A test probe station probe card test dotting device

Abstract

The application discloses a CP test probe station probe card test dotting device and relates to the field of semiconductors, which comprises the following parts: a test substrate connected to a fixing part and located above a wafer; the test substrate is provided with a needle card opening, a test needle is arranged at the needle card opening, and the test needle is used for testing a plurality of core particles on the wafer; a dotting device is arranged on the test substrate and located at the rear of the test needle, and the dotting device and the test needle act on different core particles respectively. The dotting device is modularized in the test and dotting, simplifies the test work, can simultaneously complete the test and ink dotting operation, improves equipment utilization, and improves work efficiency.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, and particularly relates to a CP test probe station probe card test marking device. Background Technology

[0002] Currently, in the semiconductor manufacturing field, during chip CP testing, defective chips require ink dotting to mark them. However, in existing technologies, this operation must be performed after testing, necessitating secondary assembly. This process involves removing the probe card, installing the ink dotting mechanism, and then adjusting the ink dot position. This has the following disadvantages: Low operating efficiency: It requires manual replacement of special clamps according to the size of the goods, and each replacement takes 20-40 minutes. In addition, the position of the grinding needle needs to be manually calibrated, making the operation process cumbersome. High cost: Specialized fixtures need to be designed and manufactured separately, with a single set costing 9,000-15,000 yuan. The configuration of multiple specifications of fixtures increases the overall cost of the equipment by more than 10%. The aforementioned defects limit the applicability of existing probe stations, making it difficult to meet the development needs of the testing industry for high efficiency, low cost, and low loss. Therefore, there is an urgent need for a simple installation combination solution. Based on the above reasons, this utility model designs a CP test probe station probe card test marking device. Summary of the Invention

[0003] The purpose of this invention is to solve the problems in the prior art, and to propose a CP test probe station probe card test marking device.

[0004] A CP test probe station and test marking device includes the following parts: A test substrate, which is connected to a fixing portion and located above the wafer; The test substrate has a pin slot, and a test pin is provided at the pin slot for testing multiple chips on the wafer. The needle holder opening is located behind the test needle and is equipped with a dotting device mounted on the test substrate. The dotting device and the test needle act on different core particles respectively.

[0005] In the aforementioned device, the wafer moves via a worktable on a platform, the worktable having a built-in drive mechanism that enables it to move along the XYZ axes.

[0006] In the above-mentioned device, the fixing part includes a fixing column, which is welded to the platform. The top of the fixing column has a slot that mates with the test substrate. The bottom of the test substrate is connected to a support, which is fixed to the test substrate and the fixing column by multiple bolts respectively.

[0007] In the above-described device, the dotting device includes an ink sac located on the rear side and a dotting needle located on the front side. The dotting needle is mounted on the ink sac, and the ink sac is connected to a fixed platform via an outer annular sleeve. The fixed platform is mounted on the test substrate by bolts.

[0008] In the above-described device, the annular sleeve is rotatably connected to the fixed part via a rotating shaft, and the rotating shaft is connected to the rotating assembly.

[0009] In the above-described device, the test probes comprise at least two sets.

[0010] In the above-described device, the rotating assembly includes a servo motor.

[0011] The beneficial effects of this invention are as follows: This invention integrates the ink dotting device onto the test substrate, effectively combining the two working methods of testing and ink dotting. Ink dotting can be performed without removing the probe card, ensuring the convenience of subsequent operations. At the same time, testing and ink dotting operations can be completed simultaneously. Through mechanism improvement, the device is modularized, reducing debugging time and facilitating the loading and unloading of components. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of a CP test probe station probe card test marking device disclosed in this invention.

[0013] Figure 2 This is a front view of a CP test probe station probe card test marking device disclosed in this invention.

[0014] Figure 3 This is a top view of a CP test probe station probe card test marking device disclosed in this invention.

[0015] Figure 4 for Figure 3 An enlarged schematic diagram of part A in the middle.

[0016] In the figure: 1 Test substrate, 2 Fixing part, 21 Fixing post, 22 Card slot, 23 Support, 3 Wafer, 4 Pin opening, 5 Dotting device, 51 Ink sac, 52 Dotting pin, 53 Ring sleeve, 54 Rotating shaft, 6 Platform, 7 Worktable, 8 Test pin, 9 Fixing stage. Detailed Implementation

[0017] To facilitate understanding of this application and to make the aforementioned objectives, features, and advantages of this application more apparent, a detailed description of specific embodiments of this application is provided below in conjunction with the accompanying drawings. Numerous specific details are set forth in the following description to provide a thorough understanding of this application, and preferred embodiments are shown in the accompanying drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application. This application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application; therefore, this application is not limited to the specific embodiments disclosed below. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. In the description of this application, "several" means at least one, such as one, two, etc., unless otherwise explicitly specified. It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is only for describing particular implementations and is not intended to limit the scope of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0018] Reference Figures 1-4 This utility model provides a CP test probe station probe card test marking device, including a test substrate 1, wherein the test substrate 1 is provided with test pins 8 for testing core particles. There are generally two test pins 8, which are arranged on both sides. The testing principle is that when a core particle moves between two test pins 8, the circuit formed by the two test pins 8 can be tested by energizing it. If it is in a conductive state, the current core particle is of good quality and usable. If the circuit is in an open state, the core particle is not conductive and may have a problem, so it needs to be marked with ink dots.

