Hot disc device and gumming developing apparatus

Abstract

The application provides a hot disc device and a gluing and developing equipment. The hot disc device comprises a heating mechanism, a driving mechanism, a first cooling mechanism and a second cooling mechanism. The heating mechanism is used for heating a wafer. The driving mechanism moves relative to the heating mechanism. The first cooling mechanism is connected to the driving mechanism. The second cooling mechanism is arranged below the heating mechanism and is used for blowing and cooling a cooling medium from below the heating mechanism, so that the heating mechanism is cooled. The driving mechanism is used for driving the first cooling mechanism to move above the heating mechanism and blowing and cooling the cooling medium on the upper surface of the heating mechanism, so that the cooling medium is blown and cooled on the upper surface of the heating mechanism, the heating mechanism is cooled from the upper surface of the heating mechanism, the heating mechanism is cooled on the upper surface and the lower surface of the heating mechanism at the same time, and the cooling efficiency of the heating mechanism is improved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing technology, and more specifically, relates to a hot plate device and a coating and developing equipment. Background Technology

[0002] In integrated circuit manufacturing, photoresist coating and developing equipment is a crucial component of the photolithography process. The hot plate unit, as a core module, is used to perform soft baking, pre-baking, or post-baking of wafers under different temperature conditions to ensure the curing quality of the photoresist and the accuracy of pattern transfer. The hot plate unit typically uses a ceramic heater as the heating element, and precise temperature control of the heater ensures stable support for the wafer processing.

[0003] In the actual operation of coating and developing equipment, as the variety of products increases and the frequency of process switching increases, the same hot plate device often needs to switch from one temperature to another in a short period of time to meet the baking requirements of different process steps.

[0004] Current cooling methods generally employ a structure that blows compressed air upwards from below the hot plate device to cool it. However, this approach has several drawbacks. Because the structure below the hot plate device is typically compact, limiting airflow space, the upper surface of the hot plate device cannot participate in heat dissipation, resulting in low cooling efficiency. Therefore, cooling solutions that only blow cooling air from below fail to meet requirements, leading to prolonged cooling time for the hot plate device and consequently impacting the overall machine capacity. Utility Model Content

[0005] The purpose of this application is to provide a hot plate device and a coating and developing equipment to solve the technical problem that the cooling efficiency of the hot plate device in the coating and developing equipment in the prior art still needs to be improved.

[0006] To achieve the above objectives, a first aspect of this application is to provide a hot plate device, comprising: Heating mechanism, used to heat the wafer; The drive mechanism moves relative to the heating mechanism; A first cooling mechanism is connected to the drive mechanism; The second cooling mechanism is located below the heating mechanism and is used to blow cooling medium from the lower surface of the heating mechanism. The driving mechanism is used to drive the first cooling mechanism to move above the heating mechanism, and to blow cooling medium onto the upper surface of the heating mechanism. After the upper surface of the heating mechanism is cooled, the driving mechanism drives the first cooling mechanism to move to the initial position.

[0007] Optionally, the first cooling mechanism includes: The first nozzle is connected to the drive mechanism; A first delivery pipe is connected to the first nozzle and is used to deliver the cooling medium to the first nozzle. A first solenoid valve is disposed in the first delivery pipeline and is used to control the opening or closing of the first delivery pipeline.

[0008] Optionally, the first nozzle is provided with multiple flow channels, and the axial directions of the multiple flow channels are arranged at an angle to each other.

[0009] Optionally, the drive mechanism includes: A fixed base, wherein the first cooling mechanism is connected to the fixed base; A transverse drive assembly is provided, wherein the fixed base is connected to the drive assembly, and the drive assembly is used to drive the fixed base to move relative to the heating mechanism.

[0010] Optionally, the lateral drive assembly is a linear module or a linear cylinder.

[0011] Optionally, the second cooling mechanism includes: The second nozzle is provided with multiple spray nozzles, which are evenly distributed on the second nozzle. The second delivery pipe is connected to the second nozzle and is used to deliver the cooling medium to the second nozzle; A second solenoid valve is installed in the second delivery pipeline and is used to control the opening or closing of the second delivery pipeline.

