Electronic component test module

Abstract

The utility model relates to test tool, especially electronic component test module, including platform, semiconductor refrigerating sheet, water cooling system and temperature detector. Platform includes base plate, the installation groove of cooperation in the electronic component of detection and is used for with electronic component electric connection's connecting interface. Semiconductor refrigerating sheet has opposite heating part and refrigeration part, and the refrigeration part of semiconductor refrigerating sheet is adjacent to the position of platform corresponding to installation groove. Water cooling system includes bearing plate. Formed with at least one through bearing plate's refrigerant passage in bearing plate inside. The both ends of refrigerant passage are connected with liquid inlet and liquid outlet, are used for making refrigerant flow through bearing plate. Refrigerant passage is adjacent to the heating part of semiconductor refrigerating sheet. Temperature detector is used for detecting the temperature of installation groove. With semiconductor refrigerating sheet to installation groove carries out the cooling, and with water cooling system to semiconductor refrigerating sheet carries out the cooling, has higher cooling efficiency and flexible cooling effect.

Description

Technical Field

[0001] This utility model relates to testing fixtures, and in particular to a testing module for electronic components. Background Technology

[0002] Electronic components have a relatively precise structure, and even small deviations during production can cause a decrease in performance. Therefore, in the production of electronic components, after each part is processed and assembled, the product needs to be tested for performance to prevent defective products from leaving the factory.

[0003] With the development of electronic components, their internal structures have become increasingly sophisticated and miniaturized, leading to increased fragility of individual components. During testing, the electronic components mounted on the carrier disk require high-power operation, causing heat buildup in and around the disk. When electronic components are small, their heat resistance decreases, making them more susceptible to damage during testing. Utility Model Content

[0004] The purpose of this invention is to provide an electronic component testing module that helps reduce thermal damage to electronic components during testing.

[0005] To achieve the above objectives, this utility model provides the following technical solution: An electronic component testing module, comprising: The stage includes a substrate, a mounting slot for fitting an electronic component to be tested, and a connection interface for electrically connecting with the electronic component. A semiconductor refrigeration chip has opposing heating and cooling sections, wherein the cooling section of the semiconductor refrigeration chip is located adjacent to the stage corresponding to the mounting slot; A water-cooling system includes a support plate, wherein at least one refrigerant channel is formed inside the support plate, and the two ends of the refrigerant channel are connected to an inlet port and an outlet port for allowing refrigerant to flow through the support plate. The refrigerant channel is adjacent to the heating section of the semiconductor refrigeration chip. A temperature detector is used to detect the temperature of the mounting slot.

[0006] Optionally, a perforated portion is formed on the substrate, the perforated portion is connected to one side edge of the substrate, the gasket is constructed as a ring with one side opening, its inner edge fits the edge of the perforated portion of the substrate, the gasket is connected to the substrate and adjacent to the perforated portion, and its side away from the substrate is connected to a base plate that fits the perforated portion of the substrate, the base plate, the gasket and the perforated portion of the substrate together form the mounting groove, the side of the base plate is partially recessed to form an embedding groove, the probe of the temperature detector is embedded and connected to the embedding groove, the base plate has a gas passage embedded in it, one end of the gas passage is connected to the side of the base plate and is connected to an external vacuum pipeline through a vacuum valve, and a vacuum hole is formed on the side surface of the base plate near the gasket, which is connected to the gas passage for adsorbing the electronic components.

[0007] Optionally, the stage further includes a constraint member that mates with the electronic component. The constraint member includes a sleeve portion and a support portion connected to each other. The sleeve portion is constructed as a ring with one side opening, sleeved inside the gasket ring and supported on the base plate. Its opening faces the opening of the gasket ring, and its inner edge mates with the electronic component. The support portion is connected to one end of the sleeve portion and to the surface of the sleeve portion away from the base plate. The gas passage is connected to the surface of the base plate near the constraint member corresponding to the position of the support portion. The support portion extends perpendicularly to the substrate, and its end away from the sleeve portion is an adsorption end. A vacuum branch is formed inside the constraint member. The vacuum branch passes through the constraint member, is sealed to the gas passage, and extends to the adsorption end. A connector groove is formed in a partial recess at the adsorption end near the end of the vacuum branch. The connector groove mates with the second connector of the electronic component.

