A chip testing apparatus

Abstract

The utility model provides a kind of chip testing equipment, belong to semiconductor equipment technical field.The chip testing equipment includes: probe card;Feed module, for reciprocating handling measured wafer assembly along first horizontal direction, measured wafer assembly is used to carry multiple measured chips;Discharge module, for reciprocating handling measured wafer assembly along first horizontal direction, discharge module and feed module are located the same side of probe card, and the discharge end of discharge module and the feed end of feed module are arranged on the same side;Test base station module, including the test stage for moving between receiving position and test position;Intermediate transport module, including transfer module and first transverse movement module and second transverse movement module extending along second horizontal direction;Intermediate transport module is used to handle measured chip between feed module and test base station module, handle measured chip between test base station module and discharge module.The utility model can effectively reduce the area occupied by equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more particularly to a chip testing device. Background Technology

[0002] To automate probe testing, existing chip testing equipment typically includes automated chip loading / unloading mechanisms and automated chip inspection mechanisms. The automated chip loading / unloading mechanism generally interfaces with external production lines via inlets and outlets; for example, the inlet connects to a device that automatically provides chips to be tested, while the outlet connects to a device that collects the tested chips. The automated chip inspection mechanism includes probe cards for batch defect and appearance inspection of the chips.

[0003] To improve chip testing efficiency, existing chip testing equipment typically employs multiple infeed and outfeed lines. These include dedicated chip supply lines from the inlet to the testing station, and chip return lines from the testing station to the outlet. This allows for the timely removal of tested chips after testing and the loading of chips to be tested. However, this multi-line layout results in a larger overall equipment footprint. Utility Model Content

[0004] One objective of this invention is to provide a chip testing device that can effectively reduce the area occupied by the device.

[0005] Another objective of this invention is to protect the chip.

[0006] A further objective of this invention is to reduce the area occupied by the equipment while maintaining testing efficiency.

[0007] Specifically, according to one aspect of the present invention, a chip testing device is provided, comprising: Probe card; The feeding module extends along the first horizontal direction and is connected to the feeding position at one end. The feeding module is used to reciprocate to transport the wafer assembly under test along the first horizontal direction. The wafer assembly under test is used to carry multiple chips under test. The discharge module extends along the first horizontal direction and one end is connected to the discharge position. The discharge module is used to reciprocate and transport the tested wafer assembly along the first horizontal direction. The tested wafer assembly is used to position multiple tested chips. The discharge module and the feed module are located on the same side of the probe card, and the discharge end of the discharge module and the feed end of the feed module are arranged on the same side. The test base module includes a test stage for moving between a receiving position and a test position, the test position being a location below the probe card for chip testing; The intermediate transport module includes a first transverse module, a transfer module and a second transverse module that are connected in sequence. Both the first transverse module and the second transverse module extend along a second horizontal direction, which is perpendicular to the first horizontal direction. The first transverse module and the feeding module have a first junction position, and the first transverse module and the discharging module have a second junction position; The second transverse module and the test base module have a third junction position, which is the material receiving position; The intermediate transport module is used to transport the chip under test between the feeding module and the test base module, and to transport the tested chip between the test base module and the discharge module.

[0008] Optionally, the transfer module includes a chip carrier, which includes multiple positioning points. Each time a chip is transported, the positioning points on the upper part of the chip carrier are positioned with the chip to be tested, so that the empty positioning points can be positioned with the chip already tested.

[0009] Optionally, the chip stage is a vacuum adsorption stage, which has multiple adsorption ports arranged in an array, each adsorption port being used to adsorb one chip.

[0010] Optionally, the transfer module also includes a transfer slide rail, and the chip stage is used to reciprocate along the transfer slide rail, which extends in a first horizontal direction.

[0011] Optionally, it also includes a probe card replacement mechanism; the probe card replacement mechanism is disposed on the end side of the probe card and is arranged on the same side as the discharge end of the discharge module and the feed end of the feed module.

[0012] Optionally, the feed position and the discharge position are aligned in the second horizontal direction.