[0012] Optionally, the heating mechanism includes: Support ring; A heater, connected to the support ring, is used to heat the wafer, and a second cooling mechanism is disposed below the heater.

[0013] Optionally, the heating mechanism further includes: A temperature sensor is used to detect the temperature of the heater.

[0014] Optionally, the hot plate device further includes: The housing has a first position and a second position relative to the support ring; When the housing is in the first position, a channel is formed between the housing and the support ring, and the drive mechanism drives the first cooling mechanism to move from the channel to above the heating mechanism; When the drive mechanism drives the first cooling mechanism back to its initial position, the housing moves to the second position to close the channel.

[0015] The beneficial effects of the hot plate device provided in this application are as follows: Compared with the prior art, the hot plate device provided in this application includes a heating mechanism, a driving mechanism, a first cooling mechanism, and a second cooling mechanism. The heating mechanism is used to heat the wafer. The driving mechanism moves relative to the heating mechanism. The first cooling mechanism is connected to the driving mechanism. The second cooling mechanism is disposed below the heating mechanism and is used to blow cooling medium from below the heating mechanism to cool the heating mechanism. The driving mechanism is used to drive the first cooling mechanism to move above the heating mechanism and blow cooling medium on the upper surface of the heating mechanism to cool the heating mechanism from the upper surface. This achieves simultaneous cooling of the heating mechanism on both the upper and lower surfaces, thereby improving the cooling efficiency of the heating mechanism.

[0016] Secondly, this application provides a coating and developing apparatus, comprising: A heating plate device, wherein the heating plate device is any one of the heating plate devices described above.

[0017] The beneficial effects of the coating and developing equipment provided in this application are as follows: Compared with the prior art, the coating and developing equipment of this application includes any of the above-mentioned hot plate devices. The hot plate device includes a heating mechanism, a driving mechanism, a first cooling mechanism, and a second cooling mechanism. The heating mechanism is used to heat the wafer. The driving mechanism moves relative to the heating mechanism. The first cooling mechanism is connected to the driving mechanism. The second cooling mechanism is located below the heating mechanism and is used to blow cooling medium from below the heating mechanism to cool the heating mechanism. The driving mechanism is used to drive the first cooling mechanism to move above the heating mechanism and blow cooling medium on the upper surface of the heating mechanism to cool the heating mechanism from the upper surface. This achieves simultaneous cooling of the heating mechanism on both the upper and lower surfaces, thereby improving the cooling efficiency of the heating mechanism. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the hot plate device provided in the embodiments of this application; Figure 2 A schematic diagram of the structure of the first cooling mechanism provided in the embodiments of this application; Figure 3This is a schematic diagram of the heating mechanism provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the housing in the first position according to an embodiment of this application; Figure 5 This is a schematic diagram of the first cooling mechanism cooling the heating mechanism.

[0020] The following are the labeling elements in the figure: 10. Heating mechanism; 11. Support ring; 12. Heater; 13. Temperature sensor; 20. Drive mechanism; 21. Fixing base; 30. First cooling mechanism; 31. First nozzle; 311. Flow channel; 32. First delivery pipe; 33. First solenoid valve; 40. Second cooling mechanism; 41. Second nozzle; 411. Spray nozzle; 42. Second delivery pipe; 43. Second solenoid valve; 50. Housing. Detailed Implementation

[0021] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0022] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0023] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0025] Please refer to the following: Figures 1 to 5 The hot plate device and coating and developing equipment provided in the embodiments of this application will now be described.

[0026] The first aspect of this application is to provide a hot plate device, such as Figure 1 As shown, it includes a heating mechanism 10, a driving mechanism 20, a first cooling mechanism 30, and a second cooling mechanism 40.

[0027] Specifically, the heating mechanism 10 is used to heat the wafer. The driving mechanism 20 moves relative to the heating mechanism 10. The first cooling mechanism 30 is connected to the driving mechanism 20. Driven by the driving mechanism 20, the first cooling mechanism 30 moves above the heating mechanism 10 so that it can blow a cooling medium from the upper surface of the heating mechanism 10, thereby cooling the heating mechanism 10 from its upper surface. After cooling the upper surface of the heating mechanism 10 is completed, the driving mechanism 20 drives the first cooling mechanism 30 to move back to its initial position. The second cooling mechanism 40 is located below the heating mechanism 10 and is used to blow a cooling medium from below the heating mechanism 10, thereby cooling the heating mechanism 10 from its lower surface.