[0008] Optionally, the electronic component testing module further includes a cover pivotally connected to the substrate. The substrate has a first side and a second side opposite to each other. The cutout portion communicates with the first side of the substrate. The substrate also has a third side and a fourth side opposite to each other. The cover is pivotally connected to the substrate near the third side. The cover includes a cover body and a first buckle pivotally connected to the cover body. A buckle beam is connected to the substrate near the fourth side. The buckle beam corresponds to the first buckle and is detachably connected to the first buckle.

[0009] Optionally, the platform further includes a first positioning component embedded in the substrate, and the cover includes a first docking component corresponding to the first positioning component. The first positioning component includes two docking wires, one end of which is electrically connected to an external circuit, and the other end of which faces the cover and is separated from each other. The first docking component includes an insulated guide plate seat and a guide plate connected to the surface of the guide plate seat. The guide plate is a conductor. When the cover is positioned on the platform, the ends of the two docking wires abut against the guide plate, so that the two docking wires are connected.

[0010] Optionally, the cover further includes a pressing assembly connected to the cover body. The pressing assembly includes a connecting plate, a pressing block, and a buffer spring. The connecting plate is connected to the surface of the cover body away from the substrate. The surface of the cover body forms a through-hole-shaped guide hole that matches the pressing block. The pressing block passes through the guide hole, and at least one of the buffer springs is connected between the connecting plate and the pressing block. The pressing block is used to controllably press the electronic components onto the stage.

[0011] Optionally, the electronic component testing module further includes a reversing mechanism, which includes a first reversing plate and a second reversing plate. The second reversing plate is pivotally connected to the pivot position of the first reversing plate via a torsion spring and is connected to the side of the substrate. The position of the first reversing plate away from the pivot position is detachably connected to the second reversing plate.

[0012] Optionally, the reversing mechanism includes a second positioning component and a second docking component that are corresponding to each other and uniformly electrically connected to each other by external circuits. The second positioning component is connected to the second reversing plate, and the second docking component is connected to the first reversing plate. When the first reversing plate is attached to the second reversing plate, the second positioning component and the second docking component are electrically connected.

[0013] Optionally, the connection interface includes a probe module, a protective plate, and a protective spring. The probe module includes a circuit board and multiple probes electrically connected to the circuit board, with the probes extending away from the circuit board. The protective plate is sleeved on the outside of the multiple probes. The protective spring is connected between the circuit board and the protective plate. When the protective spring is in a stretched state, the ends of the probes away from the circuit board are protected inside the protective plate. When the protective spring is in a compressed state, the position of the protective plate corresponds to the middle of the probes.

[0014] The beneficial effects of this invention are as follows: By incorporating a semiconductor cooling chip, the temperature of the support tank can be rapidly reduced, thereby preventing damage to electronic components from excessively high temperatures. Temperature changes are also fed back in real time via a temperature detector. A water-cooling system further cools the heating element of the semiconductor cooling chip, preventing excessive heat accumulation that could damage it. The semiconductor cooling chip possesses high cooling efficiency and flexibility, facilitating dynamic temperature adjustment of the support tank.

[0015] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the electronic component testing module shown in Embodiment 1 of this utility model; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 This is a structural schematic diagram of the electronic component testing module shown in Embodiment 1 of this utility model from another angle.

