An aging test board integrated with a temperature uniform heat dissipation structure

Abstract

The utility model discloses an aging test carrier plate of integrated temperature uniform heat dissipation structure belongs to aging board technical field. Including having the aging board, the top surface of aging board has the capacitor installation area, and the capacitor installation area is used to install the capacitor to be tested, and the side surface of aging board is installed with the interface, and the bottom surface of aging board is connected with the heat -equalizing heat dissipation layer, and the heat -equalizing heat dissipation layer is used to absorb the heat of aging board, and the bottom surface of heat -equalizing heat dissipation layer is installed with the heat exchange mechanism, and the heat exchange mechanism is used to heat -exchange to the heat -equalizing heat dissipation layer, this technical scheme through ceramic substrate's uniform heat conduction, the heat diffusion of heat -equalizing heat dissipation layer, the two -way flow temperature control of heat exchange mechanism, and the temperature difference of aging board surface is controlled in the extremely small range in the multilink cooperation, solves the problem that the uneven temperature distribution leads to test data deviation in the prior art, ensures the consistency and reliability of data when the multiple stations parallel test.

Description

Technical Field

[0001] This utility model relates to the field of aging board technology, specifically to an aging test carrier board with an integrated temperature uniform heat dissipation structure. Background Technology

[0002] In the production of electronic components such as capacitors, aging testing is a crucial step in verifying their reliability. By operating under high temperature and high pressure for extended periods, products that fail early are screened out. The aging test substrate, as the core component carrying the tested components, directly affects the testing accuracy and efficiency due to its temperature uniformity and heat dissipation performance.

[0003] In existing technologies, aging test substrates typically use ordinary PCB boards as the base material and rely on external heating equipment to provide a high-temperature environment. This approach has the following drawbacks: First, the temperature distribution is uneven, with capacitors at different locations experiencing heating differences of 5-10°C, leading to deviations in test data. Second, the heat dissipation structure is poorly designed, easily resulting in localized overheating during high-temperature aging, affecting the accuracy of capacitor testing. Therefore, it is necessary to design an aging test substrate with an integrated temperature-uniform heat dissipation structure to solve these problems. Utility Model Content

[0004] The purpose of this invention is to provide an aging test substrate with an integrated temperature uniform heat dissipation structure to solve the problems mentioned in the background art.

[0005] In view of the above problems, the technical solution proposed by this utility model is as follows:

[0006] An aging test substrate with an integrated temperature uniform heat dissipation structure includes an aging board. The top surface of the aging board has a capacitor mounting area for mounting capacitors to be tested. Interfaces are mounted on the sides of the aging board. A heat dissipation layer is connected to the bottom surface of the aging board. This heat dissipation layer can quickly dissipate localized heat on the aging board, reducing temperature differences between different capacitor mounting locations. The heat dissipation layer also absorbs heat from the aging board. A heat exchange mechanism is mounted on the bottom surface of the heat dissipation layer to exchange heat with it. The heat dissipation layer and the heat exchange mechanism work together to form a complete heat dissipation chain of heat absorption-heat dissipation-heat dissipation, effectively avoiding localized overheating during the high-temperature aging process and ensuring test accuracy.

[0007] Furthermore, the heat dissipation layer includes a copper foil layer and a graphene heat dissipation film. The copper foil layer is adhered to the bottom surface of the aging board by thermally conductive adhesive, and the graphene heat dissipation film is attached to the bottom surface of the copper foil layer. The thickness of the copper foil layer is 0.2-0.5 mm, and the thickness of the graphene heat dissipation film is 0.05-0.1 mm. The copper foil layer and the graphene heat dissipation film can quickly balance the surface temperature of the aging board.

[0008] Furthermore, the heat exchange mechanism includes a bent tube installed on the bottom surface of the graphene heat dissipation film. Both ends of the bent tube are connected to a first conduit. The free ends of the first conduits are respectively connected to a first valve body and a second valve body. A second conduit is connected between the first valve bodies, and the second conduit is connected to a third valve body. Each pair of first conduits is connected to a third conduit. The third conduits are respectively connected to a fourth valve body and a fifth valve body. The coolant flows bidirectionally through the valve body control, effectively solving the temperature difference problem at the inlet and outlet ends of the bent tube caused by unidirectional flow, making the heat dissipation rate of each area of ​​the aging plate consistent. The bent tube can be arranged to fit the complex contour of the bottom surface of the graphene heat dissipation film, increasing the heat exchange area.