[0028] Compared with the prior art, the hot plate device provided in this application includes a heating mechanism 10, a driving mechanism 20, a first cooling mechanism 30, and a second cooling mechanism 40. The heating mechanism 10 is used to heat the wafer. The driving mechanism 20 moves relative to the heating mechanism 10. The first cooling mechanism 30 is connected to the driving mechanism 20. The second cooling mechanism 40 is disposed below the heating mechanism 10 and is used to blow cooling medium from below the heating mechanism 10 to cool the heating mechanism 10. The driving mechanism 20 is used to drive the first cooling mechanism 30 to move above the heating mechanism 10 and blow cooling medium on the upper surface of the heating mechanism 10 to cool the heating mechanism 10 from the upper surface. This achieves simultaneous cooling of the heating mechanism 10 on both the upper and lower surfaces, thereby improving the cooling efficiency of the heating mechanism 10.

[0029] In this application, the cooling medium is compressed air or an inert gas, wherein the inert gas is any one of nitrogen, argon or helium. Preferably, in this application, the cooling medium is compressed air.

[0030] In this application, as Figure 2As shown, the first cooling mechanism 30 includes a first nozzle 31, a first delivery pipe 32, and a first solenoid valve 33. Specifically, the first nozzle 31 is connected to the drive mechanism 20. One end of the first delivery pipe 32 is connected to the first nozzle 31, and the other end is connected to a cooling medium storage mechanism, such as a compressed air storage tank. The first delivery pipe 32 is used to deliver cooling medium to the first nozzle 31. The first solenoid valve 33 is disposed in the first delivery pipe 32. The first solenoid valve 33 can open or close the first delivery pipe 32 as needed. For example, when it is necessary to blow cooling medium onto the upper surface of the heating mechanism 10, the first solenoid valve 33 opens; after cooling the upper surface of the heating mechanism 10 is completed, the first solenoid valve 33 closes the first delivery pipe 32.

[0031] In one embodiment of this application, the first nozzle 31 is provided with a plurality of flow channels 311, and the axial directions of the plurality of flow channels 311 are arranged at an angle to each other. By providing a plurality of flow channels 311 on the first nozzle 31, the cooling medium is blown from the first nozzle 31 to different parts of the upper surface of the heating mechanism 10, thereby improving the uniformity of cooling of the upper surface of the heating mechanism 10.

[0032] In this application, as Figure 3 As shown, the second cooling mechanism 40 includes a second nozzle 41, a second delivery pipe 42, and a second solenoid valve 43. Specifically, the second nozzle 41 is provided with multiple spray nozzles 411, which are evenly distributed on the second nozzle 41. All spray nozzles 411 blow cooling medium vertically towards the heating mechanism 10 to cool the lower end face of the heating mechanism 10. One end of the second delivery pipe 42 is connected to the second nozzle 41, and the other end is connected to a cooling medium storage mechanism, such as a compressed air storage tank. The second delivery pipe 42 is used to deliver cooling medium to the second nozzle 41. The second solenoid valve 43 is located on the second delivery pipe 42 and is used to control the opening or closing of the second delivery pipe 42.

[0033] In this application, the first cooling mechanism 30 and the second cooling mechanism 40 share the same cooling medium storage mechanism. When the first solenoid valve 33 and the second solenoid valve 43 are opened, the cooling medium storage mechanism supplies cooling medium to the first nozzle 31 and the second nozzle 41 through its internal pressure.

[0034] In another embodiment of this application, when the first solenoid valve 33 and the second solenoid valve 43 are open, the cooling medium storage mechanism delivers cooling medium to the first nozzle 31 and the second nozzle 41 through the pump body.

[0035] In this application, the drive mechanism 20 includes a fixed base 21 and a lateral drive assembly (not shown). A first cooling mechanism 30 is connected to the fixed base 21. The fixed base 21 is connected to the drive assembly, which drives the fixed base 21 to move relative to the heating mechanism 10.

