Optoelectronic module and electronic device

Abstract

The application discloses an optoelectronic module and an electronic device, wherein the optoelectronic module comprises an optoelectronic assembly, a lens assembly, at least one adhesive member and a fixed member; the optoelectronic assembly comprises an optoelectronic device and a carrier plate for accommodating the optoelectronic device, the carrier plate comprises a first matching part; the lens assembly comprises a lens and a housing for accommodating the lens, the housing comprises a second matching part; the first matching part and the second matching part are kept at least partially overlapped, the first matching part and the second matching part are bonded by the adhesive member, and the fixed member connects the first matching part and the second matching part so that the first matching part and the second matching part press the adhesive member. In addition to fixing the optoelectronic assembly and the lens assembly by the adhesive member, the optoelectronic assembly and the lens assembly are further fixed by the fixed member, the fixed member can exert a locking force to press the adhesive member, limit the swelling deformation of the adhesive member, and reduce the influence of the deformation of the adhesive member on the spatial position of the optoelectronic assembly and the lens assembly.

Description

Technical Field

[0001] This application relates to the field of optical technology, specifically to an optoelectronic module and an electronic device. Background Technology

[0002] In the assembly process of optoelectronic modules, active alignment technology is a core process for achieving high performance. The principle of active alignment technology is as follows: Real-time monitoring of the optical performance of the optoelectronic module (such as image sharpness, phase difference, and luminous flux) is used to drive a precision motion platform to adjust the spatial position of each optical component (such as lens groups and sensor chips) within the module until optimal optical performance is achieved. Then, a fixing process is used to secure the positions of each optical component. Active alignment technology solves the imaging offset problems caused by mechanical tolerances, thermal expansion and contraction, or vibration in traditional passive alignment, ensuring that each optical component is in the optimal position, thereby improving the optical performance of the optoelectronic module.

[0003] However, conventional optoelectronic modules assembled using active alignment technology have the following problems: the optical components in some optoelectronic modules are fixed in position by adhesive. During long-term use, the adhesive is easily affected by temperature and humidity, resulting in thermal expansion and contraction, curing shrinkage, and performance degradation. This leads to the relative positional shift of the optical components, causing a decrease in the optical performance of the optoelectronic module. Summary of the Invention

[0004] One objective of this application is to provide an optoelectronic module to solve the problems of poor reliability and short service life of conventional optoelectronic modules.

[0005] Another object of this application is to provide an electronic device having the above-described optoelectronic module.

[0006] To achieve at least one of the above objectives, the technical solution adopted in this application is: a photoelectric module, comprising: An optoelectronic assembly, the optoelectronic assembly including an optoelectronic device and a carrier plate for accommodating the optoelectronic device, the carrier plate including a first mating portion; A lens assembly, the lens assembly including a lens and a housing for receiving the lens, the housing including a second mating portion; and at least one adhesive component and at least one fastener; The first mating part and the second mating part maintain at least partial overlap, and the first mating part and the second mating part are bonded together by the adhesive. The fastener connects the first mating part and the second mating part so that the first mating part and the second mating part press tightly against the adhesive.

[0007] For example, after the photoelectric module is used or placed in an environment with a temperature of 85°C and a humidity of 85% for 72 hours, the focal offset of the photoelectric module is ≤6mm.

[0008] For example, the first mating part and / or the second mating part includes at least one hole, the fastener passes through the hole, and there is an adjustment gap between the fastener and the hole.

[0009] For example, the first mating part is integrally or separately disposed on the carrier plate, and the second mating part is integrally or separately disposed on the housing.

[0010] For example, the first mating part includes at least one first hole, the second mating part includes at least one second hole, each first hole and each second hole are provided in a one-to-one correspondence, and the fastener passes through the first hole and the second hole to connect the first mating part and the second mating part.

[0011] For example, the head of the fastener is pressed against one of the first mating portion and the second mating portion, the tail of the fastener is connected to the other of the first mating portion and the second mating portion, the fastener is tightly fitted with one of the first hole and the second hole, and the fastener is gap fitted with the other of the first hole and the second hole, thereby forming the adjustment gap between the fastener and the first hole or the second hole.

[0012] For example, the fastening element is a bolt.

[0013] For example, the thickness of the first mating part or the second mating part is T, the pressing width between the fastener and the first mating part or the second mating part is α, and the locking torque of the fastener is δ. When T≥0.4mm and T≤1.5mm, δ≥(α / 15)×0.92 N·m and δ≤(α / 15)×1.08 N·m; when T>1.5mm, δ≥(α / 10)×0.92 N·m and δ≤(α / 10)×1.08 N·m.

[0014] For example, the fastener is integrally disposed on the first mating part, the second mating part includes at least one second hole, the fastener is press-fitted to the second mating part, and the fastener is clearance-fitted to the second hole, and the adjustment gap is formed between the fastener and the second hole; Alternatively, the fastener is integrally disposed on the second mating part, the first mating part includes at least one first hole, the fastener is press-fitted to the first mating part, and the fastener is clearance-fitted to the first hole, and the adjustment gap is formed between the fastener and the first hole.

[0015] For example, the width of the adjustment gap is 0.08mm to 0.25mm.

[0016] For example, both the first mating part and the second mating part have a circular plate-like structure, and each of the adhesive members and each of the fasteners are evenly spaced along the circumference in the first mating part and the second mating part, and each of the adhesive members is arc-shaped.

[0017] For example, the distribution radius R1 of the fastener is not greater than the outer edge radius R2 of the adhesive member, R1≤R2; the distribution radius R1 of the fastener is not less than the inner edge radius R3 of the adhesive member, R1≥R3.

