Head-up display device

Abstract

The utility model relates to a kind of head-up display equipment, including shell, image generation unit and heat sink unit;The image generation unit is set on the shell, including at least one heat-generating part;The heat sink unit is set on the shell, including radiator and airflow equipment;The radiator includes heat sink and at least one heat-conducting part;The at least one heat-conducting part is connected with the heat sink and the at least one heat-generating part respectively, and the air outlet of the airflow equipment is towards the heat sink setting.The utility model can improve the heat dissipation efficiency, while it is beneficial to ensure the miniaturization of head-up display device.

Description

Technical Field

[0001] This application relates to the field of head-up display technology, and more specifically, to a head-up display device. Background Technology

[0002] A HUD (Head-Up Display) projects image information onto the windshield, allowing drivers to access information without looking down. The image generation unit of the HUD generates heat during operation. If this heat is not dissipated effectively, it can lead to performance degradation, shortened lifespan, or even malfunction. Currently, the common cooling method for the image generation unit is passive cooling via a heat sink. This necessitates a large heat sink area to ensure effective heat dissipation. However, a large heat sink increases the overall size of the HUD, hindering its placement within the cockpit. Utility Model Content

[0003] The technical problem to be solved by this application is to provide a head-up display device in view of the above-mentioned defects of the prior art.

[0004] The technical solution adopted by this application to solve its technical problem is: constructing a head-up display device, including: case; An image generation unit, disposed on the housing, includes at least one heat-generating element; and A heat dissipation unit is disposed on the housing and includes a radiator and an airflow device; the radiator includes a heat dissipation component and at least one heat-conducting component; the at least one heat-conducting component is connected to the heat dissipation component and the at least one heat-generating component respectively, and the air outlet of the airflow device is disposed towards the heat dissipation component.

[0005] Furthermore, the heat sink includes a fin mounting plate and a plurality of heat dissipation fins disposed on the fin mounting plate; the air outlet of the airflow device is disposed toward the plurality of heat dissipation fins.

[0006] Furthermore, the heat-conducting component includes at least one heat-conducting pipe, one end of which is connected to the fin mounting plate and the other end of which is connected to the heat-generating component.

[0007] Furthermore, the heat pipe is a phase change heat pipe, with its evaporation section connected to the heat-generating element and its condensation section connected to the fin mounting plate.

[0008] Furthermore, the heat-conducting component also includes a heat pipe fixing component, wherein the end of the at least one heat-conducting pipe away from the heat dissipation component is disposed on the heat pipe fixing component, and the heat pipe fixing component is detachably disposed on the at least one heat-generating component.

[0009] Furthermore, the fin mounting plate has at least one first mounting groove on the side opposite to the plurality of heat dissipation fins, and the end of the at least one heat pipe away from the heat-generating element is disposed within the at least one first mounting groove; and / or The heat pipe fixing component is provided with at least one second mounting groove, and the end of the at least one heat-conducting pipe away from the heat dissipation component is disposed in the at least one second mounting groove and is located between the heat pipe fixing component and the heat-generating component.

[0010] Furthermore, the heat dissipation unit also includes at least one thermoelectric cooler, which is disposed between the at least one heat-generating element and the heat-conducting element.

[0011] Furthermore, the airflow device is disposed along the length of the housing on the side of the heat sink away from the image generation unit and the at least one heat-conducting element.

[0012] Furthermore, it also includes an optical adjustment unit, which is disposed on the housing and on the side of the housing away from the image generation unit and the heat dissipation unit.

[0013] Furthermore, the optical adjustment unit includes at least one arrayed optical waveguide.

[0014] Implementing this utility model has at least the following beneficial effects: This invention improves upon traditional passive cooling methods by incorporating a heat dissipation unit including a radiator and an airflow device, thereby enhancing heat dissipation efficiency. Simultaneously, the heat dissipation component eliminates the need for a large heat dissipation surface, thus reducing the radiator's size and consequently miniaturizing the head-up display device.

