IO device based on a modular architecture

Abstract

The utility model discloses a kind of IO device based on modularization architecture, it is related to industrial automation control technical field.The device includes general base plate and function board detachably mounted on general base plate by connecting piece.Function board is integrated with main control unit, signal input / output unit and storage unit;Device further includes communication control unit for as slave station and external master station communication.In connection relationship, main control unit is connected with signal input / output unit and storage unit respectively, and communication control unit is connected with external master station and storage unit respectively.The utility model is configured to data mapping buffer by storage unit, for intermediate storage between main control unit and communication control unit Data interaction.The device not only reduces maintenance cost and improves configuration flexibility by hardware splitting, but also realizes the decoupling of communication task and control task by storage mapping mechanism, effectively guarantees the system stability under high-frequency data interaction.

Description

Technical Field

[0001] This utility model discloses an I / O device based on a modular architecture, belonging to the field of industrial automation control technology. Background Technology

[0002] In industrial automation control systems, I / O modules (input / output modules) are the key bridge connecting field devices (such as sensors and actuators) and controllers (such as PLC master stations). Traditional I / O modules typically adopt an integrated on-board design, where communication circuits, power supply circuits, main control circuits, and I / O drive circuits are all integrated and soldered onto the same PCB board and installed in a closed housing.

[0003] However, existing industrial I / O devices typically suffer from the following problems: First, hardware maintenance costs are high and flexibility is poor. Traditional I / O modules mostly use an integrated soldered structure, and the input / output circuits cannot be separated from the baseboard. If some interfaces are damaged, the user needs to replace the entire module, resulting in waste of undamaged parts. At the same time, if the input / output function needs to be changed on-site, a brand new module must be purchased, which cannot be configured flexibly.

[0004] Second, the data interaction efficiency between communication and control is low. In existing modules, the main control unit typically performs real-time data handshakes directly with the communication unit. In high-frequency communication scenarios, frequent data interactions can easily consume a large amount of the main control unit's resources, leading to delays in I / O signal acquisition or output control, and affecting the real-time stability of the system.

[0005] Therefore, a new technical solution is urgently needed to solve the above problems. Utility Model Content

[0006] To address the aforementioned technical problems, this utility model provides an I / O device based on a modular architecture, comprising: a general-purpose base plate (100) and a function board (200) detachably mounted on the general-purpose base plate (100) via connectors; the function board (200) includes a main control unit, a signal input / output unit, and a storage unit; the device further includes a communication control unit configured to communicate with an external master station as a slave station; wherein the main control unit is connected to the signal input / output unit and the storage unit respectively, and the communication control unit is connected to the external master station and the storage unit respectively; the storage unit is configured as a data mapping buffer for intermediate storage during data interaction between the main control unit and the communication control unit.

[0007] The general base plate (100) is provided with a standardized pin header interface; the function board (200) is configured as any one of an input function board, an output function board or an analog function board according to functional requirements; the function board (200) is directly plugged into and plugged into the general base plate (100) through the pin header interface, and there are no solder joints between the function board (200) and the general base plate (100).

[0008] The data processing logic of the device is configured as follows: when the function board (200) is an input module, the main control unit collects the data of the signal input / output unit and maps it into the storage unit. The communication control unit responds to the request of the external master station, reads the data from the storage unit and sends it to the external master station. When the function board (200) is an output module, the communication control unit receives the instruction from the external master station and writes it into the storage unit. The main control unit retrieves the instruction from the storage unit and controls the signal input / output unit to perform the output action.

[0009] It also includes an isolation circuit module; the isolation circuit module is disposed on the signal transmission path between the main control unit and the signal input / output unit; the isolation circuit module includes an optocoupler isolation unit and a digital isolation unit, used to realize electrical isolation and transmission control of signals.

[0010] It also includes a power conversion module; the power conversion module includes a DC-DC step-down unit, a common-mode inductor, a filter capacitor and an overcurrent protection component; the DC-DC step-down unit is configured to convert the externally input high-voltage DC into the low-voltage DC required by the system, and to supply power to multiple groups of power supplies.

[0011] The signal input / output unit includes several signal processing chips; when configured as an output function, multiple output chips are used, and each output chip is configured to control multiple NPN type signal outputs; when configured as an input function, it is configured to support PNP type and NPN type signal inputs.