[0036] In one embodiment of this application, the transverse drive assembly is a linear module, which includes a base, a guide rail, a slide, a lead screw, and a drive motor. The guide rail is connected to the base and extends horizontally. The slide is slidably connected to the guide rail via a slider. The lead screw is rotatably connected to the base and arranged parallel to the guide rail. The lead screw nut is fixedly connected to the slide. The drive motor is mounted at the end of the base, and its output shaft is connected to the lead screw via a coupling to drive the lead screw to rotate around its axis. When the drive motor drives the lead screw to rotate, the threaded pair between the lead screw and the lead screw nut converts the rotational motion into axial movement of the lead screw nut, thereby driving the slide, which is fixedly connected to the lead screw nut, to move linearly along the guide rail. A fixed seat 21 is connected to the slide, thereby enabling the fixed seat 21 to drive the first cooling mechanism 30 to move above the heating mechanism 10 and back to its initial position.

[0037] In another embodiment of this application, the lateral drive assembly is a linear cylinder. The linear cylinder includes a cylinder body and a piston rod connected to the cylinder body and capable of telescopic movement relative to the cylinder body. The telescopic member is configured to move in a horizontal direction. A fixed seat 21 is connected to the piston rod. Through the telescopic movement of the piston rod, the fixed seat 21 drives the first cooling mechanism 30 to move above the heating mechanism 10 and back to its initial position.

[0038] In this application, as Figure 3 As shown, the heating mechanism 10 includes a support ring 11 and a heater 12.

[0039] Specifically, the support ring 11 is provided with a receiving groove. The heater 12 is connected to the support ring 11 and is housed in the receiving groove. The heater 12 is a ceramic heater and is used to heat the wafer. The second cooling mechanism 40 is located below the heater 12. The second nozzle 41 in the second cooling mechanism 40 is used to blow cooling medium onto the lower end face of the heater 12.

[0040] In this application, as Figure 3 As shown, the heating mechanism 10 also includes a temperature sensor 13 for detecting the temperature of the heater 12.

[0041] Specifically, there are multiple temperature sensors 13, which are used to detect the temperature at different locations of the heater 12.

[0042] In this application, the hot plate device also includes a housing 50.

[0043] Specifically, the housing 50 has a first position and a second position relative to the support ring 11, with the first position located above the second position in the vertical direction. When the housing 50 is in the first position, the distance between the housing 50 and the support ring 11 is at its maximum value in the vertical direction, thus forming a channel between the housing 50 and the support ring 11. The drive mechanism 20 drives the first cooling mechanism 30 to move from the channel to above the heating mechanism 10. When the drive mechanism 20 drives the first cooling mechanism 30 back to the initial position, the housing 50 moves to the second position to close the channel.

[0044] In the application, the housing 50 is driven by a lifting drive assembly (not shown) to move the housing 50 between a first position and a second position. The lifting drive assembly is a linear module or a linear cylinder.

[0045] In this application, the hot plate device also includes a controller (not shown), which is electrically connected to the heater 12, the first solenoid valve 33, the second solenoid valve 43, the lateral drive assembly, the lifting drive assembly, and the temperature sensor 13.

[0046] like Figure 4 As shown, when the heater 12 needs to be switched at temperature, the controller controls the second solenoid valve 43 to open first, so that the second nozzle 41 blows the cooling medium below the heater 12. At the same time, the controller controls the lifting drive mechanism 20 to drive the housing 50 to move relative to the support ring 11 in the vertical direction, and moves the housing 50 to the first position.

[0047] like Figure 5 As shown, after the housing 50 moves to the first position, the channel between the housing 50 and the support ring 11 is opened. The controller controls the transverse drive assembly to move the first nozzle 31 above the heater 12 through the fixed seat 21. Subsequently, the controller controls the first valve body to open so that the first nozzle 31 blows the cooling medium onto the upper surface of the heater 12 to cool the upper surface of the heater 12.

[0048] Temperature sensor 13 is used to detect the temperature of heater 12 and transmit the detected temperature to the controller. When the controller determines that the temperature of heater 12 detected by temperature sensor 13 is lower than the preset temperature set inside it, the controller controls the first solenoid valve 33 to close the first delivery pipe 32 and controls the transverse drive assembly to return the first nozzle 31 to the initial position through the fixed seat 21. At the same time, the controller controls the lifting drive mechanism 20 to move the housing 50 to the second position and controls the second solenoid valve 43 to close the second delivery pipe 42, thereby ensuring the uniformity of cooling of the heating mechanism 10.