[0015] Meanwhile, when there are multiple heat-generating components, this invention can use heat-conducting components to concentrate the heat from multiple heat-generating components at the same radiator for heat dissipation, thus reducing the number of radiators and further reducing the size of the radiator, which is conducive to the miniaturization of head-up display devices. Attached Figure Description

[0016] The present application will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is a schematic diagram of the structure of a head-up display device according to one embodiment of the present invention; Figure 2 yes Figure 1 A schematic diagram of the image generation unit and heat sink in the image; Figure 3 yes Figure 1 A schematic diagram of the heat sink structure. Detailed Implementation

[0017] To provide a clearer understanding of the technical features, objectives, and effects of this application, the specific embodiments of this application are now described in detail with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0018] In the description of this application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0020] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0022] Figures 1 to 3This illustration shows a head-up display (HUD) device 1 according to one embodiment of the present invention. The HUD device 1 can be applied to driving equipment such as vehicles, aircraft, and ships that require the driver to look up while driving, thereby reducing the frequency with which the driver needs to look down at the instruments or central control screen during driving, and improving driving comfort and safety.

[0023] like Figure 1 As shown, the head-up display device 1 may include a housing 10, an image generation unit 20, an optical adjustment unit, and a heat dissipation unit 30. The image generation unit 20, the optical adjustment unit, and the heat dissipation unit 30 are all disposed on the housing 10. The image generation unit 20 is used to generate optical images. The optical adjustment unit is coupled to the image generation unit 20 and is used to transmit the optical images and to expand and adjust the optical images so that the beam distribution meets the requirements of the eyepiece. The heat dissipation unit 30 is connected to the image generation unit 20 and is used to dissipate heat from the image generation unit 20, preventing excessive heat accumulation in the image generation unit 20 that could lead to performance degradation or even malfunction.

[0024] In some embodiments, the image generation unit 20 and the heat dissipation unit 30 are disposed on the side of the housing 10 away from the optical adjustment unit. An optical transmission window (not shown in the figure) is provided on the housing 10, through which the image generation unit 20 is coupled to the optical adjustment unit to transmit optical images.

[0025] Specifically, the image generation unit 20 may include at least one heat-generating element that can generate heat during operation. The heat dissipation unit 30 is connected to the heat-generating element to dissipate heat from it.

[0026] The optical adjustment unit may include at least one arrayed optical waveguide, the input of which is coupled to the output of the image generation unit 20, for expanding the optical image output by the image generation unit 20. When the optical adjustment unit includes two arrayed optical waveguides, they can expand the optical image in two mutually perpendicular directions to achieve a two-dimensional pupil expansion effect, expand the eye movement range, improve driving safety and adaptability, and build a large field of view in a compact space, reducing the space occupied in the driver's cockpit.

[0027] It should be noted that the heat-generating component can be flexibly defined based on the heat-generating electronic elements of the image generation unit 20. For example, when the chip of the image generation unit 20 generates heat during operation, the chip and its mounting plate (or circuit board) can be defined as heat-generating components. When the LED light of the image generation unit 20 generates heat during operation, the LED light and its mounting board can also be defined as heat-generating components. No specific limitation is made here.

[0028] For example in Figure 2 In the illustrated embodiment, the image generation unit 20 includes three copper lamp panels, on which heat-generating LEDs are evenly distributed. During the operation of the image generation unit 20, the heat generated by the LEDs is dissipated through the copper lamp panels.

[0029] The three LED-lit panels are now defined as the first heat-generating element 21, the second heat-generating element 22, and the third heat-generating element 23. The first heat-generating element 21 and the second heat-generating element 22 are on the same plane and are arranged adjacent to each other. The third heat-generating element 23 is located on the side of the second heat-generating element 22 away from the first heat-generating element 21, and is arranged perpendicular to both the first and second heat-generating elements 21 and 22.

[0030] It should be noted that the image generation unit 20 and the optical waveguide can be implemented using existing technologies, and will not be elaborated further here.

[0031] It should be noted that the image generation unit 20, the optical adjustment unit, and the heat dissipation unit 30 can be detachably or non-detachably mounted on the housing 10 by means of welding, snap-fit ​​connection, glue connection, bolt connection, etc., and no specific limitation is made here.

[0032] In some other embodiments, the image generation unit 20 and the optical adjustment unit may also be located on the same side of the housing 10.

