POGOPIN test module applied to high-density needle planting of PCBA

Abstract

The utility model provides a kind of POGO PIN test module applied to PCBA high-density needle planting for being utilized POGO PIN probe stroke is small, effectively avoid the probe breakage or damage product circuit in testing process.Specifically comprising needle mould fixed plate, signal adapter plate, floating carrier plate and needle plate arranged in order from top to bottom, a plurality of POGO PIN probes are arranged on the needle plate, at least two groups of alignment pins are arranged in the needle mould fixed plate, the alignment pins pass through the signal adapter plate and floating carrier plate and are arranged, and the tail end extends to the outside of the floating carrier plate, a needle plate fixed plate is arranged in the floating carrier plate, the needle plate is arranged on the needle plate fixed plate, and the floating carrier plate is located outside the needle plate fixed plate in the extension direction of the alignment pin in normal state. The utility model is suitable for printed circuit board online testing technical field.

Description

Technical Field

[0001] This utility model relates to the field of online testing technology for printed circuit boards, and in particular to a POGOPIN test module for high-density pin placement in PCBA. Background Technology

[0002] Test probes are core tools used for electrical performance testing of PCB boards, mainly composed of springs, pin shafts, and probe tips. Their working principle combines mechanical conduction through an elastic contact mechanism with electrical signal measurement, enabling continuity testing, resistance measurement, and high-frequency signal testing. Currently, the probe compression stroke in testing equipment is too long, easily causing needle marks or scratches on the product under test during the pressing process, and even breaking the probe or directly damaging the integrated circuitry. Utility Model Content

[0003] To address the aforementioned issues, this invention provides a POGOPIN test module for high-density pin placement in PCBAs, which utilizes the short stroke of the POGO PIN probe to effectively prevent probe breakage or damage to product circuitry during testing.

[0004] The technical solution adopted by this utility model is as follows: This utility model includes a needle mold fixing plate, a signal adapter plate, a floating carrier plate, and a needle plate arranged sequentially from top to bottom. A plurality of POGO PIN probes are arranged in an array on the needle plate. At least two sets of alignment pins are arranged inside the needle mold fixing plate. The alignment pins pass through the signal adapter plate and the floating carrier plate and extend to the outside of the floating carrier plate. A needle plate fixing plate is provided inside the floating carrier plate. The needle plate is arranged on the needle plate fixing plate. Under normal conditions, the floating carrier plate is located outside the needle plate fixing plate in the extension direction of the alignment pins.

[0005] Furthermore, the floating carrier plate is connected to the needle plate fixing plate through an array of guide shafts at its four corners. The signal adapter plate is provided with a stroke groove adapted to the floating carrier plate. Under the action of the guide shaft, the floating carrier plate can reciprocate within the stroke groove and can move to be flush with the needle plate fixing plate.

[0006] Furthermore, the needle plate fixing plate is fixedly connected to the needle mold fixing plate by several connecting pins, the needle plate is installed on the needle plate fixing plate by two sets of quick-release bolts on the left and right sides, and several positioning pins are also provided on the needle plate fixing plate, and positioning holes that are adapted to the positioning pins are provided on the needle plate.

[0007] Furthermore, a buffer spring acting on the floating carrier plate is also sleeved on the guide shaft.

[0008] Finally, several elastic guide posts are also provided inside the needle mold fixing block. The elastic guide posts pass through the signal adapter plate and abut against the floating carrier plate. The compression stroke of the elastic guide posts is consistent with the stroke groove.

[0009] Compared with existing technologies, the beneficial effects of this invention are as follows: This invention improves existing PCB board testing equipment by replacing traditional probes with POGO PIN probes. Utilizing the short travel distance of the POGO PIN probe, it avoids excessive downward pressure that could cause probe slippage, effectively protecting the integrated circuitry of the product. Through the alignment pins fixed to the probe mold fixing plate and penetrating the signal adapter plate and the floating carrier plate, during the downward pressure process, the floating carrier plate and the signal adapter plate shift horizontally. The stroke groove and the elastic guide post on the signal adapter plate work together to limit the relative displacement between the floating carrier plate and the probe mold fixing plate. This ensures sufficient contact between the POGO PIN probe and the product's integrated circuitry while effectively preventing excessive downward pressure that could damage the product or break the probe. Therefore, this invention utilizes the short travel distance of the POGO PIN probe to effectively prevent probe breakage or damage to the product's circuitry during testing. Attached Figure Description

[0010] Figure 1 This is a front view of the overall structure of this utility model;

[0011] Figure 2 This is an exploded axial view of the overall structure of this utility model;

[0012] Figure 3 This is a bottom view of the overall structure of this utility model;

[0013] Figure 4 yes Figure 1 Schematic diagram of the cross-sectional structure of AA;

[0014] Figure 5 yes Figure 1 Schematic diagram of the cross-sectional structure of BB. Detailed Implementation

