A multi-site chip testing fixture

CN224921896UActive Publication Date: 2026-10-30SHANGHAI WEIZHI INFORMATION TECH CO LTD
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Patent Information

Application Number
CN202522183950.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-16
Publication Date
2026-10-30
Estimated Expiration
2035-10-16

AI Technical Summary

Technical Problem

[0005]本实用新型的目的是为了解决传统多工位芯片测试夹具结构复杂、操作不便、芯片易损坏、传动精度低等问题,而提出的一种多工位芯片测试夹具

Benefits of technology

[0016]有益效果:本实用新型中,所述一种多工位芯片测试夹具,通过夹持机构,可在将集成电路芯片放置在连接插槽板上后,可通过启动动力机构带动桥架向靠近集成电路芯片的一侧进行翻转,即可利用压紧板对集成电路芯片进行定位夹持,使集成电路芯片与连接插槽板稳定的接电配合;

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of multi-station chip test fixture, belong to chip detection technical field, it aims at solving the problems, such as complex structure, inconvenient operation, chip is easily damaged, low transmission accuracy of traditional multi-station chip test fixture, the fixture is turned over by electromagnet drive bridge, realizes chip fast positioning clamping and stable power connection using compression plate;After detection is completed, stretch spring drives push rod and automatically ejects chip, multi-station design can detect multiple chips simultaneously, improve test efficiency, the utility model is driven by repulsion of electromagnet I and electromagnet II, elastic reset of stretch spring I to III, and transmission structure of lever and sliding guide plate, realize the fast clamping and ejection of chip, improve test accuracy and stability.
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Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a multi-station chip testing fixture. Background Technology

[0002] In the manufacturing process of integrated circuit chips, chip testing is a crucial step, ensuring that the chip's performance and quality meet design requirements. Multi-station chip test fixtures, as key equipment in chip testing, primarily provide a stable testing environment for the chip, ensuring a reliable electrical connection between the chip and the testing equipment, thereby enabling comprehensive and accurate performance testing of the chip.

[0003] Traditional multi-station chip testing fixtures suffer from numerous problems in their design and use. On one hand, in terms of chip clamping and positioning, existing fixtures are complex in structure and inconvenient to operate, making it difficult to quickly and accurately fix the chip in the testing position, resulting in low testing efficiency. Furthermore, some fixtures apply uneven pressure to the chip during clamping, easily causing chip damage and affecting chip yield. On the other hand, the chip removal process after testing is also cumbersome. Some fixtures lack effective ejection mechanisms, requiring manual removal of the chip, which not only increases the operator's workload but also easily damages the chip or the fixture due to improper operation. In addition, traditional fixtures often use mechanical transmission structures for power drive, which suffers from low transmission accuracy, slow response speed, and easy wear, affecting the overall performance and stability of the fixture.

[0004] With the continuous development of integrated circuit chip technology, chips are becoming increasingly integrated and smaller in size, placing higher demands on the accuracy, stability, and reliability of test fixtures. Therefore, developing a new type of multi-station chip test fixture to solve the problems existing in the current technology and improve the efficiency and quality of chip testing is of great practical significance. Utility Model Content

[0005] The purpose of this utility model is to solve the problems of complex structure, inconvenient operation, easy chip damage, and low transmission accuracy of traditional multi-station chip testing fixtures, and to propose a multi-station chip testing fixture.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A multi-station chip testing fixture includes a fixture base, the top of which has a placement hole, and further includes: A connection slot plate is fixedly installed on the top inner wall of the fixture base and corresponds to the placement hole. The connection slot plate is used to accommodate the integrated circuit chip to be tested and form an electrical connection with it. Two clamping mechanisms are symmetrically arranged on both sides of the top of the clamping base. The clamping mechanisms are used to clamp and position the integrated circuit chip housed in the connection slot plate. An ejection mechanism is provided in the fixture base. The top of the ejection mechanism acts on the connection slot plate and the integrated circuit chip to eject the integrated circuit chip after the test is completed. Additionally, a power mechanism is installed on both sides of the top of the clamp base, the power mechanism being connected to the corresponding clamping mechanism for driving the clamping mechanism to perform clamping or releasing actions.

[0007] In one possible design, the clamping mechanism includes a bridge rotatably connected to the top of the clamp base, the bridge being fixedly mounted with a pressure plate, the bottom of the pressure plate extending into the placement hole; the power mechanism drives the bridge to rotate, causing the pressure plate to press or release the corners of the integrated circuit chip, thereby achieving positioning, clamping, and stable electrical connection.