[0013] Optionally, the chip testing equipment also includes a feeding / discharging machine and a testing machine arranged sequentially along the second horizontal direction; The infeeding and discharging machine platform is provided with a first housing, and the first housing contains an infeeding and discharging module and part of a first transverse moving module; The test machine is equipped with a second housing, which contains a probe card, a test base module, a transfer module, and part of the first transverse module.

[0014] Optionally, a needle cleaning device is also provided inside the second housing, located on the side of the probe card close to the test host; The needle cleaning device can reciprocate along the second horizontal direction and is used to clean the dirt on the probes on the probe card when it moves below the probe card.

[0015] Optionally, the feeding module includes: The first sliding component includes a first track extending along a first horizontal direction and a first robotic arm that can slide relative to the first track. The first robotic arm is used to grasp a wafer assembly under test. The wafer assembly under test includes a first wafer film layer, on which a plurality of chips under test are disposed. The first slide assembly includes a second track extending along a first horizontal direction, and a first slide stage movable relative to the second track, the first slide stage being used to receive the wafer assembly to be tested at the first robot arm. The core-finding mechanism is used to perform a preliminary separation operation between the wafer assembly and the chip under test at the first sliding stage. The first sliding stage is used to move the wafer assembly, after the initial separation operation, to the first handover position.

[0016] Optionally, a feed basket assembly is provided at the feed position for providing and recovering the wafer assembly to be tested; A discharge basket assembly is provided at the discharge position for supplying and recycling tested wafer assemblies.

[0017] According to one aspect of the present invention, the feeding module and the discharging module of the chip testing equipment are located on the same side of the probe card and both extend along the first horizontal direction. The first transverse module spans the feeding module and the discharging module to realize the docking of feeding and discharging. The first transverse module and the second transverse module both extend along the second horizontal direction, effectively utilizing the space in the second horizontal direction. This layout of the transmission mechanism effectively reduces the area occupied by the equipment.

[0018] Furthermore, the chip testing equipment in this application can save space while maintaining testing efficiency.

[0019] Furthermore, this application no longer uses a positioning groove-type chip stage. Therefore, during chip transfer, it reduces chip damage caused by inaccurate placement or damage to the chip caused by abnormal situations such as impacts during transportation, thereby better protecting the chip. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a chip testing device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a chip testing device (with probe card and first transverse module hidden) according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a chip testing device according to an embodiment of the present invention at the transfer module. Figure 4 This is a schematic diagram of the external structure of a chip testing device according to an embodiment of the present invention; Figure label: The chip testing equipment includes: 100, probe card 10, feeding module 20, wafer assembly under test 210, unloading module 30, tested wafer assembly 220, testing base module 40, testing stage 41, longitudinal slide rail 42, first slide stage 43, transverse slide rail 44, second slide stage 45, intermediate transport module 50, first transverse transfer module 510, transfer module 520, second transverse transfer module 53, first transverse rail 511, first adsorption component 512, second transverse rail 531, second adsorption component 532, chip stage 521, and adsorption nozzle. 502, Adsorption port 501, Transfer slide rail 522, Feeding and discharging host 110, Testing host 120, Feeding and discharging machine platform 111, Testing machine platform 121, First housing 112, Feed inlet 101, Second housing 122, Discharge outlet 102, Needle cleaning device 60, First track 21, First robotic arm 22, Second track 23, First sliding table 24, Feeding basket assembly 70, Discharge basket assembly 80, Third track 31, Second robotic arm 32, Fourth track 33, Second sliding table 34, Probe card replacement mechanism 90. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0022] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0023] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed description. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the spirit of this disclosure.

[0024] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0025] In this application's embodiments, "multiple" refers to two or more. The descriptions of "first," "second," etc., appearing in this application's embodiments are merely illustrative and for distinguishing the described objects; they have no order and do not indicate a specific limitation on the number in this application's embodiments, nor do they constitute any limitation on the embodiments of this application.