[0018] For example, the distribution radius R1 of the fastener is not less than half of the outer edge radius R4 of the first mating part, R1≥1 / 2×R4; the outer diameter R3 of the inner edge of the adhesive is not less than half of the outer edge radius R4 of the first mating part, R3≥1 / 2×R4.

[0019] For example, both the first mating part and the second mating part have a square ring plate structure, and each of the adhesive members and each of the fasteners are evenly spaced along the circumference in the first mating part and the second mating part, and each of the adhesive members is long strip or L-shaped.

[0020] For example, the distribution spacing W1 of the fasteners is not greater than the distribution spacing W2 of the outer edge of the adhesive, W1≤W2; the distribution spacing W1 of the fasteners is not less than the distribution spacing W3 of the inner edge of the adhesive, W1≥W3.

[0021] For example, the distribution spacing W1 of the fastener is not less than half of the distribution spacing W4 on both sides of the first mating part, i.e., W1≥1 / 2×W4; the distribution spacing W3 of the inner edge of the adhesive is not less than half of the distribution spacing W4 on both sides of the first mating part, i.e., W3≥1 / 2×W4.

[0022] For example, the first mating part and the second mating part are respectively provided with a dispensing groove and a dispensing boss, and the adhesive member is disposed between the dispensing groove and the dispensing boss to connect the first mating part and the second mating part.

[0023] For example, the lens assembly further includes a compensation lens located on the light-inlet side of the lens, and the compensation lens is fixed to the housing by adhesive bonding or threaded connection.

[0024] For example, a sealant is further provided between the first mating part and the second mating part, and the sealant is located on the outer peripheral side of the adhesive joint.

[0025] For example, the water absorption swelling rate of the adhesive component is 0.05% to 0.1%.

[0026] For example, the Shore hardness of the adhesive component is not less than 90HD; the Young's modulus of the adhesive component is not less than 10000MPa.

[0027] For example, the coefficient of thermal expansion of the adhesive is not greater than 30 ppm / K.

[0028] For example, the thickness of the adhesive is 0.2mm to 0.6mm, and / or the width of the adhesive is 0.4mm to 1mm.

[0029] For example, after the photoelectric module is used or placed in an environment with a temperature of 85°C and a humidity of 85% for 72 hours, the focal offset of the photoelectric module is ≤4mm.

[0030] To achieve at least one of the above objectives, this application also provides an electronic device including the aforementioned optoelectronic module.

[0031] Compared with conventional technologies, the advantages of this application are as follows: In addition to fixing the spatial position of the optoelectronic component and the lens component through the adhesive joint, the optoelectronic module provided in this application embodiment also further fixes the spatial position of the optoelectronic component and the lens component through the fastening member. The fastening member can apply a locking force to the first mating part and the second mating part to press the adhesive joint tightly, thereby limiting the expansion deformation of the adhesive joint, reducing the influence of the expansion deformation of the adhesive joint on the spatial position of the optoelectronic component and the lens component, and ensuring the optical performance of the optoelectronic module. Attached Figure Description

[0032] Figure 1 This is a three-dimensional schematic diagram of the optoelectronic module in this application.

[0033] Figure 2 This is an exploded view of the optoelectronic module in this application.

[0034] Figure 3 This is a cross-sectional schematic diagram of the optoelectronic module in this application.

[0035] Figure 4 This is a cross-sectional schematic diagram of the dispensing groove and dispensing boss in this application when they are V-shaped.

[0036] Figure 5 This is a cross-sectional schematic diagram of the dispensing groove being U-shaped and the dispensing convex groove being U-shaped in this application.

[0037] Figure 6 This is a schematic diagram showing the fit between the fastener and the first and second holes in this application.

[0038] Figure 7 This is a schematic diagram of one embodiment where the fixing element in this application is a bolt.

[0039] Figure 8 This is a schematic diagram of another embodiment where the fixing element in this application is a bolt.

[0040] Figure 9 This is a schematic diagram of the fastener being a rivet in this application.

[0041] Figure 10 This is a schematic diagram of one embodiment where the fastener is a pin in this application.

[0042] Figure 11 This is a schematic diagram of another embodiment where the fastener is a pin in this application.

[0043] Figure 12 This is a schematic diagram of the fixed fastener integrally disposed in the second mating part in this application.

[0044] Figure 13 This is a schematic diagram of the fastener integrally disposed in the first mating part in this application.

[0045] Figure 14 This is a schematic diagram showing the positions of the fasteners and adhesive bonding components when the first mating part in this application is a circular plate-shaped structure.

[0046] Figure 15 This is a schematic diagram showing the positions of the fastener and adhesive bonding member in one embodiment of the first mating part being a square ring plate structure in this application.

[0047] Figure 16 This is a schematic diagram showing the positions of the fastener and adhesive bonding member in another embodiment of the first mating part being a square ring plate structure in this application.

[0048] Figure 17 This is a schematic diagram showing the thickness and width of the adhesive component in this application.

[0049] Figure 18 This is a cross-sectional schematic diagram of another embodiment of the optoelectronic module in this application.

[0050] Figure 19 This is a cross-sectional schematic diagram of another embodiment of the optoelectronic module in this application.

[0051] Figure 20 This is a schematic diagram of the focal offset ΔF when the optoelectronic module in this application is a light emitting module.

[0052] Figure 21 This is a schematic diagram of the focal offset ΔF when the optoelectronic module in this application is a light receiving module.

[0053] Figure 22This is a comparison diagram of the focal offset ΔF between conventional optoelectronic modules and the optoelectronic module of this application.