[0009] Furthermore, the capacitor mounting area includes multiple independent workstations, each of which is equipped with a conductive pad that matches the pins of the capacitor to be tested. The multiple independent workstations support the simultaneous testing of multiple capacitors.

[0010] Furthermore, the conductive pad surface is provided with a gold plating layer with a thickness of 0.01 to 0.03 mm, and the conductive pad edge is provided with a solder resist layer with a thickness of 0.02 to 0.05 mm. The gold plating layer effectively reduces contact resistance, and the solder resist layer isolates adjacent conductive pads. Under high temperature and high humidity aging test environment, it can prevent safety hazards such as leakage and short circuit.

[0011] Furthermore, the aging board is a ceramic substrate with a thickness of 2-5mm. The ceramic substrate can withstand high-temperature aging environments above 150℃ and will not deform after long-term use, thus solving the problem of easy aging and deformation of ordinary PCB boards under high temperatures.

[0012] Furthermore, the interface is connected to the conductive pads via internal circuitry. The internal circuitry directly connects the interface to the conductive pads, reducing signal loss and interference along the signal transmission path and ensuring the integrity and accuracy of the test signal.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the aging test carrier with integrated temperature uniform heat dissipation structure controls the surface temperature difference of the aging board to a very small range through the uniform heat conduction of the ceramic substrate, the heat diffusion of the heat dissipation layer, and the bidirectional flow temperature control of the heat exchange mechanism. This solves the problem of test data deviation caused by uneven temperature distribution in the prior art and ensures the consistency and reliability of data during multi-station parallel testing. Attached Figure Description

[0014] Figure 1 This is a first three-dimensional structural schematic diagram of the aging test substrate with an integrated temperature uniform heat dissipation structure disclosed in an embodiment of the present utility model.

[0015] Figure 2This is an exploded structural diagram of the aging test substrate with an integrated temperature uniform heat dissipation structure disclosed in an embodiment of the present utility model.

[0016] Figure 3 This is a top view of the aging test substrate with an integrated temperature uniform heat dissipation structure disclosed in an embodiment of the present invention.

[0017] Figure 4 This is a second three-dimensional structural diagram of the aging test substrate with an integrated temperature uniform heat dissipation structure disclosed in an embodiment of the present utility model.

[0018] Figure 5 for Figure 4 A magnified schematic diagram of structure A in the middle.

[0019] In the diagram: 1. Aging board; 2. Interface; 3. Workstation; 4. First conduit; 5. First valve body; 6. Second conduit; 7. Copper foil layer; 8. Graphene heat dissipation film; 9. Bend; 10. Third conduit; 11. Fourth valve body; 12. Second valve body; 13. Fifth valve body; 14. Third valve body. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1 - Figure 5 This utility model provides a technical solution: an aging test carrier plate with an integrated temperature uniform heat dissipation structure, including an aging plate 1. The top surface of the aging plate 1 has a capacitor mounting area for mounting a capacitor to be tested. An interface 2 is mounted on the side of the aging plate 1. A heat dissipation layer is connected to the bottom surface of the aging plate 1 to absorb the heat of the aging plate 1. A heat exchange mechanism is mounted on the bottom surface of the heat dissipation layer to exchange heat with the heat dissipation layer. The capacitor to be tested is mounted in the capacitor mounting area on the top surface of the aging plate 1, and the heat generated during operation is transferred to the aging plate 1. The heat of the aging plate 1 is quickly absorbed by the heat dissipation layer on the bottom surface, making the surface temperature distribution of the aging plate 1 tend to be uniform. The heat absorbed by the heat dissipation layer is discharged through the heat exchange mechanism in contact with its bottom surface to achieve continuous heat dissipation.

[0022] Specifically, the capacitor pins to be tested are inserted into the conductive pads and fixed by soldering or elastic contact. Interface 2 connects to external testing equipment, including but not limited to power supplies, signal generators, and data acquisition devices. The external testing equipment provides the capacitor with a preset high-temperature environment, rated operating voltage, or high-voltage stress. The capacitor under test operates continuously under the set environment. During this period, early failure phenomena such as oxidation and electrolyte evaporation may occur inside the capacitor. The carrier board maintains a stable temperature through a heat dissipation layer and a heat exchange mechanism to ensure that the capacitor ages under uniform stress. The external device collects the changes in capacitor parameters in real time through interface 2, including but not limited to capacitance decay, loss tangent, and leakage current. When the parameters exceed the preset threshold, the product is judged to be an early failure product.

