method is time-consuming and reduces work efficiency to some extent. Utility Model Content
[0004] To overcome the shortcomings of existing technologies, traditional double-sided loading stations mostly adopt a hollow design, which makes it impossible for the bottom to close actively. Over long-term use, this leads to the intrusion of dust and particles, increasing the difficulty of cleaning and potentially causing wafer contamination. In addition, traditional double-sided loading stations are not convenient to rotate, which means that when testing wafers, workers often need to test, remove, rotate, and reposition the wafers. This method is time-consuming and reduces work efficiency to some extent. This utility model proposes a semiconductor wafer double-sided inspection probe station.
[0005] The technical solution adopted by this utility model to solve its technical problem is: a semiconductor wafer double-sided inspection probe station, including a double-sided inspection probe station body, an inspection instrument fixedly connected to the top of the double-sided inspection probe station body, a worktable fixedly connected to the bottom of the double-sided inspection probe station body, lower probes fixedly connected to both sides of the worktable, a connecting plate fixedly connected to the top of each of the two lower probes, an upper probe fixedly connected to the top of the connecting plate, a test stage fixedly connected to the top of the worktable, and a rotating mechanism provided on the top of the test stage;
[0006] The rotating mechanism includes an annular connecting seat, the bottom of which is fixedly connected to the top of the test bench. A hollow ring block is rotatably connected to the inner cavity of the annular connecting seat. A slot is provided on one side of the annular connecting seat. A lever is fixedly connected to one side of the hollow ring block, and the surface of the lever is slidably connected to the inner cavity of the slot. A support ring block is fixedly connected to the inner cavity of the annular connecting seat. A movable block is provided on the top of the support ring block. A connecting rod is provided in the inner cavity of the hollow ring block. There are two connecting rods, one of which has its surface slidably connected to the movable block. The inner cavity of the block is fixedly connected, one end of one of the connecting rods is fixedly connected to the top of the support ring block, and the surface of the other connecting rod is rotatably connected to a connecting hollow plate. A hollow block is fixedly connected to the inner side of the hollow ring block, and a fixing rod is fixedly connected to the inner cavity of the hollow block. The inner cavity of the connecting hollow plate is rotatably connected to the surface of the fixing rod. A limit groove is formed on the surface of the hollow ring block. A limit rod is fixedly connected to the inner cavity of the annular connecting seat. The surface of the limit rod is slidably connected to the inner cavity of the limit groove. A material feeding assembly is provided on the top of the hollow ring block.
[0007] Preferably, the feeding assembly includes a connecting column, the bottom of which is movably connected to the top of the hollow ring block, and a feeding platform is fixedly connected to the top of the connecting column.
[0008] Preferably, a snap-fit rod is fixedly connected to the bottom of the connecting column, and a snap-fit hole is provided on the top of the hollow ring block. The surface of the snap-fit rod is movably snapped into the inner cavity of the snap-fit hole.
[0009] Preferably, a U-shaped block is fixedly connected to the top of the test platform, a servo motor is fixedly connected to one side of the U-shaped block, the output end of the servo motor passes through one side of the U-shaped block and is fixedly connected to a rotating rod, and a rotating plate is fixedly connected to the surface of the rotating rod, and two rotating plates are provided.
[0010] Preferably, a dustproof frame is movably connected to the top of the annular connecting seat, and a dustproof cover is fixedly connected to the inner side of the dustproof frame.
[0011] Preferably, a rubber pad is fixedly connected to one side of the feeding platform, and a support block is fixedly connected to the inner cavity of the annular connecting seat.
[0012] Preferably, a rubber plate is movably bonded to the inner cavity of the limiting groove, and extension plates are fixedly connected to both sides of the lever.