[0054] In the diagram: 100, optoelectronic component; 110, optoelectronic device; 120, carrier plate; 130, first mating part; 140, dispensing groove; 150, first hole; 200, lens assembly; 210, lens; 220, housing; 230, second mating part; 240, dispensing boss; 250, second hole; 260, compensation lens; 300, adhesive connector; 400, fastener; 500, adjustment gap; 600, sealant. Detailed Implementation

[0055] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0056] In the description of this application, it should be noted that the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., which indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of this application.

[0057] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0058] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0059] The term "optical axis direction" as used below is defined as the optical axis direction of the lens / optoelectronic device; at the same time, "optical axis direction" corresponds to the "vertical direction" and the "Z-axis direction". The terms "X-axis direction" and "Y-axis direction" as used below are defined as two directions that are perpendicular to the "Z" axis direction and are mutually perpendicular, that is, the "X-axis direction", "Y-axis direction" and "Z-axis direction" are mutually perpendicular in space.

[0060] like Figure 1-19 As shown, this application provides an optoelectronic module, including an optoelectronic component 100, a lens component 200, at least one adhesive component 300, and at least one fastener 400.

[0061] like Figure 1-3 As shown, the optoelectronic assembly 100 includes an optoelectronic device 110 and a carrier plate 120 for housing the optoelectronic device 110. The carrier plate 120 includes a first mating portion 130. The lens assembly 200 includes a lens 210 and a housing 220 for housing the lens 210. The housing 220 includes a second mating portion 230. The first mating portion 130 and the second mating portion 230 maintain at least partial overlap in the optical axis direction. An adhesive member 300 is disposed between the first mating portion 130 and the second mating portion 230 to connect the first mating portion 130 and the second mating portion 230. A fastener 400 connects the first mating portion 130 and the second mating portion 230 such that the first mating portion 130 and the second mating portion 230 tightly press the adhesive member 300. Based on the above configuration, the optoelectronic component 100 and the lens assembly 200 are initially connected to each other through the adhesive connector 300 when the optical axis of the optoelectronic device 110 is aligned with the optical axis of the lens 210. The optoelectronic component 100 and the lens assembly 200 are then connected to each other a second time through the fastener 400 when they are initially connected.

[0062] For example, the optoelectronic device 110 can be disposed on the carrier plate 120 by means of gluing, snap-fitting, welding, pressing, etc.; the optoelectronic device 110 can also be disposed integrally with the carrier plate 120.

[0063] When assembling the optoelectronic component 100 and the lens assembly 200, firstly, the adhesive 300 is placed between the first mating part 130 and the second mating part 230; secondly, the optoelectronic component 100 and the lens assembly 200 are moved to the optimal position by active alignment; then, the adhesive 300 is exposed for pre-curing and / or baked for deep curing, and the optoelectronic component 100 and the lens assembly 200 are initially connected to each other through the adhesive 300; finally, the fastener 400 is connected to the first mating part 130 and the second mating part 230, and the optoelectronic component 100 and the lens assembly 200 are secondary connected to each other through the adhesive 300.

[0064] During long-term use, the adhesive joint 300 will expand and deform due to the influence of temperature and humidity. The spatial positions of the optical components fixed by the adhesive joint will shift due to the expansion and deformation of the adhesive joint 300, resulting in a decrease in the optical performance of the optoelectronic module. Based on the above problem, the optoelectronic module provided in this application embodiment, in addition to fixing the spatial positions of the optoelectronic assembly 100 and the lens assembly 200 with the adhesive joint 300, further fixes the spatial positions of the optoelectronic assembly 100 and the lens assembly 200 with the fastener 400. The fastener 400 can apply a locking force to the first mating part 130 and the second mating part 230 to press the adhesive joint 300 tightly, thereby limiting the expansion and deformation of the adhesive joint 300 and reducing the impact of the expansion and deformation of the adhesive joint 300 on the spatial positions of the optoelectronic assembly 100 and the lens assembly 200.

[0065] For example, the adhesive component 300 can be cured adhesive, double-sided tape, adhesive strip, etc.

[0066] like Figure 4-5 As shown, the first mating part 130 and the second mating part 230 are respectively provided with a dispensing groove 140 and a dispensing boss 240. The adhesive component 300 is disposed between the dispensing groove 140 and the dispensing boss 240 to bond the first mating part 130 and the second mating part 230. The dispensing groove 140 and the dispensing boss 240 allow the adhesive component 300 to have a larger contact area with the first mating part 130 and the second mating part 230 without increasing its size, thereby reducing the thickness of the adhesive component 300 in the Z-axis direction and increasing the width of the adhesive component 300 in the X-axis direction and / or Y-axis direction. This helps to ensure the adhesive force of the adhesive component 300. Based on the water absorption expansion coefficient and thermal expansion coefficient of the adhesive component 300, the expansion deformation of the adhesive component 300 is positively correlated with its initial thickness. Therefore, by reducing the thickness of the adhesive component 300, the expansion deformation of the adhesive component 300 can be effectively reduced, thereby reducing the impact of the expansion deformation of the adhesive component 300 on the spatial position of the optoelectronic component 100 and the lens component 200.

[0067] The cross-sectional shapes of the dispensing groove 140 and the dispensing boss 240 include, but are not limited to, V-shaped, concave, or convex shapes.