[0012] The status indication module includes an indicator light assembly mounted on the board and an external indicator assembly extending to the device housing; the status indication module is connected to the main control unit and is used to display the signal validity status of the corresponding IO point.

[0013] The beneficial effects of this utility model are as follows: 1. This application adopts a modular architecture in which the general baseboard and the function board can be detachably connected by connectors; when the IO circuit is damaged due to external reasons, the user only needs to replace the function board, without replacing the baseboard and disassembling the wiring on the baseboard, thereby greatly reducing maintenance costs and maintenance time.

[0014] 2. By setting up a storage unit as a data mapping buffer, the main control unit focuses on acquiring or driving IO data, while the communication control unit focuses on responding to requests from the external master station. Both exchange data by reading and writing to the storage unit, eliminating the need for real-time handshake synchronization. This architecture avoids IO control delays or jitter caused by frequent interrupt requests consuming main control unit resources in high-frequency communication scenarios, thus effectively ensuring the real-time performance and stability of the device under high-speed data throughput. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the general base plate and functional board in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the IO device based on the modular architecture in the embodiments of this application; Figure 3 This is a schematic diagram of the isolation circuit module in an embodiment of this application. Detailed Implementation

[0016] The present application will be further described in detail below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention, but the embodiments described are not intended to limit the present invention.

[0017] Example 1: An I / O device based on a modular architecture, as shown in the figure, includes a general base plate 100 and a function board 200, which are electrically connected by plugging and unplugging.

[0018] Specifically, the general-purpose baseboard 100 is equipped with one or more sets of standardized pin header interfaces. The baseboard integrates a general-purpose power input interface and a communication interface.

[0019] Function board 200 can be optionally configured as a 32-point input function board or a 32-point output function board. The back of function board 200 is provided with a socket that matches the pin header interface of universal base plate 100.

[0020] The function board 200 is directly plugged into the universal base plate 100 via pins. This mounting method eliminates the traditional spot welding connection method, making production assembly more efficient and facilitating subsequent maintenance and replacement. Users only need to replace the function board and burn the corresponding program to switch functions (such as switching from input to output) without changing the base plate wiring.

[0021] The function board 200 in this embodiment integrates the core control and processing circuitry, specifically including: In this embodiment, the main control unit preferably uses an STM32 series microcontroller as the main control chip. This chip is responsible for executing the acquisition logic or output control logic of 32-point data and managing the flow of internal data.

[0022] The communication control unit uses a communication chip that supports a specific industrial bus protocol. This chip defines this I / O module as a slave station, responsible for handling bus communication requests from an external master station (such as a PLC).

[0023] The storage unit is located between the main control unit and the communication control unit, serving as a data mapping buffer. Its specific function is to decouple communication and control; that is, the main control unit and the communication control unit do not directly handshake to transmit real-time I / O status, but instead perform read and write operations on the storage unit separately, thereby improving system response efficiency and preventing data conflicts.

[0024] The isolation circuit module includes an optocoupler isolation chip, a digital isolation chip, and a power conversion module. The optocoupler isolation chip is deployed at the signal input / output front end to achieve electrical isolation, preventing high current or surge signals from damaging downstream low-voltage circuits.

[0025] The digital isolation chip is used in conjunction with the optocoupler and is also used to control the signal transmission timing of the output chip, ensuring the signal transmission's anti-interference capability. The power conversion module provides an external 24V DC power supply for the device.

[0026] The 24V voltage is converted into low-voltage power supplies (such as 5V, 3.3V, etc.) required by the internal chips of the system through the onboard DC-DC step-down chip (202 step-down chip in this embodiment), and multiple independent power supplies are provided to reduce crosstalk.

[0027] The power input terminal is also equipped with a common-mode inductor (to suppress common-mode interference), a filter capacitor (to smooth voltage), and a fuse (for overcurrent and short-circuit protection), forming a complete power protection network.

[0028] When function board 200 is configured as an input module, it supports 32-point PNP or NPN signal input. The specific operating process is as follows: External sensor signals enter through the input terminal and are first converted and isolated by an optocoupler isolation chip to remove high-frequency interference.

[0029] The STM32 main control chip collects the level status (high / low) of these 32 points in real time through polling or interrupt.

[0030] The STM32 main control chip organizes the 32-point status data it collects and writes it into a specific mapped address area in the onboard memory chip.