[0017] Legend: 1-Platform, 11-Baseboard, 111-First side, 112-Second side, 113-Third side, 114-Fourth side, 115-Hollowed-out part, 12-Mounting groove, 121-Washer ring, 122-Base plate, 123-Vacuum hole, 124-Vacuum valve, 13-Constraint, 131-Sleeve part, 132-Support part, 133-Adsorption end, 134-Second pressing groove, 135-Connector groove, 136-Vacuum branch, 14-Connection interface, 141-Protective plate, 142-First pressing groove, 143-Dating groove, 144-Circuit board, 145-Probe, 15-First rotating shaft, 151-First slot, 152-First buckle beam, 16-First limiting post, 17-First positioning component, 171-Dating wire, 2-Cover, 21 - Cover body, 22- First buckle, 23- First docking assembly, 231- Guide plate seat, 232- Guide plate, 24- Pressing assembly, 241- Connecting plate, 242- Pressing block, 243- Guide hole, 25- First limiting hole, 3- Semiconductor cooling chip, 4- Water cooling system, 41- Bearing plate, 42- Liquid inlet interface, 43- Liquid outlet interface, 5- Temperature detector, 51- Probe slot, 6- Reversing mechanism, 61- First reversing plate, 611- Second slot, 612- Second buckle beam, 613- Second limiting post, 62- Second reversing plate, 621- Second buckle, 622- Second limiting hole, 63- Second docking assembly, 631- Positioning plate, 632- Alignment plate, 633- Alignment wire, 64- Second positioning assembly, 641- Positioning seat, 642- Conductor. Detailed Implementation

[0018] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0019] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0022] This utility model application protects an electronic component testing module, including a stage 1, a thermoelectric cooler 3, a water-cooling system 4, and a temperature detector 5. The stage 1 includes a substrate 11, a mounting slot 12 for the electronic component to be tested, and a connection interface 14 for electrical connection with the electronic component. The thermoelectric cooler 3 has opposing heating and cooling sections, with the cooling section of the thermoelectric cooler 3 adjacent to the stage 1 corresponding to the mounting slot 12. The water-cooling system 4 includes a support plate 41. At least one refrigerant channel is formed inside the support plate 41, penetrating the support plate 41. An inlet port 42 and an outlet port 43 are connected to both ends of the refrigerant channel for refrigerant to flow through the support plate 41. The refrigerant channel is adjacent to the heating section of the thermoelectric cooler 3. The temperature detector 5 is used to detect the temperature of the mounting slot 12.

[0023] By incorporating a thermoelectric cooler 3, the temperature of the support tank can be rapidly reduced, preventing damage to electronic components from excessive heat. Temperature changes are fed back in real time via a temperature detector 5. A water-cooling system 4 cools the heating element of the thermoelectric cooler 3, preventing excessive heat buildup and potential damage. The thermoelectric cooler 3 exhibits high cooling efficiency and flexibility, facilitating dynamic temperature control of the support tank.

[0024] Please refer to the following examples for details.

[0025] Example 1: Please see Figure 1The electronic component testing module shown in a preferred embodiment of this application includes a stage 1, a pressure cover 2, a semiconductor cooling chip 3, a water cooling system 4, a temperature detector 5, and a reversing mechanism 6, used to carry the electronic component to be tested and electrically connected to the electronic component. The electronic component in this embodiment includes a generally rectangular body, and a first pressure plate and a second pressure plate connected to the body. Both the first and second pressure plates are plate-shaped. A first connector is connected to the first pressure plate near the end furthest from the body, and a second connector is connected to the second pressure plate near the end furthest from the body. Both the first and second connectors are electrically connected to the body.