[0033] In some other embodiments, the optical adjustment unit may also include other optical adjustment or optical transmission elements such as mirrors and diffractive waveguides.

[0034] In some embodiments, the heat dissipation unit 30 may include a radiator 31 and an airflow device 32. Both the radiator 31 and the airflow device 32 are disposed on the housing 10. The radiator 31 absorbs heat generated by the heat-generating component and exchanges heat with the air to dissipate the absorbed heat. The airflow device 32 has its outlet facing the radiator 31 to accelerate the heat exchange rate between the radiator 31 and the air.

[0035] Among them, such as Figure 2 and Figure 3 As shown, the radiator 31 may include a heat dissipation element 311 and at least one heat-conducting element 312. The heat-conducting element 312 is connected to both the heat dissipation element 311 and the heat-generating element to conduct heat generated by the heat-generating element to the heat dissipation element 311. The heat dissipation element 311 is used for heat exchange with air to dissipate heat. The air outlet of the airflow device 32 is positioned towards the heat dissipation element 311 to accelerate the rate of heat exchange between the heat dissipation element 311 and the air.

[0036] Specifically, the housing 10 is now defined to include a first direction X and a second direction Y that are perpendicular to each other. The image generation unit 20, the heat sink 31 and the airflow device 32 can be connected in sequence along the first direction X. The airflow device 32 is disposed along the first direction X on the side of the heat sink 31 away from the image generation unit 20.

[0037] exist Figure 1 In the illustrated embodiment, the housing 10 is generally elongated, having mutually perpendicular length and width directions. Its length direction can be considered as the first direction X, and its width direction as the second direction Y. This effectively utilizes the structural dimensions of the housing 10, minimizing the size of the head-up display device 1 while ensuring heat dissipation performance.

[0038] Of course, the first direction X can also be the width direction of the housing 10, and the second direction Y can be the length direction of the housing 10, etc. The housing 10 can also be configured with other shapes.

[0039] This invention improves upon traditional passive cooling methods by incorporating a heat dissipation unit 30, including a heat sink 31 and an airflow device 32, thereby enhancing heat dissipation efficiency. Consequently, the heat sink 31 does not require a large heat dissipation surface, reducing its size and consequently miniaturizing the head-up display device 1.

[0040] This application sets the heat sink 31 to include only one heat sink 311. When there are multiple heat conduction elements 312, the heat sources transmitted by multiple heat conduction elements can be transferred to the same heat sink 311, so as to concentrate the heat at the same location. This facilitates the concentrated airflow at the heat concentration location by the airflow device 32, thereby improving the heat dissipation capacity while reducing the volume occupied, and ensuring the miniaturization of the head-up display device 1.

[0041] It should be noted that the airflow device 32 can be implemented using existing fans, blowers, or airflow devices, and no specific limitations are made here.

[0042] It should be noted that the heat-conducting element 312 can be connected to at least one heat-generating element. When there are multiple heat-conducting elements 312, the number of heat-generating elements connected to each heat-conducting element 312 can be the same or different.

[0043] Each heat-generating element may also be connected to at least one heat-conducting element 312. When there are multiple heat-generating elements, the number of heat-conducting elements 312 connected to each heat-generating element may be the same or different.

[0044] For example in Figure 2In the illustrated embodiment, there are three heat-generating elements and three heat-conducting elements 312, with each element corresponding to one another. The three heat-conducting elements 312 are defined as the first heat-conducting element 312A, the second heat-conducting element 312B, and the third heat-conducting element 312C. One end of each of the three heat-conducting elements 312 is connected to the heat dissipation element 311. The other end of the first heat-conducting element 312A is connected to the first heat-generating element 21, the other end of the second heat-conducting element 312B is connected to the second heat-generating element 22, and the other end of the third heat-conducting element 312C is connected to the third heat-generating element 23.

[0045] For example, in some other embodiments, for Figure 2 The image generation unit 20 shown may also include only two heat-conducting elements 312. One heat-conducting element 312 is connected to the third heat-generating element 23, and the other heat-conducting element 312 is connected to the first heat-generating element 21 and the second heat-generating element 22, which are on the same plane.