[0023] As an embodiment of this utility model, the heat dissipation layer further includes a copper foil layer 7 and a graphene heat dissipation film 8. The copper foil layer 7 is adhered to the bottom surface of the aging board 1 by thermally conductive adhesive, and the graphene heat dissipation film 8 is attached to the bottom surface of the copper foil layer 7. The thickness of the copper foil layer 7 is 0.2-0.5 mm, and the thickness of the graphene heat dissipation film 8 is 0.05-0.1 mm. The copper foil layer 7 has excellent thermal conductivity and is tightly attached to the bottom surface of the aging board 1 by thermally conductive adhesive, which can quickly absorb heat from various areas of the aging board 1 and diffuse it laterally. The graphene heat dissipation film 8 is attached to the bottom surface of the copper foil layer 7 and, with its extremely high thermal conductivity, efficiently transfers the heat diffused by the copper foil layer 7 to the heat exchange mechanism below, accelerating heat dissipation.

[0024] As an embodiment of this utility model, the heat exchange mechanism further includes a bent pipe 9 installed on the bottom surface of the graphene heat dissipation film 8. Both ends of the bent pipe 9 are connected to first conduits 4. The free ends of the first conduits 4 are respectively connected to a first valve body 5 and a second valve body 12. A second conduit 6 is connected between the first valve bodies 5, and the second conduit 6 is connected to a third valve body 14. Each pair of first conduits 4 is connected to a third conduit 10. The third conduits 10 are respectively connected to a fourth valve body 11 and a fifth valve body 13. Coolant is output from the cooler. At this time, the first valve body 5 and the fourth valve body 11 are open, and the second valve body 12, the third valve body 14, and the fifth valve body 13 are closed. The coolant enters the bent pipe 9 through the second conduit 6, the first valve body 5, and the first conduit 4. After the coolant flows through the bend and absorbs the heat transferred by the graphene heat dissipation film 8, it flows back to the cooler through the first conduit 4, the third conduit 10, and the fourth valve body 11 at the other end. After a set time, the second valve body 12, the third valve body 14, and the fifth valve body 13 are switched on, while the first valve body 5 and the fourth valve body 11 are closed. The coolant enters the bend through the second valve body 12 and the first conduit 4, absorbs heat, and then flows back to the cooler through the first conduit 4, the third conduit 10, and the fifth valve body 13 at the other end. By periodically changing the flow direction of the coolant in the bend 9, uneven heat dissipation at both ends of the bend 9 due to long-term unidirectional flow is avoided, and the temperature at one end of the aging board 1 is prevented from being higher than that at the other end, thus further ensuring the overall temperature uniformity.

[0025] Specifically, the test chamber needs to have slots pre-cut for the conduits to extend out, and the conduits are fixed in the slots with sealant, while each valve body is located outside the test chamber.

[0026] On the other hand, the first valve body 5, the second valve body 12, the third valve body 14, the fourth valve body 11, and the fifth valve body 13 are all solenoid valves. Through an external timing controller, including but not limited to a PLC or microcontroller, with preset switching logic, the flow direction is switched periodically. Initial stage: The controller outputs a signal to energize and open the first valve body 5 and the fourth valve body 11, while the other valve bodies are de-energized and closed. The coolant operates in the first flow direction mode. Switching time t1: The controller triggers a switching signal, first closing the first valve body 5 and the fourth valve body 11, and then opening the second valve body 12, the third valve body 14, and the fifth valve body 13 after a delay of 0.5 to 1 second to prevent coolant backflow impact. At this time, the second flow direction mode is entered. Cyclic operation: The above switching process is repeated according to a set cycle to ensure balanced heat dissipation at both ends of the bend 9.

[0027] As an embodiment of this utility model, the capacitor mounting area further includes multiple independent workstations 3, each workstation 3 is provided with a conductive pad that matches the pins of the capacitor to be tested. The conductive pad of each independent workstation 3 matches the pins of the capacitor to be tested, and mechanical fixation and electrical connection are achieved by welding or plugging. Multiple independent workstations 3 can install multiple capacitors to be tested at the same time. Each workstation is independently isolated from the other through the internal circuit of the aging board 1, ensuring that the testing process of a single capacitor does not affect other workstations 3, and realizing batch parallel testing.