[0031] When the external master station (PLC) initiates a read request via the Beffer protocol, the communication control unit (Beffer chip) directly reads the data from the corresponding address of the storage chip and packages it to send to the master station.

[0032] The master station performs subsequent logic control based on the acquired data. During this process, the master station's reading frequency and the main control chip's acquisition frequency do not interfere with each other.

[0033] The working process of the IO output function board includes: When function board 200 is configured as an output module, its circuit contains 8 output driver chips, each responsible for 4 signals, totaling 32 NPN type outputs. The specific working logic is as follows: The external master station (PLC) issues output commands (including the point number and level status of the specified output) through the Beffer protocol bus according to the control logic.

[0034] After receiving the instruction, the communication control unit does not directly drive the I / O port, but writes the instruction data into the instruction buffer of the storage chip.

[0035] The STM32 master control chip periodically retrieves the latest output instructions from the memory chip.

[0036] The STM32 main control chip sends control signals to the corresponding output driver chip through the digital isolation chip according to the retrieved instructions, driving the output chip to turn on or off, thereby realizing the control of external loads (such as relays and indicator lights).

[0037] Example 2: To improve user experience and facilitate debugging, this example also includes: onboard indicator lights: which are directly soldered onto the PCB board for maintenance personnel to open the cover for inspection.

[0038] Housing indicator lights: Extended to the housing surface via light guides or external wiring, allowing users to intuitively judge the signal validity (on / off) and module operating status of 32 points without disassembling the device.

[0039] Debug / Programming Interface: This interface is brought out to the board edge and reuses the program download pin and debug pin. During the production phase, it is used to program the STM32 firmware; during the development and maintenance phase, technicians can use this interface to monitor internal chip variables online and quickly locate faults.

[0040] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An I / O device based on a modular architecture, characterized in that, include: A general-purpose base plate (100) and a function board (200) detachably mounted on the general-purpose base plate (100) via connectors; the function board (200) includes a main control unit, a signal input / output unit, and a storage unit; the device also includes a communication control unit configured to communicate with an external master station as a slave station; wherein the main control unit is connected to the signal input / output unit and the storage unit respectively, and the communication control unit is connected to the external master station and the storage unit respectively; the storage unit is configured as a data mapping buffer for intermediate storage of data interaction between the main control unit and the communication control unit.

2. The I / O device based on a modular architecture according to claim 1, characterized in that, The general base plate (100) is provided with a standardized pin header interface; the function board (200) is configured as any one of an input function board, an output function board or an analog function board according to functional requirements; the function board (200) is directly plugged into and plugged into the general base plate (100) through the pin header interface, and there are no solder joints between the function board (200) and the general base plate (100).

3. The I / O device based on a modular architecture according to claim 1, characterized in that, The data processing logic of the device is configured as follows: when the function board (200) is an input module, the main control unit collects the data of the signal input / output unit and maps it into the storage unit. The communication control unit responds to the request of the external master station, reads the data from the storage unit and sends it to the external master station. When the function board (200) is an output module, the communication control unit receives the instruction from the external master station and writes it into the storage unit. The main control unit retrieves the instruction from the storage unit and controls the signal input / output unit to perform the output action.

4. The I / O device based on a modular architecture according to claim 1, characterized in that, It also includes an isolation circuit module; the isolation circuit module is disposed on the signal transmission path between the main control unit and the signal input / output unit; the isolation circuit module includes an optocoupler isolation unit and a digital isolation unit, used to realize electrical isolation and transmission control of signals.

5. The I / O device based on a modular architecture according to claim 1, characterized in that, It also includes a power conversion module; the power conversion module includes a DC-DC step-down unit, a common-mode inductor, a filter capacitor and an overcurrent protection component; the DC-DC step-down unit is configured to convert the externally input high-voltage DC into the low-voltage DC required by the system, and to supply power to multiple groups of power supplies.

6. The I / O device based on a modular architecture according to claim 1, characterized in that, The signal input / output unit includes several signal processing chips; when configured as an output function, multiple output chips are used, and each output chip is configured to control multiple NPN type signal outputs; when configured as an input function, it is configured to support PNP type and NPN type signal inputs.

7. The I / O device based on a modular architecture according to claim 1, characterized in that, It also includes a status indicator module; the status indicator module includes an indicator light assembly mounted on the board and an external indicator assembly extending to the device housing; the status indicator module is connected to the main control unit and is used to display the signal validity status of the corresponding IO point.

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