[0008] In one possible design, the ejection mechanism includes a connecting bracket II disposed within the clamp base. Multiple push rods II are symmetrically fixedly mounted on the top of the connecting bracket II. The top ends of the push rods II extend into the connecting slot plate and slide against its inner wall. A tension spring II is sleeved on each push rod II, with its two ends connected to the bottom of the connecting slot plate and the top of the connecting bracket II, respectively. When the chip is inserted, the push rods II are pressed down to store energy. After the clamping is released, the tension springs II release energy to drive the push rods II to eject the chip.

[0009] In one possible design, ball-head pressure rods are fixedly installed on both sides of the push rod II, and the top of the ball-head pressure rods extends above the clamp base and engages with the bridge frame in a transmission manner; when the bridge frame flips down to press the chip, it drives the ball-head pressure rods and push rod II to move downward, further compressing the spring energy and assisting in increasing the push-out force.

[0010] In one possible design, the power mechanism includes a support bracket fixedly mounted on the top of the clamp base, a limit box fixedly mounted on the support bracket, a push rod I slidably connected inside the limit box, the top end of the push rod I extending above the limit box and fixedly mounted on a connecting bracket I, the connecting bracket I having a stop shaft; a support plate fixedly mounted on the top of the support bracket, a lever rotatably connected to the support plate, the lever having a transmission hole, the stop shaft passing through the transmission hole; one end of the lever being connected to the bridge frame via a transmission assembly; and a thrust assembly for driving the push rod I to rise and fall is provided on the bottom inner wall of the limit box.

[0011] In one possible design, the transmission assembly includes a sliding guide plate rotatably connected to one end of the lever, and a linear slide rail is fixedly mounted on the top of the bridge frame. The sliding guide plate and the linear slide rail form a sliding pair. When the lever rotates, the rotational motion is converted into the flipping motion of the bridge frame through the cooperation of the sliding guide plate and the linear slide rail.

[0012] In one possible design, the thrust assembly includes an electromagnet I fixedly installed on the inner wall of the bottom of the limiting box and an electromagnet II fixedly installed on the bottom end of the push rod I. The polarities of the opposite surfaces of the electromagnet I and the electromagnet II are the same. When energized, a repulsive force is generated to push the push rod I upward, driving the clamping action. When de-energized, the repulsive force disappears, and the clamping is released.

[0013] In one possible design, a tension spring I is fitted onto the push rod I, with both ends of the tension spring I connected to the top of the push rod I and the top of the limiting box, respectively; after power failure, the restoring force of the tension spring I assists the push rod I in resetting, ensuring that the clamping mechanism is reliably released.

[0014] In one possible design, a test bench is also included, with multiple fixture bases fixedly installed at equal intervals on the top of the test bench to form multiple testing stations, thereby improving chip testing efficiency.

[0015] In this application, during use, the integrated circuit chip is placed in the connection slot plate corresponding to the placement hole on the top of the fixture base, so that the four sides of the integrated circuit chip are in contact with the inner walls of the four sides of the connection slot plate and the top extends to the top of the fixture base and makes electrical contact with the connection slot plate. At this time, the integrated circuit chip will press down the push rod II, causing the push rod II to move the connection bracket II downward, and the tension springs II and III are stretched. Then, the power mechanism is activated. The limit box has a built-in shielding structure to prevent the magnetic force from spreading outward. Electromagnets I and II are energized and generate a repulsive force, pushing the push rod I upward, stretching the tension spring I. The push rod I drives the stop shaft on the connection bracket I to move upward. With the cooperation of the stop shaft and the transmission hole on the lever, the lever rotates around the support plate. One end of the lever drives the sliding guide plate to make an arc motion. The sliding guide plate slides on the linear slide rail, thereby causing the bridge to flip towards the side closer to the integrated circuit chip. The bottom of the clamping plate on the bridge extends into the placement hole to position and clamp the corners of the integrated circuit chip. The system ensures stable power connection between the integrated circuit chip and the connector slot board. The connector slot board is connected to an external chip testing instrument, specifically an SOC tester, via signal wires. Simultaneously, during the bridge's rotation, the ball joint pressure rod moves downwards, further driving the push rod II downwards. The integrated circuit chip can then be tested. After testing, electromagnets I and II are de-energized, eliminating the repulsive force. Tension spring I pulls push rod I downwards, causing the lever to rotate in the opposite direction. The lever, via a sliding guide plate and linear slide rail, drives the bridge to rotate upwards, releasing the positioning clamp on the integrated circuit chip. At this point, tension springs II and III, under stress, drive push rod II upwards. The four push rods II push the integrated circuit chip from the connector slot board to above the fixture base. Since multiple fixture bases are installed at equal intervals on the top of the test bench, multiple testing stations are formed, allowing for simultaneous operation on multiple integrated circuit chips, improving testing efficiency.