[0068] Furthermore, the first mating part 130 is integrally or separately disposed on the carrier plate 120, and the second mating part 230 is integrally or separately disposed on the housing 220. The first mating part 130 has at least one first hole 150 in the area overlapping with the second mating part 230, and the second mating part 230 has at least one second hole 250 in the area overlapping with the first mating part 130. Each first hole 150 and each second hole 250 is provided in a one-to-one correspondence. A fastening member 400 is disposed within the first hole 150 and the second hole 250 to connect the first mating part 130 and the second mating part 230. Figure 6 As shown, when the fastener 400 connects the first mating part 130 and the second mating part 230, the fastener 400 is in close contact with one of the holes in the first hole 150 and the second hole 250, and in a clearance fit with the other hole in the first hole 150 and the second hole 250. This arrangement creates an adjustment gap 500 between the fastener 400 and either the first hole 150 or the second hole 250. The adjustment gap 500 allows the photoelectric component 100 and the lens assembly 200 to move relative to each other in the X-axis direction and / or the Y-axis direction, thereby eliminating the influence of the fastener 400 connection on the spatial position of the photoelectric component 100 and the lens assembly 200, ensuring precise alignment of the photoelectric component 100 and the lens assembly 200, and ensuring that the focal point of the lens assembly 200 falls in the appropriate position.

[0069] For example, the width of the adjustment gap 500 is selected to be 0.08mm to 0.25mm. For instance, the width of the adjustment gap 500+ can be 0.08mm, 0.10mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.20mm, 0.22mm, 0.24mm, 0.25mm, etc.

[0070] For example, the fastener 400 is implemented as a bolt. Figure 7-8 As shown, the bolt can connect the first mating part 130 and the second mating part 230 by threading it to the nut, or it can connect the first mating part 130 and the second mating part 230 by threading it to either the first mating part 130 or the second mating part 230. When the bolt connects the first mating part 130 and the second mating part 230 by threading it to the nut, the bolt head is pressed against the first mating part 130, the bolt shank is clearance-fitted with the first hole 150, the bolt shank is tight-fitted with the second hole 250, the bolt shank is threaded to the nut, and the nut is pressed against the second mating part 230; or, the bolt head is pressed against the second mating part 230, the bolt shank is clearance-fitted with the second hole 250, the bolt shank is tight-fitted with the first hole 150, the bolt shank is threaded to the nut, and the nut is pressed against the first mating part 130. When the bolt is threaded to connect the first mating part 130 and the second mating part 230, the bolt head is pressed against the first mating part 130, the bolt shank is clearance-fitted with the first hole 150, the bolt shank is tight-fitted with the second hole 250, and the bolt shank is threaded to the second hole 250; or, the bolt head is pressed against the second mating part 230, the bolt shank is clearance-fitted with the second hole 250, the bolt shank is tight-fitted with the first hole 150, and the bolt shank is threaded to the first hole 150.

[0071] It is worth mentioning that when the fastener 400 is implemented as a bolt, the locking torque δ (unit: N·m) of the fastener 400 is related to the thickness T (unit: mm) of the first mating part 130 or the second mating part 230 and the pressing width α (unit: mm) between the fastener 400 and the first mating part 130 or the second mating part 230. When T≥0.4mm and T≤1.5mm, δ≥(α / 15)×0.92 N·m, δ≤(α / 15)×1.08 N·m; when T>1.5mm, δ≥(α / 10)×0.92 N·m, δ≤(α / 10)×1.08 N·m.

[0072] For example, such as Figure 9 As shown, the fastener 400 is selected as a rivet. The head of the rivet is pressed against the first mating part 130, the body of the rivet is in clearance fit with the first hole 150, the body of the rivet is in tight fit with the second hole 250, and the tail of the rivet is pressed against the second mating part 230; or, the head of the rivet is pressed against the second mating part 230, the body of the rivet is in clearance fit with the second hole 250, the body of the rivet is in tight fit with the first hole 150, and the tail of the rivet is pressed against the first mating part 130.

[0073] For example, such as Figure 10-11 As shown, the fastener 400 is implemented as a pin. The head of the pin is pressed against the first mating part 130, the pin body is in clearance fit with the first hole 150, and the pin body is in tight fit with the second hole 250. The pin body is connected to the second mating part 230 by means of adhesive bonding, welding, or spring pin connection; or, the head of the pin is pressed against the second mating part 230, the pin body is in clearance fit with the second hole 250, and the pin body is in tight fit with the first hole 150. The pin body is connected to the first mating part 130 by means of adhesive bonding, welding, or spring pin connection.

[0074] It is worth mentioning that, in addition to being implemented as a separate component as described above, the fastener 400 can also be integrally disposed within the first mating portion 130 or the second mating portion 230. Specifically, as shown below... Figure 12-13As shown, the first mating part 130 has at least one first hole 150 in the area overlapping with the second mating part 230, and the second mating part 230 has at least one fastening member 400 in the area overlapping with the first mating part 130. Each first hole 150 is provided in a one-to-one correspondence with the first hole 150. The fastening member 400 is disposed in the first hole 150 and is clearance-fitted with the first hole 150. The fastening member 400 is connected to the first mating part 130 by means of adhesive bonding, welding, or nut connection. Alternatively, the first mating part 130 has at least one fastening member 400 in the area overlapping with the second mating part 230, and the second mating part 230 has at least one second hole 250 in the area overlapping with the first mating part 130. Each fastening member 400 is provided in a one-to-one correspondence with the second hole 250. The fastening member 400 is disposed in the second hole 250 and is clearance-fitted with the second hole 250. The fastening member 400 is connected to the second mating part 230 by means of adhesive bonding, welding, or nut connection.

