A semiconductor chip package test fixture

Abstract

The utility model discloses a kind of semiconductor chip packaging test fixtures, the fixture aims at solving the test seat of existing test fixture is recessed design, the influence of packaging precision possibly exists the case that semiconductor chip is stuck in test fixture, leading to product removal difficult problem. The fixture includes base, test plate and semiconductor chip, the upper surface of base is provided with mounting groove, the inner bottom wall of mounting groove is fixedly connected with support column in four corners, test plate is fixedly connected at the top of support column by screw, and through hole is provided on test plate and edge is equipped with annular test seat. The utility model is set in the inside of mounting groove of base by ejector assembly, when semiconductor chip test is completed, push button is pressed to push ejector block and ejector rod to move upwards, semiconductor chip in test hole is pushed out, to avoid the size of packaged semiconductor chip exists upper tolerance when leading to product removal difficult, effectively solve the problem of packaging test fixture jam.

Description

Technical Field

[0001] This utility model belongs to the field of chip packaging and testing technology, and specifically relates to a semiconductor chip packaging and testing fixture. Background Technology

[0002] Semiconductor chips, as core components of electronic devices, are widely used in various fields, from smartphones and computers to automotive electronics and IoT devices. Their performance and quality directly affect the functionality and reliability of electronic devices. With the continuous advancement of semiconductor technology, chips are becoming increasingly integrated and smaller in size. This places higher demands on chip packaging and testing, requiring die bonding, wire bonding, and other packaging processes before testing can begin.

[0003] Existing test fixtures are designed according to the size of the semiconductor chip being tested. Since the test fixture is recessed, when there are upper tolerances in the package size of the semiconductor chip, the package accuracy may cause the semiconductor chip to get stuck in the test fixture, making it difficult to remove the product. Utility Model Content

[0004] (1) Technical problems to be solved To address the shortcomings of existing technologies, the purpose of this utility model is to provide a semiconductor chip packaging test fixture. This fixture aims to solve the problem that the test base of existing test fixtures is designed with a concave shape, which may cause the semiconductor chip to get stuck in the test fixture due to the influence of packaging accuracy, making it difficult to remove the product.

[0005] (2) Technical solution To address the aforementioned technical problems, this utility model provides a semiconductor chip packaging test fixture, comprising a base, a test board, and a semiconductor chip. The upper surface of the base has a mounting groove, and support pillars are fixedly connected to the four corners of the inner bottom wall of the mounting groove. The test board is fixedly connected to the top of the support pillars by screws. The test board has through holes and annular test seats mounted on its edges. A top plate is fixedly connected to the upper surface of the base, and a test hole corresponding to the annular test seat is formed on the top plate. The semiconductor chip is located inside the test hole. A positioning component is provided on the left side of the upper surface of the top plate to ensure tight contact between the semiconductor chip and the annular test seat. An ejection component corresponding to the through hole is provided at the bottom of the mounting groove.

[0006] Preferably, the test hole is adapted to the size of the semiconductor chip, and the top of the test hole gradually increases outward.

[0007] Furthermore, the positioning component includes a column fixedly connected to the left side of the upper surface of the top plate, a horizontal plate rotatably connected to the top of the column via a bearing, a vertical rod slidably inserted into the other end of the horizontal plate, a handle fixedly connected to the top of the vertical rod, a pressure plate fixedly connected to the bottom of the vertical rod, and a first spring sleeved on the outer surface of the vertical rod between the pressure plate and the horizontal plate.

[0008] Furthermore, an anti-slip pad made of rubber is fixedly connected to the lower surface of the pressure plate.

[0009] Furthermore, the ejector assembly includes an ejector block that is movably inserted into the bottom of the mounting slot. Each of the four corners of the upper surface of the ejector block is fixedly connected to a push rod. The base has a cavity inside, and a movable block is set inside the cavity. The movable block has an oblique hole. A rectangular rod is fixedly connected to the right side of the movable block. The right side of the rectangular rod passes through the base and is fixedly connected to a button. The rectangular rod is slidably connected to the base. A cylinder is rotatably connected to the front of the ejector block. The cylinder is located inside the oblique hole.