[0026] Figure 1 This is a schematic diagram of the structure of a chip testing device 100 according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of a chip testing device 100 (with probe card 10 and first transverse module 510 hidden) according to an embodiment of the present invention. Figure 1 As shown, in one embodiment, the chip testing equipment 100 of this application includes a probe card 10, a feeding module 20, a discharging module 30, a test base module 40, and an intermediate transport module 50. The probe card 10 is equipped with probes for testing each chip. The feeding module 20 is positioned along a first horizontal direction (e.g., ...). Figure 1 (in the X direction) extends and one end connects to the feed position (see Figure 1 (At S1 in the diagram), the feeding module 20 is used to reciprocate the wafer assembly 210 under test along the first horizontal direction. The wafer assembly 210 under test is used to carry multiple chips under test. After the wafer is divided into multiple chips, the multiple chips are still bonded together by a film layer (generally called blue film). The wafer in this state is fixed by a fixture. The wafer assembly 210 under test here includes a fixture and a first wafer film layer, which is used to bond the wafer under test. The discharge module 30 extends along the first horizontal direction and one end is connected to the discharge position (see...). Figure 1 At point S2 in the diagram, the ejection module 30 is used to reciprocate the tested wafer assembly 220 along the first horizontal direction. The tested wafer assembly 220 is used to carry multiple tested chips. The ejection module 30 and the feed module 20 are located on the same side of the probe card 10. Similarly, the tested wafer assembly 220 includes a fixture and a second wafer film layer, which is used to bond and position the tested wafer. In this embodiment, the feed position and the ejection position are in the second horizontal direction (e.g., at point S2 in the diagram). Figure 1 The feed position and the discharge position are aligned in the Y direction (the second horizontal direction is perpendicular to the first horizontal direction). In other embodiments not shown, the feed position and the discharge position may not be aligned, which is not a limitation here.

[0027] Test base module 40 includes a section for receiving material at the receiving position (see...) Figure 1 (at S3 in the middle) and test bits (see Figure 1The test platform 41 moves between points S4 and S4. The test position is located below the probe card 10 for chip testing, and the receiving position is the docking position with the intermediate transport module 50 described below. In one embodiment, the test platform module 40 includes a slide rail assembly for realizing the reciprocating movement of the test platform 41 between the receiving position and the test position. In a further embodiment, the slide rail assembly is also used to realize the movement of the test platform 41 in other horizontal and vertical directions. For example, the slide rail assembly includes a longitudinal slide rail 42 extending along a first horizontal direction, a first slide table 43 slidably disposed on the longitudinal slide rail 42, a transverse slide rail 44 extending along a second horizontal direction disposed on the first slide table 43, a second slide table 45 slidably disposed on the transverse slide rail 44, and a lifting mechanism disposed on the second slide table 45. The top end of the lifting mechanism is connected to the test platform 41, thereby realizing the reciprocating movement of the test platform 41 along the first horizontal direction, the second horizontal direction, and the vertical direction. In this embodiment, the test position and the docking position are located in the first horizontal direction.

[0028] The intermediate transport module 50 includes a first transverse module 510, a transfer module 520, and a second transverse module 530, which are sequentially connected. Both the first transverse module 510 and the second transverse module 530 extend along a second horizontal direction. The first transverse module 510 has a first junction position with the feeding module 20 (i.e., the intersection of the conveying paths of the first transverse module 510 and the feeding module 20), a second junction position with the discharging module 30 (i.e., the intersection of the conveying paths of the first transverse module 510 and the discharging module 30), and a third junction position with the test base module 40, which is the receiving position. The intermediate transport module 50 is used to transport the chip under test between the feeding module 20 and the test base module 40, and to transport the tested chip between the test base module 40 and the discharging module 30.

[0029] Depending on the layout requirements of the internal components, the first horizontal movement module 510 and the second horizontal movement module 530 can be aligned or spaced apart; no restriction is imposed here. In this embodiment, in the first horizontal direction, the second horizontal movement module 530 is further away from the probe card 10 than the first horizontal movement module 510, so that the test stage 41 can be completely moved out of the probe card 10 area, facilitating the placement of the chip under test or removal of the tested chip at the test stage 41 by the second horizontal movement module 530.