[0075] The specific implementation of the first mating part 130 and the second mating part 230 is not limited. The first mating part 130 and the second mating part 230 may be implemented as extending from the carrier plate 120 and the housing 220 in a direction perpendicular to the optical axis, or may be implemented as extending from the carrier plate 120 and the housing 220 in a direction parallel to the optical axis. When the first mating part 130 and the second mating part 230 extend in a direction perpendicular to the optical axis, their shapes are distinct from the first mating part 130 of the carrier plate 120 and the second mating part 230 of the housing 220. It can be said that the optoelectronic component 100 and the lens assembly 200 are provided with the first mating part 130 and the second mating part 230, and the adhesive 300 and the fastener 400 are provided between the first mating part 130 and the second mating part 230 to connect the optoelectronic component 100 and the lens assembly 200. When the first mating part 130 and the second mating part 230 extend in a direction parallel to the optical axis, their shapes are not distinct from the first mating part 130 of the carrier plate 120 and the second mating part 230 of the housing 220. It can be said that the optoelectronic component 100 and the lens assembly 200 are not provided with the first mating part 130 and the second mating part 230, and the adhesive 300 and the fastener 400 are provided between the carrier plate 120 and the housing 220 to connect the optoelectronic component 100 and the lens assembly 200.

[0076] For example, such as Figure 14 As shown, the first mating part 130 is integrally disposed on the carrier plate 120 and extends in a direction perpendicular to the optical axis. The second mating part 230 is integrally disposed on the housing 220 and extends in a direction perpendicular to the optical axis. Both the first mating part 130 and the second mating part 230 have a ring-shaped structure.

[0077] The first mating part 130 is provided with three first holes 150, which are evenly spaced along the circumference. The second mating part 230 is provided with three second holes 250, which are evenly spaced along the circumference. Each fastener 400 and each adhesive bonding member 300 are also evenly spaced along the circumference, and each adhesive bonding member 300 is arc-shaped.

[0078] The distribution radius R1 of the fastener 400 is not greater than the outer edge radius R2 of the adhesive connector 300, R1≤R2; the distribution radius R1 of the fastener 400 is not less than the inner edge radius R3 of the adhesive connector 300, R1≥R3. That is to say, each adhesive connector 300 and each fastener 400 is arranged on the same ring as much as possible. This allows the locking force applied by the fastener 400 to the adhesive connector 300 to balance the expansion force inside the adhesive connector 300, reducing the expansion deformation of the adhesive connector 300, thereby reducing the positional offset of the photoelectric component 100 and the lens assembly 200, as well as the focal offset of the lens assembly 200.

[0079] The distribution radius R1 of the fastener 400 is not less than half of the outer edge radius R4 of the first mating part 130, R1 ≥ 1 / 2 × R4; the inner edge radius R3 of the adhesive 300 is not less than half of the outer edge radius R4 of the first mating part 130, R3 ≥ 1 / 2 × R4. That is, each adhesive 300 and each fastener 400 is located on the outer side of the first mating part 130. When the adhesive 300 expands or contracts, or when the fastener 400 squeezes the adhesive 300, the adhesive 300 will affect the relative position of the photoelectric component 100 and the lens assembly 200, resulting in a focus shift of the lens assembly 200. The further out the adhesive 300 is located on the first mating part 130, the smaller its influence on the relative position of the photoelectric component 100 and the lens assembly 200, and the smaller its influence on the focus shift.

[0080] For example, such as Figure 15-16 As shown, the first mating part 130 is integrally disposed on the carrier plate 120 and extends in a direction perpendicular to the optical axis. The second mating part 230 is integrally disposed on the housing 220 and extends in a direction perpendicular to the optical axis. Both the first mating part 130 and the second mating part 230 have a square ring plate structure.

[0081] like Figure 15 As shown, the first mating part 130 is provided with four first holes 150, which are evenly distributed around the four corners of the first mating part 130. The second mating part 230 is provided with four second holes 250, which are evenly distributed around the four corners of the second mating part 230. Each fastener 400 and each adhesive bonding member 300 are also evenly distributed around the circumference, and each adhesive bonding member 300 is elongated.

[0082] Or, such as Figure 16 As shown, the first mating part 130 is provided with four first holes 150, which are evenly distributed around the four sides of the first mating part 130. The second mating part 230 is provided with four second holes 250, which are evenly distributed around the four sides of the second mating part 230. Each fastener 400 and each adhesive bonding member 300 are also evenly distributed around the circumference, and each adhesive bonding member 300 is L-shaped.

[0083] The distribution spacing W1 of the fasteners 400 is not greater than the outer edge distribution spacing W2 of the adhesive connectors 300, where W1 ≤ W2; the distribution spacing W1 of the fasteners 400 is not less than the inner edge distribution spacing W3 of the adhesive connectors 300, where W1 ≥ W3. In other words, each adhesive connector 300 and each fastener 400 is arranged on the same square ring as much as possible. This allows the locking force applied by the fasteners 400 to the adhesive connectors 300 to balance the internal expansion force of the adhesive connectors 300, reducing the expansion deformation of the adhesive connectors 300, thereby reducing the positional offset of the photoelectric component 100 and the lens assembly 200, as well as the focal offset of the lens assembly 200.

