Eight-inch wafer detection dedicated probe equipment

Abstract

The utility model relates to eight inches wafer detection field, specifically is eight inches wafer detection special probe equipment, including probe detection device body, the probe detection device body includes base, and the top fixed coupling of base has longitudinal slide rail and horizontal slide rail, the utility model discloses through probe detection device body and multi -jaw chucking mechanism, before probe detection device body carries out probe detection to wafer, through eight arc clamping plates of multi -jaw chucking mechanism to wafer clamping fixed, compared with traditional three -jaw chucking, increased the clamping area to wafer, reduced the stress that clamping produced to wafer, avoided the condition of causing damage to wafer to a certain extent, solved the clamping method on general probe detection device more for three -point chucking, but wafer itself thickness is thin, is fragile, possibly will due to three -point chucking stress and lead to edge collapse, thereby causes wafer damage problem.

Description

Technical Field

[0001] This utility model relates to the field of eight-inch wafer inspection, specifically to a dedicated probe device for eight-inch wafer inspection. Background Technology

[0002] Eight-inch wafer inspection refers to a critical quality control step in the semiconductor manufacturing process, which involves electrical testing, defect inspection, or parameter measurement of chips on an eight-inch wafer. This ensures that the chips are functionally qualified before they are cut and packaged. Probe testing devices are generally used in the inspection process.

[0003] When performing probe testing on an 8-inch wafer, the wafer needs to be clamped first. However, the clamping method on most probe testing devices is three-point clamping. But the wafer itself is thin and fragile, and the clamping stress at the three points may cause edge chipping, thus damaging the wafer. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, the clamping method on general probe inspection devices is mostly three-point clamping. However, the wafer itself is thin and fragile, and the clamping stress at the three points may cause edge chipping, resulting in wafer damage. This utility model proposes a special probe device for eight-inch wafer inspection.

[0005] The technical solution adopted by this utility model to solve its technical problem is: an eight-inch wafer inspection probe device, including a probe inspection device body, the probe inspection device body including a base, the top of the base being fixedly connected to a longitudinal slide rail and a transverse slide rail, the surface of the transverse slide rail being movably connected to a sliding support block, the top of the sliding support block being fixedly connected to a placement stage, the top of the base being fixedly connected to a mounting frame, the top of the mounting frame being fixedly connected to a probe inspection mechanism, the number of probe inspection mechanisms being four, the surface of the mounting frame being fixedly connected to a microscope camera, and the bottom of the placement stage being provided with a multi-claw clamping mechanism;

[0006] The multi-claw clamping mechanism includes a rotating disk, the top of which is movably connected to the bottom of the placement platform. A sliding column is movably connected to the inner cavity of the rotating disk, and the inner cavity of the rotating disk is movably connected to the surface of the sliding support block. There are eight sliding columns, and a sliding rod is fixedly connected to the top of each sliding column. An arc-shaped clamping plate is fixedly connected to the surface of the sliding rod.

[0007] Preferably, the surface of the rotating disk is provided with guide grooves, and the number of guide grooves is eight. The inner cavity of each guide groove is movably connected to the surface of a sliding column.

[0008] Preferably, the surface of the placement platform is provided with eight sliding grooves, and the inner cavity of each sliding groove is movably connected to the surface of a sliding rod.

[0009] Preferably, an anti-slip strip is fixedly connected to the inner side of the arc-shaped clamping plate, and the anti-slip strip is made of rubber.

[0010] Preferably, a second bevel gear is fixedly connected to the surface of the sliding support block, a first bevel gear is meshed with the teeth of the second bevel gear, a damping shaft is movably connected to the surface of the first bevel gear, a rotating block is fixedly connected to one end of the damping shaft, and a fixing frame is threaded onto the surface of the damping shaft.

[0011] Preferably, a support frame is fixedly connected to the bottom of the fixed frame, and the surface of the support frame is fixedly connected to the surface of the sliding support block.

[0012] Preferably, a limiting ring is fixedly connected to the surface of the sliding support block, and the top of the limiting ring is movably connected to the surface of the second bevel gear.

[0013] The advantages of this utility model are:

[0014] This invention utilizes a probe inspection device body and a multi-jaw clamping mechanism. Before the probe inspection device body performs probe inspection on the wafer, the eight arc-shaped clamping plates of the multi-jaw clamping mechanism clamp and fix the wafer. Compared with the traditional three-jaw clamping, this increases the clamping area of ​​the wafer and reduces the stress generated by clamping, thus avoiding damage to the wafer to a certain extent. It also solves the problem that the clamping method in general probe inspection devices is mostly three-point clamping, but the wafer itself is thin and fragile, and the clamping stress at three points may cause edge chipping, thereby damaging the wafer. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the overall bottom view of the present invention;

[0018] Figure 3 This is a schematic diagram of the internal structure of the rotating disk of this utility model;

[0019] Figure 4 This is an exploded structural diagram of the placement platform of this utility model.