[0019] Wherein the test substrate 1 is disposed directly above the wafer 3 via the fixing part 2. The test substrate 1 is provided with a probe card opening 4, in which test probes 8 are arranged for testing the dies on the wafer 3. Behind the probe card opening 4, a dotting device 5 for applying ink dots is arranged, which is characterized in that the dotting device 5 and the test probes 8 are respectively used for dies at different positions, preferably two dies adjacent to each other in the front-back direction. The advantage of this arrangement is that when the wafer 3 is moved for testing, after it is detected that the current die needs to be marked, the current die automatically moves into the action area of the dotting device 5 while the die behind is being tested, so that the functions of dotting and testing can be realized simultaneously, and the working efficiency is improved.

[0020] Wherein the wafer 3 can be mounted on the platform 6 via the worktable 7 to realize movement. The worktable 7 is preferably a worktable capable of XYZ three-axis movement, which has the advantages that the testing of different dies can be realized through movement on the X-axis and Y-axis, and the mode switching of making a die enter testing or exit testing can be realized through movement on the Y-axis. The above operations can be realized through movement in the vertical direction, wherein moving up can make the die currently facing the test probes 8 enter the testing state, and moving down can stop the testing.

[0021] Further, the test substrate 1 can be fixed by fixing posts 21. For the convenience of assembly, the fixing posts 21 may be provided with clamping grooves 22 matching with the test substrate 1, so that the test substrate 1 can be inserted into the clamping grooves 22 in advance, and then the supports 23 for connecting the test substrate 1 and the fixing posts 21 are installed. Wherein, the test substrate 1 and the fixing posts 21 can be pre-drilled with holes that match the holes arranged in the supports 23, and are fixed by bolts, so as to improve the connection stability of the test substrate 1. Moreover, for the stability of testing and to avoid trajectory overlap between the worktable 7 and the fixing posts 21, the fixing posts 21 are arranged on the side far away from the probe card opening 4, or the fixing posts 21 are shaped as "H" or "∩", which can effectively avoid the above problems.

[0022] The dotting device 5 includes an ink sac 51 and a dotting needle 52. The ink sac 51 stores ink, while the dotting needle 52 has a needle-like structure. The end position of the dotting needle 52 can be adjusted according to the gap between multiple crystals and the distance between it and the test needle 8. This ensures that when the test needle 8 is testing the current crystal, the dotting needle 52 can act on the previous crystal. Thus, if a crystal has a problem, the ink dotting and testing of the next crystal can be performed simultaneously. The ink sac 51 can be assembled by connecting it to the annular sleeve 53 in the fixed part 2. The operator only needs to insert the ink sac 51 into the annular sleeve to complete the assembly. Therefore, the ink sac 51 itself can also be designed with a limiting part or a positioning part to determine the final position of the dotting needle 52. The ink sac 51 is connected to the fixed platform 9, which is bolted to the test substrate 1 and is located on the opposite side of the fixed part 2.

[0023] The ink sac 51 and the dotting pin 52 need to be constantly adjusted during testing to ensure they correspond precisely with the die. A better adjustment method is to connect the annular sleeve 53 to the fixed part 2 via a rotating shaft 54 ​​and a rotating assembly. The rotating assembly is electrically driven to rotate the shaft 54, thus enabling the automatic rotation of the annular sleeve 53 and the ink sac 51. In practical applications, by designing sensors or camera probes, the location of the die being tested and the working position of the dotting pin 52 can be clearly determined. This allows for adjustment by rotation during actual testing to match the positional changes after wafer movement, avoiding the problem of the dotting pin 52 failing to function accurately due to machine vibration or inconsistent die spacing.

[0024] To ensure accurate testing, multiple sets of test needles can be set, with a minimum of two sets. This allows for testing with one set of test needles 8 followed by a retest with another set of test needles 8, thereby improving testing accuracy. Based on this principle, multiple sets of test needles 8 can be set at equal intervals to achieve multiple retests, making it convenient to use.

[0025] The rotating component can be a servo motor, which utilizes the smoothness of rotation to achieve high-precision adjustment and ensure the accuracy of the dot pin 52.

[0026] As is known from common technical knowledge, this invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative and not exhaustive. All modifications within the scope of this invention or its equivalents are included in this invention.

Claims

1. A CP test probe station probe card test marking device, characterized in that, Includes the following parts: Test substrate (1), which is connected to the fixing part (2) and located above the wafer (3); The test substrate (1) has a pin card opening (4), and a test pin (8) is provided at the pin card opening (4) for testing multiple chips on the wafer (3); The needle opening (4) is located behind the test needle (8) and a dotting device (5) is installed on the test substrate (1). The dotting device (5) and the test needle (8) act on different core particles respectively.

2. The CP test probe station and test marking device according to claim 1, characterized in that, The wafer (3) moves via a worktable (7) on a platform (6), the worktable (7) having a built-in drive unit that enables it to move along the XYZ axes.

3. The CP test probe station and test marking device according to claim 1, characterized in that, The fixed part (2) includes a fixed column (21), which is welded to the platform (6). The top of the fixed column (21) is provided with a slot (22) that cooperates with the test substrate (1). The bottom of the test substrate (1) is connected to a support (23), which is fixed to the test substrate (1) and the fixed column (21) by multiple bolts.

4. The CP test probe station and test marking device according to claim 1, characterized in that, The dotting device (5) includes an ink sac (51) located on the rear side and a dotting needle (52) located on the front side. The dotting needle (52) is mounted on the ink sac (51). The ink sac (51) is connected to the fixed platform (9) by an outer ring sleeve (53). The fixed platform (9) is mounted on the test substrate (1) by bolts.

5. The CP test probe station and test marking device according to claim 4, characterized in that, The annular sleeve (53) is rotatably connected to the fixed platform (9) via a rotating shaft (54), which is connected to the rotating assembly.

6. The CP test probe station and test marking device according to claim 2, characterized in that, The test needle (8) includes at least two sets.

7. The CP test probe station and test marking device according to claim 5, characterized in that, The rotating assembly includes a servo motor.

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