[0026] Please see Figure 1 , Figure 2 and Figure 3The platform 1 includes a substrate 11, a mounting groove 12, a constraint member 13, and a connection interface 14. The substrate 11 is generally constructed as a horizontal rectangular plate, having a vertical first side 111, a second side 112, a third side 113, and a fourth side 114. The first side 111 and the second side 112 are opposite to each other and extend along a first direction, while the third side 113 and the fourth side 114 are opposite to each other and extend along a second direction. The center of the first side 111 of the substrate 11 is recessed inward to form a rectangular groove-shaped cutout 115, and the cutout 115 vertically penetrates the substrate 11. The mounting groove 12 includes a gasket 121 and a base plate 122. The gasket 121 is constructed as a rectangular ring with an opening on one side, its inner edge fitting into the cutout 115 and connected to the lower surface of the cutout 115, with the opening facing the first side 111 of the substrate 11. The base plate 122 is rectangular, its edges fitting the outer edge of the washer 121 and connected to the lower surface of the washer 121. The base plate 122 is thickened and protrudes corresponding to the position of the washer 121, forming a groove-like structure on its upper surface. The constraint member 13 includes a fitting portion 131 and a support portion 132. The fitting portion 131 is a rectangular frame with an opening on one side, its outer edge fitting the mounting groove 12 and its inner edge fitting the body of the electronic component. The fitting portion 131 is fixedly connected to the upper surface of the base plate 122 and fitted into the mounting groove 12. The support portion 132 is a vertical column, connected to the upper surface of one end of the fitting portion 131. The end of the support portion 132 furthest from the sleeve portion 131 is an adsorption end 133. The adsorption end 133 is recessed to form a second pressure groove 134 that fits into the second pressure plate, and the bottom surface of the second pressure groove 134 is partially recessed to form a connector groove 135 that fits into the second connector. A gas channel extending in a first direction is formed inside the base plate 122. One end of the gas channel is embedded in the base plate 122, and the other end is connected to the side of the base plate 122 and connected to a vacuum valve 124, and is connected to an external vacuum pipeline through the vacuum valve 124. An elongated vacuum hole 123 communicating with the gas channel is formed on the upper surface of the base plate 122, and the vacuum hole 123 extends in a second direction. The middle part of the gas channel extends vertically upward to the upper surface of the base plate 122 corresponding to the position of the support portion 132, and a vacuum branch 136 is formed vertically through the support portion 132 at the corresponding position. One end of the vacuum branch 136 is located on the bottom surface of the second pressure groove 134 and adjacent to the connector groove 135. The end of the vacuum branch 136 furthest from the adsorption end 133 is sealed and connected to the gas channel via a sealing ring. Under the action of the external vacuum pipeline, the body of the electronic component embedded in the constraint member 13 is positioned and adsorbed onto the base plate 122, and the second pressure plate is adsorbed onto the adsorption end 133 of the constraint member 13, with the second connector embedded in the connector groove 135. The connection interface 14 is located on one side of the mounting groove 12 along the second direction. The connection interface 14 includes a probe module, a protection plate 141, and a protection spring. The probe module includes a circuit board 144, a mounting block, and multiple probes 145.Circuit board 144 is connected to the lower surface of substrate 11, and mounting block is embedded in substrate 11 and connected to circuit board 144. Multiple probes 145 are connected to the surface of mounting block away from circuit board 144 and are electrically connected to circuit board 144. Protective plate 141 is disposed above mounting block, and its upper surface is partially recessed to form a first pressure groove 142 that fits with the first pressure plate. The bottom surface of the first pressure groove 142 is partially recessed to form a mating groove 143 that fits with the first connector. The bottom surface of the mating groove 143 has multiple pinholes for each probe 145 to pass through. Protective spring is connected between circuit board 144 and protective plate 141. When the protective spring is in a stretched state, the end of probe 145 away from circuit board 144 is protected inside the pinhole. When the protective spring is in a compressed state, the end of probe 145 away from circuit board 144 is exposed into the mating groove 143.

[0027] In this embodiment, probe 145 is constructed as a sheet, with its top portion protruding to abut against a contact point. In the prior art, probe 145 often adopts a needle-like structure. To ensure the strength and heat resistance of probe 145 for signal transmission, the diameter of probe 145 is usually large, resulting in a large spacing between adjacent probes 145. Currently, the minimum spacing between probes 145 is approximately 0.3 mm. In this embodiment, probe 145 is constructed as a sheet, with multiple probes 145 parallel to each other and arranged in a row, thereby reducing the minimum spacing between probes 145 in its arrangement direction to within 0.15 mm, which helps to achieve a dense arrangement of probes 145.