[0084] The distribution spacing W1 of the fixed members 400 is not less than half of the distribution spacing W4 on both sides of the first mating part 130, W1 ≥ 1 / 2 × W4; the distribution spacing W3 of the inner edge of the adhesive members 300 is not less than half of the distribution spacing W4 on both sides of the first mating part 130, W3 ≥ 1 / 2 × W4. That is to say, each adhesive member 300 and each fixed member 400 is disposed on the outer side of the first mating part 130. When the adhesive member 300 expands or contracts, or when the fixed member 400 squeezes the adhesive member 300, the adhesive member 300 will affect the relative position of the photoelectric component 100 and the lens assembly 200, thereby causing the focus of the lens assembly 200 to shift. The further out the adhesive member 300 is disposed on the first mating part 130, the smaller its influence on the relative position of the photoelectric component 100 and the lens assembly 200, and the smaller its influence on the focus shift.

[0085] For example, such as Figure 17As shown, the thickness h of the adhesive component 300 in the optical axis direction is selected to be 0.2mm~0.6mm, and the width d of the adhesive component 300 (i.e., (R2-R3) or (W2-W3) / 2) is selected to be 0.4mm~1mm. Based on the water absorption expansion coefficient and thermal expansion coefficient of the adhesive component 300, the expansion deformation of the adhesive component 300 is positively correlated with its initial thickness and initial width. Therefore, the thickness and width of the adhesive component 300 should be as small as possible to reduce the expansion deformation of the adhesive component 300, thereby further reducing the offset of the optoelectronic component 100 and the lens component 200. The thickness of the adhesive component 300 is controlled at 0.2mm~0.6mm. A smaller thickness can reduce the contact area between the adhesive component 300 and the air, thereby reducing the amount of water vapor adsorption of the adhesive component 300 and the amount of expansion of the adhesive component 300 in the thickness direction due to water vapor adsorption. The width of the adhesive component 300 is controlled between 0.4mm and 1mm. This width is neither too large nor too small, ensuring sufficient bonding area for adequate adhesive force while minimizing its contact area with air, reducing moisture absorption, and further suppressing expansion in the thickness direction. Overall, controlling the thickness and width of the adhesive component 300 prevents overflowing adhesive from contaminating optical components, reduces the misalignment of the optoelectronic assembly 100 and lens assembly 200, improves the reliability of the optoelectronic module, and extends its lifespan.

[0086] For example, the thickness h of the adhesive component 300 can be 0.20mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.30mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, 0.36mm, 0.37mm, 0.38mm, 0.39mm, 0.40mm, 0.41mm, 0.42mm, 0.43mm, etc. The thicknesses are 0.44mm, 0.45mm, 0.46mm, 0.47mm, 0.48mm, 0.49mm, 0.50mm, 0.51mm, 0.52mm, 0.53mm, 0.54mm, 0.55mm, 0.56mm, 0.57mm, 0.58mm, 0.59mm, and 0.60mm; the width d of the adhesive joint 300 can be 0.40mm, 0.41mm, 0.42mm, 0.43mm, 0.44mm, 0.45mm, 0.46mm, and 0.47mm. m, 0.48mm, 0.49mm, 0.50mm, 0.51mm, 0.52mm, 0.53mm, 0.54mm, 0.55mm, 0.56mm, 0.57mm, 0.58mm, 0.59mm, 0.60mm, 0.61mm, 0.62mm, 0.63mm, 0.64mm, 0.65mm, 0.66mm, 0.67mm, 0.68mm, 0.69mm, 0.70mm, 0.71mm, 0.72mm, 0.73mm, 0. 74mm, 0.75mm, 0.76mm, 0.77mm, 0.78mm, 0.79mm, 0.80mm, 0.81mm, 0.82mm, 0.83mm, 0.84mm, 0.85mm, 0.86mm, 0.87 mm, 0.88mm, 0.89mm, 0.90mm, 0.91mm, 0.92mm, 0.93mm, 0.94mm, 0.95mm, 0.96mm, 0.97mm, 0.98mm, 0.99mm, 1.00mm.

[0087] For example, the adhesive 300 may be implemented as an acrylate-modified epoxy resin adhesive, which has the characteristics of low shrinkage, low water absorption and high hardness, and can reduce the deformation of the adhesive 300 during long-term use, thereby reducing the offset of the optoelectronic component 100 and the lens component 200.

[0088] After curing, the adhesive component 300 has a water absorption swelling rate of 0.05% to 0.1%, for example, 0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0.1%, etc. This low water absorption swelling rate helps reduce the expansion deformation of the adhesive component 300 due to moisture absorption during long-term use, thereby reducing the misalignment of the optoelectronic assembly 100 and lens assembly 200 caused by the expansion deformation of the adhesive component 300.

[0089] After curing, the adhesive component 300 has a Shore hardness of not less than 90 HD and a Young's modulus of not less than 10000 MPa. The high hardness and high Young's modulus help increase the compressive strength of the adhesive component 300, reducing its deformation under pressure and thus minimizing the displacement of the optoelectronic assembly 100 and lens assembly 200 caused by the deformation of the adhesive component 300. Simultaneously, the high Young's modulus of the adhesive component 300 enhances the peel resistance of the adhesive interface through rigid support, resulting in a more stable bond between the adhesive layer and the substrate.

[0090] After curing, the coefficient of thermal expansion of the adhesive component 300 is no greater than 30ppm / K. The low coefficient of thermal expansion helps maintain the stability of the adhesive component 300 in high and low temperature environments, reduces the impact of temperature changes on the adhesive component 300, reduces the expansion deformation of the adhesive component 300 in the thickness direction, and avoids the optical performance of the optoelectronic module from deteriorating due to the misalignment of the optoelectronic component 100 and the lens component 200.

[0091] The coefficient of thermal expansion of the cured adhesive 300 is no greater than 30ppm / K. The coefficient of thermal expansion of the adhesive and the substrate are matched, so the internal stress generated by temperature changes will be smaller, and the influence of temperature changes on the adhesive layer will be smaller. This reduces the amount of deformation in the thickness direction of the adhesive and prevents the optoelectronic component 100 and the lens component 200 from shifting.

