A mainboard testing device and a mainboard testing system

Abstract

The utility model provides a kind of mainboard testing device and mainboard testing system, it is related to mainboard test field.Die tray includes the first carrier plate of being installed on bearing plate and having limit slot and the second carrier plate of being installed in limit slot, multiple mainboards to be measured are placed on the second carrier plate, and with multiple first mounting holes, lifting assembly drives die tray to move along vertical direction, to carry out alignment and contact with the upper sky plate module above mainboard testing device.Connector is through first mounting hole, and there is first gap between first mounting hole, and there is second gap between second carrier plate and limit slot, to adjust the position of second carrier plate in horizontal direction when second carrier plate is aligned with upper sky plate module.The above technical scheme is when realizing the synchronous test of multiple mainboards to be measured, by the slight floating of second carrier plate in horizontal direction, to correct the alignment deviation between upper sky plate module, ensure that upper sky plate module and mainboard to be measured accurate and reliable contact, improve test precision and efficiency.

Description

Technical Field

[0001] This utility model relates to the field of motherboard testing technology, and in particular to a motherboard testing device and motherboard testing system. Background Technology

[0002] The motherboard is the fundamental carrier of key chips, circuits, and components in various electronic devices. Its functional integrity and operational stability are the core determinants of the quality of the final product. Therefore, it must undergo rigorous testing after production to ensure compliance with standards. Currently, the main testing method for motherboards is to use the test probes of the upper-side mounting module to contact the test points on the motherboard to achieve signal conduction. However, in existing motherboard testing equipment, the tray or carrier used to support the motherboard is usually directly locked in place by rigid means such as screws. This fixing method lacks the necessary degree of freedom for fine adjustment. During motherboard testing, misalignment can easily occur between the motherboard and the test probes of the upper-side mounting module, resulting in poor contact between the probes and the test points on the motherboard, leading to low testing accuracy. Utility Model Content

[0003] One objective of this invention is to provide a motherboard testing device that solves the technical problem of misalignment between the motherboard and the upper platen module in the prior art.

[0004] Another objective of this invention is to provide a motherboard testing system having the aforementioned motherboard testing device.

[0005] Specifically, this utility model provides a motherboard testing system, comprising: The support plate is installed horizontally; At least one tray includes a first carrier plate and a second carrier plate. The first carrier plate is mounted on the support plate and has a limiting groove. The second carrier plate is mounted in the limiting groove. The second carrier plate has multiple mounting grooves and multiple first mounting holes that extend vertically through it. Each mounting groove holds a motherboard to be tested. A lifting assembly, connected to the tray, is used to drive the tray to move vertically to align with the upper antenna module above the motherboard testing device, so that the test probes of the upper antenna module contact the motherboard under test, thereby testing the motherboard under test. Multiple connectors are provided, each connector passing through the first mounting hole of the second carrier plate and connecting the first carrier plate to the second carrier plate. There is a first gap between the outer wall of the connector and the outer wall of the first mounting hole, and a second gap between the second carrier plate and the inner wall of the limiting groove, so as to adjust the position of the second carrier plate in the horizontal direction when the second carrier plate is aligned with the upper plate module.

[0006] Optionally, the first mounting hole is a countersunk hole, and the connector is a height-equalizing bolt.

[0007] Optionally, the inner wall of the limiting groove has a first stepped structure and a second stepped structure. The first stepped structure includes a first part arranged vertically, the outer wall of the second carrier plate has a second part arranged at a distance from the first part, the second stepped structure includes a third part arranged vertically, and the outer wall of the second carrier plate has a fourth part arranged at a distance from the third part.

[0008] Optionally, the first carrier board is provided with a plurality of first positioning holes, and the second carrier board is provided with a plurality of second positioning holes, each of the first positioning holes being aligned with one of the second positioning holes. The motherboard testing device further includes: Multiple positioning sleeves are arranged vertically, each positioning sleeve being located within a second positioning hole. These sleeves are used to be fitted onto the outside of the positioning post of the upper platen module when the second carrier plate is aligned with the upper platen module, so that the positioning post passes through the corresponding first positioning hole and second positioning hole, thereby providing vertical guidance for the upwardly moving tray.

[0009] Optionally, each of the first carrier plates is provided with multiple sets of limiting posts, each set of limiting posts corresponds to one of the motherboards under test and includes multiple limiting posts. The multiple limiting posts penetrate the second carrier plate and are located around the mounting groove of the second carrier plate, for limiting the corresponding motherboard under test.