[0013] The advantages of this utility model are:
[0014] This invention utilizes a servo motor to drive a lever, which in turn rotates the hollow ring block. This rotation, in turn, causes the hollow ring block to rotate synchronously. The hollow ring block, connected to a hollow plate, pulls a moving block. Because the moving block is limited by a connecting rod, it rotates only around the limiting connecting rod, thus releasing the block from closing the bottom of the feeding platform. This connection with the feeding platform allows the platform to rotate, enabling the opening and closing of its bottom. The hollow ring block design also allows the feeding platform to rotate, eliminating the need for frequent adjustments during crystal source testing. The wafer source is removed and its position changed, while the moving block can also actively close and protect the inside of the annular connector, making it difficult for dust to enter the interior of the annular connector. This solves the problem that most traditional double-sided loading tables use a hollow design, which makes it impossible for the bottom to close actively. Over long-term use, this can lead to the intrusion of dust and particles, increasing the difficulty of cleaning and potentially causing wafer contamination. In addition, traditional double-sided loading tables are not convenient to rotate, which means that when testing wafers, staff often need to test, remove, rotate, and reposition the wafers. This method is time-consuming and can reduce work efficiency to some extent. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0017] Figure 2 This is a schematic diagram of the limiting rod and limiting groove of this utility model;
[0018] Figure 3 This is a structural schematic diagram of the dustproof frame and dustproof cover of this utility model;
[0019] Figure 4 This is a schematic diagram of the connecting column and the feeding platform of this utility model;
[0020] Figure 5 This is a schematic diagram of the structure of the annular connecting seat and the movable block of this utility model.
[0021] In the diagram: 1. Double-sided detection probe station body; 2. Upper probe; 3. Test stage; 4. Rotation mechanism; 401. Annular connecting seat; 402. Hollow ring block; 403. Lever; 404. Slot; 405. Support ring block; 406. Moving block; 407. Connecting rod; 408. Connecting hollow plate; 409. Limiting groove; 410. Limiting rod; 411. Fixing rod; 412. Feeding assembly; 4121. Connecting column; 4122. Feeding stage; 413. Hollow block; 5. Dustproof frame; 6. Dustproof cover; 7. Support block; 8. Rubber plate; 9. U-shaped block; 10. Servo motor; 11. Rotating rod; 12. Rotating plate; 13. Extension plate; 14. Snap-fit hole; 15. Snap-fit rod; 16. Rubber pad; 17. Lower probe; 18. Detector; 19. Worktable; 20. Connecting plate. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0023] The following is in conjunction with the appendix Figures 1-5 This application will be described in further detail.
[0024] This application discloses a semiconductor wafer double-sided inspection probe station. (Refer to...) Figure 1 and Figure 2 A semiconductor wafer double-sided inspection probe station includes a double-sided inspection probe station body 1. An inspection instrument 18 is fixedly connected to the top of the double-sided inspection probe station body 1. A worktable 19 is fixedly connected to the bottom of the double-sided inspection probe station body 1. Lower probes 17 are fixedly connected to both sides of the worktable 19. A connecting plate 20 is fixedly connected to the top of the two lower probes 17. An upper probe 2 is fixedly connected to the top of the connecting plate 20. A test stage 3 is fixedly connected to the top of the worktable 19. A rotating mechanism 4 is provided on the top of the test stage 3.
[0025] The rotating mechanism 4 includes an annular connecting seat 401, the bottom of which is fixedly connected to the top of the test bench 3. A hollow ring block 402 is rotatably connected to the inner cavity of the annular connecting seat 401. A slot 404 is provided on one side of the annular connecting seat 401. A lever 403 is fixedly connected to one side of the hollow ring block 402. The surface of the lever 403 is slidably connected to the inner cavity of the slot 404. A support ring block 405 is fixedly connected to the inner cavity of the annular connecting seat 401. A moving block 406 is provided on the top of the support ring block 405. A connecting rod 407 is provided in the inner cavity of the hollow ring block 402. There are two connecting rods 407, one of which has a surface that is connected to the moving block 406. The inner cavity of 06 is fixedly connected, one end of one connecting rod 407 is fixedly connected to the top of the support ring block 405, the surface of the other connecting rod 407 is rotatably connected to the connecting hollow plate 408, the inner side of the hollow ring block 402 is fixedly connected to the hollow block 413, the inner cavity of the hollow block 413 is fixedly connected to the fixing rod 411, the inner cavity of the connecting hollow plate 408 is rotatably connected to the surface of the fixing rod 411, the surface of the hollow ring block 402 is provided with a limiting groove 409, the inner cavity of the annular connecting seat 401 is fixedly connected to the limiting rod 410, the surface of the limiting rod 410 is slidably connected to the inner cavity of the limiting groove 409, and the top of the hollow ring block 402 is provided with a feeding assembly 412.