[0049] Secondly, this application provides a coating and developing apparatus, including a hot plate device, wherein the hot plate device is the hot plate device provided in any of the above embodiments.

[0050] The beneficial effects of the coating and developing equipment provided in this application are as follows: Compared with the prior art, the coating and developing equipment provided in this application includes any of the above-mentioned hot plate devices. The hot plate device includes a heating mechanism 10, a driving mechanism 20, a first cooling mechanism 30, and a second cooling mechanism 40. The heating mechanism 10 is used to heat the wafer. The driving mechanism 20 moves relative to the heating mechanism 10. The first cooling mechanism 30 is connected to the driving mechanism 20. The second cooling mechanism 40 is disposed below the heating mechanism 10 and is used to blow cooling medium from below the heating mechanism 10 to cool the heating mechanism 10. The driving mechanism 20 is used to drive the first cooling mechanism 30 to move above the heating mechanism 10 and blow cooling medium on the upper surface of the heating mechanism 10 to cool the heating mechanism 10 from the upper surface. This achieves simultaneous cooling of the heating mechanism 10 on both the upper and lower surfaces, thereby improving the cooling efficiency of the heating mechanism 10.

[0051] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heating plate device, characterized in that, include: Heating mechanism, used to heat the wafer; The drive mechanism moves relative to the heating mechanism; A first cooling mechanism is connected to the drive mechanism; The second cooling mechanism is located below the heating mechanism and is used to blow cooling medium from the lower surface of the heating mechanism. The driving mechanism is used to drive the first cooling mechanism to move above the heating mechanism, and to blow cooling medium onto the upper surface of the heating mechanism. After the upper surface of the heating mechanism is cooled, the driving mechanism drives the first cooling mechanism to move to the initial position.

2. The hot plate device as described in claim 1, characterized in that, The first cooling mechanism includes: The first nozzle is connected to the drive mechanism; A first delivery pipe is connected to the first nozzle and is used to deliver the cooling medium to the first nozzle. A first solenoid valve is disposed in the first delivery pipeline and is used to control the opening or closing of the first delivery pipeline.

3. The hot plate device as described in claim 2, characterized in that, The first nozzle is provided with multiple flow channels, and the axial directions of the multiple flow channels are arranged at an angle to each other.

4. The hot plate device as described in claim 1, characterized in that, The drive mechanism includes: A fixed base, wherein the first cooling mechanism is connected to the fixed base; A transverse drive assembly is provided, wherein the fixed base is connected to the drive assembly, and the drive assembly is used to drive the fixed base to move relative to the heating mechanism.

5. The hot plate device as described in claim 4, characterized in that, The lateral drive component is a linear module or a linear cylinder.

6. The hot plate device as described in claim 1, characterized in that, The second cooling mechanism includes: The second nozzle is provided with multiple spray nozzles, which are evenly distributed on the second nozzle. The second delivery pipe is connected to the second nozzle and is used to deliver the cooling medium to the second nozzle; A second solenoid valve is installed in the second delivery pipeline and is used to control the opening or closing of the second delivery pipeline.

7. The hot plate device according to any one of claims 1-6, characterized in that, The heating mechanism includes: Support ring; A heater, connected to the support ring, is used to heat the wafer, and a second cooling mechanism is disposed below the heater.

8. The hot plate device as described in claim 7, characterized in that, The heating mechanism further includes: A temperature sensor is used to detect the temperature of the heater.

9. The hot plate device as described in claim 8, characterized in that, Also includes: The housing has a first position and a second position relative to the support ring; When the housing is in the first position, a channel is formed between the housing and the support ring, and the drive mechanism drives the first cooling mechanism to move from the channel to above the heating mechanism; When the drive mechanism drives the first cooling mechanism back to its initial position, the housing moves to the second position to close the channel.

10. A coating and developing apparatus, characterized in that, include: A heating plate device, wherein the heating plate device is the heating plate device according to any one of claims 1-9.

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