[0020] In the diagram: 1. Probe detection device body; 101. Base; 102. Longitudinal slide rail; 103. Transverse slide rail; 104. Sliding support block; 105. Placement stage; 106. Microscope camera; 107. Probe detection mechanism; 108. Mounting frame; 2. Multi-jaw clamping mechanism; 201. Rotary disk; 202. Fixing frame; 203. Arc-shaped clamping plate; 204. Support frame; 205. Damping rotating shaft; 206. Rotating block; 207. First bevel gear; 208. Limiting ring; 209. Second bevel gear; 210. Sliding rod; 211. Sliding column; 212. Anti-slip strip; 213. Sliding groove; 214. Guide groove. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0022] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0023] This application discloses a dedicated probe device for 8-inch wafer inspection. (Refer to...) Figure 1 and Figure 4 An 8-inch wafer inspection probe device includes a probe inspection device body 1, which includes a base 101. The top of the base 101 is fixedly connected to a longitudinal slide rail 102 and a transverse slide rail 103. A sliding support block 104 is movably connected to the surface of the transverse slide rail 103. A placement stage 105 is fixedly connected to the top of the sliding support block 104. A mounting frame 108 is fixedly connected to the top of the base 101. A probe inspection mechanism 107 is fixedly connected to the top of the mounting frame 108. There are four probe inspection mechanisms 107. A microscope camera 106 is fixedly connected to the surface of the mounting frame 108. A multi-claw clamping mechanism 2 is provided at the bottom of the placement stage 105.

[0024] The multi-jaw clamping mechanism 2 includes a rotating disk 201. The top of the rotating disk 201 is movably connected to the bottom of the placement platform 105. A sliding column 211 is movably connected to the inner cavity of the rotating disk 201. The inner cavity of the rotating disk 201 is movably connected to the surface of the sliding support block 104. There are eight sliding columns 211. A sliding rod 210 is fixedly connected to the top of each sliding column 211. An arc-shaped clamping plate 203 is fixedly connected to the surface of the sliding rod 210.

[0025] Reference Figure 4 The surface of the rotating disk 201 is provided with guide grooves 214, and there are eight guide grooves 214. The inner cavity of each guide groove 214 is movably connected to the surface of a sliding column 211. Because the guide grooves 214 are arc-shaped, when the rotating disk 201 rotates, the sliding column 211 is driven to slide along the inner cavity of the guide groove 214, which can drive the sliding rod 210 to slide to the outside or center of the rotating disk 201, indirectly driving the arc-shaped clamping plate 203 to move. When the arc-shaped clamping plate 203 moves to the center of the rotating disk 201 and contacts the wafer surface, it fixes and clamps the wafer.

[0026] Reference Figure 4 The surface of the placement platform 105 is provided with sliding grooves 213. There are eight sliding grooves 213. The inner cavity of each sliding groove 213 is movably connected to the surface of a sliding rod 210. The sliding grooves 213 guide the sliding rod 210 in the inner cavity of the placement platform 105, thereby improving the stability of the sliding rod 210 in the inner cavity of the placement platform 105.

[0027] Reference Figure 3 and Figure 4 An anti-slip strip 212 is fixedly connected to the inner side of the arc-shaped clamping plate 203. The anti-slip strip 212 is made of rubber. By setting the anti-slip strip 212, the rubber material of the anti-slip strip 212 increases the friction when it contacts the wafer, and also reduces the force generated by the direct hard contact between the arc-shaped clamping plate 203 and the wafer, thus reducing the possibility of the arc-shaped clamping plate 203 damaging the wafer.

[0028] Reference Figure 3A second bevel gear 209 is fixedly connected to the surface of the sliding support block 104. The teeth of the second bevel gear 209 are meshed with a first bevel gear 207. A damping shaft 205 is movably connected to the surface of the first bevel gear 207. A rotating block 206 is fixedly connected to one end of the damping shaft 205. A fixing frame 202 is threaded onto the surface of the damping shaft 205. The fixing frame 202, the damping shaft 205, the rotating block 206, the first bevel gear 207, and the second bevel gear 209 work together. By rotating the rotating block 206, the damping shaft 205 is rotated, which in turn drives the first bevel gear 207 to rotate. The first bevel gear 207 drives the second bevel gear 209 to mesh and rotate, ultimately driving the rotating disk 201 to rotate, thus achieving a transmission function.

[0029] Reference Figure 3 A support frame 204 is fixedly connected to the bottom of the fixed frame 202. The surface of the support frame 204 is fixedly connected to the surface of the sliding support block 104. The support frame 204 provides a fixed support for the fixed frame 202, preventing the fixed frame 202 from falling due to gravity and indirectly affecting the meshing of the first bevel gear 207 and the second bevel gear 209.