[0046] In some other embodiments, when there are multiple heat-conducting elements 312, the heat sink 31 may also include multiple heat sinks 311, and the heat dissipation unit 30 may also be provided with multiple airflow devices 32, with the airflow devices 32, heat sinks 311 and heat-conducting elements 312 being provided in a one-to-one correspondence.

[0047] In some other embodiments, the airflow device 32 may also be disposed on one side of the radiator 31 along the second direction Y or other directions.

[0048] like Figure 2 and Figure 3 As shown, in some embodiments, the heat sink 311 may include a fin mounting plate 3112 and a plurality of heat sink fins 3111. The plurality of heat sink fins 3111 are disposed on the fin mounting plate 3112 for collecting heat transferred by the heat conductor 312 and exchanging it with the air. The fin mounting plate 3112 is used to connect the heat sink fins 3111 and each heat conductor 312.

[0049] Specifically, the heat-conducting element 312 and the heat dissipation fins 3111 are respectively disposed on opposite sides of the fin mounting plate 3112. Multiple heat dissipation fins 3111 can be arranged parallel to each other along the second direction Y, with each heat dissipation fin 3111 perpendicular to the second direction Y of the housing 10 and extending along the first direction X. The air outlet 321 of the airflow device 32 extends along the first direction X and is located on the side of the heat dissipation fins 3111 away from the image generation unit 20 and the heat-conducting element 312 along the first direction X, so as to blow air into the channel between each pair of adjacent heat dissipation fins 3111, accelerating the airflow within the channel, thereby accelerating the heat exchange between the heat dissipation fins 3111 and the air, and improving heat dissipation efficiency.

[0050] It should be noted that the fin mounting plate 3112 can be made of materials with good thermal conductivity, such as copper, copper-aluminum alloy, graphene, graphite, carbon fiber, and C / C composite materials, to ensure thermal conductivity.

[0051] The fin mounting plate 3112 can be detachably or non-detachably mounted on the housing 10 by means of welding, bolting, snap-fitting, glue, etc., and no specific limitation is made here.

[0052] In some other embodiments, when the heat dissipation fins 3111 are arranged perpendicular to the first direction X, the airflow device 32 can also be arranged along the second direction Y on one side of the heat dissipation component 311, and the air outlet 321 is arranged along the second direction Y toward the heat dissipation fins 3111.

[0053] In some embodiments, the heat-conducting element 312 may include a heat pipe fixing member 3122 and at least one heat-conducting pipe 3121. The two ends of the heat-conducting pipe 3121 are respectively connected to the fin mounting plate 3112 and the heat-generating element of the image generation unit 20, for conducting heat from the heat-generating element to the fin mounting plate 3112. One end of the heat-conducting pipe 3121, away from the fin mounting plate 3112, is disposed on the heat pipe fixing member 3122 and is detachably assembled with the heat-generating element via the heat pipe fixing member 3122.

[0054] Specifically, the fin mounting plate 3112 has at least one first mounting groove 3113 recessed on the side opposite to the heat dissipation fins 3111, and the heat pipe fixing member 3122 has at least one second mounting groove 3123. The two ends of the heat pipe 3121 are respectively disposed within the first mounting groove 3113 and the second mounting groove 3123. When the heat pipe fixing member 3122 is assembled onto the heat-generating component, the corresponding end of the heat pipe 3121 is positioned between the heat pipe fixing member 3122 and the heat-generating component.

[0055] During the production process, the heat pipe 3121, heat pipe fastener 3122, and heat dissipation component 311 can be assembled into a modular structure, and then the modular structure can be assembled onto the housing 10, and the heat-generating component of the heat pipe fastener 3122 image generation unit 20 can be connected.

[0056] By setting the heat pipe fixing component 3122, compared to directly fixing the heat pipe 3121 to the heat generating component by welding or other methods, the connection between the heat dissipation unit 30 and the heat generating component can be made more convenient, and it provides disassembly, which facilitates the maintenance or replacement of the heat dissipation unit 30 and ensures the overall service life of the head-up display device 1.