[0010] Furthermore, a second spring is fitted onto the outer surface of the rectangular rod. One end of the second spring is fixedly connected to the inner wall of the cavity, and the other end of the second spring is fixedly connected to the movable block.

[0011] Furthermore, mounting holes are provided at all four corners of the base, extending through the upper and lower sides of the base.

[0012] (3) Beneficial effects Compared with the prior art, the beneficial effects of this utility model are as follows: 1. This utility model uses a test hole to make the semiconductor chip accurately contact the ring test seat contact on the test board. Then, the horizontal plate is rotated around the column to move the pressure plate above the semiconductor chip and clamp and fix the semiconductor chip, thereby achieving a stable and reliable electrical connection, accurately transmitting test signals, and improving the stability of semiconductor chip detection. 2. This utility model sets an ejection component inside the mounting slot of the base. After the semiconductor chip test is completed, pressing the button pushes the ejection block and ejector rod to move upward. During the movement, the ejector rod can pass through the through hole and push out the semiconductor chip in the test hole, thereby avoiding the difficulty of removing the product when there is a large tolerance in the size of the packaged semiconductor chip, and effectively solving the problem of material jamming in the packaging test fixture. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is the utility model Figure 1 A magnified schematic diagram of the positioning component.

[0015] Figure 3This is a schematic diagram of the installation structure of this utility model.

[0016] Figure 4 This is a frontal cross-sectional structural diagram of the present invention.

[0017] Figure 5 This is the utility model Figure 4 A magnified structural diagram of point A in the middle.

[0018] Figure 6 This is an exploded structural diagram of the present invention.

[0019] The labels in the attached diagram are as follows: 1. Base; 2. Test board; 3. Semiconductor chip; 4. Mounting slot; 5. Support column; 6. Through hole; 7. Annular test seat; 8. Top plate; 9. Test hole; 10. Positioning component; 11. Ejection component; 12. Mounting hole; 1001. Column; 1002. Horizontal plate; 1003. Vertical rod; 1004. Handle; 1005. Pressure plate; 1006. First spring; 1007. Anti-slip pad; 1101. Ejection block; 1102. Ejection rod; 1103. Cavity; 1104. Movable block; 1105. Angled hole; 1106. Rectangular rod; 1107. Button; 1108. Cylinder; 1109. Second spring. Detailed Implementation

[0020] This specific embodiment is a semiconductor chip packaging and testing fixture, the structural schematic diagram of which is shown below. Figures 1-6 As shown, the fixture includes a base 1, a test board 2, and a semiconductor chip 3. The upper surface of the base 1 has a mounting groove 4. Support columns 5 are fixedly connected to the four corners of the inner bottom wall of the mounting groove 4. The test board 2 is fixedly connected to the top of the support columns 5 by screws. The front of the mounting groove 4 has a through groove. The connector of the test board 2 is connected to an external device from the through groove. The test board 2 has a through hole 6 and an annular test seat 7 is installed on its edge. The upper surface of the base 1 is fixedly connected to a top plate 8. The top plate 8 has a test hole 9 corresponding to the annular test seat 7. The semiconductor chip 3 is located inside the test hole 9. A positioning component 10 is provided on the left side of the upper surface of the top plate 8. The positioning component 10 is used to make the semiconductor chip 3 and the annular test seat 7 in close contact. An ejection component 11 corresponding to the through hole 6 is provided at the bottom of the mounting groove 4.

[0021] like Figure 4 and Figure 5 As shown: In this embodiment, the test hole 9 is adapted to the size of the semiconductor chip 3, and the top of the test hole 9 gradually increases outward; in this way, the semiconductor chip 3 can be accurately contacted with the contact point of the annular test seat 7 on the test board 2 through the test hole 9, and at the same time, the top of the test hole 9 is convenient for guiding the semiconductor chip 3 and making it easier to put it into the test hole 9.