[0016] Beneficial effects: In this utility model, the multi-station chip testing fixture, through the clamping mechanism, can, after the integrated circuit chip is placed on the connection slot plate, drive the bridge to flip towards the side closer to the integrated circuit chip by starting the power mechanism, so that the integrated circuit chip can be positioned and clamped by the clamping plate, so that the integrated circuit chip and the connection slot plate can be stably connected and electrically engaged. In this utility model, the multi-station chip testing fixture can place an integrated circuit chip in a connecting slot plate through an ejection mechanism, and use two clamping plates to clamp the integrated circuit chip, thereby causing the four push rods II to move downward, which will stretch the tension springs II. After the integrated circuit chip is tested, by releasing the clamping and positioning of the integrated circuit chip, the tension springs II, which are under force, can drive the push rods II to move upward, thereby pushing the integrated circuit chip out of the connecting slot plate through the four connecting brackets II. In this utility model, the multi-station chip testing fixture, through a power mechanism, can drive the push rod I to move upward by activating the push assembly. At this time, under the action of the stop shaft and the transmission hole, it can drive the lever to rotate. When the lever rotates, under the transmission action of the transmission assembly, it can drive the bridge to rotate, thereby facilitating the positioning and clamping or releasing of the integrated circuit chip. This invention solves many problems of traditional clamps by using an electromagnet to drive the chip for rapid positioning, clamping, and stable power connection, thereby improving testing accuracy. After testing, the chip is automatically ejected by a spring, reducing labor intensity. The multi-station design allows for the simultaneous testing of multiple chips, effectively improving testing efficiency and quality, and enhancing stability. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the fixture and integrated circuit chip clamping structure of a multi-station chip testing fixture proposed in this utility model. Figure 2 This is a three-dimensional structural schematic diagram of a multi-station chip testing fixture proposed in this utility model; Figure 3 This is a three-dimensional cross-sectional view of a multi-station chip testing fixture proposed in this utility model. Figure 4 This is a three-dimensional top-view structural diagram of a multi-station chip testing fixture proposed in this utility model. Figure 5 This is a three-dimensional schematic diagram of the structure of a multi-station chip testing fixture proposed in this utility model, in which multiple fixtures are mounted on a test bench.

[0018] In the diagram: 1. Fixture base; 2. Connecting slot plate; 3. Cable tray; 4. Pressure plate; 5. Integrated circuit chip; 6. Support plate; 7. Lever; 8. Sliding guide plate; 9. Linear slide rail; 10. Bearing bracket; 11. Limiting box; 12. Push rod I; 13. Connecting bracket I; 14. Tension spring I; 15. Electromagnet I; 16. Electromagnet II; 17. Push rod II; 18. Connecting bracket II; 19. Tension spring II; 20. Ball head pressure rod; 21. Tension spring III; 22. Test table. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] In one embodiment: Refer to Figure 1-5A fixture includes a test platform 22, on the top of which multiple fixture bases 1 are fixedly mounted at equal intervals, forming multiple testing stations to improve testing efficiency. Each fixture base 1 adopts a shell structure, with a rectangular placement hole on its top inner wall. A rectangular connecting slot plate 2 is fixedly mounted directly below the placement hole. The connecting slot plate 2 has conductive contacts inside that match the pins of an integrated circuit chip 5. When the integrated circuit chip 5 is placed, its four sides are in complete contact with the four inner walls of the connecting slot plate 2, and the top of the chip extends above the fixture base 1 to achieve electrical connection.