[0057] The first mounting groove 3113 increases the contact area between the heat pipe 3121 and the fin mounting plate 3112, thereby improving the heat conduction efficiency. The second mounting groove 3123 allows the corresponding end of the heat pipe 3121 to be accommodated between the groove wall of the second mounting groove 3123 and the heat-generating element, thus improving the heat conduction efficiency.

[0058] It should be noted that the two ends of the heat pipe 3121 are fixed in the first mounting groove 3113 and the second mounting groove 3123, which can be achieved by welding, glue connection or other methods, and no specific limitation is made here.

[0059] It should be noted that the number of heat pipes 3121 in the heat-conducting component 312 can be flexibly set according to the heat generation of the heat-generating component it is connected to. When there are multiple heat-conducting components 312, the number of heat pipes 3121 in each heat-conducting component 312 can be the same or different. No specific limitation is made here.

[0060] For example in Figure 3 In the embodiment shown, the first heat-conducting element 312A and the third heat-conducting element 312C each include two heat-conducting pipes 3121, while the second heat-conducting element 312B includes only one heat-conducting pipe 3121.

[0061] In some other embodiments, the fin mounting plate 3112 may not have a first mounting groove 3113, and the corresponding end of the heat pipe 3121 may be directly fixed to the surface of the fin mounting plate 3112 away from the heat dissipation fins 3111. And / or, the heat pipe fixing member 3122 may not have a second mounting groove 3123, and the corresponding end of the heat pipe 3121 may be directly fixed to the surface of the heat pipe fixing member 3122.

[0062] In some other embodiments, the heat-conducting component 312 may also include only a heat-conducting pipe 3121, which is connected to the heat-generating component of the image generation unit 20 by means of welding, glue connection or other methods.

[0063] In some embodiments, the heat pipe 3121 may specifically be an existing phase change heat pipe, which can transfer heat through the vapor-liquid phase change of the working fluid in a fully enclosed vacuum tube to achieve extremely high thermal conductivity and improve thermal efficiency.

[0064] Specifically, the evaporation section of the phase change heat pipe exchanges heat with the heat-generating element, and the condensation section exchanges heat with the heat dissipation element 311.

[0065] Of course, the heat pipe 3121 can also be made of other heat pipe structures with excellent thermal conductivity, such as copper pipe, aluminum pipe, carbon fiber heat pipe, metal matrix composite pipe, and thermal superconducting material pipe.

[0066] In some other embodiments, the end of the heat pipe 3121 away from the heat sink 311 may also be disposed on the side of the heat pipe fixing member 3122 away from the heat generating member, and the heat of the heat generating member is conducted to the heat pipe 3121 through the heat pipe fixing member 3122.

[0067] like Figure 2 As shown, in some embodiments, the heat dissipation unit 30 may further include at least one thermoelectric cooler 33 (TEC), which is disposed between at least one heat-generating element and a heat-conducting element 312 to improve heat conduction efficiency.

[0068] Specifically, the thermoelectric cooler 33 includes a cold end face and a hot end face. The cold end face is in contact with the heat-generating element to facilitate heat exchange with the heat-generating element. The hot end face is used to fix it to the heat pipe fixing member 3122. The corresponding end of the heat pipe 3121 is disposed between the heat pipe fixing member 3122 and the hot end face to exchange heat with the hot end face.

[0069] It should be understood that the image generation unit 20 has a heat-generating component that needs to keep the operating temperature at a low level in order to meet the brightness requirements of the optical image output by the image generation unit 20.

[0070] By setting up a thermoelectric cooler 33, efficient heat transfer can be achieved by utilizing the contact between the cold end face and the heat-generating component, and the heat-generating component can be effectively controlled at a lower temperature level to meet the operating temperature range requirements of the heat-generating component.

[0071] For example in Figure 2 In the embodiment shown, a thermoelectric cooler 33 is provided between the first heat-generating element 21 and the first heat-conducting element 312A, while no other heat-generating element and other heat-conducting element 312 are provided.

[0072] Of course, in some other embodiments, a thermoelectric cooler 33 may be arranged between each heat-generating element and each heat-conducting element 312.

[0073] In some other embodiments, the heat dissipation unit 30 may also include only a heat sink 31 and an airflow device 32.