[0028] The pressure cap 2 includes a cap body 21, a first latch 22, a first docking assembly 23, and a pressing assembly 24. The cap body 21 is a rectangular plate with an upward convex center, and the convex position corresponds to the mounting groove 12. The convex height matches the constraint member 13. The base plate 11 and the cap body 21 are rotatably connected by a first rotating shaft 15 extending along a second direction and a cooperating torsion spring. The first rotating shaft 15 is located on the outer side of the base plate 11, adjacent to the third side surface 113, and is higher than the upper surface. The fourth side surface 114 of the base plate 11 is partially recessed to form a first latching groove 151. The first latching groove 151 connects the fourth side surface 114 of the base plate 11 and the upper surface. A first latching beam 152, corresponding to the fourth side surface 114 of the base plate 11 and extending along the second direction, is connected above the first latching groove 151. The cap body 21 is pivotally connected to the first latch 22 at the position corresponding to the first latching beam 152, and the first latch 22 is connected to the cap body 21 by a compression spring, so that the first latch 22 can be locked to the first latching beam 152. When the first latch 22 is disengaged from the first latch beam 152, the cover 2 springs open under the action of the corresponding torsion spring and rotates away from the platform 1. Two protruding first limiting posts 16 are formed on the upper surface of the substrate 11 near the first latch beam 152. Both first limiting posts 16 are cylindrical in shape, tapering to a rounded cone at the top, and are arranged along the second direction. The cover 21 has two elongated first limiting holes 25 corresponding to the positions of the first limiting posts 16. The first limiting holes 25 are through holes parallel to the first direction, used to constrain the position of the cover 21 in the second direction when pressed against the substrate 11. The first docking assembly 23 includes a guide plate seat 231 embedded in the cover 21 and a guide plate 232 connected to the surface of the guide plate seat 231 near the carrier. The guide plate seat 231 is an insulating structure, and the guide plate 232 is a conductor. A first positioning assembly 17 is embedded in the corresponding position of the substrate 11. The first positioning assembly 17 includes two docking wires 171, one end of which is electrically connected to an external circuit, and the other end faces the cover 2 and is separated from each other. When the cover 2 is positioned on the platform 1, the ends of the two docking wires 171 abut against the guide plate 232, making the two docking wires 171 interconnected, thereby ensuring the accurate positioning of the cover 2. The pressing assembly 24 includes a connecting plate 241, a pressing block 242, and a buffer spring. The connecting plate 241 is constructed as a rectangular plate and is connected to the surface of the cover 21 away from the base plate 11. A through-hole-shaped guide hole 243 is formed on the cover 21 at a corresponding position to cooperate with the pressing block 242. The pressing block 242 is constructed as a rectangular column and extends vertically. Its top expands to form a stepped structure, so that the inside of the guide hole 243 is stepped and cooperates with it. Multiple buffer springs are connected between the connecting plate 241 and the pressing block 242. In this embodiment, two pressing components 24 are provided, corresponding to the mounting slot 12 and the connection interface 14 respectively, which are used to press the body of the electronic component and the first pressure plate, thereby controllably pressing the electronic component onto the stage 1.Because the guide hole 243 has a stepped interior, it helps prevent the pressure block 242 from being pressed down excessively and supports the pressure block 242 when no electronic components are installed, thereby protecting the buffer spring. In this embodiment, the portion of the guide hole 243 corresponding to the mounting groove 12 communicates with the first side surface 111 of the substrate 11. The buffer spring and the protective spring cooperate with each other to ensure that each probe 145 is electrically connected to the second connector of the electronic component.