[0021] Each fixture base 1 has an ejection mechanism inside, which consists of a connecting bracket II 18, four push rods II 17, a tension spring II 19, a ball-head pressure rod 20, and a tension spring III 21. The connecting bracket II 18 is horizontally arranged inside the fixture base 1, and four push rods II 17 are vertically fixed to its top. The push rods II 17 pass upward through the guide holes at the bottom of the connecting slot plate 2 and slide in the guide holes. The two ends of the tension spring II 19 are connected to the bottom of the connecting slot plate 2 and the top of the connecting bracket II 18 by hooks, respectively, and are in the initial tension state. Ball-head pressure rods 20 are horizontally welded to both sides of each push rod II 17. The top of the ball-head pressure rod 20 passes through the top of the fixture base 1 and extends to the outside, and its ball head contacts the bottom of the bridge 3 to form a transmission engagement. The two ends of the tension spring III 21 are connected to the inner wall of the top of the fixture base 1 and the top of the push rod II 17, respectively, and are kept in the initial tension state. When the integrated circuit chip 5 is placed into the connection slot plate 2, the chip's own weight presses the push rod II 17 downward by 1.5 mm, increasing the tension of the tension spring II 19 to 3 mm. At the same time, the ball head pressure rod 20 descends synchronously with the push rod II 17.

[0022] The clamping mechanism includes two symmetrically arranged bridges 3, each of which is connected to the top two sides of the clamp base 1 via a pivot, forming a flip-up structure. An L-shaped pressure plate 4 is welded to the inner side of the bridge 3. The bottom of the pressure plate 4 has a rubber buffer layer, with its vertical section extending into the placement hole and its horizontal section forming surface contact with the corner of the integrated circuit chip 5. When the bridge 3 is flipped downwards at 45 degrees, the pressure plate 4 applies a vertical pressure of 5 Newtons to the chip, ensuring reliable contact between the chip pins and the internal contacts of the connection slot plate 2.

[0023] The power mechanism consists of a support bracket 10, a limiting box 11, a push rod I 12, a connecting bracket I 13, a lever 7, and a transmission assembly. The support bracket 10 is vertically fixed to the side of the fixture base 1, and a rectangular limiting box 11 is installed on its top. The push rod I 12 passes through the guide hole at the top of the limiting box 11 and slides with it, and its top end is connected to the connecting bracket I 13. A 5 mm diameter stop shaft is horizontally installed inside the connecting bracket I 13. The middle part of the lever 7 is connected to the support plate 6 through a rotating shaft. The support plate 6 is fixed to the side wall of the fixture base 1. One end of the lever 7 has an elongated transmission hole, and the stop shaft is embedded in the transmission hole to form a transmission engagement. The other end of the lever 7 is connected to the transmission assembly. The transmission assembly includes a sliding guide plate 8 and a linear slide rail 9. The sliding guide plate 8 is connected to the end of the lever 7 through a rotating shaft. The linear slide rail 9 is horizontally fixed to the top of the bridge frame 3, and the sliding guide plate 8 and the linear slide rail 9 form a sliding engagement.

[0024] This application can be used in the field of chip testing technology, or in other fields applicable to this application.

[0025] In another embodiment: Reference Figure 3 Based on the above embodiments, an improvement is made: a multi-station chip testing fixture, applied to the field of chip testing technology, wherein the thrust assembly adopts an electromagnetic drive structure, electromagnet I15 is fixed to the bottom of the limiting box 11, and electromagnet II16 is fixed to the bottom end of the push rod I12, with their opposite surfaces set to the same pole, for example, both being N poles or both being S poles. When electromagnets I15 and II16 are energized, an 8-Newton repulsive force is generated to push the push rod I12 upward. During the upward movement of the push rod I12, the tension spring I14 is stretched. The tension spring I14 is sleeved on the outside of the push rod I12. When its stretch reaches 4 mm, the lever 7 rotates 15 degrees around the midpoint, and the bridge 3 is flipped downward through the cooperation of the sliding guide plate 8 and the linear slide rail 9. When the power is off, the restoring force of the tension spring I14 is 6 Newtons, pulling the push rod I12 downward, and the lever 7 rotates in the opposite direction to flip the bridge 3 upward and reset it.

[0026] However, as is well known to those skilled in the art, the working principles and wiring methods of the connecting slot board 2, integrated circuit chip 5, electromagnet I 15 and electromagnet II 16 are conventional means or common knowledge, and will not be described in detail here. Those skilled in the art can make any selections according to their needs or convenience.

[0027] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A multi-station chip testing fixture, comprising a fixture base (1), wherein the top of the fixture base (1) has a placement hole, characterized in that, Also includes: A connecting slot plate (2) is fixedly installed on the top inner wall of the fixture base (1) and corresponds to the placement hole. The connecting slot plate (2) is used to accommodate the integrated circuit chip (5) to be tested and to form an electrical connection with it. Two clamping mechanisms are symmetrically arranged on both sides of the top of the clamping base (1). The clamping mechanisms are used to clamp and position the integrated circuit chip (5) housed in the connecting slot plate (2). An ejection mechanism is provided in the fixture base (1). The top of the ejection mechanism acts on the connection slot plate (2) and the integrated circuit chip (5) to eject the integrated circuit chip (5) after the test is completed. In addition, a power mechanism is installed on both sides of the top of the clamp base (1), the power mechanism is connected to the corresponding clamping mechanism for driving the clamping mechanism to perform clamping or releasing actions.