[0026] The double-sided inspection probe station body 1 can support the inspection instrument 18, which can be used for wafer marking and probe position calibration. At the same time, the double-sided inspection probe station body 1 is connected to the worktable 19, which can support the test stage 3. The lower probe 17 can inspect the lower part of the wafer, and one side of the lower probe 17 can provide a connection to the connecting plate 20. The connecting plate 20 is connected to the upper probe 2, which can inspect the upper part of the wafer. The test stage 3 provides a connection to the annular connecting seat 401 through the connection with the worktable 19. The annular connecting seat 401 is connected to the hollow ring block 402, and the hollow ring block 402 is connected to the lever 403. By opening a slot 404 on the surface of the annular connecting seat 401, the lever 403 can rotate inside the slot 404.
[0027] In addition, the operator can move the lever 403, causing the hollow ring block 402 to rotate at a certain angle. Simultaneously, the support ring block 405, connected to the annular connecting seat 401, provides support for the moving block 406. Multiple moving blocks 406 are provided, each with two connecting rods 407 connected to its surface. Each moving block 406 is connected to two connecting rods 407, and the two connecting rods 407 have different heights. The longer connecting rod 407 is connected to the connecting hollow plate 408. The number of hollow plates 408 is the same as that of the movable blocks 406. Another connecting rod 407 is connected to the support ring block 405 and serves to limit and connect the movable blocks 406. The hollow ring block 402 is connected to the hollow block 413. The fixing rod 411 provides a connection to the hollow plates 408 through its connection with the hollow block 413. At the same time, the annular connecting seat 401 is connected to the limiting rod 410. By opening a limiting groove 409 on the surface of the hollow ring block 402, the limiting rod 410 can be positioned within the inner cavity of the limiting groove 409. The sliding mechanism and the limiting groove 409 limit the rotation of the hollow ring block 402, so that when the operator moves the lever 403, the hollow ring block 402 will rotate. When the hollow ring block 402 rotates, it will pull the connecting hollow plate 408 and the connecting rod 407 to move through the hollow block 413, and drive the moving block 406 to rotate through the connecting rod 407. Since one side of the moving block 406 is limited by another shorter connecting rod 407, the moving block 406 will only rotate with the other connecting rod 407. 7 rotates around the center and is driven to the inner side of the hollow ring block 402 as the hollow ring block 402 rotates. When the hollow ring block 402 rotates to a certain angle, the limiting rod 410 will limit the limiting groove 409 and stop the hollow ring block 402 from rotating. In addition, the double-sided detection probe station body 1, upper probe 2, test stage 3, detector 18, worktable 19 and connecting plate 20 are all important components of the semiconductor wafer double-sided detection probe station and are existing technologies in this field, so they will not be described in detail.
[0028] Reference Figure 2 and Figure 4 The feeding assembly 412 includes a connecting post 4121. The bottom of the connecting post 4121 is movably connected to the top of the hollow ring block 402. The top of the connecting post 4121 is fixedly connected to the feeding platform 4122. The connecting post 4121 provides support for the feeding platform 4122 through its connection with the hollow ring block 402. Multiple connecting posts 4121 are provided, which can provide a relatively stable support effect for the feeding platform 4122. The operator can put the wafer into the feeding platform 4122 and inspect the wafer through the upper probe 2 and the lower probe 17.
[0029] Reference Figure 2 and Figure 4A snap-fit rod 15 is fixedly connected to the bottom of the connecting column 4121, and a snap-fit hole 14 is opened on the top of the hollow ring block 402. The surface of the snap-fit rod 15 is movably snapped into the inner cavity of the snap-fit hole 14. Multiple connecting columns 4121 are connected with snap-fit rods 15. By opening multiple snap-fit holes 14 on the top of the hollow ring block 402, the snap-fit rod 15 can be movably snapped into the snap-fit hole 14. The operator can disassemble the feeding platform 4122 by connecting the snap-fit rod 15 into the snap-fit hole 14, so that when the operator needs to maintain the feeding platform 4122, the feeding platform 4122 can be disassembled quickly and conveniently.