[0010] Optionally, there are two material trays, which are arranged on opposite sides of the support plate. The support plate is configured to rotate in a controlled manner, so that the two material trays alternately occupy the first station and the second station. The first station is used to load the motherboard under test, and the second station is used to test the motherboard under test. The upper plate module is arranged above the second station.

[0011] Optionally, the lifting assembly includes a drive component, a lifting plate, and a bracket. The drive component is arranged vertically and mounted on the bracket. The lifting plate is mounted on top of the drive component and is used to move the tray located at the second work station vertically under the drive of the drive component.

[0012] Optionally, the carrier plate is provided with a plurality of second mounting holes, and the motherboard testing device further includes: A plurality of first guide posts, at least one of the guide posts corresponding to one of the trays, each of the first guide posts having a second mounting hole through its top and being connected to the bottom of the first carrier plate for providing vertical guidance for the trays moving vertically.

[0013] Optionally, it also includes: Multiple guide sleeves, each of which is fitted around the periphery of a first guide post and located within a corresponding second mounting hole, so that the first guide post can move vertically along the guide sleeve.

[0014] In particular, this utility model also provides a motherboard testing system, including the motherboard testing device as described above.

[0015] This invention provides a motherboard testing device, relating to the field of motherboard testing. In this invention, at least one tray includes a first carrier plate mounted on a support plate and having a limiting groove, and a second carrier plate mounted within the limiting groove. Multiple motherboards to be tested are placed on the second carrier plate, which has multiple first mounting holes. A lifting assembly drives the tray to move vertically to align and contact with an upper mounting module above the motherboard testing device. A connector passes through the first mounting holes and has a first gap with the first mounting holes. A second gap exists between the second carrier plate and the limiting groove, allowing adjustment of the second carrier plate's horizontal position when aligned with the upper mounting module. This technical solution enables simultaneous testing of multiple motherboards to be tested while simultaneously correcting alignment deviations with the upper mounting module through slight horizontal movement of the second carrier plate, ensuring precise and reliable contact between the upper mounting module and the motherboards to be tested, thus improving testing accuracy and efficiency.

[0016] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0017] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic structural diagram of a motherboard testing device according to an embodiment of the present invention, taken from one angle. Figure 2 This is a schematic structural diagram of a motherboard testing device according to one embodiment of the present invention from another angle; Figure 3 This is a schematic cross-sectional view of a motherboard testing device according to an embodiment of the present invention; Figure 4 This is a schematic structural diagram of the motherboard under test located in the mounting slot according to an embodiment of the present invention.

[0018] Figure label: 100-Main board testing device, 200-Main board under test, 1-Carrier plate, 2-Plate, 3-Limiting groove, 4-Mounting groove, 5-First mounting hole, 6-Lifting assembly, 7-Connector, 8-First step structure, 9-Second step structure, 10-Positioning sleeve, 11-First guide post, 12-Guide sleeve, 13-Second guide post, 21-First carrier plate, 22-Second carrier plate, 23-Limiting post group, 24-Second part, 25-Fourth part, 231-Limiting post, 61-Driver, 62-Lifting plate, 63-Bracket, 71-Fifth part, 72-Sixth part, 81-First part, 91-Third part, 131-Head, 132-Rod. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0020] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0022] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0024] Figure 1 This is a schematic structural diagram of a motherboard testing device according to an embodiment of the present invention, taken from one angle. Figure 2 This is a schematic structural diagram of a motherboard testing device according to one embodiment of the present invention from another angle. Figure 3 This is a schematic cross-sectional view of a motherboard testing device according to an embodiment of the present invention. Figure 4 This is a schematic structural diagram of the motherboard under test located in the mounting slot according to an embodiment of the present invention.