[0092] For example, such as Figure 18 As shown, the lens assembly 200 also includes a compensation lens 260, which is located on the light-inlet side of the lens 210 and is fixed to the housing 220 by adhesive bonding or threaded connection. Because the fastener 400 applies a locking force to the first mating part 130 and the second mating part 230 when connecting them, there will be a slight offset in the relative positions of the optoelectronic assembly 100 and the lens. The compensation lens 260 allows for secondary active alignment or manual focusing of the optoelectronic device 110 and the lens 210, reducing the focus offset of the optoelectronic module.

[0093] For example, such as Figure 19As shown, a sealant 600 is also provided between the first mating part 130 and the second mating part 230. The sealant 600 is located on the outer periphery of the adhesive member 300. The sealant 600 is suitable for isolating external moisture and preventing external moisture from contacting the adhesive member 300, thereby preventing the adhesive member 300 from contacting moisture and expanding and deforming.

[0094] For example, the optoelectronic module can be implemented as a light receiving module or a light emitting module; the light receiving module can be implemented as a camera module or a laser receiving module; and the light emitting module can be implemented as an illumination module or a laser emitting module.

[0095] When the optoelectronic module is implemented as a light receiving module, the optoelectronic device 110 is a photoelectric sensor. When the optoelectronic module is implemented as a light emitting module, the optoelectronic device 110 is a photoelectric transmitter. When the optoelectronic module is implemented as an illumination module, the optoelectronic device 110 is a light-emitting diode (LED). When the optoelectronic module is implemented as a camera module, the optoelectronic device 110 is an image sensor. When the optoelectronic module is implemented as a laser emitting module, the optoelectronic device 110 is a laser transmitter. When the optoelectronic module is implemented as a laser receiving module, the optoelectronic device 110 is a laser receiver.

[0096] like Figures 20-21 As shown, focus F is the focal position of the photoelectric module in its original state, and focus F' is the focal position of the photoelectric module after use or placement in an unconventional environment (e.g., after 72 hours of use or placement in an environment with a temperature of 85℃ and a humidity of 85%). The offset between focus F and focus F' is the focus offset ΔF. The focus offset ΔF is a key indicator for evaluating the stability of the photoelectric module. The smaller the focus offset ΔF, the better the stability and performance of the photoelectric module.

[0097] To verify the improvement effect of the photoelectric module of this application, 10 test groups were set up. Each test group included one conventional technology photoelectric module and one photoelectric module of this application. The focal offset ΔF of the conventional technology photoelectric module and the photoelectric module of this application in each group was measured. The results are shown in the table below. Figure 22 Conventional optoelectronic modules, after being used or placed in an environment of 85°C and 85% humidity for 72 hours, exhibit a focal shift ΔF between 11mm and 15mm. In contrast, the optoelectronic module of this application, after being used or placed in an environment of 85°C and 85% humidity for 72 hours, exhibits a focal shift ΔF ≤ 6mm. Therefore, the optoelectronic module of this application demonstrates a significant improvement.

[0098]

[0099] After being used or placed in an environment with a temperature of 85℃ and a humidity of 85% for 72 hours, the focal offset of the photoelectric module of this application is ΔF≤6mm, which can improve the stability and optical performance of the photoelectric module. When the photoelectric module is a light receiving module, the change in the size of the light spot on the image plane is small, which can ensure that the light receiving module maintains a high resolution. When the photoelectric module is a light emitting module, the change in the size of the light spot on the illuminated object is small, which can ensure that the light emitting module maintains a high resolution or a high illumination effect.

[0100] Furthermore, after the optoelectronic module of this application is used or placed in an environment with a temperature of 85°C and a humidity of 85% for 72 hours, the focal offset of the optoelectronic module is ≤4mm, which can better improve the stability and optical performance of the optoelectronic module and ensure that the optoelectronic module maintains a high resolution or illumination effect.

[0101] This application also provides an electronic device that includes the above-described optoelectronic module.

[0102] For example, the electronic device may be implemented as a projector, a lighting fixture, a camera, a camera, a lidar, a security monitoring camera, a HUD display device, etc.

[0103] For example, the electronic device may also be implemented as an aircraft, vehicle, ship, robot, lighting system, detection system, monitoring system, etc., having one or more of the following: projector, lighting lamp, camera, camera, lidar, security monitoring camera or HUD display device.

[0104] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A photoelectric module, characterized in that, include: An optoelectronic assembly, the optoelectronic assembly including an optoelectronic device and a carrier plate for accommodating the optoelectronic device, the carrier plate including a first mating portion; A lens assembly, the lens assembly including a lens and a housing for receiving the lens, the housing including a second mating portion; and at least one adhesive component and at least one fastener; The first mating part and the second mating part maintain at least partial overlap, and the first mating part and the second mating part are bonded together by the adhesive. The fastener connects the first mating part and the second mating part so that the first mating part and the second mating part press tightly against the adhesive.

2. The optoelectronic module as described in claim 1, characterized in that, After the photoelectric module is used or placed in an environment with a temperature of 85℃ and a humidity of 85% for 72 hours, the focal offset ΔF of the photoelectric module is ≤6mm.

3. The optoelectronic module as described in claim 1, characterized in that, The first mating part and / or the second mating part includes at least one hole, the fastener passes through the hole, and there is an adjustment gap between the fastener and the hole.