[0030] Depending on the positions of the first lateral movement module 510 and the second lateral movement module 530, the transfer module 520 may be equipped with a movable chip carrier 521. For example... Figure 2As shown, for example, the first transverse module 510 includes a first transverse rail 511 and a first adsorption component 512 movable along the first transverse rail 511, and the second transverse module 530 includes a second transverse rail 531 and a second adsorption component 532 movable along the second transverse rail 531. The first adsorption component 512 and the second adsorption component 532 are respectively disposed on opposite sides of the first transverse rail 511 and the second transverse rail 531. In this embodiment, the transfer module 520 also includes a transfer slide rail 522 extending along a first horizontal direction, and the chip stage 521 is used to reciprocate along the transfer slide rail 522. The first adsorption component 512 and the second adsorption component 532 may include a plurality of adsorption nozzles, for example, a plurality of adsorption nozzles arranged sequentially along the first horizontal direction, or a plurality of adsorption nozzles arranged sequentially along the second horizontal direction, or a plurality of adsorption nozzles arranged in an array. In this embodiment, both the first adsorption component 512 and the second adsorption component 532 include the same number of adsorption nozzles arranged along the second horizontal direction. The chip stage 521 is provided with positioning points arranged in a rectangular array. In the second horizontal direction, each positioning point is aligned with each adsorption nozzle of the row of adsorption nozzles to improve handling efficiency and alignment accuracy.

[0031] In this embodiment, the chip testing equipment 100 has an infeed module 20 and an outfeed module 30 located on the same side of the probe card 10 and extending along a first horizontal direction. A first transverse module 510 spans the infeed module 20 and the outfeed module 30 to achieve infeed and outfeed docking. Both the first transverse module 510 and the second transverse module 530 extend along a second horizontal direction, effectively utilizing the space in that direction. This layout of the transmission mechanism effectively reduces the area occupied by the equipment. In one embodiment, this layout can reduce the horizontal size of the equipment to a smaller area. .

[0032] To better match chip testing time with chip transmission time, this application also incorporates a transmission design in the intermediate transmission mechanism.

[0033] Figure 3 This is a schematic diagram of the structure of a chip testing device 100 according to an embodiment of the present invention at the relay module 520. Figure 3As shown, the transfer module 520 further includes a chip platform 521, which includes multiple positioning points. Each time a chip is transported, the positioning points on the upper part of the chip platform 521 position the chip to be tested, so that the remaining positioning points can position the chip already tested. These positioning points can be suction ports 501, which are flush with the bearing surface of the chip platform 521. In one embodiment, half of the positioning points on the chip platform 521 are used to position the chip to be tested, and the other half are used to position the chip already tested. In this embodiment, by directly setting multiple positioning points on the chip platform 521, collisions or scratches between the chip and other structures such as grooves can be avoided during chip handling, preventing damage to the chip.

[0034] During chip transfer, the first lateral movement module 510 picks up several chips under test from the wafer assembly 210 at the first junction position and places them on the chip stage 521 until half of the positioning points are occupied by chips under test. Then, the half of the empty chip stage 521 moves to the docking position with the second lateral movement module. When the chips under test are first transported to the test stage 41, the second lateral movement module moves all the chips under test on the chip stage 521 to the test stage 41 at the receiving position. When there are already tested chips on the test stage 41, the second lateral movement module first moves the already tested chips at the receiving position to the remaining positioning points on the chip stage 521, and then moves the already tested chips on the chip stage 521 to the receiving stage to increase chip transport efficiency.

[0035] In actual testing, chip testing usually takes between 10 and 15 minutes. The chip carrying efficiency of this embodiment is high, which can balance the testing time and carrying time, thereby matching the testing cycle and improving the testing efficiency. In other words, the chip testing equipment 100 of this embodiment can save space while taking into account the testing efficiency.

[0036] In one embodiment, the chip stage 521 is a vacuum adsorption stage, which has multiple adsorption ports 501 arranged in an array, each adsorption port 501 being used to adsorb one chip.

[0037] This embodiment no longer uses the positioning groove type chip stage 521. Therefore, during chip transfer, it reduces chip damage caused by inaccurate placement or damage to the chip caused by abnormal situations such as impacts during transportation, thus better protecting the chip.