[0022] likeFigure 1 and Figure 2 As shown: In this embodiment, the positioning component 10 includes a column 1001 fixedly connected to the left side of the upper surface of the top plate 8. A horizontal plate 1002 is rotatably connected to the top of the column 1001 via a bearing. A vertical rod 1003 is slidably inserted into the other end of the horizontal plate 1002. A handle 1004 is fixedly connected to the top of the vertical rod 1003. A pressure plate 1005 is fixedly connected to the bottom of the vertical rod 1003. A first spring 1006 is sleeved on the outer surface of the vertical rod 1003, located between the pressure plate 1005 and the horizontal plate 1002. After the semiconductor chip 3 is placed in the ring test holder 7, the handle 1004 is pulled to move the vertical rod 1003 and the pressure plate 1005 upward and compress the first spring 1006. Then, the horizontal plate 1002 is rotated around the column 1001, so that the pressure plate 1005 moves above the semiconductor chip 3. Then, the handle 1004 is released, and the restoring force of the first spring 1006 causes the pressure plate 1005 to move downward to clamp and fix the semiconductor chip 3, thereby achieving a stable and reliable electrical connection and accurately transmitting test signals.

[0023] like Figure 2 As shown: In this embodiment, an anti-slip pad 1007 is fixedly connected to the lower surface of the pressure plate 1005. The anti-slip pad 1007 is made of rubber. The anti-slip pad 1007 increases the friction between the anti-slip pad and the semiconductor chip 3, thus preventing slippage.

[0024] like Figure 4 , Figure 5 and Figure 6 As shown: In this embodiment, the ejector assembly 11 includes an ejector block 1101 that is movably inserted into the bottom of the mounting groove 4. The ejector block 1101 has a rectangular structure that can slide up and down without falling off. Ejector rods 1102 are fixedly connected to the four corners of the upper surface of the ejector block 1101. A cavity 1103 is provided inside the base 1. A movable block 1104 is provided inside the cavity 1103. An oblique hole 1105 is provided on the movable block 1104. A rectangular rod 1106 is fixedly connected to the right side of the movable block 1104. The right side of the rectangular rod 1106 passes through the base 1 and is fixedly connected to a button 1107. The rectangular rod 1106 is slidably connected to the base 1, ejecting... A cylinder 1108 is rotatably connected to the front of block 1101. The cylinder 1108 is located inside the oblique hole 1105. After the semiconductor chip 3 is tested, pressing button 1107 drives the rectangular rod 1106 and movable block 1104 to move to the left. Since the cylinder 1108 is located inside the oblique hole 1105, the movable block 1104 can push the cylinder 1108, ejection block 1101 and ejector rod 1102 to move upward during the leftward movement. During the movement, the ejector rod 1102 can pass through the through hole 6 and push out the semiconductor chip 3 in the test hole 9, thereby avoiding the difficulty of product removal when the packaged semiconductor chip 3 has upper tolerance in size.

[0025] like Figure 4 and Figure 5 As shown: In this embodiment, a second spring 1109 is sleeved on the outer surface of the rectangular rod 1106. One end of the second spring 1109 is fixedly connected to the inner wall of the cavity 1103, and the other end of the second spring 1109 is fixedly connected to the movable block 1104. By pressing the button 1107, the rectangular rod 1106 and the movable block 1104 are moved to the left and the second spring 1109 is stretched. After releasing the button 1107, the restoring force of the second spring 1109 causes the ejector block 1101 and the ejector rod 1102 to reset downwards, thereby facilitating the next inspection of the semiconductor chip 3.

[0026] like Figure 1 and Figure 3 As shown: In this embodiment, mounting holes 12 are provided at all four corners of the base 1, and the mounting holes 12 penetrate through the upper and lower sides of the base 1; in this way, the clamp can be fixed to the base plate through the mounting holes 12 to prevent movement.