[0015] like Figures 1 to 5As shown, this utility model includes a pin mold fixing plate 1, a signal adapter plate 2, a floating carrier plate 3, and a pin plate 4 arranged sequentially from top to bottom. A plurality of POGO PIN probes are arrayed on the pin plate 4. At least two sets of alignment pins 5 are provided within the pin mold fixing plate 1. The alignment pins 5 pass through the signal adapter plate 2 and the floating carrier plate 3, with their ends extending outside the floating carrier plate 3. A pin plate fixing plate 6 is provided within the floating carrier plate 3, and the pin plate 4 is disposed on the pin plate fixing plate 6. Under normal conditions, the floating carrier plate 3 is located outside the pin plate fixing plate 6 in the extension direction of the alignment pins 5. This utility model is based on an ICT structure design for a micro-needle module, utilizing POGO PIN probes with short stroke and high durability. The alignment pins 5 position the signal adapter plate 2 and the floating carrier plate 3, limiting horizontal displacement during probe pressing, ensuring full contact between the product under test and the POGO PIN probes before connection to the signal adapter plate 2, thus improving the testability of the device.

[0016] In this invention, the floating carrier plate 3 is connected to the needle mold fixing plate 1 via an array of guide shafts 7 positioned at its four corners. The signal adapter plate 2 is provided with a travel groove 8 adapted to the floating carrier plate 3. Under the action of the guide shafts 7, the floating carrier plate 3 can reciprocate within the travel groove 8 and can move until it is flush with the needle mold fixing plate 6. A buffer spring acting on the floating carrier plate 3 is also sleeved on the guide shaft 7. Several elastic guide posts 13 are also provided inside the needle mold fixing block. The elastic guide posts 13 pass through the signal adapter plate 2 and abut against the floating carrier plate 3. The compression stroke of the elastic guide posts 13 is consistent with the travel groove 8. Through the combined action of the guide shaft 7, the stroke groove 8, and the elastic guide post 13, when the floating carrier plate 3 comes into contact with the product to be tested, it moves back along the alignment pin 5, and can only move to the position aligned with the needle plate fixing plate 6 at most. This effectively avoids excessive compression of the probe, prevents the probe from being broken, and prevents needle marks or scratches from being generated on the product's integrated circuit.

[0017] The needle plate fixing plate 6 is fixedly connected to the needle mold fixing plate 1 by a number of connecting pins 9. The needle plate 4 is installed on the needle plate fixing plate 6 by two sets of quick-release bolts 10 on the left and right sides. A number of positioning pins 11 are also provided on the needle plate fixing plate 6. The needle plate 4 is provided with positioning holes 12 that are adapted to the positioning pins 11.

[0018] Finally, it should be emphasized that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A POGOPIN test module for high-density pin placement in PCBA, characterized in that: The device includes a needle mold fixing plate (1), a signal adapter plate (2), a floating carrier plate (3), and a needle plate (4) arranged sequentially from top to bottom. Several POGO PIN probes are arrayed on the needle plate (4). At least two sets of alignment pins (5) are provided in the needle mold fixing plate (1). The alignment pins (5) pass through the signal adapter plate (2) and the floating carrier plate (3) and extend to the outside of the floating carrier plate (3). A needle plate fixing plate (6) is provided in the floating carrier plate (3). The needle plate (4) is located on the needle plate fixing plate (6). Under normal conditions, the floating carrier plate (3) is located outside the needle plate fixing plate (6) in the extension direction of the alignment pins (5).

2. The POGOPIN test module for high-density pin placement in PCBA according to claim 1, characterized in that: The floating carrier plate (3) is connected to the needle mold fixing plate (1) through the array of guide shafts (7) at its four corners. The signal adapter plate (2) is provided with a stroke groove (8) that is compatible with the floating carrier plate (3). Under the action of the guide shaft (7), the floating carrier plate (3) can reciprocate in the stroke groove (8) and can move to be flush with the needle plate fixing plate (6).

3. The POGOPIN test module for high-density pin placement in PCBA according to claim 2, characterized in that: The needle plate fixing plate (6) is fixedly connected to the needle mold fixing plate (1) by several connecting pins (9). The needle plate (4) is installed on the needle plate fixing plate (6) by two sets of quick-release bolts (10) on the left and right sides. Several positioning pins (11) are also provided on the needle plate fixing plate (6). The needle plate (4) is provided with positioning holes (12) that are compatible with the positioning pins (11).

4. The POGOPIN test module for high-density pin placement in PCBA according to claim 3, characterized in that: A buffer spring acting on the floating carrier plate (3) is also sleeved on the guide shaft (7).

5. A POGOPIN test module for high-density pin placement in PCBA according to claim 4, characterized in that: Several elastic guide posts (13) are also provided inside the needle mold fixing plate. The elastic guide posts (13) pass through the signal adapter plate (2) and abut against the floating carrier plate (3). The compression stroke of the elastic guide posts (13) is consistent with the stroke groove (8).

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