[0025] like Figures 1 to 4 As shown, in a specific embodiment, the motherboard testing device 100 includes a support plate 1, at least one tray 2, a lifting assembly 6, and multiple connectors 7. The support plate 1 is arranged horizontally, and the tray 2 includes a first carrier plate 21 and a second carrier plate 22. The first carrier plate 21 is mounted on the support plate 1 and has a limiting groove 3. The second carrier plate 22 is mounted in the limiting groove 3 and has multiple mounting grooves 4 and multiple first mounting holes 5 extending vertically. Each mounting groove 4 holds a motherboard 200 to be tested. The lifting assembly 6 is connected to the tray 2 and is used to drive the tray 2 to move vertically to align with the upper top plate module above the motherboard testing device 100, so that the test probes of the upper top plate module contact the motherboard 200 to be tested. The connector 7 passes through the first mounting hole 5 of the second carrier plate 22 and connects the first carrier plate 21 and the second carrier plate 22. There is a first gap between the outer wall of the connector 7 and the outer wall of the first mounting hole 5, and there is a second gap between the second carrier plate 22 and the inner wall of the limiting groove 3, so as to adjust the position of the second carrier plate 22 in the horizontal direction when the second carrier plate 22 is aligned with the upper plate module. Specifically, when the lifting component 6 drives the material tray 2 to move upward, so that the multiple motherboards 200 under test carried by the second carrier plate 22 enter the alignment moment with the upper plate module, the existing micro-alignment deviation is converted into a horizontal adjustment force acting on the second carrier plate 22 through the contact force between the test probe of the upper plate module and the test point of the motherboard 200 under test, causing the second carrier plate 22 to generate a driven micro-displacement within the space defined by the first gap and the second gap, so as to achieve adaptive adjustment. This adjustment mechanism can effectively eliminate alignment deviations caused by manufacturing, assembly, and thermal deformation during the simultaneous testing of multiple motherboards 200 under test, ensuring accurate and reliable contact between the test probes and the test points of the motherboard 200 under test, and significantly improving test accuracy and reliability.

[0026] In this embodiment, while simultaneously testing multiple motherboards 200 under test, the slight horizontal movement of the second carrier board 22 corrects the alignment deviation between it and the upper antenna module, ensuring accurate and reliable contact between the upper antenna module and the motherboard 200 under test, thereby improving testing accuracy and efficiency.

[0027] In some embodiments, the first mounting hole 5 is a countersunk hole, and the connector 7 is a height-equalizing bolt. Specifically, the countersunk hole is a stepped hole with an upper diameter larger than the lower diameter. The connector 7 includes a fifth part 71 and a sixth part 72. The fifth part 71 is located inside the countersunk hole and has a first gap with the inside of the countersunk hole, allowing the second carrier plate 22 to have adaptive floating in the horizontal direction, ensuring accurate alignment between the motherboard 200 under test and the upper plate module. The sixth part 72 has threads on its periphery and penetrates through the first carrier plate 21 and is fixedly connected to the first carrier plate 21, realizing reliable vertical positioning of the second carrier plate 22 and effectively preventing the second carrier plate 22 from lifting during the testing process.

[0028] In some embodiments, the inner wall of the limiting groove 3 has a first stepped structure 8 and a second stepped structure 9. The first stepped structure 8 includes a first portion 81 arranged vertically, and the outer wall of the second carrier plate 22 has a second portion 24 spaced apart from the first portion 81. The second stepped structure 9 includes a third portion 91 arranged vertically, and the outer wall of the second carrier plate 22 has a fourth portion 25 spaced apart from the third portion 91. In this embodiment, the first stepped structure 8 further includes a seventh portion arranged horizontally, the outer wall of the second carrier plate 22 has an eighth portion spaced apart from the seventh portion, the second stepped structure 9 further includes a ninth portion arranged horizontally, and the outer wall of the second carrier plate 22 has a tenth portion spaced apart from the ninth portion, so that the second carrier plate floats smoothly in the horizontal direction, thereby reducing the contact friction between the second carrier plate 22 and the limiting groove 3. The outer wall shape of the second carrier plate 22 corresponds to and matches the inner wall shape of the limiting groove 3, and there is a second gap between the outer wall of the second carrier plate 22 and the inner wall of the limiting groove 3, ensuring that the floating displacement of the second carrier plate 22 can be accurately focused on correcting the alignment deviation between the upper plate module and the main board 200 under test, which significantly improves the consistency and repeatability of the alignment process.

[0029] In some embodiments, the first carrier plate 21 is provided with a plurality of first positioning holes, and the second carrier plate 22 is provided with a plurality of second positioning holes. Each first positioning hole is aligned with a second positioning hole. The motherboard testing device 100 also includes a plurality of positioning sleeves 10, which are arranged vertically. Each positioning sleeve 10 is located in a second positioning hole and is used to be fitted on the outside of the positioning post of the upper top plate module when the second carrier plate 22 is aligned with the upper top plate module, so that the positioning post passes through the corresponding first positioning hole and second positioning hole, thereby providing vertical guidance for the upwardly moving tray 2. In this embodiment, the diameter of the first positioning hole is larger than the diameter of the positioning sleeve 10. At the moment when the lifting component 6 drives the tray 2 to move upward and the second carrier plate 22 is aligned with the upper top plate module, the positioning post of the upper top plate module accurately enters the positioning sleeve 10 in the second positioning hole. As the tray 2 continues to move upward, the positioning post slides smoothly along the inner wall of the positioning sleeve 10. After the alignment is completed, the positioning post enters the second positioning hole, forming a stable vertical guide and effectively suppressing the horizontal offset and shaking of the tray 2.