[0029] The semiconductor cooling chip 3 is an existing structure that can be easily obtained through purchase, and it has opposing heating and cooling sections. In this embodiment, the semiconductor cooling chip 3 is connected to the lower surface of the base plate 122 with the cooling section facing upwards, thereby achieving rapid cooling of the mounting slot 12. In this embodiment, the base plate 122 is a copper plate, which has good thermal conductivity.

[0030] A water-cooling system 4 is connected to the lower surface of the thermoelectric cooler 3 and is used to cool the heating element of the thermoelectric cooler 3. The water-cooling system 4 includes a support plate 41, a liquid inlet 42, and a liquid outlet 43. The liquid inlet 42 and the liquid outlet 43 are both connected to and adjacent to the side of the support plate 41 extending in a second direction. The support plate 41 includes a refrigerant channel. Both ends of the refrigerant channel are connected to the same side. The refrigerant enters the refrigerant channel from the liquid inlet 42, flows along the refrigerant channel to a position adjacent to the opposite side, turns back, and leaves the support plate 41 from the liquid outlet 43. In this embodiment, the refrigerant is water. The water-cooling system 4 helps to continuously cool the heating element of the thermoelectric cooler 3 and prevent structural damage caused by high temperature.

[0031] Temperature detector 5 is used to detect the temperature of mounting slot 12. A probe slot 51 is formed by a slot on the side of the base plate 122 parallel to the second direction. The probe slot 51 is located on the portion of the base plate 122 that is fitted onto the constraint member 13 and communicates with the outer surface of the constraint member 13. The probe of temperature detector 5 is disposed inside the probe slot 51, thereby detecting the temperature around the electronic components and achieving dynamic temperature control.

[0032] In this embodiment, in order to reduce the overall weight and improve the thermal conductivity, the structure of the stage 1 is cut to remove unnecessary parts that do not affect the function, thereby improving the cooling efficiency and reducing the temperature detected by the temperature detector 5 from 70°C to 50°C within 5 seconds.

[0033] The reversing mechanism 6 includes a first reversing plate 61 and a second reversing plate 62, both constructed as rectangular plates. The first reversing plate 61 is horizontally disposed, and the second reversing plate 62 is pivotally connected to the first reversing plate 61 via a torsion spring, with its side away from the first reversing plate 61 connected to the second side surface 112 of the base plate 11. The base plate 11 is connected to the end of the second reversing plate 62 away from the corresponding torsion spring. A second latch 621 is connected to one end of the second reversing plate 62 adjacent to the first latch 22, and the first reversing plate 61 is connected to a second latch groove 611 and a second latch beam 612 that engage with the second latch 621, for controllable and detachable connection of the first reversing plate 61 and the second reversing plate 62. A cylindrical second limiting post 613 protrudes from the surface of the first reversing plate 61 near the second reversing plate 62, with the tops of both second limiting posts 613 tapering to rounded corners and arranged along a second direction. The surface of the second deflector plate 62 has two second limiting holes 622 that respectively mate with the second limiting post 613, used to constrain the position of the second deflector plate 62. A second docking assembly 63 is connected to the surface of the first deflector plate 61, and a second positioning assembly 64 is embedded in the second deflector plate 62 at a position corresponding to the second docking assembly 63. The second positioning assembly 64 communicates with the surface of the second deflector plate 62 near the first deflector plate 61, and its embedding depth matches the second docking assembly 63. The second docking assembly 63 includes a positioning plate 631, an alignment plate 632, and alignment wires 633. The positioning plate 631 is fixedly connected to the surface of the first deflector plate 61, and has through holes for the two alignment wires 633 to pass through. The side of the first deflector plate 61 is recessed inward to form a slot, and the two alignment wires 633 are embedded into the first deflector plate 61 until one end is located in the slot. The alignment plate 632 is inserted into the slot and is electrically connected to the two alignment wires 633 and external circuitry. The second positioning component 64 includes a positioning seat 641 and two conductive members 642 mounted on the positioning seat 641. Each conductive member 642 is elongated and extends through the positioning seat 641. A circular metal piece is connected to one end of the conductive member 642 near the first deflector plate 61, and their positions correspond to the two alignment guide wires 633. When the second deflector plate 62 is pressed against the first deflector plate 61, and the second limiting post 613 is inserted into the second limiting hole 622, and the second latch 621 locks the second latch beam 612, the ends of the two alignment guide wires 633 abut against the conductive members 642, making them conductive and thus indicating the accurate position of the second deflector plate 62. When the second deflector plate 62 separates from the first deflector plate 61, the alignment guide wires 633 and the conductive members 642 are disconnected, and the second deflector plate 62 extends vertically under the action of a torsion spring, causing the base plate 11 to be in a horizontal direction.

