Computer case with inclined heat dissipation

Abstract

The utility model discloses a computer case with inclined plane heat dissipation, including case subassembly and heat dissipation subassembly, the heat dissipation subassembly is located the inside wall of case subassembly, is convenient for the heat dissipation of case, the heat dissipation subassembly includes heat dissipation fan, inclined plane heat dissipation hole and side plate heat dissipation hole, the heat dissipation fan is located the inside wall of case subassembly, the inclined plane heat dissipation hole is set up in the inside wall of case subassembly, the side plate heat dissipation hole is set up in one side of case subassembly, through the included angle of the bottom plate of inclination angle and horizontal plane, cooperate heat dissipation fan angle optimization, form " bottom in top out " high -efficient airflow circulation. This layout can strengthen hot air exhaust efficiency, especially in the " bottom in top out " path of inclined mesh modeling, can quickly take away the heat of high heat components such as display card and CPU radiator, avoid the vortex area and heat accumulation phenomenon caused by traditional horizontal bottom plate, and the heat dissipation performance is effectively improved compared with traditional seascape room case.

Description

Technical Field

[0001] This utility model relates to the field of electronic device chassis technology, specifically a computer chassis with sloping heat dissipation. Background Technology

[0002] Driven by the demands of high-performance computing and e-sports, the power density of modern computer hardware continues to rise, posing stringent challenges to chassis heat dissipation efficiency and space utilization.

[0003] While traditional "seaview room" computer cases dominate the market with their aesthetically pleasing glass side panels, their heat dissipation structure and spatial design suffer from significant technical bottlenecks. Traditional "seaview room" cases typically employ a unidirectional airflow layout with side / bottom air intake and top / rear air exhaust. Although the bottom air intake is equipped with a filter to introduce cool air, the flat structure of the horizontal base plate easily creates vortex zones at the bottom of the case, resulting in insufficient cooling efficiency for high-heat hardware such as the graphics card. Hot air generated by high-power graphics cards tends to accumulate at the bottom, forming a "heat buildup" phenomenon that directly threatens hardware performance stability and lifespan. For example, traditional bottom air intakes can only specifically supplement cool air to the area below the graphics card, but cannot create efficient airflow circulation, leading to obstructed hot air exhaust and limited heat dissipation performance. To address this problem, the inventors have proposed a computer case with angled heat dissipation. Utility Model Content

[0004] In view of the shortcomings of the above-mentioned technologies, this utility model provides a computer case with sloping heat dissipation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a computer chassis with sloping heat dissipation, comprising a chassis assembly and a heat dissipation assembly, wherein the heat dissipation assembly is disposed on the inner side wall of the chassis assembly to facilitate heat dissipation of the chassis, the heat dissipation assembly comprising a cooling fan, sloping heat dissipation holes and side plate heat dissipation holes, the cooling fan being disposed on the inner side wall of the chassis assembly, the sloping heat dissipation holes being opened on the inner side wall of the chassis assembly, and the side plate heat dissipation holes being opened on one side of the chassis assembly.

[0006] As further explained, the chassis assembly includes a base plate, a rear cover plate, support feet, and foot pads. The base plate is disposed on the upper surface of the support feet, the rear cover plate is disposed on the upper surface of the base plate, the support feet are located between the foot pads and the base plate, and multiple support feet are provided and spaced apart. The cooling fan is located on the inner sidewall of the rear cover plate, and the sloping heat dissipation holes are located on the inner sidewall of the base plate.

[0007] As further explained, one end of the rear cover is provided with a right side plate, one end of the rear cover is provided with a side plate glass corresponding to the right side plate, one end of the side plate glass is provided with a front plate glass corresponding to the rear cover, the upper surface of the rear cover is provided with an upper cover, and the heat dissipation holes of the side plate are located on the inner sidewall of the right side plate.

[0008] As further explained, one end of the right side panel is provided with a front frame, the inner sidewall of the front frame is provided with a front panel reinforcing piece for reinforcing the front panel glass, one end of the front frame is provided with a front upper retaining strip for limiting the front panel glass, and one end of the front frame is provided with a front lower retaining strip corresponding to the front upper retaining strip, so as to facilitate limiting the front panel glass.

[0009] As a further explanation, the upper surface of the side panel glass is provided with an upper side retaining strip, and one end of the side panel glass is provided with a lower side retaining strip corresponding to the upper side retaining strip, which facilitates the limiting of the side panel glass.

[0010] As further explained, the upper surface of the base plate is provided with a motherboard, one end of the rear cover is provided with a hard drive bracket, and one end of the rear cover is provided with a rear window cover.

[0011] As further explained, one end of the base plate is provided with a protective shell, the inner side wall of the protective shell is provided with a control panel, and one end of the control panel is provided with buttons.

[0012] As further explained, one end of the rear cover is provided with a power support bracket for supporting the power supply, and the inner sidewall of the rear cover is provided with an interface card.

[0013] As further explained, the inner wall of the upper cover is provided with a PVC dustproof net for dust prevention, and one end of the front frame is provided with EVA cotton.