[0030] In some embodiments, each first carrier plate 21 is provided with multiple sets of limiting post groups 23, each limiting post group 23 corresponding to a motherboard 200 under test, and including multiple limiting posts 231. The multiple limiting posts 231 penetrate through the second carrier plate 22 and are located around the mounting groove 4 of the second carrier plate 22, for limiting the corresponding motherboard 200 under test. In this embodiment, each motherboard 200 under test is provided with multiple through holes. When the motherboard 200 under test is placed on the second carrier plate 22, each through hole of the motherboard 200 under test is used to pass through a limiting post 231, realizing precise limiting of the motherboard 200 under test in the horizontal direction, effectively preventing the motherboard 200 under test from shifting during the upward movement of the tray 2, and significantly improving the reliability and stability of synchronous testing of multiple motherboards 200 under test.

[0031] In some embodiments, there are two trays 2, arranged on opposite sides of a support plate 1. The support plate 1 is configured to rotate in a controlled manner, causing the two trays 2 to alternately switch between a first station and a second station. The first station is used to load the motherboard under test 200, and the second station is used to test the motherboard under test 200. An upper platen module is arranged above the second station. Specifically, the support plate 1 is configured to rotate in a controlled manner to drive the two trays 2 to alternately switch between the first station and the second station. The first station is used to perform loading and unloading operations on the motherboard under test 200, and the upper platen module is arranged above the second station for testing the motherboard under test 200. Through the rotation of the support plate 1, the motherboard under test 200 on one tray 2 is tested at the second station while the other tray 2 is loaded and unloaded at the first station. This completely overlaps the testing time with the loading and unloading time, eliminating the waiting interval in traditional testing and greatly improving the utilization rate and testing efficiency of the motherboard testing device 100.

[0032] In some embodiments, the lifting assembly 6 includes a drive member 61, a lifting plate 62, and a bracket 63. The drive member 61 is arranged vertically and mounted on the bracket 63. The lifting plate 62 is mounted on top of the drive member 61 and is used to move the tray 2 located at the second station vertically under the drive of the drive member 61. Specifically, the drive member 61 is a cylinder. The lifting assembly 6 is located below the support plate 1 and directly below the upper plate module. When the cylinder drives the lifting plate 62 to move upward, it lifts the tray 2 located at the second station upward until the motherboard 200 to be tested on the tray 2 is aligned and in contact with the upper plate module for testing. After the test is completed, the cylinder drives the lifting plate 62 to reset downward, separating the tray 2 located at the second station from the upper plate module. The support plate 1 then rotates, returning the tested tray 2 to the first station for unloading and reloading, while simultaneously transferring another tray 2 loaded with the motherboard 200 to be tested from the first station to the second station. By coordinating the lifting motion of the lifting component 6 with the rotation of the support plate 1, the second station can be used cyclically, enabling continuous and automated testing of the motherboard 200 from the first station, thus ensuring the efficient and continuous operation of the motherboard testing device 100.

[0033] In some embodiments, the carrier plate 1 is provided with a plurality of second mounting holes, and the motherboard testing device 100 further includes a plurality of first guide posts 11, at least one guide post corresponding to a material tray 2. The top of each first guide post 11 passes through a second mounting hole and is connected to the bottom of the first carrier plate 21, for providing vertical guidance for the material tray 2 moving vertically. Specifically, when the lifting assembly 6 drives the material tray 2 located at the second station to move upward, a sliding fit is formed between the first guide post 11 and the second mounting hole, providing stable linear guidance for the vertical movement of the material tray 2, effectively suppressing the horizontal offset or torsion that occurs during the upward movement of the material tray 2, ensuring that the material tray 2 and the plurality of motherboards 200 under test carried by it can reliably contact the upper plate module with precise repeatability positioning accuracy, thereby ensuring the stability of the testing process.

[0034] In some embodiments, the motherboard testing device 100 further includes a plurality of guide sleeves 12, each guide sleeve 12 being fitted around the periphery of a first guide post 11 and located within a corresponding second mounting hole, so that the first guide post 11 can move vertically along the guide sleeve 12. In this embodiment, the guide sleeve 12, acting as a wear-resistant medium, is located between the first guide post 11 and the second mounting hole, eliminating the frictional loss caused by the first guide member, being a metal part, directly contacting the second mounting hole. Furthermore, the precise fit between the inner wall of the guide sleeve 12 and the first guide post 11 provides stable vertical movement for the lifting and lowering motion of the tray 2.