[0038] Figure 4 This is a schematic diagram of the external structure of a chip testing device according to an embodiment of the present invention. Figure 4As shown, in one embodiment, the chip testing equipment 100 includes a material handling host 110 and a testing host 120 arranged side-by-side along a second horizontal direction. The material handling host 110 includes a material handling platform 111 and a first housing 112. The first housing 112 has a material inlet 101 and houses a material handling module 30 and a portion of a first transverse movement module 510. The testing host 120 includes a testing platform 121 and a second housing 122. The second housing 122 has a material outlet 102 and houses a probe card 10, a testing base module 40, a transfer module 520, and a portion of the first transverse movement module 510. The interiors of the material handling platform 111 and the testing platform 121 can accommodate various drive sources. The top surfaces of the material handling platform 111 and the testing platform 121 are constructed as planes to support the tracks and other components of the aforementioned transport mechanisms.

[0039] Furthermore, a needle cleaning device 60 is also provided inside the second housing 122, located on the side of the probe card 10 near the test host 120. The needle cleaning device 60 can reciprocate along the second horizontal direction, and when it moves below the probe card 10, it is used to clean the dirt on the probes on the probe card 10.

[0040] In this embodiment, the transfer module 520 and the needle cleaning device 60 are both located on the same side of the probe card 10 in the second horizontal direction, thus saving space more effectively.

[0041] Furthermore, the chip testing equipment 100 also includes a probe card replacement mechanism 90 disposed within the second housing 122 (see...). Figure 1 The probe card replacement mechanism 90 is located on the end side of the probe card 10, and is arranged on the same side as the discharge end of the discharge module 30 and the feed end of the feed module 20. That is, the probe card replacement mechanism 90, the feed module 20, and the discharge module 30 are all located at the same end in the first horizontal direction. When performing different types of chip testing, the probe card replacement mechanism 90 can replace the probe card to provide the probe card required for the current test.

[0042] In this embodiment, the probe card replacement mechanism 90, the feeding module 20, and the discharging module 30 are all located on the same side, which can further save the space occupied by the equipment.

[0043] In one embodiment, a feed basket assembly 70 is provided at the feed position for providing and recovering the wafer assembly 210 to be tested. The feed module 20 includes a first sliding assembly, a first sliding stage assembly, and a core sampling mechanism.

[0044] The first sliding assembly includes a first track 21 extending along a first horizontal direction and a first robotic arm 22 slidable relative to the first track 21. The first robotic arm 22 is used to grasp a wafer assembly 210 to be tested at the feed basket assembly 70. The wafer assembly 210 to be tested includes a first wafer film layer, on which multiple chips to be tested are disposed. The first sliding stage assembly includes a second track 23 extending along a first horizontal direction and a first sliding stage 24 movable relative to the second track 23. The first sliding stage 24 is used to receive and position the wafer assembly 210 to be tested at the first robotic arm 22. The core-retrieving mechanism is used to perform a preliminary separation operation on the wafer assembly 210 to be tested and the chips to be tested at the first sliding stage 24. This preliminary separation operation includes film expansion and lifting of each chip to be tested to reduce the adhesion between each chip to be tested and the first wafer film layer. Film expansion and lifting are common operations in the art and will not be described in detail here. The first sliding stage 24 is used to move the wafer assembly after the preliminary separation operation to a first junction position.

[0045] After all the chips under test on the wafer assembly 210 have been removed, the first robotic arm 22 is used to transport the wafer assembly 210 to the feed basket assembly 70.

[0046] Furthermore, a discharge basket assembly 80 is provided at the discharge position for providing and recovering the tested wafer assembly 220. The discharge module 30 includes a second sliding assembly and a second slide assembly.

[0047] The second sliding assembly includes a third track 31 extending along a first horizontal direction and a second robotic arm 32 slidable relative to the third track 31. The wafer assembly under test 210 includes a second wafer film layer for bonding multiple tested chips. The second sliding stage assembly includes a fourth track 33 extending along a first horizontal direction and a second sliding stage 34 movable relative to the fourth track 33 for receiving and positioning the tested wafer assembly 220.