[0014] In summary, this utility model has the following beneficial effects: This utility model provides a computer chassis with a sloping heat dissipation design. It adopts an integrated mesh area design on the sloping bottom plate. The angled bottom plate forms an angle with the horizontal plane, and combined with an optimized cooling fan angle, it creates a highly efficient "bottom-in, top-out" airflow circulation. This layout enhances the efficiency of hot air exhaust, especially in the "bottom-in, top-out" path of the sloping mesh design, which can quickly remove heat from high-heat components such as graphics cards and CPU coolers. It avoids the vortex zones and heat accumulation phenomena caused by traditional horizontal bottom plates, effectively improving heat dissipation performance compared to traditional chassis. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a computer case with sloping heat dissipation according to the present invention;

[0016] Figure 2This is a schematic diagram of the internal structure of a computer case with sloping heat dissipation according to the present invention;

[0017] Figure 3 This is a schematic diagram of the internal structure of a computer case with sloping heat dissipation according to the present invention;

[0018] Figure 4 This is a schematic diagram of the internal structure of a computer case with sloping heat dissipation according to the present invention;

[0019] Figure 5 This is an exploded view of a computer case with sloping heat dissipation according to the present invention. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figure 1-5 As shown, this utility model discloses a computer chassis with sloping heat dissipation, including a chassis assembly and a heat dissipation assembly. The heat dissipation assembly is located on the inner side wall of the chassis assembly to facilitate heat dissipation of the chassis. The heat dissipation assembly includes a cooling fan 21, sloping heat dissipation holes 22, and side plate heat dissipation holes 23. The cooling fan 21 is located on the inner side wall of the chassis assembly, the sloping heat dissipation holes 22 are opened on the inner side wall of the chassis assembly, and the side plate heat dissipation holes 23 are opened on one side of the chassis assembly.

[0022] Specifically, the base plate 11 adopts an inclined angle design, forming a specific angle with the horizontal plane to create an inclined heat dissipation hole 22 area. The cooling fan 21 is installed on the inner side wall of the base plate 11 and the inner side wall of the rear cover plate 12. Through the airflow guidance of the inclined angle, a highly efficient "bottom in, top out" heat dissipation path is formed. When the fan is running, cool air enters from the bottom of the inclined heat dissipation hole 22, flows upward along the inclined base plate 11, directly impacts high-heat components such as the graphics card and CPU cooler, carries away heat, and is then discharged from the top or rear exhaust vents, avoiding the vortex zone and heat accumulation problems caused by the traditional horizontal base plate 11.

[0023] The chassis assembly includes a base plate 11, a rear cover plate 12, support feet 17, and feet 18. The base plate 11 is located on the upper surface of the support feet 17, the rear cover plate 12 is located on the upper surface of the base plate 11, and the support feet 17 are located between the feet 18 and the base plate 11. Multiple support feet 17 are provided and spaced apart. A cooling fan 21 is located on the inner sidewall of the rear cover plate 12, and the inclined ventilation holes 22 are located on the inner sidewall of the base plate 11. One end of the rear cover plate 12 has a right side panel 13, and another end of the rear cover plate 12 has a side panel glass 14 corresponding to the right side panel 13. One end of the side panel glass 14 has a front panel glass 15 corresponding to the rear cover plate 12. The upper surface of the rear cover plate 12 has an upper cover plate 16, and the side panel ventilation holes 23 are located on the inner sidewall of the right side panel 13. A front frame 101 is provided at one end of the right side panel 13. The inner sidewall of the front frame 101 is provided with a front panel reinforcing piece 102 for reinforcing the front panel glass 15. A front upper retaining strip 103 for limiting the front panel glass 15 is provided at one end of the front frame 101, and a front lower retaining strip 104 corresponding to the front upper retaining strip 103 is provided at one end of the front frame 101 to facilitate limiting the front panel glass 15. A side upper retaining strip 105 is provided on the upper surface of the side panel glass 14, and a side lower retaining strip 106 corresponding to the side upper retaining strip 105 is provided at one end of the side panel glass 14 to facilitate limiting the side panel glass 14.

[0024] Specifically, the side panel ventilation holes 23 on the inner wall of the right side panel 13 work in conjunction with the side fan to create directional cooling airflow for high-heat components such as the graphics card. The bottom fan simultaneously supplies cool air to the area below the graphics card, forming a three-dimensional airflow circulation system to ensure efficient heat dissipation under high-power hardware configurations.

[0025] The power supply bracket 111 is directly fixed to the inner wall of the rear cover 12, reducing the space occupied by the traditional vertically installed power supply bracket 111, reducing the overall width of the machine by 15%, and making it more compact and aesthetically pleasing.

[0026] The front panel reinforcing piece 102 on the inner sidewall of the front frame 101 enhances the structural strength of the front glass 15. The upper front retaining strip 103 and the lower front retaining strip 104 limit the upper and lower positions of the front glass 15 to prevent damage from vibration or impact. The side glass 14 is similarly limited and fixed by the upper side retaining strip 105 and the lower side retaining strip 106, ensuring stable installation and long-term safety of the glass side panels.