[0030] Reference Figure 1 and Figure 3 A U-shaped block 9 is fixedly connected to the top of the test bench 3. A servo motor 10 is fixedly connected to one side of the U-shaped block 9. The output end of the servo motor 10 passes through one side of the U-shaped block 9 and is fixedly connected to a rotating rod 11. A rotating plate 12 is fixedly connected to the surface of the rotating rod 11. There are two rotating plates 12. The U-shaped block 9 provides a mounting function for the servo motor 10 through its connection with the test bench 3, while the rotating rod 11 provides a connection function for the rotating plate 12 through its connection with the servo motor 10. The operator can start the servo motor 10, and the operation of the servo motor 10 drives the rotating rod 11 to rotate. When the rotating rod 11 rotates, it will drive the rotating plate 12 to rotate synchronously, and the rotating plate 12 will realize the automatic movement of the lever 403. This eliminates the need for the operator to manually move the lever 403 frequently and reduces the workload of the operator to a certain extent.
[0031] Reference Figure 1 and Figure 3 A dustproof frame 5 is movably connected to the top of the annular connecting seat 401, and a dustproof cover 6 is fixedly connected to the inner side of the dustproof frame 5. The dustproof frame 5 and the dustproof cover 6 are connected, and the size of the dustproof frame 5 is adapted to the size of the annular connecting seat 401. When the equipment is not in use, the staff can place the dustproof frame 5 on the top of the annular connecting seat 401 and protect the dust with the dustproof cover 6, so that the dust is not easy to enter the interior of the annular connecting seat 401, thereby reducing the cleaning frequency of the interior of the annular connecting seat 401.
[0032] Reference Figure 2 and Figure 4 A rubber pad 16 is fixedly connected to one side of the feeding platform 4122, and a support block 7 is fixedly connected to the inner cavity of the annular connecting seat 401. The feeding platform 4122 is connected to the rubber pad 16. When the operator puts the wafer into the feeding platform 4122, the bottom of the wafer will contact the rubber pad 16, which makes it difficult for the wafer to directly contact the bottom of the feeding platform 4122 and reduces the degree of wear on the wafer caused by the feeding platform 4122.
[0033] Reference Figure 1and Figure 4 A rubber plate 8 is movably bonded to the inner cavity of the limiting groove 409. Extension plates 13 are fixedly connected to both sides of the lever 403. The limiting groove 409 is connected to the rubber plate 8. When the hollow ring block 402 moves a certain distance, it will contact the limiting rod 410 and be stopped by the limiting rod 410, thus limiting its position. The rubber plate 8 can reduce the wear between the limiting rod 410 and the limiting groove 409 to a certain extent, thereby extending the service life of the limiting rod 410. At the same time, the lever 403 is connected to the extension plate 13. Through the extension plate 13, the rotating plate 12 can contact the extension plate 13 earlier when rotating, and the lever 403 can be rotated through the extension plate 13, which can shorten the time required for the servo motor 10 to drive the lever 403.
[0034] Working Principle: Before using this device, the operator needs to place the wafer to be inspected into the loading table 4122 and control the upper probe 2 and lower probe 17 to inspect the wafer. When it is necessary to open or close the bottom of the loading table 4122, the operator can start the servo motor 10, which drives the rotating rod 11 to rotate. When the rotating rod 11 rotates, it drives the rotating plate 12 to rotate synchronously, and the rotating plate 12 moves the lever 403. When the lever 403 is moved, it drives the hollow ring block 402 to rotate. When the hollow ring block 402 rotates, it pulls the connecting hollow plate 408 and the connecting rod 407 to move through the hollow block 413. At the same time, there are two connecting rods 407 with different lengths. When the connecting hollow plate 408 moves, it drives the moving block 406 to move through one of the connecting rods 407. One side of 6 is limited by another connecting rod 407, so the moving block 406 will only rotate around the other connecting rod 407 as the center, and will be driven to the inside of the hollow ring block 402 as the hollow ring block 402 rotates. When the hollow ring block 402 rotates to a certain angle, the limiting rod 410 will limit the limiting groove 409 and make the hollow ring block 402 stop rotating, thereby releasing the enclosure of the bottom loading platform by the moving block 406. At the same time, through the connection between the hollow ring block 402 and the connecting post 4121, the connecting post 4121 and the loading platform 4122 connected to the connecting post 4121 will rotate at a certain angle. When it is necessary to close the bottom of the loading platform 4122, the above steps can be reversed. Through the above steps, when the operator tests the wafer, there is no need to frequently manually take out the wafer and reposition it, which saves working time to a certain extent.