[0048] The second robotic arm 32 first transports the tested wafer assembly 220 at the discharge basket assembly 80 to the second sliding stage 34. The second sliding stage 34 moves to the second docking position. After the first transverse module 510 fills the tested wafer assembly 220 with tested chips, the second robotic arm 32 transports the fully loaded tested wafer assembly 220 to the discharge basket assembly 80.

[0049] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A chip testing device, characterized in that, include: Probe card; The feeding module extends along a first horizontal direction and is connected to the feeding position at one end. The feeding module is used to reciprocate to transport the wafer assembly under test along the first horizontal direction. The wafer assembly under test is used to carry multiple chips under test. The discharge module extends along a first horizontal direction and one end is connected to the discharge position. The discharge module is used to reciprocate and transport the tested wafer assembly along the first horizontal direction. The tested wafer assembly is used to position multiple tested chips. The discharge module and the feed module are located on the same side of the probe card, and the discharge end of the discharge module and the feed end of the feed module are arranged on the same side. The test base module includes a test stage for moving between a receiving position and a test position, wherein the test position is a position located below the probe card for chip testing; The intermediate transport module includes a first transverse module, a transfer module and a second transverse module that are connected in sequence. Both the first transverse module and the second transverse module extend along a second horizontal direction, which is perpendicular to the first horizontal direction. The first transverse module and the feeding module have a first intersection position, and the first transverse module and the discharging module have a second intersection position; The second transverse module and the test base module have a third junction position, which is a material receiving position; The intermediate transport module is used to transport the chip under test between the feeding module and the test base module, and to transport the tested chip between the test base module and the discharge module.

2. The chip testing equipment according to claim 1, characterized in that, The transfer module includes a chip carrier, which includes multiple positioning points. Each time a chip is transported, the positioning points on the upper part of the chip carrier are used to position the chip to be tested, so that the remaining positioning points can be used to position the chip that has already been tested.

3. The chip testing equipment according to claim 2, characterized in that, The chip carrier is a vacuum adsorption stage, which has multiple adsorption ports arranged in an array, each of which is used to adsorb one chip.

4. The chip testing equipment according to claim 2, characterized in that, The transfer module also includes a transfer slide rail, and the chip platform is used to reciprocate along the transfer slide rail; The transfer slide rail extends along the first horizontal direction.

5. The chip testing equipment according to claim 4, characterized in that, It also includes a probe card replacement mechanism; the probe card replacement mechanism is located on the end side of the probe card and is arranged on the same side as the discharge end of the discharge module and the feed end of the feed module.

6. The chip testing equipment according to claim 1, characterized in that, The feed position and the discharge position are aligned in the second horizontal direction.

7. The chip testing equipment according to any one of claims 1-6, characterized in that, It also includes feeding and discharging machines and testing machines arranged sequentially along the second horizontal direction; The feeding and discharging machine platform is provided with a first housing, and the first housing contains the feeding and discharging module and part of the first transverse moving module. The testing machine is provided with a second housing, which contains the probe card, the testing base module, the transfer module, and part of the first transverse module.

8. The chip testing equipment according to claim 7, characterized in that, The second housing also contains a needle cleaning device, located on the side of the probe card closest to the test host. The needle cleaning device can reciprocate along the second horizontal direction and, when it moves below the probe card, is used to clean the dirt on the probes on the probe card.

9. The chip testing equipment according to claim 1, characterized in that, The feeding module includes: The first sliding component includes a first track extending along a first horizontal direction and a first robotic arm that can slide relative to the first track. The first robotic arm is used to grasp the wafer assembly under test. The wafer assembly under test includes a first wafer film layer, on which a plurality of the chips under test are disposed. The first slide assembly includes a second track extending along a first horizontal direction, and a first slide stage movable relative to the second track, the first slide stage being used to receive the wafer assembly to be tested positioned at the first robotic arm; The core-taking mechanism is used to perform a preliminary separation operation on the wafer assembly under test and the chip under test at the first sliding stage; The first sliding stage is also used to move the wafer assembly after the initial separation operation to the first handover position.

10. The chip testing equipment according to claim 1, characterized in that, The feed position is equipped with a feed basket assembly for providing and recovering the wafer assembly to be tested; The discharge position is equipped with a discharge basket assembly for providing and recycling the tested wafer assembly.

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