4. The optoelectronic module as described in claim 1, characterized in that, The first mating part is integrally or separately disposed on the carrier plate, and the second mating part is integrally or separately disposed on the housing.

5. The optoelectronic module as described in claim 3, characterized in that, The first mating part includes at least one first hole, and the second mating part includes at least one second hole. Each first hole and each second hole are provided in a one-to-one correspondence. The fastening member passes through the first hole and the second hole to connect the first mating part and the second mating part.

6. The optoelectronic module as described in claim 5, characterized in that, The head of the fastener is pressed against one of the first mating portion and the second mating portion, and the tail of the fastener is connected to the other of the first mating portion and the second mating portion. The fastener is tightly fitted with one of the first hole and the second hole, and the fastener is gap fitted with the other of the first hole and the second hole, thereby forming the adjustment gap between the fastener and the first hole or the second hole.

7. The optoelectronic module as described in claim 6, characterized in that, The fastening component is a bolt.

8. The optoelectronic module as described in claim 7, characterized in that, The thickness of the first mating part or the second mating part is T, the pressing width of the fastener with the first mating part or the second mating part is α, and the locking torque of the fastener is δ. When T≥0.4mm and T≤1.5mm, δ≥(α / 15)×0.92 N·m and δ≤(α / 15)×1.08 N·m; when T>1.5mm, δ≥(α / 10)×0.92 N·m and δ≤(α / 10)×1.08 N·m.

9. The optoelectronic module as described in claim 3, characterized in that, The fastener is integrally disposed on the first mating part, the second mating part includes at least one second hole, the fastener is press-fitted to the second mating part, and the fastener is clearance-fitted to the second hole, and the adjustment gap is formed between the fastener and the second hole; Alternatively, the fastener is integrally disposed on the second mating part, the first mating part includes at least one first hole, the fastener is press-fitted to the first mating part, and the fastener is clearance-fitted to the first hole, and the adjustment gap is formed between the fastener and the first hole.

10. The optoelectronic module as described in claim 5 or 9, characterized in that, The width of the adjustment gap is 0.08mm to 0.25mm.

11. The optoelectronic module as described in any one of claims 5-9, characterized in that, Both the first mating part and the second mating part have a circular ring plate structure. Each of the adhesive components and each of the fastening components are evenly spaced along the circumference in the first mating part and the second mating part, and each of the adhesive components is arc-shaped.

12. The optoelectronic module as described in claim 11, characterized in that, The distribution radius R1 of the fastener is not greater than the outer edge radius R2 of the adhesive joint, R1≤R2; the distribution radius R1 of the fastener is not less than the inner edge radius R3 of the adhesive joint, R1≥R3.

13. The optoelectronic module as described in claim 11, characterized in that, The distribution radius R1 of the fastener is not less than half of the outer edge radius R4 of the first mating part, and R1 ≥ 1 / 2 × R4; the outer diameter R3 of the inner edge of the adhesive is not less than half of the outer edge radius R4 of the first mating part, and R3 ≥ 1 / 2 × R4.

14. The optoelectronic module as described in any one of claims 5-9, characterized in that, Both the first mating part and the second mating part have a square ring plate structure. Each of the adhesive components and each of the fastening components are evenly distributed in the first mating part and the second mating part along the circumference, and each of the adhesive components is long strip or L-shaped.

15. The optoelectronic module as described in claim 14, characterized in that, The distribution spacing W1 of the fasteners is not greater than the distribution spacing W2 of the outer edge of the adhesive joint, W1≤W2; the distribution spacing W1 of the fasteners is not less than the distribution spacing W3 of the inner edge of the adhesive joint, W1≥W3.

16. The optoelectronic module as described in claim 14, characterized in that, The distribution spacing W1 of the fixed connecting parts is not less than half of the distribution spacing W4 on both sides of the first mating part, i.e., W1≥1 / 2×W4; the distribution spacing W3 of the inner edge of the adhesive bonding parts is not less than half of the distribution spacing W4 on both sides of the first mating part, i.e., W3≥1 / 2×W4.

17. The optoelectronic module as described in claim 1, characterized in that, The first mating part and the second mating part are respectively provided with a dispensing groove and a dispensing boss, and the adhesive connector is disposed between the dispensing groove and the dispensing boss to connect the first mating part and the second mating part.

18. The optoelectronic module as described in claim 1, characterized in that, The lens assembly also includes a compensation lens, which is located on the light-inlet side of the lens and is fixed to the housing by adhesive bonding or threaded connection.

19. The optoelectronic module as described in claim 1, characterized in that, A sealant is also provided between the first mating part and the second mating part, and the sealant is located on the outer periphery of the adhesive joint.

20. The optoelectronic module as described in claim 1, characterized in that, The water absorption swelling rate of the adhesive component is 0.05%~0.1%.

21. The optoelectronic module as described in claim 1, characterized in that, The Shore hardness of the adhesive component is not less than 90HD; the Young's modulus of the adhesive component is not less than 10000MPa.

22. The optoelectronic module as described in claim 1, characterized in that, The coefficient of thermal expansion of the adhesive component is not greater than 30ppm / K.

23. The optoelectronic module as described in claim 1, characterized in that, The thickness of the adhesive joint is 0.2mm to 0.6mm, and / or the width of the adhesive joint is 0.4mm to 1mm.

24. The optoelectronic module as described in claim 1, characterized in that, After the photoelectric module is used or placed in an environment with a temperature of 85℃ and a humidity of 85% for 72 hours, the focal offset ΔF of the photoelectric module is ≤4mm.

25. An electronic device, characterized in that, Includes the optoelectronic module as described in any one of claims 1-21.

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