[0035] Specifically, in a preferred embodiment, the motherboard testing device 100 further includes a plurality of second guide posts 13, at least one second guide post 13 corresponding to a tray 2. Each second guide post 13 has a rod portion 132 and a head 131. The side of the rod portion 132 away from the head 131 passes through the support plate 1 and is connected to the bottom of the first support plate 21. When the lifting assembly 6 drives the tray 2 to move upward, the bottom of the support plate 1 abuts against the head 131 of the second guide post 13, limiting the maximum upward stroke of the tray 2 in the vertical direction.

[0036] This embodiment also provides a motherboard testing system, including the motherboard testing device 100 described above. Here, the motherboard testing device 100 will not be described in detail.

[0037] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A motherboard testing device, characterized in that, include: The support plate is installed horizontally; At least one tray includes a first carrier plate and a second carrier plate. The first carrier plate is mounted on the support plate and has a limiting groove. The second carrier plate is mounted in the limiting groove. The second carrier plate has multiple mounting grooves and multiple first mounting holes that extend vertically through it. Each mounting groove holds a motherboard to be tested. A lifting assembly, connected to the tray, is used to drive the tray to move vertically to align with the upper antenna module above the motherboard testing device, so that the test probes of the upper antenna module contact the motherboard under test, thereby testing the motherboard under test. Multiple connectors are provided, each connector passing through the first mounting hole of the second carrier plate and connecting the first carrier plate to the second carrier plate. There is a first gap between the outer wall of the connector and the outer wall of the first mounting hole, and a second gap between the second carrier plate and the inner wall of the limiting groove, so as to adjust the position of the second carrier plate in the horizontal direction when the second carrier plate is aligned with the upper plate module.

2. The motherboard testing device according to claim 1, characterized in that, The first mounting hole is a countersunk hole, and the connecting piece is a height-equalizing bolt.

3. The motherboard testing apparatus according to claim 2, characterized in that, The inner wall of the limiting groove has a first stepped structure and a second stepped structure. The first stepped structure includes a first part arranged vertically. The outer wall of the second carrier plate has a second part arranged at a distance from the first part. The second stepped structure includes a third part arranged vertically. The outer wall of the second carrier plate has a fourth part arranged at a distance from the third part.

4. The motherboard testing apparatus according to claim 3, characterized in that, The first carrier board is provided with a plurality of first positioning holes, and the second carrier board is provided with a plurality of second positioning holes, wherein each first positioning hole is aligned with one second positioning hole, and the motherboard testing device further includes: Multiple positioning sleeves are arranged vertically, each positioning sleeve being located within a second positioning hole. These sleeves are used to be fitted onto the outside of the positioning post of the upper platen module when the second carrier plate is aligned with the upper platen module, so that the positioning post passes through the corresponding first positioning hole and second positioning hole, thereby providing vertical guidance for the upwardly moving tray.

5. The motherboard testing apparatus according to claim 4, characterized in that, Each of the first carrier plates is provided with multiple sets of limiting posts. Each set of limiting posts corresponds to one motherboard under test and includes multiple limiting posts. The multiple limiting posts penetrate the second carrier plate and are located around the mounting slot of the second carrier plate, for limiting the corresponding motherboard under test.

6. The motherboard testing apparatus according to any one of claims 1-5, characterized in that, The number of material trays is two, and they are arranged on opposite sides of the support plate. The support plate is configured to rotate in a controlled manner so that the two material trays alternately occupy the first station and the second station. The first station is used to load the motherboard under test, and the second station is used to test the motherboard under test. The upper plate module is arranged above it.

7. The motherboard testing apparatus according to claim 6, characterized in that, The lifting assembly includes a drive component, a lifting plate, and a bracket. The drive component is arranged vertically and mounted on the bracket. The lifting plate is mounted on top of the drive component and is used to move the material tray located at the second work station vertically under the drive of the drive component.

8. The motherboard testing apparatus according to claim 7, characterized in that, The carrier plate is provided with multiple second mounting holes, and the motherboard testing device further includes: A plurality of first guide posts, at least one of the guide posts corresponding to one of the trays, each of the first guide posts having a second mounting hole through its top and being connected to the bottom of the first carrier plate for providing vertical guidance for the trays moving vertically.

9. The motherboard testing apparatus according to claim 8, characterized in that, Also includes: Multiple guide sleeves, each of which is fitted around the periphery of a first guide post and located within a corresponding second mounting hole, so that the first guide post can move vertically along the guide sleeve.

10. A motherboard testing system, characterized in that, Includes the motherboard testing device as described in any one of claims 1-9.

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