2. The multi-station chip testing fixture according to claim 1, characterized in that, The clamping mechanism includes a bridge (3) rotatably connected to the top of the clamp base (1), and a pressure plate (4) is fixedly installed on the bridge (3). The bottom of the pressure plate (4) extends into the placement hole. The power mechanism drives the bridge (3) to flip, thereby causing the pressure plate (4) to press or release the corners of the integrated circuit chip (5) to achieve positioning, clamping and stable electrical connection.

3. The multi-station chip testing fixture according to claim 2, characterized in that, The ejection mechanism includes a connecting bracket II (18) disposed in the clamp base (1). Multiple push rods II (17) are symmetrically fixedly installed on the top of the connecting bracket II (18). The top end of the push rod II (17) extends into the connecting slot plate (2) and slides with the inner wall. A tension spring II (19) is sleeved on the push rod II (17). The two ends of the tension spring II (19) are respectively connected to the bottom of the connecting slot plate (2) and the top of the connecting bracket II (18). When the chip is inserted, the push rod II (17) is pressed down to store energy. After the clamp is released, the tension spring II (19) releases energy to drive the push rod II (17) to eject the chip.

4. The multi-station chip testing fixture according to claim 3, characterized in that, Ball-head pressure rods (20) are fixedly installed on both sides of the push rod II (17). The top of the ball-head pressure rod (20) extends above the clamp base (1) and is in transmission cooperation with the bridge frame (3). When the bridge frame (3) flips down to press the chip, it drives the ball-head pressure rod (20) and the push rod II (17) to move downward, further compressing the spring to store energy and assisting in increasing the push force.

5. The multi-station chip testing fixture according to claim 2, characterized in that, The power mechanism includes a support bracket (10) fixedly installed on the top of the clamp base (1), a limit box (11) fixedly installed on the support bracket (10), a push rod I (12) slidably connected inside the limit box (11), the top end of the push rod I (12) extends above the limit box (11) and a connecting bracket I (13) is fixedly installed thereon, the connecting bracket I (13) is provided with a stop shaft; a support plate (6) is fixedly installed on the top of the support bracket (10), a lever (7) is rotatably connected on the support plate (6), the lever (7) is provided with a transmission hole, the stop shaft passes through the transmission hole; one end of the lever (7) is connected to the bridge frame (3) through a transmission assembly; a thrust assembly for driving the push rod I (12) to rise and fall is provided on the bottom inner wall of the limit box (11).

6. The multi-station chip testing fixture according to claim 5, characterized in that, The transmission assembly includes a sliding guide plate (8) rotatably connected to one end of the lever (7), and a linear slide rail (9) is fixedly installed on the top of the bridge frame (3). The sliding guide plate (8) and the linear slide rail (9) form a sliding pair. When the lever (7) rotates, the rotational motion is converted into the flipping motion of the bridge frame (3) through the cooperation of the sliding guide plate (8) and the linear slide rail (9).

7. The multi-station chip testing fixture according to claim 5, characterized in that, The thrust assembly includes an electromagnet I (15) fixedly installed on the inner wall of the bottom of the limiting box (11) and an electromagnet II (16) fixedly installed on the bottom end of the push rod I (12). The polarities of the opposite surfaces of the electromagnet I (15) and the electromagnet II (16) are the same. When energized, a repulsive force is generated to push the push rod I (12) upward, driving the clamping action. When the power is cut off, the repulsive force disappears and the clamping is released.

8. The multi-station chip testing fixture according to claim 7, characterized in that, A tension spring I (14) is sleeved on the push rod I (12). The two ends of the tension spring I (14) are respectively connected to the top of the push rod I (12) and the top of the limiting box (11). After the power is cut off, the restoring force of the tension spring I (14) assists the push rod I (12) to reset, ensuring that the clamping mechanism can be reliably released.

9. The multi-station chip testing fixture according to any one of claims 1-8, characterized in that, It also includes a test bench (22), and multiple fixture bases (1) are fixedly installed at equal intervals on the top of the test bench (22) to form a multi-inspection station.