[0074] It should be noted that the thermoelectric cooler 33 can specifically adopt existing thermoelectric cooler types such as semiconductor coolers, and no specific limitation is made here.

[0075] Furthermore, a heat-conducting medium (not shown in the figure) can be provided between the thermoelectric cooler 33 and the heat-conducting component 312, and between the thermoelectric cooler 33 and the heat-generating component, to fill the microscopically uneven gaps in the contact surface, reduce thermal resistance, and further improve heat conduction efficiency.

[0076] Specifically, the thermally conductive medium can be in sheet form for easy installation. It can be made from existing materials such as thermal grease, thermally conductive silicone sheets, thermally conductive pads, graphene, and thermally conductive tape, without any specific limitations.

[0077] Understandably, the above-mentioned technical features can be used in any combination without restriction.

[0078] The above embodiments merely illustrate specific implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this application's patent. It should be noted that those skilled in the art can freely combine the above technical features without departing from the concept of this application, and can also make several modifications and improvements, all of which fall within the protection scope of this application. Therefore, any equivalent transformations and modifications made within the scope of the claims of this application should be covered by the claims of this application.

Claims

1. A head-up display device, characterized in that, include: Shell (10); An image generation unit (20) is disposed on the housing (10) and includes at least one heat-generating element; as well as A heat dissipation unit (30) is disposed on the housing (10) and includes a radiator (31) and an airflow device (32); the radiator (31) includes a heat dissipation component (311) and at least one heat-conducting component (312); the at least one heat-conducting component (312) is connected to the heat dissipation component (311) and the at least one heat-generating component respectively, and the air outlet (321) of the airflow device (32) is disposed facing the heat dissipation component (311).

2. The head-up display device according to claim 1, characterized in that, The heat sink (311) includes a fin mounting plate (3112) and a plurality of heat sink fins (3111) disposed on the fin mounting plate (3112); the air outlet (321) of the airflow device (32) is disposed toward the plurality of heat sink fins (3111).

3. The head-up display device according to claim 2, characterized in that, The heat-conducting component (312) includes at least one heat-conducting pipe (3121), one end of which is connected to the fin mounting plate (3112) and the other end is connected to the heat-generating component.

4. The head-up display device according to claim 3, characterized in that, The heat pipe (3121) is a phase change heat pipe, with its evaporation section connected to the heat-generating element and its condensation section connected to the fin mounting plate (3112).

5. The head-up display device according to claim 3, characterized in that, The heat-conducting component (312) further includes a heat pipe fixing component (3122), wherein the end of the at least one heat-conducting pipe (3121) away from the heat dissipation component (311) is disposed on the heat pipe fixing component (3122), and the heat pipe fixing component (3122) is detachably disposed on the at least one heat-generating component.

6. The head-up display device according to claim 5, characterized in that, The fin mounting plate (3112) has at least one first mounting groove (3113) on the side opposite to the plurality of heat dissipation fins (3111), and the end of the at least one heat pipe (3121) away from the heat-generating element is disposed in the at least one first mounting groove (3113); and / or The heat pipe fixing member (3122) is provided with at least one second mounting groove (3123), and the end of the at least one heat pipe (3121) away from the heat dissipation member (311) is disposed in the at least one second mounting groove (3123) and located between the heat pipe fixing member (3122) and the heat generating member.

7. The head-up display device according to any one of claims 1 to 6, characterized in that, The heat dissipation unit (30) further includes at least one thermoelectric cooler (33), which is disposed between the at least one heat-generating element and the heat-conducting element (312).

8. The head-up display device according to claim 7, characterized in that, The airflow device (32) is disposed along the length of the housing (10) on the side of the heat sink (311) away from the image generation unit (20) and the at least one heat conductor (312).

9. The head-up display device according to any one of claims 1 to 6, characterized in that, It also includes an optical adjustment unit, which is disposed on the housing (10) and on the side of the housing (10) away from the image generation unit (20) and the heat dissipation unit (30).

10. The head-up display device according to claim 9, characterized in that, The optical adjustment unit includes at least one arrayed optical waveguide.

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