[0027] The upper surface of the base plate 11 is provided with a motherboard 110. One end of the rear cover plate 12 is provided with a hard drive cage 112, and the other end of the rear cover plate 12 is provided with a rear window cover 117. One end of the base plate 11 is provided with a protective shell 115, and the inner side wall of the protective shell 115 is provided with a control panel 114. One end of the control panel 114 is provided with a button 113. One end of the rear cover plate 12 is provided with a power support bracket 111 for supporting the power supply, and the inner side wall of the rear cover plate 12 is provided with an interface card 116. The inner side wall of the top cover plate 16 is provided with a PVC dustproof mesh 1 for dust prevention, and one end of the front frame 101 is provided with EVA cotton 2.

[0028] Specifically, the power supply bracket 111 is a crucial and ingenious part of the chassis design. The power supply bracket 111 is directly fixed to the inner wall of the rear cover 12. This design offers significant advantages compared to the traditional vertical mounting method of the power supply bracket 111. Traditional vertically mounted power supply brackets 111 often occupy a large amount of horizontal space inside the chassis, making the internal layout cramped. This not only limits the installation position and expandability of other hardware devices but also increases the overall width of the chassis.

[0029] Specifically, the PVC dustproof mesh 1 on the inner wall of the top cover 16 works in conjunction with the sloping heat dissipation holes 22 to ensure efficient heat dissipation while blocking dust from entering through the filtering effect of the PVC dustproof mesh 1. The EVA cotton 2 at one end of the front frame 101 further enhances the dustproof effect and plays a role in shock absorption and protection.

[0030] When the chassis is running, the cooling fan 21 starts, and cool air enters through the sloping ventilation holes 22 on the bottom plate 11, forming an upward airflow along the sloping bottom plate 11 to directly cool high-heat components such as the graphics card and CPU cooler. The side ventilation holes and side fans work together to create a directional cooling airflow for the graphics card, while the bottom fan supplements the cool air, forming a three-dimensional airflow circulation of "bottom in, top out". Hot air is exhausted from the top or rear exhaust vents to prevent heat buildup. The PVC dust filter 1 and EVA cotton 2 simultaneously prevent dust during the cooling process, achieving a balance between heat dissipation and dust prevention.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0032] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A computer case with sloping heat dissipation, characterized in that: Including chassis components; A heat dissipation component is disposed on the inner side wall of the chassis component to facilitate heat dissipation from the chassis. The heat dissipation assembly includes a cooling fan, a sloping heat dissipation hole, and a side plate heat dissipation hole. The cooling fan is located on the inner side wall of the chassis assembly, the sloping heat dissipation hole is located on the inner side wall of the chassis assembly, and the side plate heat dissipation hole is located on one side of the chassis assembly.

2. A computer case with sloping heat dissipation according to claim 1, characterized in that: The chassis assembly includes a base plate, a rear cover plate, support feet, and foot pads. The base plate is disposed on the upper surface of the support feet, the rear cover plate is disposed on the upper surface of the base plate, the support feet are located between the foot pads and the base plate, and multiple support feet are provided and spaced apart. The cooling fan is located on the inner sidewall of the rear cover plate, and the sloping heat dissipation holes are located on the inner sidewall of the base plate.

3. A computer case with sloping heat dissipation according to claim 2, characterized in that: One end of the rear cover plate is provided with a right side plate, one end of the rear cover plate is provided with a side plate glass corresponding to the right side plate, one end of the side plate glass is provided with a front plate glass corresponding to the rear cover plate, the upper surface of the rear cover plate is provided with an upper cover plate, and the heat dissipation holes of the side plate are located on the inner sidewall of the right side plate.

4. A computer case with sloping heat dissipation according to claim 3, characterized in that: One end of the right side panel is provided with a front frame, the inner side wall of the front frame is provided with a front panel reinforcing piece for reinforcing the front panel glass, one end of the front frame is provided with a front upper retaining strip for limiting the front panel glass, and one end of the front frame is provided with a front lower retaining strip corresponding to the front upper retaining strip, so as to facilitate limiting the front panel glass.

5. A computer case with sloping heat dissipation according to claim 3, characterized in that: The upper surface of the side panel glass is provided with an upper side retaining strip, and one end of the side panel glass is provided with a lower side retaining strip corresponding to the upper side retaining strip, so as to facilitate the limiting of the side panel glass.

6. A computer chassis with sloping heat dissipation according to claim 2, characterized in that: The upper surface of the base plate is provided with a motherboard, one end of the rear cover is provided with a hard drive bracket, and one end of the rear cover is provided with a rear window cover.

7. A computer case with sloping heat dissipation according to claim 6, characterized in that: One end of the base plate is provided with a protective shell, the inner side wall of the protective shell is provided with a control panel, and one end of the control panel is provided with buttons.

8. A computer case with sloping heat dissipation according to claim 2, characterized in that: One end of the rear cover is provided with a power support bracket for supporting the power supply, and the inner sidewall of the rear cover is provided with an interface card.

9. A computer case with sloping heat dissipation according to claim 4, characterized in that: The inner wall of the upper cover is provided with a PVC dustproof net for dust prevention, and one end of the front frame is provided with EVA cotton.

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