[0028] As an embodiment of this utility model, the conductive pad surface is further provided with a gold plating layer with a thickness of 0.01 to 0.03 mm, and the edge of the conductive pad is provided with a solder resist layer with a thickness of 0.02 to 0.05 mm. The gold plating layer on the surface of the conductive pad has excellent conductivity and oxidation resistance, which can reduce the contact resistance between the capacitor pin under test and the pad, ensure stable transmission of electrical signals, and prevent the pad from oxidizing and failing under high temperature aging conditions. The solder resist layer at the edge of the conductive pad can isolate the current conduction between adjacent pads, avoid short circuits, and protect the surface circuit of the aging board 1.

[0029] As an embodiment of this utility model, the aging plate 1 is further made of ceramic substrate and the thickness of the aging plate 1 is 2-5mm. The ceramic substrate has excellent high temperature resistance and thermal conductivity. The thickness of 2-5mm can provide sufficient structural strength to support the capacitor under test and the surface circuit, while uniformly transferring the heat generated by the capacitor to the heat dissipation layer on the bottom surface.

[0030] As an embodiment of this utility model, interface 2 is further connected to conductive pads through internal circuitry. Interface 2 serves as the connection hub between external testing equipment and the capacitor under test. External power and test signals are transmitted to the conductive pads of each station 3 through the conductive circuitry inside the aging board 1, and then transmitted to the capacitor under test through the conductive pads. At the same time, the response signal of the capacitor under test is transmitted back to interface 2 through the conductive pads and internal circuitry, and fed back to the external testing equipment, forming a complete signal closed loop.

[0031] It should be noted that all standard parts used in this application can be purchased from the market, and can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The control method is automatic control through a control cabinet. The control circuit can be implemented by simple programming by those skilled in the art and is common knowledge in the field. Furthermore, since this application is mainly used to protect mechanical devices, this application will not explain the control method and circuit connection in detail.

Claims

1. An aging test substrate with an integrated temperature uniform heat dissipation structure, characterized in that, The device includes an aging board (1), the top surface of which has a capacitor mounting area for mounting a capacitor to be tested, the side surface of which has an interface (2), the bottom surface of which is connected to a heat dissipation layer for absorbing heat from the aging board (1), and the bottom surface of which has a heat exchange mechanism for exchanging heat with the heat dissipation layer.

2. The aging test substrate with an integrated temperature uniform heat dissipation structure according to claim 1, characterized in that, The heat dissipation layer includes a copper foil layer (7) and a graphene heat dissipation film (8). The copper foil layer (7) is adhered to the bottom surface of the aging board (1) by thermally conductive adhesive. The graphene heat dissipation film (8) is attached to the bottom surface of the copper foil layer (7). The thickness of the copper foil layer (7) is 0.2 to 0.5 mm, and the thickness of the graphene heat dissipation film (8) is 0.05 to 0.1 mm.

3. The aging test substrate with an integrated temperature uniform heat dissipation structure according to claim 2, characterized in that, The heat exchange mechanism includes a bent tube (9) installed on the bottom surface of the graphene heat dissipation film (8). Both ends of the bent tube (9) are connected to a first conduit (4). The free ends of the first conduit (4) are respectively connected to a first valve body (5) and a second valve body (12). The first valve bodies (5) are connected to a second conduit (6), and the second conduit (6) is connected to a third valve body (14). Each pair of first conduits (4) is connected to a third conduit (10). The third conduit (10) is respectively connected to a fourth valve body (11) and a fifth valve body (13).

4. The aging test substrate with an integrated temperature uniform heat dissipation structure according to claim 1, characterized in that, The capacitor mounting area includes multiple independent workstations (3), each of which is provided with a conductive pad that matches the pins of the capacitor to be tested.

5. The aging test substrate with an integrated temperature uniform heat dissipation structure according to claim 4, characterized in that, The conductive pad has a gold plating layer on its surface, the thickness of which is 0.01 to 0.03 mm, and the edge of the conductive pad has a solder resist layer, the thickness of which is 0.02 to 0.05 mm.

6. The aging test substrate with an integrated temperature uniform heat dissipation structure according to claim 1, characterized in that, The aging board (1) is a ceramic substrate, and the thickness of the aging board (1) is 2-5 mm.

7. The aging test substrate with an integrated temperature uniform heat dissipation structure according to claim 4, characterized in that, The interface (2) is connected to the conductive pads through internal circuitry.

Images