[0030] Reference Figure 3 A limiting ring 208 is fixedly connected to the surface of the sliding support block 104. The top of the limiting ring 208 is movably connected to the surface of the second bevel gear 209. By setting the limiting ring 208, the second bevel gear 209 is supported without affecting its rotation, thus preventing it from falling due to gravity. This also indirectly prevents the rotating disk 201 from falling, thus avoiding the situation where the sliding column 211 cannot slide within the inner cavity of the rotating disk 201 when it rotates.

[0031] Working principle: When performing probe testing on a wafer, the wafer is first placed on the surface of the placement stage 105 and fixed by a clamping device. Then, the wafer is observed through a computer screen connected to a microscope camera 106. Next, the sliding support block 104 is moved, sliding onto the surface of the horizontal slide rail 103 to adjust the wafer's lateral position. Pushing or pulling the sliding support block 104 indirectly slides the horizontal slide rail 103 onto the surface of the vertical slide rail 102, adjusting the wafer's longitudinal position. Then, in conjunction with the probe testing mechanism 107 connected to the computer, the wafer is tested. This is existing technology and will not be elaborated further. To avoid the excessive stress on the wafer caused by traditional three-point clamping, which could potentially damage the wafer, a multi-jaw clamping mechanism 2 can be used for multi-point clamping. First, the wafer is placed on the surface of the placement stage 105, then the rotating block 2 is rotated... 06. The damping shaft 205 is rotated within the cavity of the fixed frame 202 by the rotating block 206. The fixed frame 202 drives the first bevel gear 207 to rotate, which in turn drives the second bevel gear 209 to mesh and rotate. The second bevel gear 209 drives the rotating disk 201 to rotate, which in turn drives the sliding column 211 to slide within the guide groove 214 of the rotating disk 201. The sliding column 211 drives the sliding rod 210 to slide towards the center of the rotating disk 201, which in turn drives the arc-shaped clamping plate 203 to move. The arc-shaped clamping plate 203 drives the anti-slip strip 212 to contact the surface of the wafer, thereby clamping and fixing the wafer. Since there are eight arc-shaped clamping plates 203, compared with the traditional three-point clamping, the stress generated by clamping the wafer is reduced, and the situation of wafer damage caused by excessive clamping stress is reduced.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A probe device for 8-inch wafer inspection, comprising a probe inspection device body (1), characterized in that: The probe detection device body (1) includes a base (101), a longitudinal slide rail (102) and a transverse slide rail (103) are fixedly connected to the top of the base (101), a sliding support block (104) is movably connected to the surface of the transverse slide rail (103), a placement platform (105) is fixedly connected to the top of the sliding support block (104), a mounting frame (108) is fixedly connected to the top of the base (101), a probe detection mechanism (107) is fixedly connected to the top of the mounting frame (108), and there are four probe detection mechanisms (107). A microscope camera (106) is fixedly connected to the surface of the mounting frame (108), and a multi-claw clamping mechanism (2) is provided at the bottom of the placement platform (105). The multi-claw clamping mechanism (2) includes a rotating disk (201), the top of which is movably connected to the bottom of the placement platform (105). A sliding column (211) is movably connected to the inner cavity of the rotating disk (201), and the inner cavity of the rotating disk (201) is movably connected to the surface of the sliding support block (104). There are eight sliding columns (211), and a sliding rod (210) is fixedly connected to the top of each sliding column (211). An arc-shaped clamping plate (203) is fixedly connected to the surface of the sliding rod (210).

2. The eight-inch wafer inspection probe device according to claim 1, characterized in that: The surface of the rotating disk (201) is provided with guide grooves (214), and there are eight guide grooves (214). The inner cavity of each guide groove (214) is movably connected to the surface of a sliding column (211).

3. The eight-inch wafer inspection probe device according to claim 1, characterized in that: The surface of the placement platform (105) is provided with sliding grooves (213), and there are eight sliding grooves (213). The inner cavity of each sliding groove (213) is movably connected to the surface of a sliding rod (210).

4. The eight-inch wafer inspection probe device according to claim 1, characterized in that: The inner side of the arc-shaped clamping plate (203) is fixedly connected with an anti-slip strip (212), which is made of rubber.

5. The eight-inch wafer inspection probe device according to claim 1, characterized in that: A second bevel gear (209) is fixedly connected to the surface of the sliding support block (104). A first bevel gear (207) is meshed with the teeth of the second bevel gear (209). A damping shaft (205) is movably connected to the surface of the first bevel gear (207). A rotating block (206) is fixedly connected to one end of the damping shaft (205). A fixing bracket (202) is threaded onto the surface of the damping shaft (205).

6. The eight-inch wafer inspection probe device according to claim 5, characterized in that: The bottom of the fixed frame (202) is fixedly connected to a support frame (204), and the surface of the support frame (204) is fixedly connected to the surface of the sliding support block (104).

7. The eight-inch wafer inspection probe device according to claim 1, characterized in that: A limiting ring (208) is fixedly connected to the surface of the sliding support block (104), and the top of the limiting ring (208) is movably connected to the surface of the second bevel gear (209).

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