[0034] The level of automation of the transfer module varies across different production lines. By exposing the surface of the electronic component corresponding to the first side 111 of the substrate 11 to the outside of the stage 1 and the pressure cap 2, and by setting a reversing mechanism 6, the orientation of the electronic component can be adjusted after sample loading, thus cooperating with the machine for testing. When the transfer module has the function of adjusting the overall orientation of the test module, there is no need to adjust the orientation through the reversing mechanism 6, thereby enabling the electronic component test module to adapt to different production lines and improving its versatility.

[0035] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0036] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An electronic component testing module, characterized in that, include: The stage (1) includes a substrate (11), a mounting slot (12) that fits into the electronic component to be tested, and a connection interface (14) for electrically connecting with the electronic component. The semiconductor cooling chip (3) has a heating section and a cooling section opposite each other, and the cooling section of the semiconductor cooling chip (3) is located adjacent to the stage (1) and corresponds to the mounting groove (12); The water cooling system (4) includes a support plate (41), and at least one refrigerant channel is formed inside the support plate (41) through the support plate (41). The two ends of the refrigerant channel are connected to an inlet port (42) and an outlet port (43) for allowing the refrigerant to flow through the support plate (41). The refrigerant channel is adjacent to the heating part of the semiconductor cooling chip (3). Temperature detector (5) is used to detect the temperature of the mounting slot (12).

2. The electronic component testing module as described in claim 1, characterized in that, A perforated portion (115) is formed on the substrate (11), the perforated portion (115) is connected to one side edge of the substrate (11), and a gasket (121) is constructed as a ring with one side opening, the inner edge of which fits into the edge of the perforated portion (115) of the substrate (11). The gasket (121) is connected to the substrate (11) and adjacent to the perforated portion (115), and a base plate (122) that fits into the perforated portion (115) of the substrate (11) is connected to its side away from the substrate (11). The base plate (122) and the gasket (121) are connected to the perforated portion (115) of the substrate (11). 21) and the hollow portion (115) of the substrate (11) together form the mounting groove (12). The side of the base plate (122) is partially recessed to form an embedding groove. The probe of the temperature detector (5) is embedded and connected to the embedding groove. The base plate (122) has a gas passage embedded in it. One end of the gas passage is connected to the side of the base plate (122) and is connected to an external vacuum pipeline through a vacuum valve (124). A vacuum hole (123) is formed on the side surface of the base plate (122) near the gasket (121) and is connected to the gas passage for adsorbing the electronic components.

3. The electronic component testing module as described in claim 2, characterized in that, The stage (1) further includes a constraint member (13) that mates with the electronic component. The constraint member (13) includes a sleeve portion (131) and a support portion (132) connected to each other. The sleeve portion (131) is constructed as a ring with one side open, sleeved inside the gasket ring (121) and supported on the base plate (122). Its opening faces the opening of the gasket ring (121), and its inner edge mates with the electronic component. The support portion (132) is connected to one end of the sleeve portion (131) and to the surface of the sleeve portion (131) away from the base plate (122). The gas passage is connected to the base plate (122) near the... The surface of the constraint member (13) corresponds to the position of the support portion (132). The support portion (132) extends perpendicularly to the substrate (11), and its end away from the sleeve portion (131) is the adsorption end (133). A vacuum branch (136) is formed inside the constraint member (13). The vacuum branch (136) passes through the constraint member (13), is sealed to the gas passage, and extends to the adsorption end (133). A connector groove (135) is formed in a local recess at the position of the adsorption end (133) near the end of the vacuum branch (136). The connector groove (135) is matched with the second connector of the electronic component.