[0027] Working principle: By placing the semiconductor chip 3 into the test hole 9 of the top plate 8, the semiconductor chip 3 makes accurate contact with the contact point of the annular test seat 7 on the test plate 2 through the test hole 9. Then, pulling the handle 1004 moves the vertical rod 1003 and the pressure plate 1005 upward and compresses the first spring 1006. Then, rotating the horizontal plate 1002 around the column 1001 moves the pressure plate 1005 above the semiconductor chip 3. Then, releasing the handle 1004, the restoring force of the first spring 1006 moves the pressure plate 1005 and the anti-slip pad 1007 downward to clamp and fix the semiconductor chip 3, thereby achieving stable and reliable electrical... The connection accurately transmits test signals. After the test is completed, pressing button 1107 drives the rectangular rod 1106 and the movable block 1104 to move to the left and stretch the second spring 1109. Since the cylinder 1108 is located inside the inclined hole 1105, the movable block 1104 can push the cylinder 1108, the ejector block 1101 and the ejector rod 1102 to move upward during the leftward movement. During the movement, the ejector rod 1102 can pass through the through hole 6 and push out the semiconductor chip 3 in the test hole 9, thereby avoiding the difficulty of product removal when the packaged semiconductor chip 3 has upper tolerances, and effectively solving the problem of material jamming in the packaging test fixture.

[0028] All technical features in this embodiment can be freely combined according to actual needs.

[0029] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A semiconductor chip packaging test fixture, the fixture comprising a base (1), a test board (2), and a semiconductor chip (3), characterized in that: The upper surface of the base (1) is provided with an installation groove (4). The four corners of the inner bottom wall of the installation groove (4) are fixedly connected with support columns (5). The test plate (2) is fixedly connected to the top of the support column (5) by screws. The test plate (2) is provided with a through hole (6) and an annular test seat (7) is installed on the edge. The upper surface of the base (1) is fixedly connected with a top plate (8). The top plate (8) is provided with a test hole (9) corresponding to the annular test seat (7). The semiconductor chip (3) is located inside the test hole (9). The left side of the upper surface of the top plate (8) is provided with a positioning component (10). The positioning component (10) is used to make the semiconductor chip (3) and the annular test seat (7) in close contact. The bottom of the installation groove (4) is provided with an ejection component (11) corresponding to the through hole (6).

2. The semiconductor chip packaging and testing fixture according to claim 1, characterized in that, The test hole (9) is adapted to the size of the semiconductor chip (3), and the top of the test hole (9) gradually increases outward.

3. The semiconductor chip packaging and testing fixture according to claim 2, characterized in that, The positioning component (10) includes a column (1001) fixedly connected to the left side of the upper surface of the top plate (8). The top end of the column (1001) is rotatably connected to a horizontal plate (1002) via a bearing. The other end of the horizontal plate (1002) is slidably inserted with a vertical rod (1003). The top end of the vertical rod (1003) is fixedly connected to a handle (1004). The bottom end of the vertical rod (1003) is fixedly connected to a pressure plate (1005). A first spring (1006) is sleeved on the outer surface of the vertical rod (1003) between the pressure plate (1005) and the horizontal plate (1002).

4. The semiconductor chip packaging and testing fixture according to claim 3, characterized in that, An anti-slip pad (1007) is fixedly connected to the lower surface of the pressure plate (1005), and the anti-slip pad (1007) is made of rubber.

5. The semiconductor chip packaging and testing fixture according to claim 4, characterized in that, The ejection assembly (11) includes an ejection block (1101) that is movably inserted into the bottom of the mounting groove (4). The four corners of the upper surface of the ejection block (1101) are fixedly connected to the ejection rods (1102). The base (1) has a cavity (1103) inside. The cavity (1103) has a movable block (1104) inside. The movable block (1104) has an oblique hole (1105) on it. The right side of the movable block (1104) is fixedly connected to a rectangular rod (1106). The right side of the rectangular rod (1106) passes through the base (1) and is fixedly connected to a button (1107). The rectangular rod (1106) is slidably connected to the base (1). The front of the ejection block (1101) is rotatably connected to a cylinder (1108). The cylinder (1108) is located inside the oblique hole (1105).

6. The semiconductor chip packaging and testing fixture according to claim 5, characterized in that, The outer surface of the rectangular rod (1106) is fitted with a second spring (1109). One end of the second spring (1109) is fixedly connected to the inner wall of the cavity (1103), and the other end of the second spring (1109) is fixedly connected to the movable block (1104).

7. The semiconductor chip packaging and testing fixture according to claim 6, characterized in that, The base (1) has mounting holes (12) at all four corners, and the mounting holes (12) pass through the upper and lower sides of the base (1).

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