[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A semiconductor wafer double-sided inspection probe station, characterized in that: The device includes a double-sided detection probe station body (1), a detector (18) is fixedly connected to the top of the double-sided detection probe station body (1), a workbench (19) is fixedly connected to the bottom of the double-sided detection probe station body (1), lower probes (17) are fixedly connected to both sides of the workbench (19), a connecting plate (20) is fixedly connected to the top of the two lower probes (17), an upper probe (2) is fixedly connected to the top of the connecting plate (20), a test platform (3) is fixedly connected to the top of the workbench (19), and a rotating mechanism (4) is provided on the top of the test platform (3). The rotating mechanism (4) includes an annular connecting seat (401), the bottom of which is fixedly connected to the top of the test bench (3). A hollow ring block (402) is rotatably connected to the inner cavity of the annular connecting seat (401). A slot (404) is provided on one side of the annular connecting seat (401). A lever (403) is fixedly connected to one side of the hollow ring block (402). The surface of the lever (403) is slidably connected to the inner cavity of the slot (404). A support ring block (405) is fixedly connected to the inner cavity of the annular connecting seat (401). A moving block (406) is provided on the top of the support ring block (405). A connecting rod (407) is provided in the inner cavity of the hollow ring block (402). There are two connecting rods (407), one of which has a surface that is slidably connected to the moving block (406). The inner cavity of the moving block (406) is fixedly connected, one end of one of the connecting rods (407) is fixedly connected to the top of the support ring block (405), and the surface of the other connecting rod (407) is rotatably connected to a connecting hollow plate (408). The inner side of the hollow ring block (402) is fixedly connected to a hollow block (413), and the inner cavity of the hollow block (413) is fixedly connected to a fixing rod (411). The inner cavity of the connecting hollow plate (408) is rotatably connected to the surface of the fixing rod (411). A limiting groove (409) is opened on the surface of the hollow ring block (402). A limiting rod (410) is fixedly connected to the inner cavity of the annular connecting seat (401). The surface of the limiting rod (410) is slidably connected to the inner cavity of the limiting groove (409). A feeding assembly (412) is provided on the top of the hollow ring block (402).
2. The semiconductor wafer double-sided inspection probe station according to claim 1, characterized in that: The feeding assembly (412) includes a connecting column (4121), the bottom of which is movably connected to the top of the hollow ring block (402), and the top of which is fixedly connected to a feeding platform (4122).
3. The semiconductor wafer double-sided inspection probe station according to claim 2, characterized in that: The bottom of the connecting column (4121) is fixedly connected to a snap-fit rod (15), and the top of the hollow ring block (402) is provided with a snap-fit hole (14). The surface of the snap-fit rod (15) is movably snapped into the inner cavity of the snap-fit hole (14).
4. The semiconductor wafer double-sided inspection probe station according to claim 1, characterized in that: A U-shaped block (9) is fixedly connected to the top of the test bench (3). A servo motor (10) is fixedly connected to one side of the U-shaped block (9). The output end of the servo motor (10) passes through one side of the U-shaped block (9) and is fixedly connected to a rotating rod (11). A rotating plate (12) is fixedly connected to the surface of the rotating rod (11). There are two rotating plates (12).
5. The semiconductor wafer double-sided inspection probe station according to claim 3, characterized in that: A dustproof frame (5) is movably connected to the top of the annular connecting seat (401), and a dustproof cover (6) is fixedly connected to the inner side of the dustproof frame (5).
6. The semiconductor wafer double-sided inspection probe station according to claim 2, characterized in that: A rubber pad (16) is fixedly connected to one side of the feeding platform (4122), and a support block (7) is fixedly connected to the inner cavity of the annular connecting seat (401).
7. The semiconductor wafer double-sided inspection probe station according to claim 1, characterized in that: The inner cavity of the limiting groove (409) is movably bonded with a rubber plate (8), and both sides of the lever (403) are fixedly connected with extension plates (13).