4. The electronic component testing module as described in claim 2, characterized in that, It also includes a cover (2) pivotally connected to the substrate (11), the substrate (11) having opposing first side (111) and second side (112), the cutout (115) communicating with the first side (111) of the substrate (11), the substrate (11) also having opposing third side (113) and fourth side (114), the cover (2) pivotally connected to the substrate (11) near the third side (113), the cover (2) including a cover body (21) and a first buckle (22) pivotally connected to the cover body (21), and a buckle beam connected to the substrate (11) near the fourth side (114), the buckle beam corresponding to the first buckle (22) and detachably connected to the first buckle (22).

5. The electronic component testing module as described in claim 4, characterized in that, The platform (1) further includes a first positioning component (17) embedded in the substrate (11). The cover (21) includes a first docking component (23) corresponding to the first positioning component (17). The first positioning component (17) includes two docking wires (171). One end of the docking wires (171) is electrically connected to an external circuit, and the other end faces the cover (2) and is separated from each other. The first docking component (23) includes an insulated guide plate seat (231) and a guide plate (232) connected to the surface of the guide plate seat (231). The guide plate (232) is a conductor. When the cover (2) is aligned and placed on the platform (1), the ends of the two docking wires (171) abut against the guide plate (232), so that the two docking wires (171) are connected.

6. The electronic component testing module as described in claim 4, characterized in that, The cover (2) further includes a pressing assembly (24) connected to the cover body (21). The pressing assembly (24) includes a connecting plate (241), a pressing block (242), and a buffer spring. The connecting plate (241) is connected to the surface of the cover body (21) away from the substrate (11). A through-hole-shaped guide hole (243) is formed on the surface of the cover body (21) to fit the pressing block (242). The pressing block (242) passes through the guide hole (243), and at least one of the buffer springs is connected between the connecting plate (241) and the pressing block (242). The pressing block (242) is used to controllably press the electronic components onto the stage (1).

7. The electronic component testing module as described in claim 1, characterized in that, It also includes a reversing mechanism (6), which includes a first reversing plate (61) and a second reversing plate (62). The second reversing plate (62) is pivotally connected to the pivot position of the first reversing plate (61) by a torsion spring and is connected to the side of the base plate (11). The position of the first reversing plate (61) away from the pivot position is detachably connected to the second reversing plate (62).

8. The electronic component testing module as described in claim 7, characterized in that, The reversing mechanism (6) includes a second positioning component (64) and a second docking component (63) that are corresponding to each other and uniformly electrically connected to the external circuit. The second positioning component (64) is connected to the second reversing plate (62), and the second docking component (63) is connected to the first reversing plate (61). When the first reversing plate (61) is attached to the second reversing plate (62), the second positioning component (64) and the second docking component (63) are electrically connected.

9. The electronic component testing module as described in claim 1, characterized in that, The connection interface (14) includes a probe module, a protection plate (141), and a protective spring. The probe module includes a circuit board (144) and multiple probes (145) electrically connected to the circuit board (144). The probes (145) extend in a direction away from the circuit board (144). The protection plate (141) is sleeved on the outside of the multiple probes (145). The protective spring is connected between the circuit board (144) and the protection plate (141). When the protective spring is in a stretched state, the end of the probe (145) away from the circuit board (144) is protected inside the protection plate (141). When the protective spring is in a compressed state, the position of the protection plate (141) corresponds to the middle of the probe (145).

Images